PHILIPS TEA1622P

TEA1622P
STARplugTM
Rev. 01 — 17 March 2004
Product data sheet
1. General description
The TEA1622P is a Switched Mode Power Supply (SMPS) controller IC that operates
directly from the rectified universal mains. It is implemented in the high voltage EZ-HV™
SOI process, combined with a low voltage BICMOS process.
The device includes a high voltage power switch and a circuit for start-up directly from the
rectified mains voltage. A dedicated circuit for valley switching is built in, which makes a
very efficient slim-line electronic power-plug concept possible.
In its most basic version of application, the TEA1622P acts as a voltage source. Here, no
additional secondary electronics are required. A combined voltage and current source can
be realized with minimum costs for external components. Implementation of the
TEA1622P renders an efficient and low cost power supply system.
2. Features
■
■
■
■
■
■
■
■
■
■
■
■
■
■
Designed for general purpose supplies
Integrated power switch: 12 Ω and 650 V
Operates from universal AC mains supplies: 80 V to 276 V
Adjustable frequency for flexible design
RC oscillator for load insensitive regulation loop constant
Valley switching for minimum switch-on loss
Frequency reduction at low power output for low standby power: <100 mW
Adjustable overcurrent protection
Undervoltage protection
Temperature protection
Short winding protection
Safe restart mode for system fault conditions
Simple application with both primary and secondary (opto) feedback
Available in 8-pin DIP package.
3. Applications
■ Adapters
■ Set-Top Box (STB)
■ DVD
■ VCD
■ CD(R)
■ PC Silverbox standby SMPS.
TEA1622P
Philips Semiconductors
STARplugTM
4. Quick reference data
Table 1:
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC(max)
maximum supply voltage
-
-
40
V
VDRAIN(max)
maximum voltage at pin
DRAIN
Tj > 0 °C
-
-
650
V
IDRAIN
supply current drawn from
pin DRAIN
no auxiliary supply
-
0.5
-
mA
RDSon
drain-source on-state
resistance
ISOURCE = −0.25 A
Tj = 25 °C
-
12
13.8
Ω
Tj = 100 °C
-
17
19.6
Ω
fosc
oscillator frequency range
10
-
200
kHz
Tamb
ambient temperature
−20
-
+85
°C
5. Ordering information
Table 2:
Ordering information
Type number
TEA1622P
Package
Name
Description
Version
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
2 of 16
TEA1622P
Philips Semiconductors
STARplugTM
6. Block diagram
VCC
1
8
SUPPLY
DRAIN
VALLEY
TEA1622P
GND
LOGIC
2
7
n.c.
100 mV
PWM
stop
RC
3
OSCILLATOR
6
THERMAL
SHUTDOWN
low frequency
SOURCE
PROTECTION
LOGIC
POWER-UP
RESET
f
1.8
blank
U
overcurrent
REG
4
2.5 V
0.5 V
10x
5
AUX
short winding
0.75 V
col009
Fig 1. Block diagram.
7. Pinning information
7.1 Pinning
VCC
1
8
DRAIN
GND
2
7
n.c.
RC
3
REG
4
TEA1622P
6
SOURCE
5
AUX
001aaa309
Fig 2. Pin configuration.
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
3 of 16
TEA1622P
Philips Semiconductors
STARplugTM
7.2 Pin description
Table 3:
Pin description
Symbol
Pin
Description
VCC
1
supply voltage
GND
2
ground
RC
3
frequency setting
REG
4
regulation input
AUX
5
input for voltage from auxiliary winding for timing (demagnetization)
SOURCE
6
source of internal MOS switch
n.c.
7
not connected
DRAIN
8
drain of internal MOS switch; input for start-up current and valley sensing
8. Functional description
The TEA1622P is the heart of a compact flyback converter, with the IC placed at the
primary side. The auxiliary winding of the transformer can be used for indirect feedback to
control the isolated output. This additional winding also powers the IC. A more accurate
control of the output voltage and/or current can be implemented with an additional
secondary sensing circuit and optocoupler feedback.
The TEA1622P uses voltage mode control. The frequency is determined by the maximum
transformer demagnetizing time and the time of the oscillator. In the first case, the
converter operates in the Self Oscillating Power Supply (SOPS) mode. In the latter case, it
operates at a constant frequency, which can be adjusted with external components RRC
and CRC. This mode is called Pulse Width Modulation (PWM). Furthermore, a primary
stroke is started only in a valley of the secondary ringing. This valley switching principle
minimizes capacitive switch-on losses.
