INTERSIL ISL4485EIB

ISL4485E
®
Data Sheet
April 21, 2005
FN6049.3
±15kV ESD Protected, 20Mbps, 5V, Low
Features
Power, RS-485/RS-422 Transceiver
• Pb-Free Available (RoHS Compliant)
The Intersil ISL4485E is a high speed, BiCMOS 5V
powered, single transceiver that meets both the RS-485 and
RS-422 standards for balanced communication. Each driver
output/receiver input is protected against ±15kV ESD
strikes, without latch-up. Unlike competitive devices, this
Intersil device is specified for 10% tolerance supplies (4.5V
to 5.5V).
The excellent differential output voltage coupled with high
drive-current output stages allow 20Mbps operation over
twisted pair networks up to 450 feet in length. The 25kΩ
receiver input resistance presents a “single unit load” to the
RS-485 bus, allowing up to 32 transceivers on the network.
• RS-485 I/O Pin ESD Protection . . . . . . . . . . ±15kV HBM
- Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM
• Operates from a Single +5V Supply (10% Tolerance)
• 1 Unit Load Allows up to 32 Devices on the Bus
• Low Quiescent Current . . . . . . . . . . . . . . . . . . . . . 700µA
• -7V to +12V Common Mode Input Voltage Range
• Three State Rx and Tx Outputs
• 30ns Propagation Delays, 2ns Skew
• Current Limiting and Thermal Shutdown for driver
Overload Protection
Receiver (Rx) inputs feature a “fail-safe if open” design,
which ensures a logic high Rx output if Rx inputs are
floating.
Applications
Driver (Tx) outputs are short circuit protected, even for
voltages exceeding the power supply voltage. Additionally,
on-chip thermal shutdown circuitry disables the Tx outputs to
prevent damage if power dissipation becomes excessive.
The half duplex configuration multiplexes the Rx inputs and
Tx outputs to allow transceivers with Rx and Tx disable
functions in 8 lead packages.
• SCSI “Fast 20” Drivers and Receivers
• Data Loggers
• Security Networks
• Building Environmental Control Systems
• Industrial/Process Control Networks
• Level Translators
Ordering Information
PART NO.
(BRAND)
• High Data Rates. . . . . . . . . . . . . . . . . . . . . up to 20Mbps
Pinout
TEMP.
RANGE (oC)
PACKAGE
PKG. DWG. #
ISL4485EIB
(4485EIB)
-40 to 85
8 Ld SOIC
M8.15
ISL4485EIBZ
(4485EIBZ)
(See Note)
-40 to 85
8 Ld SOIC
(Pb-free)
M8.15
ISL4485EIB-T
(4485EIB)
-40 to 85
8 Ld SOIC
Tape & Reel
M8.15
ISL4485EIBZ-T
(4485EIBZ)
(See Note)
-40 to 85
8 Ld SOIC
Tape & Reel
(Pb-free)
M8.15
ISL4485E (SOIC)
TOP VIEW
RO 1
R
RE 2
DE 3
DI 4
D
8
VCC
7
B/Z
6
A/Y
5
GND
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with
both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2005. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
ISL4485E
Truth Tables
RECEIVING
TRANSMITTING
INPUTS
INPUTS
OUTPUTS
OUTPUT
RE
DE
DI
B/Z
A/Y
RE
DE
A-B
RO
X
1
1
0
1
0
0
≥ +0.2V
1
X
1
0
1
0
0
0
≤ -0.2V
0
X
0
X
High-Z
High-Z
0
0
Inputs Open
1
1
X
X
High-Z
Pin Descriptions
PIN
FUNCTION
RO
Receiver output: If A > B by at least 0.2V, RO is high; If A < B by 0.2V or more, RO is low; RO = High if A and B are unconnected (floating).
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection.
A/Y
±15kV HBM ESD Protected, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0; pin is an output
(Y) if DE = 1.
B/Z
±15kV HBM ESD Protected, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is an output (Z) if
DE = 1.
VCC
System power supply input (4.5V to 5.5V).
