Standard Variable Output LDO Regulators 300mA Standard Variable Output LDO Regulator BA3662CP-V5 No.10023EAT05 ●Description The BA3662CP-V5 is low-saturation regulator. The output voltage can be arbitrarily configured using the external resistance. This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits and a thermal shutdown circuit that protects the IC from thermal damage due to overloading. ●Features 1) Output Current: 300mA 2) High Output Voltage Precision : ±2% 3) Low saturation with PNP output 4) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits 5) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading 6) Built-in over- voltage protection circuit that prevents the destruction of the IC due to power supply surges 7) TO220CP-V5 packaging ●Applications Audiovisual equipments, FPDs, televisions, personal computers or any other consumer device ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Ratings Unit Vcc -0.3～+35.0 V VCTL -0.3～+Vcc V Pd 2000 mW Operating Temperature Range Topr -40～+125 ℃ Storage Temperature Range Tstg -55～+150 ℃ Tjmax +150 ℃ Vcc peak +50 V ※1 Supply Voltage Output Control Voltage ※2 Power Dissipation Maximum Junction Temperature Peak Supply Voltage ※3 ※ 1 Not to exceed Pd. ※ 2 TO220CP-V5:Derating in done at 16mW/℃ for operating above Ta≧25℃.(without heat sink) ※ 3 Applied voltage : 200msec or less (tr≥1msec) NOTE : This product is not designed for protection against radioactive rays. tr≧1msec 50V 35V MAX200msec (Voltage Supply more than 35V) 0V www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/11 2010.10 - Rev.A Technical Note BA3662CP-V5 ●Operating conditions (Ta=-40～+125℃) Parameter Symbol Min. Max. Unit Supply Voltage Vcc 4.0 25.0 V Output Control Voltage VCTL 0 Vcc V Output Current Io 0 0.3 A Output Voltage Vo 3.0 15.0 V ●Protect features Parameter Over Voltage protection Symbol Min. Typ. Max. Unit Vcc 26 28 30 V ●Electrical characteristics (Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=200mA,R1=2.2kΩ, R2=6.8kΩ) Parameter Symbol Min. Typ. Max. Unit Shut Down Current Isd － 0 10 µA VCTL=0V Bias Current Ib － 2.5 5.0 mA VCTL=2V, Io=0mA C Terminal Voltage Vc 1.200 1.225 1.250 V Io=50mA Dropout Voltage ⊿Vd － 0.3 0.5 V Vcc=Vo×0.95 Ripple Rejection R.R. 45 55 － dB 1 f=120Hz, ein※ =1Vrms, Io=100mA Line Regulation Reg.I － 20 100 mV Vcc=6→25V Load Regulation Reg.L － 40 80 mV Io=5mA→200mA Tcvo － ±0.02 － %/℃ Ios － 0.1 － A Vcc=25V,Vo=0V ON Mode Voltage VthH 2.0 － － V ACTIVE MODE, Io=0mA OFF Mode Voltage VthL － － 0.8 V OFF MODE, Io=0mA Input High Current ICTL 100 200 300 µA VCTL=5V, Io=0mA Temperature Coefficient of Output Voltage Short Current Conditions Io=5mA,Tj=0～125℃ ※ 1 ein : Input Voltage Ripple www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/11 2010.10 - Rev.A Technical Note BA3662CP-V5 6 6 2.5 5 5 2.0 1.5 1.0 0.5 OUTPUT VOLTAGE ： Vo [V] 3.0 OUTPUT VOLTAGE ： Vo [V] CIRCUIT CURRENT ：Ib+I FEEDBACK_R [mA] ●Reference data BA3662CP-V5(5.0V preset voltage) (Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=200mA,R1=2.2kΩ, R2=6.8kΩ) 4 3 2 1 0.0 2 4 6 8 10 12 14 16 18 20 22 24 0 2 4 SUPPLY VOLTAGE ： Vcc [V] 0 10 12 14 16 18 20 22 24 4 3 2 1 400 500 200 150 100 50 50 40 30 20 10 0 0 5.0 4.5 4.0 3.5 -40 -20 0 20 40 60 50 100 150 200 250 300 10 80 20 12 8 4 800 700 600 500 400 300 200 100 0 0 0 50 100 150 200 250 300 0 Fig.8 Circuit Current (Io=0mA→300mA) (IFEEDBACK_R≒555µA) OUTPUT VOLTAGE ： Vo [V] 5 OUTPUT VOLTAGE ： Vo [V] 5 0 4 3 2 1 4 6 8 10 12 14 16 18 