8.1 Start-up and undervoltage lock-out
Initially, the IC is self supplying from the rectified mains voltage. The IC starts switching as
soon as the voltage on pin VCC passes the VCC(start) level. The supply is taken over by the
auxiliary winding of the transformer as soon as VCC is high enough and the supply from
the line is stopped for high efficiency operation.
As soon as the voltage on pin VCC drops below the VCC(stop) level, the IC stops switching
and restarts from the rectified mains voltage.
8.2 Oscillator
The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The
external capacitor is charged rapidly to the VRC(max) level and, starting from a new primary
stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the
relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost
equal to the sensitivity at high duty factors. This results in a more constant gain over the
duty factor range compared to PWM systems with a linear sawtooth oscillator. Stable
operation at low duty factors is easily realized. For high efficiency, the frequency is
reduced as soon as the duty factor drops below a certain value. This is accomplished by
increasing the oscillator charge time.
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
4 of 16
TEA1622P
Philips Semiconductors
STARplugTM
To ensure that the capacitor can be charged within the charge time, the value of the
oscillator capacitor should be limited to approximately 1 nF.
8.3 Duty factor control
The duty factor is controlled by the internal regulation voltage and the oscillator signal on
pin RC. The internal regulation voltage is equal to the external regulation voltage (minus
2.5 V) multiplied by the gain of the error amplifier (typical 20 dB or 10 ×).
The minimum duty factor of the switched mode power supply is 0 %. The maximum duty
factor is set to 75 % (typical value at 100 kHz oscillation frequency).
8.4 Valley switching
A new cycle is started at the primary stroke when the switch is switched on (see Figure 3).
After a certain time (determined by the RC oscillator voltage and the internal regulation
level), the switch is turned off and the secondary stroke starts. The internal regulation
level is determined by the voltage on pin REG. After the secondary stroke, the drain
1
voltage shows an oscillation with a frequency of approximately -----------------------------2π × L p C p
Where:
Lp is the primary self inductance on the drain node
Cp is the parasitic capacitance on the drain node.
As soon as the oscillator voltage is high again and the secondary stroke has ended, the
circuit waits for a low drain voltage before starting a new primary stroke.
The primary stroke starts some time before the actual valley at low ringing frequencies,
and some time after the actual valley at high ringing frequencies. Figure 4 shows a typical
curve for a reflected voltage N × Vo of 80 V. This voltage is the output voltage Vo (see
Figure 5) transferred to the primary side of the transformer with the factor N (determined
by the turns ratio of the transformer). Figure 4 shows that the system switches exactly at
minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on
losses to a minimum. At 200 kHz, the next primary stroke is started at 33° before the
valley. The switch-on losses are still reduced significantly.
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
5 of 16
TEA1622P
Philips Semiconductors
STARplugTM
primary
stroke
secondary
stroke
secondary
ringing
drain
valley
secondary
stroke
A
B
regulation level
RC
oscillator
col007
A: Start of new cycle with valley switching.
B: Start of new cycle in a classical PWM system.
Fig 3. Signals for valley switching.
001aaa311
40
phase
(°)
20
0
−20
−40
0
200
400
600
800
f (kHz)
Reflected voltage at N × Vo = 80 V.
Fig 4. Typical phase of drain ringing at switch-on.
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
6 of 16
TEA1622P
Philips Semiconductors
STARplugTM
8.5 Demagnetization
The system operates in discontinuous conduction mode all the time. As long as the
secondary stroke has not ended, the oscillator will not start a new primary stroke. During
the suppression time tsuppr, demagnetization recognition is suppressed. This suppression
may be necessary in applications where the transformer has a large leakage inductance
and at low output voltages.
8.6 Protections
8.6.1 Overcurrent protection
The cycle-by-cycle peak drain current limit circuit uses the external source resistor RI (see
Figure 5) to measure the current. The circuit is activated after the leading edge blanking
time tleb. The protection circuit limits the source voltage to Vsource(max), and thus limits the
primary peak current.
8.6.2 Short winding protection
The short winding protection circuit is also activated after the leading edge blanking time.
If the source voltage exceeds the short winding protection voltage Vswp, the TEA1622P
stops switching. Only a power-on reset will restart normal operation. The short winding
protection also protects in case of a secondary diode short circuit.
8.6.3 Overtemperature protection
An accurate temperature protection is provided in the TEA1622P. When the junction
temperature exceeds the thermal shutdown temperature, the IC stops switching. During
thermal protection, the IC current is lowered to the start-up current. The IC continues
normal operation as soon as the overtemperature situation has disappeared.
8.6.4 Overvoltage protection
Overvoltage protection can be achieved in the application by pulling pin REG above its
normal operation level, or by keeping the level of pin AUX above Vdemag. The current
primary stroke is terminated immediately, and no new primary stroke is started until the
voltage on pin REG drops to its normal operation level. Pin REG has an internal clamp.