Typical Operating Circuit
ISL4485E
+5V
+5V
+
8
0.1µF
0.1µF
+
8
VCC
1 RO
VCC
R
D
2 RE
B/Z
7
3 DE
A/Y
6
4 DI
RT
RT
7
B/Z
DE 3
6
A/Y
RE 2
R
D
2
DI 4
GND
GND
5
5
RO 1
ISL4485E
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Input / Output Voltages
A / Y, B / Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Short Circuit Duration
Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
170
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(Lead Tips Only)
Operating Conditions
Temperature Range
ISL4485EIB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified.
Typicals are at VCC = 5V, TA = 25oC, Note 2
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(oC)
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Driver Differential VOUT (no load)
VOD1
Driver Differential VOUT (with load)
VOD2
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
Full
-
-
VCC
V
R = 50Ω (RS-422), (Figure 1)
Full
2
3
-
V
R = 27Ω (RS-485), (Figure 1)
Full
1.5
2.3
5
V
∆VOD
R = 27Ω or 50Ω, (Figure 1)
Full
-
0.01
0.2
V
VOC
R = 27Ω or 50Ω, (Figure 1)
Full
-
-
3
V
∆VOC
R = 27Ω or 50Ω, (Figure 1)
Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
-
0.8
V
Logic Input Current
IIN1
DE, DI, RE
Input Current (A, B), (Note 5)
IIN2
DE = 0V, VCC = 0V or
4.5 to 5.5V
Receiver Differential Threshold
Voltage
VTH
Full
-25
-
25
µA
VIN = 12V
Full
-
-
1
mA
VIN = -7V
Full
-
-
-0.8
mA
-7V ≤ VCM ≤ 12V
Full
-0.2
-
0.2
V
Receiver Input Hysteresis
∆VTH
VCM = 0V
25
-
70
-
mV
Receiver Output High Voltage
VOH
IO = -4mA, VID = 200mV
Full
3.5
4
-
V
Receiver Output Low Voltage
VOL
IO = -4mA, VID = 200mV
Full
-
0.1
0.4
V
Three-State (high impedance)
Receiver Output Current
IOZR
0.4V ≤ VO ≤ 2.4V
Full
-
-
±1
µA
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
No-Load Supply Current, (Note 3)
ICC
DI, RE = 0V or VCC
Full
12
25
-
kΩ
DE = VCC
Full
-
700
900
µA
DE = 0V
Full
-
500
565
µA
Driver Short-Circuit Current,
VO = High or Low
IOSD1
DE = VCC, -7V ≤ VY or VZ ≤ 12V, (Note 4)
Full
35
-
250
mA
Receiver Short-Circuit Current
IOSR
0V ≤ VO ≤ VCC
Full
7
-
85
mA
3
ISL4485E
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified.
Typicals are at VCC = 5V, TA = 25oC, Note 2 (Continued)
TEMP
(oC)
MIN
tPLH, tPHL RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
tSKEW
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
tR, tF
RDIFF = 54Ω, CL = 100pF, (Figure 2)
tZH
Driver Enable to Output Low
Driver Disable from Output High
Driver Disable from Output Low
PARAMETER
TYP
MAX
UNITS
15
30
50
ns
-
1.3
5
ns
Full
3
11
25
ns
CL = 100pF, SW = GND, (Figure 3)
Full
-
17
30
ns
tZL
CL = 100pF, SW = VCC, (Figure 3)
Full
-
14
30
ns
tHZ
CL = 15pF, SW = GND, (Figure 3)
Full
-
19
30
ns
tLZ
CL = 15pF, SW = VCC, (Figure 3)
Full
-
13
30
ns
fMAXD
VOD ≥ 1.5V , (Figure 4, Note 6)
Full
20
-
-
Mbps
SYMBOL
TEST CONDITIONS
SWITCHING CHARACTERISTICS
Driver Input to Output Delay
Driver Output Skew
Driver Differential Rise or Fall Time
Driver Enable to Output High
Driver Maximum Data Rate
tPLH, tPHL Figure 5
Receiver Input to Output Delay
Receiver Skew | tPLH - tPHL |
tSKD
Full
20
40
70
ns
Figure 5
Full
-
3
10
ns
Receiver Enable to Output High
tZH
CL = 15pF, SW = GND, (Figure 6)
Full
-
9
25
ns
Receiver Enable to Output Low
tZL
CL = 15pF, SW = VCC, (Figure 6)
Full
-
9
25
ns
Receiver Disable from Output High
tHZ
CL = 15pF, SW = GND, (Figure 6)
Full
-
9
25
ns
Receiver Disable from Output Low
tLZ
CL = 15pF, SW = VCC, (Figure 6)
Full
-
9
25
ns
CL = 15pF, VID ≥ 1.5V (Note 6)
Full
20
-
-
Mbps
Human Body Model
25
-
±15
-
kV
25
-
>±7
-
kV
Receiver Maximum Data Rate
fMAXR
ESD PERFORMANCE
RS-485 Pins (A/Y, B/Z)
All Other Pins
NOTE:
2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
3. Supply current specification is valid for loaded drivers when DE = 0V.
4. Applies to peak current. See “Typical Performance Curves” for more information.
5. Devices meeting these limits are denoted as “single unit load (1 UL)” transceivers. The RS-485 standard allows up to 32 Unit Loads on the bus.
6. Guaranteed by characterization, but not tested.
Test Circuits and Waveforms
R
VCC
DE
Z
DI
VOD
D
Y
R
VOC
FIGURE 1. DRIVER VOD AND VOC
4
ISL4485E
Test Circuits and Waveforms (Continued)
3V
DI
1.5V
1.5V
0V
tPHL
tPLH
VOH
VCC
CL = 100pF
DE
50%
OUT (Y)
50%
VOL
Z
DI
tPHL
RDIFF
D
Y
tPLH
VOH
CL = 100pF
OUT (Z)
50%
SIGNAL
GENERATOR
50%
VOL
90%
DIFF OUT (Y - Z)
+VOD
90%
10%
10%
tR
-VOD
tF
SKEW = |CROSSING PT. OF Y↑ & Z↓ - CROSSING PT. OF Y↓ & Z↑|
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2A. TEST CIRCUIT
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
3V
DE
Z
DI
DE
500Ω
VCC
D
SIGNAL
GENERATOR
SW
Y
1.5V
1.5V
0V
GND
tZH
CL
tHZ
OUTPUT HIGH
VOH - 0.5V
OUT (Y, Z)
VOH
2.3V
0V
PARAMETER OUTPUT
RE
DI
SW
CL (pF)
tHZ
Y/Z
X
1/0
GND
15
tLZ
Y/Z
X
0/1
VCC
15
tZH
Y/Z
X
1/0
GND
100
tZL
Y/Z
X
0/1
VCC
100
FIGURE 3A. TEST CIRCUIT
tZL
VCC
OUT (Y, Z)
2.3V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
5
tLZ
ISL4485E
Test Circuits and Waveforms (Continued)
3V
DI
VCC
DE
0V
+
Z
DI
CD = 200pF
60Ω
D
VOD
Y
-
+VOD
DIFF OUT (Y - Z)
-VOD
0V
SIGNAL
GENERATOR
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4A. TEST CIRCUIT
FIGURE 4. DRIVER DATA RATE
3V
RE
15pF
B
+1.5V
R
A
A
1.5V
1.5V
RO
0V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
50%
RO
50%
0V
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5A. TEST CIRCUIT
FIGURE 5. RECEIVER PROPAGATION DELAY
RE
B
R
SIGNAL
GENERATOR
3V
1kΩ
RO
VCC
SW
A
RE
1.5V
1.5V
GND
0V
15pF
tZH
tHZ
OUTPUT HIGH
VOH - 0.5V
RO
PARAMETER
DE
A
SW
tHZ
0
+1.5V
GND
tLZ
0
-1.5V
VCC
tZH
0
+1.5V
GND
tZL
0
-1.5V
VCC
0V
tZL
tLZ
VCC
RO
1.5V
OUTPUT LOW
FIGURE 6A. TEST CIRCUIT
VOL + 0.5V V
OL
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES
6
VOH
1.5V
ISL4485E
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a pointto-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 spec requires that
drivers must handle bus contention without sustaining any
damage.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range
from +12V to -7V. RS-422 and RS-485 are intended for runs
as long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
Receiver Features
The ISL4485E utilizes a differential input receiver for
maximum noise immunity and common mode rejection. Input
sensitivity is ±200mV, as required by the RS-422 and RS-485
specifications.
