ROHM BD90571EFJ-C

BD90571EFJ-C
Datasheet
Secondary power supply series for automotive
2.69 to 5.5V, 1.2V Output, 2.25MHz
Synchronous Step-Down Converter
BD90571EFJ-C
●General Description
The BD90571EFJ-C is a synchronous rectification type
step-down DC/DC converter with a 2.25MHz fixed
frequency that operates in with an input voltage range
of 2.69V-5.5V. It has an integrated feedback resistor
that
supplies a fixed output voltage of 1.2V and a
phase compensation constant. Applications can be
created with a minimum of three external components.
Moreover, the integrated Pch and Nch output MOSFET
can supply a maximum output current of 1A.
●Key Specifications
■ Input voltage range
■ Output voltage
■ Output voltage accuracy
■ Operating frequency
■ Maximum output current
■ Circuit current at standby
■ Operational temperature
range
●Features
■
Thanks to the integrated output feedback resistor
and phase compensation, applications can be
created with a minimum of external components
■
Excellent load response through current mode
control
■
Integrated Pch and Nch output MOSFET
■
Integrated overcurrent protection with auto-reset
■
Integrated output overvoltage detection/
short-circuit detection
■
Integrated TSD and UVLO
■
Light load mode/PWM fixation operation selection
terminal
●Package
HTSOP-J8
2.69V～5.5[V]
1.2 [V] (Typ.)
±2.0[%](-40～+125°C)
2.25 [MHz] (Typ.)
1.0 [A] (Max.)
0[μA](Typ., 25°C)
-40～+125[°C]
4.90 ㎜×6.00 ㎜×1.00 ㎜
●Applications
■
Automotive equipment
■
Car audio and navigation
■
TV
■
Other electronic equipment
100
●Typical application circuit
90
Light Load MODE
80
10μF
1μF
47μF
EFFICIENCY [%]
1.5μH
70
60
PWM MODE
50
40
30
20
VIN=5.0V
Figure 1 CIRCUIT
10
0
Figure 1. Typical application circuit
(VIN=5V, VOUT=1.2V, IOUT=1A)
0.01
0.10
LOAD CURRENT [A]
1.00
Figure 2. Efficiency(VIN=5V)
○Product structure：Silicon monolithic integrated circuit ○This product is not designed to be radiation resistant.
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Datasheet
BD90571EFJ-C
●Pin Configuration [TOP VIEW]
●Pin Description
（TOP VIEW）
PVIN
1
8
SW
VIN
2
7
PGND
EN
3
6
FB
GND
4
5
MODE
Pin
Symbol
Function
1
PVIN
2
VIN
Power supply pin
3
EN
Enable pin
4
GND
5
MODE
6
FB
7
PGND
8
SW
Power supply pin for
output FET
GND pin
Light load mode/Fixed
PWM mode select pin
Output feedback pin
Figure 3. Pin arrangement diagram
GND pin for output FET
SW pin
●Block diagram
EN
VIN
VREF
SOFT
START
UVLO
PVIN
PWM
Comp
ERROR
Amp.
R
OCP
SLOPE
OSC
SW
Driver
Logic
S
OVP
PGND
UVLO
/TSD
SCP
1024cycle
OSC
FB
GND
MODE
Figure 4. Block diagram
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Datasheet
BD90571EFJ-C
●Block operation descriptions
■
Standby
The circuit enters the state of standby when the terminal EN is set to 0.7V or less. All the circuits, such as internal
reference voltage VREF, oscillators OSC, and drivers are turned off during standby, and current consumption of the
power supply becomes 0μA(25℃, Typ.). Via the FB terminal, the output capacitor is discharged at a resistance of
1kΩ.
■
Start operation
The circuit starts operating when terminal EN is set to 2.1V or more. A soft start circuit (SOFT START) is integrated to
prevent inrush current to the capacitor when starting. The output voltage reaches a set voltage with 1ms(Typ.) while
following the startup of the soft start circuit. There is a delay of about 200μsec up to the beginning of soft start after the
terminal EN is turned on and the internal logic operation is started. In order to prevent a defective start, the short-circuit
protection is not active during startup.
