PHILIPS TDA6108JF

INTEGRATED CIRCUITS
DATA SHEET
TDA6108JF
Triple video output amplifier
Product specification
Supersedes data of 1998 Jun 22
File under Integrated Circuits, IC02
1999 Oct 29
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
FEATURES
• Black-Current Stabilization (BCS) circuit
• Typical bandwidth of 9.0 MHz for an output signal of
60 V (p-p)
• Thermal protection.
• High slew rate of 1850 V/µs
GENERAL DESCRIPTION
• No external components required
The TDA6108JF includes three video output amplifiers in
one plastic DIL-bent-SIL 9-pin medium power (DBS9MPF)
package (SOT111-1), using high-voltage DMOS
technology, and is intended to drive the three cathodes of
a colour CRT directly. To obtain maximum performance,
the amplifier should be used with black-current control.
• Very simple application
• Single supply voltage of 200 V
• Internal reference voltage of 2.5 V
• Fixed gain of 51
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
TDA6108JF
DBS9MPF
DESCRIPTION
VERSION
plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
BLOCK DIAGRAM
VDD
handbook, full pagewidth
6
MIRROR 5
MIRROR 1
TDA6108JF
CASCODE 1
3×
MIRROR 4
CURRENT
SOURCE
9, 8, 7
1×
Voc(3),
Voc(2),
Voc(1)
1×
THERMAL
PROTECTION
CIRCUIT
Vi(1),
Vi(2),
Vi(3)
1, 2, 3
Rf
VIP
REFERENCE
DIFFERENTIAL
STAGE
5
MIRROR 3
Ri
Ra
3×
CASCODE 2
MIRROR 2
4
MGL318
Fig.1 Block diagram (one amplifier shown).
1999 Oct 29
2
Io(m)
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
PINNING
SYMBOL
PIN
DESCRIPTION
Vi(1)
1
inverting input 1
Vi(2)
2
inverting input 2
Vi(3)
3
handbook, halfpage
Vi(1)
1
inverting input 3
Vi(2)
2
3
4
GND
4
ground (fin)
Vi(3)
Iom
5
black current measurement output
GND
VDD
6
supply voltage
Voc(3)
7
cathode output 3
Voc(2)
8
cathode output 2
Voc(1)
9
cathode output 1
Iom
5 TDA6108JF
VDD
6
Voc(3)
7
Voc(2)
8
Voc(1)
9
MGL319
Fig.2 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages measured with respect to pin 4 (ground);
currents as specified in Fig.1; unless otherwise specified.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VDD
supply voltage
0
250
V
Vi
input voltage
0
12
V
Vom
measurement output voltage
0
6
V
Voc
cathode output voltage
0
VDD
V
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−20
+150
°C
Ves
electrostatic handling
human body model (HBM)
−
2000
V
machine model (MM)
−
300
V
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices” ).
QUALITY SPECIFICATION
Quality specification “SNW-FQ-611 part D” is applicable.
1999 Oct 29
3
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
Rth(j-a)
thermal resistance from junction to ambient
Rth(j-fin)
thermal resistance from junction to fin
Rth(h-a)
thermal resistance from heatsink to ambient
VALUE
note 1
UNIT
56
K/W
11
K/W
10
K/W
Note
1. An external heatsink is necessary.
Thermal protection
The internal thermal protection circuit gives a decrease of
the slew rate at high temperatures: 10% decrease at
130 °C and 30% decrease at 145 °C (typical values on the
spot of the thermal protection circuit).
MGL322
8
handbook, halfpage
Ptot
(W)
(1)
6
4
(2)
handbook, halfpage
2
outputs
5 K/W
thermal protection circuit
0
−20
20
60
100
6 K/W
180
140
Tamb (°C)
fin
MGK279
(1) Infinite heatsink.
(2) No heatsink.
Fig.4 Equivalent thermal resistance network.
Fig.3 Power derating curves.