Receiver input impedance surpasses the RS-422 spec of
4kΩ, and meets the RS-485 “Unit Load” requirement of
12kΩ minimum.
Receiver inputs function with common mode voltages as
great as ±7V outside the power supplies (i.e., +12V and
-7V), making them ideal for long networks where induced
voltages are a realistic concern.
The receiver includes a “fail-safe if open” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating). The output is three-statable via
the active low RE input, and the receiver easily meets the
20Mbps data rate.
Driver Features
The RS-485/422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485), and at
least 2V across a 100Ω load (RS-422). The ISL4485E driver
features low propagation delay skew to maximize bit width,
and to minimize EMI, and the outputs are three-statable via
the active high DE input.
Outputs of ISL4485E drivers are not slew rate limited, so
faster output transition times allow data rates up to 20Mbps.
Data Rate, Cables, and Terminations
Twisted pair is the cable of choice for RS-485/422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
7
signals, which are effectively rejected by the differential
receivers in these ICs.
RS-485/422 are intended for network lengths up to 4000',
but the maximum transmission length decreases as the data
rate increases. According to guidelines in the RS-422
specification, a 20Mbps network should be limited to less
than 50' of 24 AWG twisted pair. Nevertheless, the
ISL4485E's large differential voltage swing, fast transition
times, and high drive-current output stages allow operation
at 20Mbps in RS-485/422 networks as long as 450'. Figure 7
details ISL4485E operation at 20Mbps driving 300' of CAT 5
cable terminated in 120Ω at the driver and the receiver (i.e.,
double terminated). The acceptance criteria for this test was
the ability of the driver to deliver a 1.5V differential signal to
the receiver at the end of the cable (i.e., |A-B| ≥ 1.5V). If a
more liberal acceptance criteria is used, the distance can be
further extended. For example, Figure 8 illustrates the
performance in the same configuration, but with a cable
length of 450', and an acceptance criteria of no more than
6dB attenuation across the cable (i.e., |A-B| = |Y-Z|/2).
Driver differential output voltage decreases with increasing
differential load capacitance, so maintaining a 1.5V
differential output requires a data rate reduction, as shown in
Figure 9.
To minimize reflections, proper termination is imperative
when using this 20Mbps device. In point-to-point, or point-tomultipoint (single driver on bus) networks, the main cable
should be terminated in its characteristic impedance
(typically 120Ω) at the end farthest from the driver. In multireceiver applications, stubs connecting receivers to the main
cable should be kept as short as possible (preferably less
than 12 inches). Multipoint (multi-driver) systems require that
the main cable be terminated in its characteristic impedance
at both ends. Again, stubs connecting a transceiver to the
main cable should be kept as short as possible.
Built-In Driver Overload Protection
As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. The
ISL4485E device meets this requirement via driver output
short circuit current limits, and on-chip thermal shutdown
circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 spec, even at the common mode
voltage range extremes. Additionally, these devices utilize a
foldback circuit which reduces the short circuit current, and
thus the power dissipation, whenever the contending voltage
exceeds either supply.
In the event of a major short circuit condition, this device
also includes a thermal shutdown feature that disables the
drivers whenever the die temperature becomes excessive.
This eliminates the power dissipation, allowing the die to
cool. The drivers automatically reenable after the die
ISL4485E
temperature drops about 15 degrees. If the contention
persists, the thermal shutdown / reenable cycle repeats until
the fault is cleared. Receivers stay operational during
thermal shutdown.
ESD Protection
Human Body Model Testing
All pins on these interface devices include class 3 Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs) incorporate
advanced structures allowing them to survive ESD events in
excess of ±15kV HBM. The RS-485 pins are particularly
vulnerable to ESD damage because they typically connect to
an exposed port on the exterior of the finished product.
Simply touching the port pins, or connecting a cable, can
cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or not
it is powered up, protect without allowing any latchup
The RS-485 pin survivability on this high ESD device has
been characterized to be in excess of ±15kV, for discharges
to GND.