■
Error amplifier and phase compensation
The voltage of the output feedback terminal (FB) is compared with an internal reference voltage, the voltage
corresponding to the difference is generated, and send to the PWM comparator which determines the duty ratio of the
output. The feedback resistor which determines the output voltage, resistance for compensations, and the capacitor are
integrated into the BD90571EFJ-C.
■
Oscillator
The 2.25MHz(Typ.) internally fixed clock is generated and send to the slope generation circuit (SLOPE) and to the
driver.
■
Light load mode and PWM fixation mode
BD90571EFJ-C operates in the light load mode when the terminal MODE is set to 0.7V or less. When the output load
current is small, the switching operation automatically becomes intermittent in the light load mode. The efficiency at
light load improves compared to the PWM fixation mode because the switching loss is suppressed by operating
intermittently. The intermittently operating load current level changes depending on the input voltage, inductor value,
etc.
If the terminal MODE is set to 2.1V or more the chip operates in PWM fixation mode. In the PWM fixation mode, the
efficiency at a light load decreases compared with the light load mode. However, because of the fixed frequency
switching through the entire load range, noise is more easily countered.
VOUT(10mV/div)
VOUT(10mV/div)
SW
SW
Figure 5. Switching operation at light load mode
■
Figure 6. Switching operation at PWM mode
Overcurrent detection
When in the output stage the current flowing to the Pch FET is 1.0A(Min.) or more, the Pch FET is turned off and the
power supply to the output is intercepted. The overcurrent detection is operated every cycle, limits the switching duty,
and returns at the next clock cycle.
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BD90571EFJ-C
■
Output short-circuit detection
The output short-circuit detection circuit (SCP) detects a short-circuit of the output when output voltage falls below 70%
of a set value during 1024 cycles of the frequency. In this case, the Pch FET and Nch FET of the output are turned off,
and the power supply is intercepted. The count is reset when the output voltage returns to 70% or more before 1024
cycles, and the output voltage returns to the set value.
Ths SCP automatically resets when after 1024 cycles of the frequency after detecting the short-circuit, and switching
is restarted. Resetting triggers the soft start operation because the internal soft start circuit is initialized when the
short-circuit detection is activated. The short-circuit detection circuit is not active while soft start is starting. In case the
short-circuit continues after resetting, the cycle of starting with a soft start, turning off the output after 1024 cycles, and
returning after 1024 cycles is repeated.
■
Output overvoltage detection
When the output overvoltage detection circuit (OVP) detects that the output voltage is exceeding 120% of a set value,
the Pch FET and Nch FET of the output are turned off and the power supply is intercepted. Switching is restarted if
after the power supply interception the output decreases and the overvoltage situation is released. The overvoltage
detection voltage and the release voltage have a hysteresis of about 100mV.
■
UVLO
The UVLO circuit is activated and shuts down the circuit when the input voltage (VIN) decreases to 2.6V or less. When
the UVLO is activated, the control circuit of the error amplifier, the oscillator, the driver and, the output is turned off. Via
the FB terminal, the output capacitor is discharged at a resistance of 1kohm. Afterwards, UVLO is released when the
input voltage VIN rises to 2.69V or more, and the output is restored. The output voltage starts with soft start when
UVLO is reset.
■
Thermal shutdown(TSD)
Thermal shutdown (TSD) is activated when the IC junction part temperature exceeds 175 ℃(Typ.). When the TSD is
activated the control circuit of the error amplifier, the oscillator, the driver, and the output is turned off. There is
hysteresis in the detection temperature of TSD, which is reset when the junction temperature decreases to 150℃(Typ.)
or less. The output voltage starts with soft start when TSD is reset.