1999 Oct 29
4
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
CHARACTERISTICS
Operating range: Tj = −20 to +150 °C; VDD = 180 to 210 V. Test conditions: Tamb = 25 °C; VDD = 200 V;
Vo(c1) = Vo(c2) = Vo(c3) = 1⁄2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W
(measured in test circuit of Fig.8); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Iq
quiescent supply current
8.8
10.3
11.7
mA
Vref(int)
internal reference voltage
(input stage)
−
2.5
−
V
Ri
input resistance
−
3.2
−
kΩ
G
gain of amplifier
47.5
51.0
55.0
∆G
gain difference
−2.5
0
+2.5
VO(c)
nominal output voltage at
pins 7, 8 and 9 (DC value)
Ii = 0 µA
116
129
142
V
∆VO(c)(offset)
differential nominal output
offset voltage between
pins 7 and 8, 8 and 9 and
9 and 7 (DC value)
Ii = 0 µA
−
0
5
V
∆Vo(c)(T)
output voltage temperature
drift at pins 7, 8 and 9
−
−10
−
mV/K
−
0
−
mV/K
−50
−
+50
µA
0.9
1.0
1.1
∆Vo(c)(T)(offset) differential output offset
voltage temperature drift
between pins 7 and 8,
8 and 9 and 7 and 9
Io(m)(offset)
offset current of measurement Io(c) = 0 µA;
output (for 3 channels)
1.5 V < Vi < 5.5 V;
3 V < Vo(m) < 6 V
∆Io(m)/∆Io(c)
linearity of current transfer
Io(c)(max)
maximum peak output current 50 V < Vo(c) < VDD − 50 V
(pins 7, 8 and 9)
−
28
−
mA
Vo(c)(min)
minimum output voltage
(pins 7, 8 and 9)
Vi = 7.0 V; note 1
−
−
10
V
Vo(c)(max)
maximum output voltage
(pins 7, 8 and 9)
Vi = 1.0 V; note 1
VDD − 15 −
−
V
BS
small signal bandwidth
(pins 7, 8 and 9)
Vo(c) = 60 V (p-p)
−
9.0
−
MHz
BL
large signal bandwidth
(pins 7, 8 and 9)
Vo(c) = 100 V (p-p)
−
8.0
−
MHz
tPco
cathode output propagation
time 50% input to 50% output
(pins 7, 8 and 9)
Vo(c) = 100 V (p-p)
square wave; f <1 MHz;
tr = tf = 40 ns
(pins 1, 2 and 3);
see Figs 6 and 7
−
32
−
ns
1999 Oct 29
−100 µA < Io(c) < 100 µA;
1.5 V < Vi < 5.5 V;
3 V < Vo(m) < 6 V
5
Philips Semiconductors
Product specification
Triple video output amplifier
SYMBOL
PARAMETER
TDA6108JF
CONDITIONS
MIN.
TYP.
MAX.
UNIT
∆tPco
difference in cathode output
propagation time 50% input to
50% output (pins 7 and 8,
7 and 9 and 8 and 9)
Vo(c) = 100 V (p-p)
square wave; f < 1 MHz;
tr = tf = 40 ns
(pins 1, 2 and 3)
−10
0
+10
ns
to(r)
cathode output rise time
10% output to 90% output
(pins 7, 8 and 9)
Vo(c) = 50 to 150 V square
wave; f < 1 MHz; tf = 40 ns
(pins 1, 2 and 3); see Fig.6
35
50
65
ns
to(f)
cathode output fall time
90% output to 10% output
(pins 7, 8 and 9)
Vo(c) = 150 to 50 V square
wave; f < 1 MHz; tr = 40 ns
(pins 1, 2 and 3); see Fig.7
35
50
65
ns
tst
settling time 50% input to
99% < output < 101%
(pins 7, 8 and 9)
Vo(c) = 100 V (p-p)
square wave; f < 1 MHz;
tr = tf = 40 ns
(pins 1, 2 and 3);
see Figs 6 and 7
−
−
350
ns
SR
slew rate between
50 V to (VDD − 50 V)
(pins 7, 8 and 9)
Vi = 4 V (p-p) square wave;
f < 1 MHz; tr = tf = 40 ns
(pins 1, 2 and 3)
−
1850
−
V/µs
Ov
cathode output voltage
overshoot (pins 7, 8 and 9)
Vo(c) = 100 V (p-p)
square wave; f < 1 MHz;
tr = tf = 40 ns
(pins 1, 2 and 3);
see Figs 6 and 7
−
10
−
%
PSRR
power supply rejection ratio
f < 50 kHz; note 2
−
65
−
dB
αct(DC)
DC crosstalk between
channels
−
50
−
dB
Notes
1. See also Fig.5 for the typical DC-to-DC transfer of Vi to Vo(c).
2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.
1999 Oct 29
6
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
MGL371
200
handbook, halfpage
Vo(c)
(V)
160
129
120
80
40
0
0
2
2.5
4
Vi (V)
6
Fig.5 Typical DC-to-DC transfer of Vi to Vo(c).
1999 Oct 29
7
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
4.18
Vi
(V)
3.09
t
2.00
tst
Ov (in %)
151
150
140
149
Vo(c)
(V)
100
60
50
t
to(r)
MGL369
tPco
Fig.6 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal.
1999 Oct 29
8
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
4.18
Vi
(V)
3.09
t
2.00
tst
150
140
Vo(c)
(V)
100
Ov (in %)
51
60
50
49
t
to(f)
MGL370
tPco
Fig.7 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal.
1999 Oct 29
9
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
External flashover protection
Dissipation
For sufficient flashover protection it is necessary to apply
an external diode and 100 Ω resistor for each channel.
See application note “Application and Product description
of TDA6107Q/N1” (report number AN96072).