20 22 24 CONTROL VOLTAGE ： VCTL [V] Fig.10 CTL Voltage vs Output Voltage www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8 10 12 14 16 18 20 22 24 4 3 2 1 0 0 2 6 Fig.9 CTL Voltage vs CTL Current 5 1 4 CONTROL VOLTAGE ：VCTL [V] 6 2 2 OUTPUT CURRENT ： Io [mA] 6 3 100000 1000000 Fig.6 Ripple Rejection (lo=100mA) 6 4 10000 900 16 100 Fig.7 Output Voltage 1000 1000 AMBIENT TEMPERATURE ： Ta [℃] 0 100 FREQUENCY ： f [Hz] CIRCUIT CURRENT ： I CTL [µA] CIRCUIT CURRENT ： Ib+I FEEDBACK_R [mA] 5.5 10 12 14 16 18 20 22 24 60 Fig.5 Dropout Voltage Io-△Vd Characteristics (Vcc=4.75V) 6.0 8 70 OUTPUT CURRENT ： IO [mA] Fig.4 Load Regulation 6 Fig.3 Line Regulation (Io=200mA) 250 600 4 SUPPLY VOLTAGE ： Vcc [V] 0 300 2 80 OUTPUT CURRENT ： IO[mA] OUTPUT VOLTAGE ： Vo [V] 8 RIPPLE REJECTION ： R.R. [dB] DROPOUT VOLTAGE ： ΔVd [mV] OUTPUT VOLTAGE ： Vo [V] 5 0 OUTPUT VOLTAGE ： Vo [V] 6 300 200 1 Fig.2 Line Regulation 6 100 2 SUPPLY VOLTAGE ： Vcc [V] Fig.1 Circuit Current 0 3 0 0 0 4 0 5 10 15 20 25 30 SUPPLY VOLTAGE ： Vcc [V] Fig.11 Overvoltage Operating (lo = 200mA) 3/11 35 130 140 150 160 170 180 190 AMBIENT TEMPERATURE ： Ta [℃] Fig.12 Thermal Shutdown Circuit Characteristics 2010.10 - Rev.A Technical Note BA3662CP-V5 ●Measurement Circuit for Reference Data A Vo Vcc Vo Vcc 6.8kΩ 1µ F CTL GND Vcc Vo CTL ADJ 6.8kΩ 1µ F + ADJ CTL 22µ F GND 6.8kΩ 1µ F + ADJ V GND + V 22µ F 22µ F 200mA 2.2kΩ 5V 2.2kΩ 2.2kΩ 5V IFEEDBACK _R Measurement Circuit of Fig.1 Measurement Circuit of Fig.2 Measurement Circuit of Fig.3 V Vo Vcc Vo Vcc 6.8kΩ 1µ F CTL GND 6.8kΩ + ADJ A 22µ F 10V 1µ F CTL GND 1µ F 22µ F 10V CTL V 2.2kΩ GND 2.2kΩ Vcc Vo CTL ADJ 6.8kΩ 1µ F 22µ F A GND + 22µ F 10V IFEEDBACK _R 5V 100mA Measurement Circuit of Fig.6 + ADJ 10V 2.2kΩ 5V + ADJ 6.8kΩ + ADJ GND 5V Vo Vcc 6.8kΩ 1µ F CTL 22µ F 10V 2.2kΩ Measurement Circuit of Fig.5 Vo Vcc 1µ F ～ 22µ F 5V Measurement Circuit of Fig.4 6.8kΩ 1Vrms A + ADJ GND 4.75V 2.2kΩ 5V CTL Vo Vcc 2.2kΩ A Vo Vcc Vo Vcc 6.8kΩ 1µ F CTL GND 22µ F 10V Vcc Vo CTL ADJ 6.8kΩ 1µ F + ADJ Measurement Circuit of Fig.9 Measurement Circuit of Fig.8 Measurement Circuit of Fig.7 CTL V 2.2kΩ Measurement Circuit of Fig.10 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. GND V 22µ F 10V 2.2kΩ 5V 6.8kΩ 1µ F + ADJ 200mA Measurement Circuit of Fig.11 4/11 GND + 22µ F 10V 5V V 2.2kΩ Measurement Circuit of Fig.12 2010.10 - Rev.A Technical Note BA3662CP-V5 ●Block Diagrams Vref Vcc Driver 2 VO Vref :Bandgap Reference OVP :Over Voltage protection OCP :Over Current protection TSD :Thermal Shut Down Driver :Power Transistor Driver OVP 1 TSD 3 CTL 4 + OCP 5 GND R1 Fig.13 Pin No. Pin Name 1 CTL Output Control Pin 2 Vcc Power Supply Pin 3 GND GND 4 Vo Output Pin 5 C Adjustable Pin C R2 Function ●Top View〈Package dimension〉 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 5/11 2010.10 - Rev.A Technical Note BA3662CP-V5 ●Input / Output equivalent circuit diagrams CTL Pin Vcc Pin Vo Pin C Pin Vcc 25kΩ Vcc CTL 10 kΩ C IC 25kΩ Vo 5.5 kΩ ●Output voltage configuration method Please connect resistors R1 and R2 (which determines the output voltage) as shown in Fig.14. Please be aware that the offset due to the current that flows from the C terminal becomes large when resistors with large values are used. The use of resistors with R1=2kΩ to 15kΩ is recommended. Vo R2 IC Vo ≒ Vc × (R1+R2) / R1 Vc≒1.225V (TYP.) C pin R1 Fig.14 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/11 2010.10 - Rev.A Technical Note BA3662CP-V5 ●Thermal design 