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Datasheet
BD90571EFJ-C
●Absolute maximum rating
Parameter
Symbol
Rating
Unit
VIN
-0.3～7 *1
V
PVIN
-0.3～7 *1
V
EN voltage
EN
-0.3～7
V
SW voltage
SW
-1.0～PVIN *1
V
FB voltage
FB
-0.3～7
V
MODE
-0.3～7
V
Pd
3.75 *2
W
Operating temperature range
Topr
-40～+125
℃
Storage temperature range
Tstg
-55～+150
℃
Tj
+150
℃
VIN voltage
PVIN voltage
MODE voltage
Power dissipation
Junction temperature
*1 Pd should not be exceeded.
*2 33.3mW/°C reduction when Ta≧25°C if mounted on 4 layers glass epoxy board of 70mm×70mm×1.6mm
●Recommended operating range (Ta=-40~+125°C)
Parameter
Symbol
Operating Range
Unit
VVIN
2.69～5.5
V
VPVIN
2.69～5.5
V
VEN
0～5.5(*1)
V
MODE voltage
VMODE
0～5.5
V
Output current
ISW
0～1
A
VIN voltage
PVIN voltage
EN voltage
*1 The circuit goes into test mode when the terminal EN is set at 6V or higher.
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Datasheet
BD90571EFJ-C
●Electrical characteristics (unless otherwise specified: Ta=-40~+125°C, VIN=PVIN=5V, EN=3.3V)
Parameter
Symbol
Guaranteed Limit
Min.
Typ.
Max.
Unit
Conditions
Standby circuit current
IST
-
0
1
μA
EN=0V, Ta=25℃
Circuit current
ICC
-
650
1300
μA
FB=1.3V, Ta=25℃
UVLO detection voltage
VUVLO1
2.30
2.45
2.60
V
Sweep down
UVLO release voltage
VUVLO2
2.40
2.55
2.69
V
Sweep up
EN threshold voltage
VEN
0.7
1.4
2.1
V
EN inflow current
IEN
0.8
1.4
2
μA
FOSC
1.8
2.25
2.7
MHz
Output voltage
VFB
1.176
1.20
1.224
V
Io=0mA
FB pull-down resistance
RFB
0.4
1
2
MΩ
FB=1.2V
Soft start time
TSS
0.4
1
2
ms
Pch FET ON resistance
PRON
-
85
-
mΩ
Nch FET ON resistance
NRON
-
70
-
mΩ
Overcurrent detection current
IOCP
-
2.5
-
A
VOVP
1.3
1.45
1.6
V
VSCP
0.7
0.85
1.0
V
MODE threshold voltage
VMODE
0.9
1.6
2.3
V
MODE inflow current
IMODE
3.5
7
14
μA
Operating frequency
Output overvoltage detection
voltage
Output short-circuit detection
voltage
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MODE=3.3V
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Datasheet
BD90571EFJ-C
●Typical Performance Curve
100
2.0
90
STANDBY CIRCUIT CURRENT [uA]
Light Load MODE
80
EFFICIENCY [%]
70
60
PWM MODE
50
40
30
20
VIN=3.3V
Figure 1. CIRCUIT
10
0
1.5
1.0
0.5
0.0
0.01
0.10
LOAD CURRENT [A]
1.00
-40
Figure 7. Efficiency (VIN=3.3V)
0
20
40
60
80
TEMPERATURE [℃]
100
120
Figure 8. Standby circuit current
0.9
1.23
1.22
OUTPUT VOLTAGE [V]
0.8
CIRCUIT CURRENT [mA]
-20
0.7
0.6
0.5
1.21
1.20
1.19
1.18
1.17
0.4
-40
-20
0
20
40
60
80
TEMPERATURE [℃]
100
-40
120
Figure 9. Circuit Current
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-20
0
20 40
60 80
TEMPERATURE [℃]
100 120
Figure 10. Output voltage vs. temperature
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BD90571EFJ-C
0.0
2.1
1.9
EN THRESHOLD VOLTAGE [V]
⊿OUTPUT VOLTAGE [%]
-0.1
-0.2
-0.3
VIN=5V,
MODE=3.3V
Figure 1 Circuit
Rohm evaluation
board
-0.4
1.7
1.5
1.3
1.1
0.9
0.7
-0.5
0.0
0.5
LOAD CURRENT [A]
-40
1.0
-20
Figure 11. Load regulation
0
20
40 60
80
TEMPERATURE [℃]
100 120
Figure 12. EN threshold voltage
2.7
2.6
ON
2.5
FREQUENCY [MHz]
UVLO THRESHOLD VOLTAGE [V]
2.6
OFF
2.4
2.4
2.2
2.0
2.3
1.8
-40
-20
0
20
40
60
80
TEMPERATURE [℃]
100
120
-40
Figure 13. UVLO detect/release voltage
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-20
0
20
40
60
80
TEMPERATURE [℃]
Figure 14.