Regarding dissipation, distinction must first be made
between static dissipation (independent of frequency) and
dynamic dissipation (proportional to frequency).
The static dissipation of the TDA6108JF is due to voltage
supply currents and load currents in the feedback network
and CRT.
To limit the diode current an external 1 kΩ carbon
high-voltage resistor in series with the external diode and
a 2 kV spark gap are needed (for this resistor value, the
CRT has to be connected to the main PCB).
The static dissipation Pstat equals:
P stat = V DD × I DD + 3 × V O(c) × I O(c)
VDD must be decoupled to GND:
Where:
1. With a capacitor >20 nF with good HF behaviour
(e.g. foil); this capacitor must be placed as close as
possible to pins 6 and 4, but definitely within 5 mm.
VDD = supply voltage
IDD = supply current
2. With a capacitor >3.3 µF on the picture tube base
print.
VO(c) = DC value of cathode voltage
IO(c) = DC value of cathode current.
Switch-off behaviour
The dynamic dissipation Pdyn equals:
The switch-off behaviour of the TDA6108JF is controllable.
This is due to the fact that the output pins of the
TDA6108JF are still under control of the input pins for low
power supply voltages (approximately 30 V and higher).
P dyn = 3 × V DD × ( C L + C int ) × f i × V o(c)(p-p) × δ
Where:
CL = load capacitance
Cint = internal load capacitance (≈4 pF)
Bandwidth
fi = input frequency
The addition of the flash resistor produces a decreased
bandwidth and increases rise and fall times. For further
information, see Application note of the TDA6108JF.
Vo(c)(p-p) = output voltage (peak-to-peak value)
δ = non-blanking duty cycle.
The IC must be mounted on the picture tube base print to
minimize the load capacitance CL.
1999 Oct 29
10
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
TEST AND APPLICATION INFORMATION
VDD
handbook, full pagewidth
C1
Vi(1)
J1
22 µF
6
Rf
1
Ri
Vof
C2
1
Ra
C7
20 nF
Voc(1)
9
Iom
22 nF
C8
10 µF
C10
6.8 pF
R1
2 MΩ
C11
136 pF
R2
100 kΩ
C13
6.8 pF
R3
2 MΩ
C14
136 pF
R4
100 kΩ
C16
6.8 pF
R5
2 MΩ
C17
136 pF
R6
100 kΩ
C9
3.2 pF
C3
Vi(2)
J2
22 µF
Rf
2
Ri
Vof
C4
2
Ra
Voc(2)
8
Iom
22 nF
probe 1
C12
3.2 pF
C5
Vi(3)
22 µF
J3
Rf
3
Ri
Vof
C6
3
Ra
Voc(3)
7
Iom
22 nF
probe 2
C15
3.2 pF
VIP
REFERENCE
probe 3
5
TDA6108JF
Vo(m)
4
4V
MGL321
Current sources J1, J2 and J3 are to be tuned so that Vo(c) of pins 9, 8 and 7 is set to 100 V.
Fig.8 Test circuit.
1999 Oct 29
11
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
INTERNAL CIRCUITRY
handbook, full pagewidth
to cascode
stage
GND
VDD
4
6
to black current
measurement circuit
TDA6108JF
1, 2, 3
(1)
esd
from
input
circuit
esd
flash
7, 8, 9
esd
to black current
measurement circuit
from
control
circuit
from
input
circuit
Vbias
esd
5
esd
6.8 V
esd
from
control
circuit
to black current
measurement circuit
to black current
measurement circuit
MGL320
(1) All pins have an energy protection for positive or negative overstress situations.
Fig.0 Internal pin configuration.
1999 Oct 29
12
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
PACKAGE OUTLINE
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
D
D1
A2
q
P
P1
Q
A3
q2
q1
A
seating plane
A4
E
pin 1 index
c
L
1
9
e2
b
e
Z
b2
0
θ
w M
b1
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
mm
18.5
17.8
A2
A3
max.
3.7
8.7
8.0
A4
b
b1
b2
c
D (1)
D1
E (1)
e
e2
15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54
15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
L
P
P1
3.9
3.4
2.75
2.50
3.4
3.2
Q
q
1.75 15.1
1.55 14.9
q1
q2
w
Z (1)
max.
θ
4.4
4.2
5.9
5.7
0.25
1.0
65o
55o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-03-11
SOT111-1
1999 Oct 29
EUROPEAN
PROJECTION
13
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
The total contact time of successive solder waves must not
exceed 5 seconds.
SOLDERING
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
DBS, DIP, HDIP, SDIP, SIL
WAVE
suitable(1)
suitable
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Oct 29
14
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6108JF
NOTES
1999 Oct 29
15
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Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
Internet: http://www.semiconductors.philips.com
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
SCA 68
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Printed in The Netherlands
545004/200/03/pp16
Date of release: 1999
Oct 29
Document order number:
9397 750 06486