5
RO
(~450ns)
3
1.5
0
A-B
-1.5
-3
DI
5
0
5
RO
0
DRIVER+CABLE DELAY
DRIVER INPUT (V)
0
RECEIVER OUTPUT (V)
5
DRIVER INPUT (V)
VCC = 5V, TA = 25oC; Unless Otherwise Specified
DI
DRIVER+CABLE DELAY
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge stored on a 100pF capacitor through a
1.5kΩ current limiting resistor into the pin under test. The
HBM method determines an ICs ability to withstand the ESD
events typically present during handling and manufacturing.
RECEIVER INPUT (V)
RECEIVER INPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
0
mechanism to activate, and without degrading the RS-485
common mode range of -7V to +12V. This built-in ESD
protection eliminates the need for board level protection
structures (e.g., transient suppression diodes), and the
associated, undesirable capacitive load they present.
(~650ns)
3
1.5
0
A-B
-1.5
-3
TIME (20ns/DIV)
TIME (20ns/DIV)
FIGURE 7. DRIVER AND RECEIVER WAVEFORMS DRIVING
300 FEET OF CABLE (DOUBLE TERMINATED)
FIGURE 8. DRIVER AND RECEIVER WAVEFORMS DRIVING
450 FEET OF CABLE (DOUBLE TERMINATED)
750
30
RDIFF = 54Ω
700
25
20
ICC (µA)
DATA RATE (Mbps)
DE = VCC, RE = X
650
15
600
550
10
500
DE = GND, RE = X
5
450
0
500 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000
DIFFERENTIAL CAPACITANCE (pF)
FIGURE 9. DATA RATE vs DIFFERENTIAL CAPACITANCE
8
400
-40
-25
0
25
50
75
TEMPERATURE (oC)
FIGURE 10. SUPPLY CURRENT vs TEMPERATURE
85
ISL4485E
VCC = 5V, TA = 25oC; Unless Otherwise Specified (Continued)
90
3.6
80
3.4
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
Typical Performance Curves
70
60
50
40
30
20
10
0
0
1
2
3
4
3.2
RDIFF = 100Ω
3
2.8
2.6
2.4
RDIFF = 54Ω
2.2
2
-40
5
-25
FIGURE 11. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
25
50
75
85
FIGURE 12. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
40
3
35
2.5
tPHLY - tPLHZ
tPHLY
30
tPHLZ
tPLHZ
SKEW (ns)
PROPAGATION DELAY (ns)
0
TEMPERATURE (oC)
DIFFERENTIAL OUTPUT VOLTAGE (V)
tPLHY
25
tPLHY - tPHLZ
2
1.5
CROSSING PT. OF Y↑ & Z↓ - CROSSING PT. OF Y↓ & Z↑
25
-40
-25
0
25
50
TEMPERATURE (oC)
FIGURE 13. DRIVER PROPAGATION DELAY vs
TEMPERATURE
9
75
85
1
-40
-25
0
25
50
TEMPERATURE (oC)
FIGURE 14. DRIVER SKEW vs TEMPERATURE
75
85
ISL4485E
DI
0
5
RO
0
4
3
2
B/Z
A/Y
1
0
RDIFF = 54Ω, CL = 100pF
5
DI
0
5
RO
0
4
3
A/Y
2
B/Z
1
0
TIME (10ns/DIV)
TIME (10ns/DIV)
FIGURE 15. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH
FIGURE 16. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW
160
140
120
Y OR Z = LOW
OUTPUT CURRENT (mA)
100
80
60
40
20
0
-20
Y OR Z = HIGH
-40
-60
-80
-100
-120
-7 -6
-4
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
12
FIGURE 17. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
518
PROCESS:
Si Gate CMOS
10
DRIVER INPUT (V)
5
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CL = 100pF
DRIVER INPUT (V)
VCC = 5V, TA = 25oC; Unless Otherwise Specified (Continued)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
ISL4485E
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
INDEX
AREA
0.25(0.010) M
H
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
SYMBOL
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
µα
e
A1
B
0.25(0.010) M
C
C A M
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
MILLIMETERS
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
8o
0o
N
NOTES:
MAX
A1
e
0.10(0.004)
MIN
α
8
0o
8
7
8o
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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