The current feed into pin REG must be limited.
8.7 Characteristics of the complete power-plug
8.7.1 Input
The input voltage range comprises the universal AC mains from 80 V to 276 V.
8.7.2 Accuracy
The accuracy of the complete converter, functioning as a voltage source with primary
sensing, is approximately 8 % (mainly dependent on the transformer coupling). The
accuracy with secondary sensing is defined by the accuracy of the external components.
For safety requirements in case of optocoupler feedback loss, the primary sensing
remains active when an overvoltage circuit is connected.
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
7 of 16
TEA1622P
Philips Semiconductors
STARplugTM
8.7.3 Efficiency
An efficiency of 75 % at maximum output power can be achieved for a complete converter
designed for universal mains.
8.7.4 Ripple
A minimum ripple is obtained in a system designed for a maximum duty factor of 50 %
under normal operating conditions, and a minimized dead time. The magnitude of the
ripple in the output voltage is determined by the frequency and duty factor of the
converter, the output current level, and the value and ESR of the output capacitor.
9. Limiting values
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
supply voltage
continuous
Min
Max
Unit
−0.4
+40
V
Voltages
VCC
[1]
VRC
oscillator input voltage
−0.4
+3
V
VSOURCE
DMOS power transistor source
voltage
−0.4
+5
V
VDRAIN
DMOS power transistor drain
voltage
−0.4
+650
V
[1]
Currents
regulation input current
[2]
-
6
mA
IAUX
auxiliary winding input current
[2]
−10
+5
mA
IRC
oscillator capacitor charge
current
−3
-
mA
ISOURCE
source current
−1
+1
A
IDRAIN
drain current
−1
+1
A
-
1.0
W
IREG
General
Tamb < 45 °C
Ptot
total power dissipation
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−20
+85
°C
Tj
junction temperature
−20
+145
°C
Vesd
electrostatic discharge voltage
−1000
+1000
V
−2000
+2000
V
−200
+200
V
human body model
[3]
pin DRAIN
all other pins
machine model
all pins
[1]
Pins VCC and RC are not allowed to be current driven.
[2]
Pins REG and AUX are not allowed to be voltage driven.
[3]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
[4]
Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω series
resistor.
9397 750 12578
Product data sheet
[4]
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
8 of 16
TEA1622P
Philips Semiconductors
STARplugTM
10. Thermal characteristics
Table 5:
Thermal characteristics
Symbol
Rth(j-a)
[1]
Parameter
Conditions
thermal resistance from junction
to ambient
[1]
in free air
Typ
Unit
100
K/W
Thermal resistance Rth(j-a) can be lower when pin GND is connected to sufficient copper area on the
printed-circuit board. See the TEA152x application notes for details.
11. Characteristics
Table 6:
Characteristics
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
Supply on pin VCC
VCC(start)
start voltage
9
9.5
10
V
VCC(stop)
stop voltage
undervoltage lock-out
7.0
7.5
8.0
V
ICC(operate)
operating supply current
normal operation
-
1.3
1.9
mA
ICC(startup)
start-up supply current
start-up
-
180
400
µA
ICC(ch)
charging current
VDRAIN > 60 V
VCC = 0 V
−650
−520
−390
µA
VCC = 8.5 V
−375
−275
−175
µA
Supply on pin DRAIN
IDRAIN
supply current drawn from pin DRAIN
no auxiliary supply
-
0.5
-
mA
with auxiliary supply;
VDRAIN > 60 V
-
30
125
µA
-
0
-
%
fosc = 100 kHz
-
75
-
%
Pulse width modulator mode
δmin
minimum duty factor
δmax
maximum duty factor
Self oscillating power supply mode
Vdemag
demagnetization recognition voltage
level
50
100
150
mV
tsuppr
time of suppression of transformer
ringing at start of secondary stroke
1.0
1.5
2.0
µs
Oscillator: pin RC
VRC(min)
minimum voltage of RC oscillator
setting
60
75
90
mV
VRC(max)
maximum voltage of RC oscillator
setting
2.4
2.5
2.6
V
tRC(ch)
RC charging time
-
1
-
µs
fosc
oscillator frequency range
10
-
200
kHz
2.4
2.5
2.6
V
Duty factor regulator: pin REG
VREG
input voltage on pin REG
9397 750 12578
Product data sheet
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Rev. 01 — 17 March 2004
9 of 16
TEA1622P
Philips Semiconductors
STARplugTM
Table 6:
Characteristics …continued
Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into
the IC; unless otherwise specified.
