Datasheet Single-Output LDO Regulator 35V Voltage Resistance 1A LDO Regulator BD00C0AWFPS-M ●General Description The BD00C0AWFPS-M is a low-saturation regulator. The output voltage can be arbitrarily configured depending on the external resistor combination. This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuit and a thermal shutdown circuit that protects the IC from thermal damage due to overloading. ●Key Specifications Supply Voltage: 4.0V to 26.5V Output voltage range: 3.0V to 15.0V Output Current: 1A Output voltage Precision(Ta=25℃): ±1% (-40℃≤Ta≤+105℃): ±3% Operating temperature range: -40℃≤Ta≤+105℃ ●Features Output Current capability : 1A High Output Voltage Precision : ±1% (Ta=25℃) Low saturation with PDMOS output Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuit Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading Low ESR Capacitor ●Package TO252S-5 W(Typ.) × D(Typ.) × H(Max.) 6.50mm × 9.50mm × 1.30mm ●Applications Automotive (audio system, navigation system and etc.) TO252S-5 ●Typical Application Circuit Vcc Vo R2 Vcc Cin Cout ADJ CTL GND R1 Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed for protection against radioactive rays 1/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Pin Configuration TO252S-5 (TOP VIEW) 3 1 2 4 5 Figure 2. Pin configuration ●Pin Description Pin No. Symbol Function 1 CTL Output Control Pin 2 VCC Power Supply Pin 3 N.C. N.C. Pin 4 VO Output Pin 5 ADJ Variable Pin FIN GND GND ※N.C.Pin can be open. Because it isn't connect it inside of IC. GND ●Block Diagram FIN + VREF Driver VREF OCP TSD Driver : Bandgap Reference : Over Current Protection Circuit : Thermal Shutdown Circuit : Power Transistor Driver OCP TSD 1 2 3 4 5 CTL VCC N.C. VO ADJ Figure 3. Block diagram www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Limits Unit Supply Voltage *1 VCC -0.3～+35.0 V Output Control Voltage *2 VCTL -0.3～+35.0 V Pd 1.3 W Operating Temperature Range Topr -40～+105 ℃ Storage Temperature Range Tstg -55～+150 ℃ Tjmax +150 ℃ Power Dissipation *3 Maximum Junction Temperature *1 *2 *3 Not to exceed Pd. The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within the range of the operation power-supply voltage ahead. TO252S-5 : 70ｍｍ×70ｍｍ×1.6mm Glass-Epoxy PCB. If Ta≥25℃, reduce by 10.4mW/℃ ●Recommended Operating Ratings (-40℃≤Ta≤+105℃) Symbol Min. Max. Unit Supply Voltage Vcc 4.0 25.0 V Output Control Voltage VCTL 0 25.0 V Output Current Io 0 1.0 A Output Voltage Vo 3.0 15.0 V Parameter ●Electrical Characteristics Ta=25℃, Vcc=10V, VCTL=5V, Io=50mA, Vo=5.0V output setting (Resistor valued used between ADJ and Vo is 56.7kΩ, while resistor value used between ADJ and GND is 10kΩ) Guaranteed Limit Parameter Symbol Unit Conditions Min. Typ. Max. ADJ Terminal Voltage VADJ 0.742 0.750 0.758 V Unless otherwise specified, -40℃≤Ta≤+105℃, Vcc=10V, VCTL=5V, Io=0mA, Vo=5.0V output setting (Resistor valued used between ADJ and Vo is 56.7kΩ, while resistor value used between ADJ and GND is 10kΩ) Guaranteed Limits Parameter Symbol Unit Conditions Min. Typ. Max. Shutdown Current Isd － 0 10 µA Circuit Current Ib － 0.5 2.5 mA ADJ Terminal Voltage VADJ 0.727 0.750 0.773 V IO=50mA Dropout Voltage ΔVd － 0.3 1.0 V VCC =VO×0.95, IO=500mA Ripple Rejection R.R. 45 55 － dB f=120Hz, Input Voltage Ripple =1Vrms IO=100mA Line Regulation Reg.I － 20 80 mV VCC =6→25V Load Regulation Reg.L － V IO=5mA→1A CTL ON Mode Voltage VthH 2.0 － － V ACTIVE MODE CTL OFF Mode Voltage VthL － － 0.8 V OFF MODE CTL Bias Current ICTL － 25 50 µA www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VO×0.010 VO×0.015 3/17 VCTL =0V TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Typical Performance Curves BD00C0AWFPS-M (Vo=5.0V output setting) Unless otherwise specified, -40℃≤Ta≤+105℃, Vcc=10V, VCTL=5V, Io=0mA, Vo=5.0V (Resistor valued used between ADJ and Vo is 56.7kΩ, while resistor value used between ADJ and GND is 10kΩ) 1.0 18 15 0.8 Shutdown Current: Isd [μA] Circuit Current: Ib+IFEEDBACK_R [mA] Ta=-40℃ 0.6 0.4 Ta=-40℃ 0.2 Ta=25℃ Ta=25℃ Ta=105℃ 12 9 6 3 Ta=105℃ 0.0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage: Vcc [V] 0 2 4 8 10 12 14 16 18 20 22 24 26 Supply Voltage: Vcc [V] Figure 5. Shutdown Current 6 6 5 5 Output Voltage: Vo [V] Output Voltage: Vo [V] Figure 4. Circuit Current (IFEEDBACK_R≒75µA) 6 4 3 2 4 3 2 Ta=-40℃ Ta=-40℃ Ta=25℃ 1 Ta=25℃ 1 Ta=105℃ Ta=105℃ 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage: Vcc [V] Figure 6. Line Regulation (Io=0mA) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage: Vcc [V] Figure 7. Line Regulation (Io=500mA) 4/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Typical Performance Curves - Continued 6 1,000 Ta=-40℃ 900 Dropout Voltage: ΔVd [mV] Output Voltage: Vo [V] 5 4 3 2 Ta=-40℃ 1 Ta=25℃ 800 Ta=105℃ 700 600 500 400 300 200 Ta=25℃ 100 Ta=105℃ 0 0 0 400 800 1200 1600 Output Current: Io [mA] 2000 0 2400 200 400 600 800 Output Current: Io [mA] 1000 Figure 9. Dropout Voltage (Vcc=4.75V) (lo=0mA→1000mA) Figure 8. Load Regulation 6 80 Ta=-40℃ 5 Ta=25℃ 60 Output Voltage:Vo [V] Ripple Rejection: R.R. [dB] 70 Ta=105℃ 50 40 30 4 3 2 20 1 10 0 0 10 100 1000 10000 Frequency: f [Hz] 100000 1000000 -20 0 20 40 60 80 100 Ambient Temperature:Ta[℃] Figure 10. Ripple Rejection (lo=100mA) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 Figure 11. Output Voltage Temperature Characteristic 5/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Typical Performance Curves - Continued 1.0 180 CTL Bias Current: ICTL [μA] Circuit Current: Ib+IFEEDBACK_R [mA] 160 0.8 0.6 0.4 Ta=-40℃ 0.2 140 120 100 80 60 Ta=-40℃ 40 Ta=25℃ Ta=25℃ 20 Ta=105℃ 0.0 Ta=105℃ 0 0 200 400 600 800 Output Current: Io [mA] 1000 0 4 6 8 10 12 14 16 18 20 22 24 26 Control Voltage: VCTL[V] Figure 13. CTL Voltage vs CTL Current 6 6 5 5 Output Voltage:Vo [V] Output Voltage:Vo [V] Figure 12. Circuit Current (lo=0mA→1000 mA) (IFEEDBACK_R≒75µA) 2 4 3 2 4 3 2 Ta=-40℃ 1 1 Ta=25℃ Ta=105℃ 0 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 Control Voltage: VCTL[V] Figure 14. CTL Voltage vs Output Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 130 140 150 160 170 180 190 Ambient Temperature:Ta [℃] Figure 15. Thermal Shutdown Circuit Characteristic 6/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Measurement setup for Typical Performance Curves Vcc Vo CTL ADJ Vcc Vo CTL ADJ 56.7kΩ 56.7kΩ 1µF GND 10kΩ A Measurement Circuit of Figure 4 1µF 1µF 1µF GND V 10kΩ 5V Measurement Circuit of Figure 5 Measurement Circuit of Figure 6 Measurement Circuit of Figure 8 Measurement Circuit of Figure 9 Vo Vcc 56.7kΩ 1µF 1µF CTL GND ADJ V 500mA 10kΩ 5V Measurement Circuit of Figure 7 Vo Vcc Vo Vcc 56.7kΩ 56.7kΩ 1Vrms ～ 1µF 1µF 1µF CTL GND 1µF CTL ADJ GND ADJ V 10V 100mA 10V 10kΩ 5V Measurement Circuit of Figure 10 Measurement Circuit of Figure 11 Vo Vcc 10kΩ 5V Vo Vcc 56.7kΩ 1µF CTL GND Vo Vcc 56.7kΩ 1µF A Measurement Circuit of Figure 12 CTL 10V 56.7kΩ 1µF 1µF ADJ GND ADJ 10kΩ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 CTL GND ADJ V 10V 10V Measurement Circuit of Figure 13 1µF 1µF V 10kΩ Measurement Circuit of Figure 14 7/17 5V 10kΩ Measurement Circuit of Figure 15 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Application Examples Applying positive surge to the VCC pin If the possibility exists that surges higher than 35.0V will be applied to the VCC pin, a zenar diode should be placed between the Vcc pin and GND pin as shown in the Figure below. Vcc GND Figure 16. Applying negative surge to the VCC pin If the possibility exists that negative surges lower than the GND are applied to the VCC pin, a schottky diode should be place between the Vcc pin and GND pin as shown in the Figure below. Vcc GND Figure 17. Implementing a protection diode If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup and Shutdown, a protection diode should be placed as shown in the Figure below. Vo Figure 18. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Power Dissipation TO252S-5 5 Mounted on a Rohm standard board Board size : 70mm×70mm×1.6mm Copper foil area :7mm×7mm Power dissipation Pd(W) 4 TO252S-5 θja=96.2(℃/W) 3 2 1.30 1 0 0 25 50 75 100 125 150 Ambient Temperature: Ta(℃) Figure 19. TO252S-5 5 ③4.80 Power dissipation Pd （W) 4 IC mounted on a ROHM standard board Board size：70mm×70mm×1.6mm Copper area：7mm×7mm ②3.50 ①:2-layer PCB (Copper foil area on the reverse side of PCB:15mm×15mm) ②:2-layer PCB (Copper foil area on the reverse side of PCB:70mm×70mm) ③:4-layer PCB (Copper foil on the reverse side of PCB:70mm×70mm) 3 ①1.85 2 1 ①:θja=67.6℃/W ②:θja=35.7℃/W ③:θja=26.0℃/W 0 0 25 50 75 100 125 Ambient Temperature: Ta(℃) 150 Figure 20. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M Refer to the heat mitigation characteristics illustrated in Figure 19 and Figure 20 when using the IC in an environment of Ta≥25°C. The characteristics of the IC are greatly influenced by the operating temperature, and it is necessary to operate under the maximum junction temperature Timax. Even if the ambient temperature Ta is at 25°C it is possible that the junction temperature Tj reaches high temperatures. Therefore, the IC should be operated within the power dissipation range. Figure 19 and Figure 20 show the acceptable power dissipation characteristic curves of TO252S-5 package. Even when the ambient temperature Ta is a normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures less than the acceptable loss Pd. The following method is used to calculate the power consumption Pc (W). Pc=(Vcc-Vo)×Io+ VCC×Ib Acceptable loss Pd≥Pc VCC VO IO Ib Ishort The load current Io is obtained by operating the IC within the power dissipation range. IO ≤ Pd－VCC×Ib (Please refer to Figure.12 for Ib.) VCC－Vo : Input voltage : Output voltage : Load current : Circuit current : Short current Thus, the maximum load current Iomax for the applied voltage Vcc can be calculated during the thermal design process. Calculation Example) with TO252S-5,Ta=85℃,Vcc=10V, Vo=5V IO ≤ 2.496－10×Ib 5 IO ≤ 498.2mA Figure 20③:θja=26.0℃/W → -38.4mW/℃ 25℃=4.80W → 85℃=2.496W (Ib: 0.5mA) At Ta=85℃ with Figure 20③ condition, the calculation shows that ca about 500mA of output current is possible at 5V potential difference across input and output. The thermal calculation shown above should be taken into consideration during the thermal design in order to keep the whole operating temperature range within the power dissipation range. In the event of shorting (i.e. VO and GND pins are shorted) the power consumption Pc of the IC can be calculated as follows: Pc=VCC×(Ib+Ishort) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 (Please refer to Figure.8 for Ishort.) 10/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Input / Output Equivalent Circuit Diagrams VCC terminal CTL terminal 200kΩ Vcc 1kΩ CTL 200kΩ IC VO terminal ADJ terminal Vcc 15kΩ Vo Figure 21. ●Output Voltage Configuration Method Please connect resistors R1 and R2 (which determines the output voltage) as shown in Figure 22. Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistors values are large. Due to this, resistance ranging from R1=5kΩ to 10kΩ is highly recommend for R1. VO≒VADJ×(R1+R2)/R1 Figure 22. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Operational Notes 1. Absolute maximum ratings Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage (e.g. short circuit, open circuit, etc). Therefore, if any special mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2. The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. Transient characteristics should be sufficiently verified.. 3. GND electric potential Keep the GND pin potential at the lowest (minimum) level under any operating condition. Furthermore, ensure that, including the transient, none of the pin’s voltages are less than the GND pin voltage. 4. Ground wiring pattern When both a small-signal GND and a high current GND are present, single-point grounding (at the set standard point) is recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not cause any voltage change in the small-signal GND. Similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. 5. Inter-pin shorting and mounting errors Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in damaging the IC. Also, shorts caused by dust entering between the output, input and GND pin may result in damaging the IC. 6. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 7. Inspection using the set board The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with transportation and storage. Also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 8. Power dissipation (Pd) Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm X 70mm X 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 9. Thermal design The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. On the reverse side of the package this product has an exposed heat pad for improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation pattern as far as possible. The amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed the Pd rating. Tjmax: Maximum junction temperature=150[℃], Ta: Peripheral temperature [℃], θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W], Pc: Power dissipation [W], Vcc: Input Voltage, Vo: Output Voltage, Io: Load, Ib : Circuit Current Package Power dissipation Power dissipation : Pd (W) = (Tjmax-Ta) / θja : Pc (W) = (VCC-VO) × IO + VCC × Ib 10. VCC pin Insert a capacitor(Vo≥5.0V:capacitor≥1µF, 3.0V≤Vo≤5.0V:capacitor≥2.2µF) between the VCC and GND pins. Choose the capacitance according to the line between the power smoothing circuit and the VCC pin. Selection of the capacitance also depends on the application. Verify the application and allow for sufficient margins in the design. We recommend using a capacitor with excellent voltage and temperature characteristics. Electric capacitance IC Ceramic capacitors, Low ESR capacitor www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M 11. Output pin In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a capacitor with a capacitance of more than 1μF. Electrolytic, tantalum and ceramic capacitors can be used. When selecting the capacitor ensure that the capacitance of more than 1μF is maintained at the intended applied voltage and temperature range. Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the capacitor refer to the Cout ESR vs. Io. The stable operation range given in the reference data is based on the standalone IC and resistive load. For actual applications the stable operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is needed. When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and DC-biasing characteristics and high voltage tolerance. Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets with the required specification. 4.0V≤VCC≤26.5V -40℃≤Ta≤+105℃ 5kΩ≤R1≤10kΩ 2.2µF≤Cin≤100µF 1µF≤Cout≤100µF 3.0V ≤ VO ≤ 15.0V 4.0V≤VCC≤26.5V -40℃≤Ta≤+105℃ 5kΩ≤R1≤10kΩ 100 6.0V≤VCC≤26.5V -40≤Ta≤+105℃ 5kΩ≤R1≤10kΩ 3.0V≤VO≤15.0V 0A≤IO≤1A 5.0V≤VO≤15.0V 0A≤IO≤1A 100 100 Unstable operating region Stable operating region 0.1 Stable operating region 10 0.01 2.2 0.001 1 Cin（μF） 1 Cin（µF） Cout_ESR(Ω） 10 10 Stable operating region Unstable operating region 0 200 400 600 800 1000 1 1 10 Io(mA) 1 100 Cout_ESR vs. IO(reference data) 10 100 Cout(μF) Cout（µF） Cin vs. Cout(reference data) Cout (1µF or higher) ESR (0.001Ω or higher) VCC VCC (4.0V to 26.5V) VO Cin (1µF or higher) R2 CTL ADJ GND VCTL (5.0V) Io (Rout) R1 (5k to 10kΩ) ※Operation Note 11 Measurement circuit 12. CTL pin Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected, otherwise, the output voltage would be unstable. 13. Rapid variation in VCC voltage and load current In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output current and temperature are also possible causes. In case problems arise within the actual operating range, use countermeasures such as adjusting the output capacitance. 14. Minute variation in output voltage In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and load current, etc., use countermeasures such as implementing filters. 15. Over current protection circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M 16. Thermal shutdown circuit (TSD) This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature (Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below the TSD threshold the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 17. In some applications, the VCC and pin potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. For example, while the external capacitor is charged, the VCC shorts to the GND. Use a capacitor with a capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a bypass between all pins and the VCC pin. 18. This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: ○ The P/N junction functions as a parasitic diode when GND > pin A for the resistor, or GND > pin B for the transistor. ○ Also, when GND > pin B for the transistor (NPN), the parasitic diode described above combines with the N layer of the other adjacent elements to operate as a parasitic NPN transistor. Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (P substrate) GND. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Ordering Information B D 0 Output voltage 00:Variable 0 C Current capacity C0A：1A 0 A W F Shutdown switch W : With switch P S - Package FPS：TO252S-5 M E 2 Packaging specification E2: Embossed tape and reel ●Marking Diagram TO252S-5 (TOP VIEW) Part Number Marking 00C0AW LOT Number www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Physical Dimension, Tape and Reel Information Package Name TO252S-5 <Tape and Reel information> Tape Embossed carrier tape Quantity 2000pcs Direction of feed E2 The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 16/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet BD00C0AWFPS-M ●Revision History Date Revision 08.Feb.2013 001 Changes New Release www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/17 TSZ02201-0T2T0AN00050-1-2 08.Feb.2013 Rev.001 Datasheet Notice General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet Other Precaution 1. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.