8/19
100
120
Frequency vs. temperature
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Datasheet
BD90571EFJ-C
90
2.6
80
ON RESISTANCE [mΩ]
FREQUENCY [MHz]
70
2.4
2.2
2.0
Pch
60
50
Nch
40
30
20
10
1.8
0
2.5
3.0
3.5
4.0
4.5
5.0
INPUT VOLTAGE VIN[V]
5.5
-40
Figure 15. Frequency vs. input voltage
0
20
40
60
80
TEMPERATURE [℃]
100
120
Figure 16. FET ON resistance
4.0
1.6
OVP
1.5
THRESHOLD VOLTAGE [V]
OCP THRESHOLD CURRENT [A]
-20
3.0
2.0
1.4
1.3
1.2
1.1
1.0
SCP
0.9
0.8
1.0
0.7
-40
-20
0
20 40 60 80
TEMPERATURE [℃]
100 120
-40
Figure 17. Over current detect vs. temperature
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-20
0
20
40 60
80
TEMPERATURE [℃]
100 120
Figure 18. Output over/short detect voltage
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Datasheet
BD90571EFJ-C
The characteristics below are reference data which are measured with the typical application circuit as shown in Figure 1
Also, these characteristics are influenced by the external components and board layout.
EN
SW
VOUT
Figure 19. Loop response (VIN=5V, IOUT=1A)
Figure 20. Start-up waveform (VIN=5V, MODE=3.3V)
VOUT(50mV/div)
VOUT(50mV/div)
IOUT(0.5A/div)
IOUT(0.5A/div)
Figure 21. Load response (VIN=5V, MODE=0V)
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Figure 22. Load response (VIN=5V, MODE=3.3V)
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BD90571EFJ-C
●Timing chart
■
Start-up
Figure 23. Start-up
■
OCP
Figure 24. OCP
■
SCP
Figure 25. SCP
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BD90571EFJ-C
●Selection of external components
■
Selection of inductor
The inductor value greatly influences the output ripple current. The larger
the coil is, the more the ripple current drops as shown in the equation below.
（PVIN-VOUT）×VOUT
ΔIL =
L×PVIN×f
ΔIL
[A]
An inductor with a low value will cause the ripple current to increase and also
cause an increase of the ripple element of the output voltage.
The optimal output ripple current setting is between 10% ~ 30% of the maximum
output current.
PVIN
IL
VOUT
L
ΔIL = 0.2×IOUTmax. [A]
Co
（PVIN-VOUT）×VOUT
[H]
ΔIL×PVIN×f
（ΔIL: Output ripple current, f: switching frequency）
L=
Figure 26. .Ripple current
Supplying the coil with a current exceeding the coil’s rated current will cause magnetic saturation of the coil and will
decrease the efficiency of the coil. Please allow for a sufficient margin in selecting the inductor to ensure that the peak
current does not exceed the inductor’s rated current. Please select a coil with a small resistance element (DCR, ACR)
to reduce the coil loss, and to improve efficiency.
■
Selection of input capacitor
The input capacitor serves to lower the impedance of the power supply connected to the input pin (VIN, PVIN). An
increase of the impedance of this power supply can cause input voltage instability and may negatively impact
oscillation and ripple rejection characteristics. Therefore, it is necessary to place an input capacitor in close proximity to
the VIN, PVIN, GND and PGND pins.