Symbol
Parameter
GV(erroramp)
voltage gain of error amplifier
VREG(clamp)
clamping voltage on pin REG
Conditions
IREG = 6 mA
Min
Typ
Max
Unit
-
20
-
dB
-
-
7.5
V
−102
-
+102
V/µs
200
550
800
kHz
-
150
-
ns
Valley switching recognition
dV/dtvalley
valley recognition
fvalley
ringing frequency for valley switching
td(valley-on)
delay from valley recognition to
switch-on
N × Vo = 100 V
Output stage (FET)
IL(drain)
drain leakage current
VDRAIN = 650 V
-
-
125
µA
VBR(drain)
drain breakdown voltage
Tj > 0 °C
650
-
-
V
RDSon
drain-source on-state resistance
ISOURCE = −0.06 A
Tj = 25 °C
-
12
13.8
Ω
Tj = 100 °C
-
17
19.6
Ω
-
75
-
ns
tdrain(f)
drain fall time
VDRAIN(switch_on) = 300 V;
no external capacitor at pin
DRAIN
Temperature protection
Tprot(max)
maximum threshold temperature
150
160
170
°C
Tprot(hys)
threshold temperature hysteresis
-
2
-
°C
0.47
0.50
0.53
V
Overcurrent and short winding protection: pin SOURCE
Vsource(max)
overcurrent protection voltage
dV/dt = 0.1 V/µs
Vswp
short winding protection voltage
dV/dt = 0.5 V/µs
0.7
0.75
0.8
V
td(propagation)
delay from detecting Vsource(max) to
switch-off
dV/dt = 0.5 V/µs
-
160
185
ns
tleb
leading edge blanking time
both overcurrent and short
winding protection
250
350
450
ns
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
10 of 16
TEA1622P
Philips Semiconductors
STARplugTM
12. Application information
LF
D5
Z1
CF1
C5
Vo
D1
CF2
mains
R1
D2
R2
CVCC
VCC
GND
RRC
RC
R4
CRC
REG
1
8
2
7
TEA1622P
3
6
4
5
DRAIN
C6 - Ycap
n.c.
SOURCE
AUX
RI
RAUX
R3
col010
Further application information can be found in the TEA152x application notes.
Fig 5. Application with primary sensing.
13. Test information
13.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
11 of 16
TEA1622P
Philips Semiconductors
STARplugTM
14. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.02
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT97-1
050G01
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 6. Package outline.
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
12 of 16
TEA1622P
Philips Semiconductors
STARplugTM
15. Soldering
15.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
15.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
15.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
15.4 Package related soldering information
Table 7:
Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package
Soldering method
Dipping
Wave
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable [1]
PMFP [2]
−
not suitable
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2]
For PMFP packages hot bar soldering or manual soldering is suitable.
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Product data sheet
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Rev. 01 — 17 March 2004
13 of 16
TEA1622P
Philips Semiconductors
STARplugTM
16. Revision history
Table 8:
Revision history
Document ID
Release date
Data sheet status
Change notice
Order number
Supersedes
TEA1622P_1
20040317
Product data
-
9397 750 12578
-
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
14 of 16
TEA1622P
Philips Semiconductors
STARplugTM
17. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
18. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
20. Trademarks
19. Disclaimers
STARplug — is a trademark of Koninklijke Philips Electronics N.V.
EZ-HV — is a trademark of Koninklijke Philips Electronics N.V.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
21. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
9397 750 12578
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 17 March 2004
15 of 16
TEA1622P
Philips Semiconductors
STARplugTM
22. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.6.1
8.6.2
8.6.3
8.6.4
8.7
8.7.1
8.7.2
8.7.3
8.7.4
9
10
11
12
13
13.1
14
15
15.1
15.2
15.3
15.4
16
17
18
19
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
Start-up and undervoltage lock-out . . . . . . . . . 4
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Duty factor control. . . . . . . . . . . . . . . . . . . . . . . 5
Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 5
Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 7
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Overcurrent protection . . . . . . . . . . . . . . . . . . . 7
Short winding protection . . . . . . . . . . . . . . . . . . 7
Overtemperature protection . . . . . . . . . . . . . . . 7
Overvoltage protection . . . . . . . . . . . . . . . . . . . 7
Characteristics of the complete power-plug . . . 7
Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ripple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal characteristics. . . . . . . . . . . . . . . . . . . 9
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Application information. . . . . . . . . . . . . . . . . . 11
Test information . . . . . . . . . . . . . . . . . . . . . . . . 11
Quality information . . . . . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Soldering by dipping or by solder wave . . . . . 13
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13
Package related soldering information . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information . . . . . . . . . . . . . . . . . . . . 15
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 17 March 2004
Document order number: 9397 750 12578
Published in The Netherlands