25 (1)When using a maximum heat sick : θjc=6.25(℃/W) (2)When using an IC alone : θja=62.5(℃/W) Power Dissipation Pd （W) (1) 20.0 20 15 10 5 (2) 2.0 0 0 25 50 75 100 125 150 Ambient Temperature Ta(℃) Fig.15 When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.15. The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at temperatures less than the maximum junction temperature Tjmax. Fig.15 shows the acceptable loss and heat reducing characteristics of the TO220CP-V5 package. Even when the ambient temperature Ta is a normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures less than the acceptable loss Pd. The calculation method for power consumption Pc(W) is as follows. Pc=(Vcc－Vo)×Io+Vcc×Ib Acceptable loss Pd≧Pc Solving this for load current Io in order to operate within the acceptable loss, Io≦ Pd－Vcc×Ib Vcc－Vo Vcc: Vo: Io: Ib: Ishort: Input voltage Output voltage Load current Circuit current Short current (Please refer to Figs.8 for Ib.) It is then possible to find the maximum load current IoMax with respect to the applied voltage Vcc at the time of thermal design. Calculation Example) When Ta=85℃,Vcc=10V,Vo=5V 1.04－10×Ib 5 Io≦192mA (Ib:8mA) Io≦ With the IC alone :θja=62.5℃/W → -16mW/℃ 25℃=2.0W → 85℃=1.04W Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is : Pc=Vcc×(Ib+Ishort) (Please refer to Fig.4 for Ishort.) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 7/11 2010.10 - Rev.A Technical Note BA3662CP-V5 ●Notes for use 1. Absolute maximum ratings Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics. 3. GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics. 4. Ground wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Inter-pin shorts and mounting errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign objects) may result in damage to the IC. 6. Operation in strong electromagnetic fields Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. 7. Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Thermal consideration Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc) Tjmax : Maximum junction temperature=150[℃], θja : Thermal resistance of package-ambience[℃/W], Pc : Power dissipation [W], Vo : Output Voltage, Io : Load, Package Power dissipation Power dissipation Ta : Peripheral temperature[℃] , Pd : Package Power dissipation [W], Vcc : Input Voltage, Ib : Bias Current : Pd (W)=(Tjmax－Ta)/θja : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib 9. Vcc pin Insert a capacitor(capacitor≧0.33µF～) between the Vcc and GND pins. application. Be sure to allow a sufficient margin for input voltage levels. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/11 The appropriate capacitance value varies by 2010.10 - Rev.A Technical Note BA3662CP-V5 10. Vo Terminal Please attach an anti-oscillation capacitor between Vo and GND. The capacitance of the capacitor may significantly change due to factors such as temperature changes, which may cause oscillations. Please use a tantalum capacitor or aluminum electrolytic capacitor with favorable characteristics and small external series resistance (ESR) even at low temperatures. The output oscillates regardless of whether the ESR is large or small. Please use the IC within the stable operating region while referring to the ESR characteristics reference data shown in Fig.16. In cases where there are sudden load fluctuations, the large capacitor is recommended. Below figure, it is ESR-to-Io stability Area characteristics, measured by 