We recommend selecting a ceramic capacitor with a value of 10uF or more that influenced by changes in temperature
as little as possible and that has a sufficiently large permissible ripple current. The ripple current RMS can be
calculated using the following equation.
IRMS = IOUT ×
VOUT（VIN - VOUT） [A]
VIN
Note that depending on the capacitor, the capacitance may be greatly influenced by the applied voltage. Please select
a capacitor with good DC bias characteristics and with a high voltage.
■
Selection of output capacitor
We recommend selecting a ceramic capacitor. The ripple element of the output voltage is determined by the ESR of
the output capacitor. Please take the permissible voltage of the actual application into consideration when selecting the
output capacitor. The ripple element of the output voltage can be calculated by using the equation below. Selecting a
low-ESR capacitor can reduce the ripple element of the output voltage. Note that depending on the capacitor, the
capacitance may be greatly influenced by the applied voltage. Please select a acapacitor with god DC bias
characteristics and with a high voltage.
ΔVPP = ΔIL × RESR +
ΔIL
Co
×
Vo
VIN
×
1
f
[V]
f: Switching frequency
The startup time needs to be within the soft start time. Therefore, please take the following equation into consideration
when selecting the output capacitor
.
TSS × (ILimit – IOUT)
Tss: Soft start time (typ. 1ms)
Co ≦
VOUT
ILimit: Overcurrent detection value (min. 1A)
Non-optimal capacitance values may cause startup problems. Especially in cases of extremely large capacitance
values, the possibility exists that the inrush current at startup will activate the overcurrent protection, thus not starting
the output. Therefore, verification and conformation with the actual application is recommended.
■
Selection of Schottky diode
Depending on the application the efficiency may be improved by placing a Schottky diode between the SW pin and
PGND pin thereby creating a current path when the synchronous switching (Nch FET) is off. When selecting the
Schottky diode ensure that the maximum reverse voltage is higher than the input voltage and that the rated current is
higher than the maximum inductor current (the sum of the maximum output current and inductor ripple current).
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BD90571EFJ-C
●Notes on the substrate layout
The substrate layout greatly influences the stable operation of the IC. Depending on the substrate layout the IC might not
show its original characteristics or might not function properly.
Please note the following points when creating the substrate layout.

The input capacitors C1 and C2 should be placed as close as possible to the VIN, PVIN, GND and PGND pins.

The output voltage feedback line should be separated from lines with a lot of noise such as the SW line.

The GND signal should be separated from the input capacitor and the GND and PGND of the output capacitor and
brought together at one point.

The output capacitors C3 and C4 should be placed in close proximity to inductor L1.

The inductor L1 should be placed as close as possible to the SW pin. The pattern area of the SW node should be as
small as possible.

The MODE pin should be pulled down via R1 by GND and pulled up via R2 by VIN.
It is also possible to directly supple the MODE pin with voltage.

The feedback frequency characteristics (phase margin) can be measured by inserting a resistor at the location of R3
and using FRA. However, this should be shorted during normal operation.
L1
VIN
1 PVIN
C2
C1
EN
VOUT
SW 8
2 VIN
PGND 7
3 EN
FB 6
C3
C4
R3
4 GND
VIN
MODE 5
R1
R2
Figure 27. Reference circuit
VIN
GND
VOUT
C4
C3
R3
C2
L1
C1
IC
R2
R1
EN
<TOP VIEW>
<BOTTOM VIEW>
Figure 28. Reference layout pattern
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BD90571EFJ-C
●Heat dissipation
The maximum allowable junction temperature Tj of BD90571EFJ-C is 150°C. In case Tj exceeds 150℃, the temperature
protection circuit is activated and the circuit shuts down. Therefore, it is necessary to design the system requirements and
the board layout so that the junction temperature does not exceed 150℃ in the power-supply voltage, the output load and
the operating temperature range.
The maximum junction temperature can be calculated using the ambient temperature Ta, the thermal resistance θja of the
package and heat dissipation P of the IC.
Tj = Ta + θja × P [°C]
The thermal resistance θja of the package changes depending on the number of layers and the copper foil area of the
board.
The heat dissipation PTOTAL of the IC can be calculated by the equation below.
PTOTAL = PICC + PRON + PSW [W]
PICC = VIN × ICC ・・・ Heat dissipation in control circuit
PRON = Ron × Io2 ・・・ Heat dissipation in output FET
PSW = Tr × Io × VIN × F ・・・ Heat dissipation in switching
ICC: circuit current
Ron: ON resistance of the output FET
F: frequency
All values are specified in the electrical characteristics.
Tr is the rise time and fall time at switching. In the standard case is 5nsec and in the max case is 10nsec.
Also, these characteristics are influenced by the external components and board layout.
●Heat reduction characteristic
4
④3.75W
IC mounted on ROHM standard board
・Board size：70mm×70mm×1.6mm
・The board and the back exposure heat radiation
board part of package are connected with solder.
Power Dissipation : Pd （W)
3.5
3
① IC unit, θja=249.5℃/W
② 2 layers board (Copper foil：15mm×15mm),
θja =113.6℃/W
③ 2 layers board (Copper foil：70mm×70mm),
θja =59.2℃/W
④ 4 layers board (Copper foil：70mm×70mm),
θja =33.3℃/W
2.5
③2.11W
2
1.5
②1.1W
1
①0.5W
0.5
0
0
25
50
75
100
125
150
Ambient Temperature: Ta(℃)
Figure 29. Heat reduction characteristic
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BD90571EFJ-C
●I/O equivalence circuit
3PIN (EN)
5PIN (MODE)
6PIN (FB)
8PIN (SW)
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BD90571EFJ-C
●Operational Notes
1.
Absolute maximum ratings
Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters may result in
damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage
(e.g. short circuit, open circuit, etc.). Therefore, if any special mode is being considered with values expected to exceed
the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered.
2.
Thermal protection circuit (TSD)
If the junction temperature (Tj) exceeds 175℃(Typ.) the thermal protection circuit (TSD) is activated and the output is
put in the OFF status. The releasing temperature has hysteresis of about 25°C(typ.). The thermal protection circuit
only functions to block thermal overloads from reaching the IC. Its purpose is not to protect the circuit or to guarantee
the operations of the IC. Therefore, the IC should not be continuously operated after this circuit has been activated,
nor should the IC be used in applications where the activation of this circuit is a prerequisite.
3.
Overcurrent protection circuit
This IC incorporates an integrated overcurrent protection circuit that operates in accordance with the rated output
capacity. This circuit serves to protect the IC from damage when the load becomes shorted. The protection circuit is
effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in
applications characterized by the continuous or transitive operation of the protection circuit.
4.
High temperature, no load behavior
In a situation where there is a high temperature and no load, it might be that the leak current of the output transistor
causes output voltage to rise (up to maximum VIN). It case it is expected that in the application conditions the output
load drops below 1mA, please place a 1kohm resistor at the output in order to prevent an no-load situation.
5.
Power dissipation, ASO
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip and lead to a decrease of the reliability. Therefore, allow for sufficient
margins to ensure use within the power dissipation rating. Also, please ensure in the design that the absolute
maximum rating of the output transistor and the ASO are not exceeded when operating the IC.
6.
Operation in strong electromagnetic fields
Use caution when operating in the presence of strong electromagnetic fields, as this may cause the IC to malfunction.
7.
Connection to the power supply connector
A reverse connection to the power supply connector may cause damages to the IC. In order to prevent against
reverse connection damages please externally place a diode between the power supply and the power supply pin of
the IC.
8.
Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may
result in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins
(caused by poor soldering or foreign objects) may result in damage to the IC.
9.