22µF-ceramic-capacitor and resistor connected in series. This characteristic is not equal value perfectly to 22µF-aluminum electrolytic capacitor in order to measurement method. Note, however, that the stable range suggested in the figure depends on the IC and the resistance load involved, and can vary with the board’s wiring impedance, input impedance, and/or load impedance. Therefore, be certain to ascertain the final status of these items for actual use. Keep capacitor capacitance within a range of 22µF～1000µF. It is also recommended that a 0.33µF bypass capacitor be connected as close to the input pin-GND as location possible. However, in situations such as rapid fluctuation of the input voltage or the load, please check the operation in real application to determine proper capacitance. Vcc=10V Vo=5V Ta=25℃ R1=2kΩ～15kΩ Cin=0.33µF Cout=22µF 100 U n sta b le o p e ra tin g re g io n Cout_ESR（Ω） Cout(22µF) 10 R2 Cin Vcc (0.33µF) (10V) 1 CTL GND ADJ Io (ROUT) VCTL (5V) U n sta b le o p e ra tin g re g io n 0 .1 0 ESR (0.001Ω～) Vo Vcc Sta b le o p e ra tin g re g io n 100 200 300 R1 (2k～15kΩ) ※Operation Note 10 Measurement circuit Io[mA] Fig.16 Cout_ESR vs Io (reference data) 11. Over current protection circuit (OCP) The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous or transitive operation of the protection circuits. 12. Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit is assumed. 13. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent reverse current flow, or insert bypass diodes between Vcc and each pin. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/11 2010.10 - Rev.A Technical Note BA3662CP-V5 14. Positive voltage surges on VCC pin A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 50V on the VCC pin. Vcc GND 15. Negative voltage surges on VCC pin A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the VCC pin. Vcc GND 16. Output protection diode Loads with large inductance components may cause reverse current flow during startup or shutdown. protection diode should be inserted on the output to protect the IC. In such cases, a 17. Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors. For example (refer to the figure below): ○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode ○When GND > Pin B, the PN junction operates as a parasitic transistor Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Transistor (NPN) Resistor B (Pin B) (Pin A) (Pin B) E C B N P P+ N P P+ N P+ N Parasitic elements GND E P P+ N N GND N P substrate Parasitic elements or transistors C GND Parasitic elements or transistors (Pin A) Parasitic elements Example of Simple Monolithic IC Architecture www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/11 2010.10 - Rev.A Technical Note BA3662CP-V5 ●Ordering part number B A Part No. 3 6 6 2 Part No. C P - V 5 Package CP-V5: TO220CP-V5 E 2 Packaging and forming specification E2: Embossed tape and reel TO220CP-V5 1.444 <Tape and Reel information> 4.5±0.1 0.82±0.1 0.92 1.778 Tape Embossed carrier tape Quantity 500pcs Direction of feed E2 The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 16.92 13.60 +0.2 2.8 -0.1 (1.0) 8.0 ± 0.2 12.0 ± 0.2 4.92 ± 0.2 1.0 ± 0.2 +0.4 15.2 -0.2 +0.3 φ3.2±0.1 10.0 -0.1 0.42±0.1 1.58 (2.85) 4.12 (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Reel 11/11 1pin Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.10 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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