Short to power supply, short to ground, inter-pin shorts
Please avoid shorts between the output pin and the power supply (VIN, PVIN), shorts between the output pin and
ground (GND, PGND) and shorts between the output pins.
10. Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the
IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport
and storage.
11. GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no
pins are at a voltage below the GND at any time, regardless of transient characteristics.
12. Wiring of VIN and GND
For the wiring of VIN, PVIN, GND and PGND please create a layout with as wide as possible wires and a minimum
distance in between the wires. In case of both small signal lines and high current lines, use single-point grounding to
separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring
resistance and high current do not cause any voltage change in the small-signal. Also place a capacitor at the
grounding point for stabilization.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/19
TSZ02201-0T1T0AL00030-1-2
31.JUL.2012 Rev.001
Datasheet
BD90571EFJ-C
13. Capacitor between PVIN and PGND
The capacitor between PVIN and PGND absorbs the steep changes in voltage and current caused by the PWM drive
and thereby suppress fluctuations in the PVIN voltage. However, this effect is diminished due to wiring impedance the
further the capacitor is removed from the IC.
14. Input pins
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a
parasitic diode or transistor. Relations between each potential may form as shown in the example below, where a
resistor and transistor are connected to a pin:
 With the resistor, when GND＞ Pin A, and with the transistor (NPN), when GND＞Pin B:
The P-N junction operates as a parasitic diode.
 With the transistor (NPN), when GND＞ Pin B:
The P-N junction operates as a parasitic transistor by interacting with the N layers of elements in proximity to the
parasitic diode described above.
Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between
circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not
employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than
the (P substrate) GND.
Transistor (NPN)
B
Resistor
(Pin A)
(Pin B)
C
(Pin B)
E
B
P
P+
N
P
N
P+
N
P+
N
Parasitic
element
GND
E
P
N
N
C
GND
P+
Parasitic element
or transistor
N
P sub
(Pin A)
Parasitic element or
transistor
GND
Parasitic
element
Figure 30. Example of IC structure
15. Application current and constants
The application circuit as shown in Figure 1. and the constants are examples to show the standard operation and
application of this IC. In case of creating a design for mass production with different external components please
contact ROHM for detailed information.
16. In some applications, the PVIN pin and SW pin potential might be reversed, possibly resulting in circuit internal
damage or damage to the elements. For example, while the external capacitor is charged, the PVIN shorts to the
GND. To prevent this we recommend reverse polarity diodes in series or placing a bypass diode between the SW pin
and PVIN pin.
Bypass
diode
Reverse polarity diode PVIN
Pin
Figure 31. Measure for reverse
Note concerning this document
The Japanese version of this document is the official specification. This translation should be seen as a reference to aid reading
the official specification. In case of any discrapencies between the two versions, the offical version always takes precedence.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
17/19
TSZ02201-0T1T0AL00030-1-2
31.JUL.2012 Rev.001
Datasheet
BD90571EFJ-C
●Ordering Information
B
D
9
0
5
7
1
E
F
J
-
Package
EFJ: HTSOP-J8
CE2
Packaging and forming specification
CE2: Embossed tape and reel
●Physical Dimension Tape and Reel Information
HTSOP-J8
<Tape and Reel information>
+6°
4°
−4°
(2.4)
3.9±0.1
6.0±0.2
8 7 6 5
1
1.05±0.2
(3.2)
0.65±0.15
4.9±0.1
(MAX 5.25 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
2 3 4
1PIN MARK
+0.05
0.17 -0.03
1.0MAX
0.545
S
0.08±0.08
0.85±0.05
1.27
+0.05
0.42 -0.04
0.08
M
0.08 S
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
HTSOP-J8
(TOP VIEW)
D90571
Lot. No.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
18/19
TSZ02201-0T1T0AL00030-1-2
31.JUL.2012 Rev.001
Datasheet
BD90571EFJ-C
●Revision History
Rev.
Date
001
2012/07/31
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Notes
New release
19/19
TSZ02201-0T1T0AL00030-1-2
31.JUL.2012 Rev.001
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.