ROHM BU4S66G2_09

General-purpose CMOS Logic IC Series (BU4S,BU4000B Series)
Single Gate CMOS Logic ICs
<Analog Switch>
BU4S66G2
No. 09050JAT02
●Description
The BU4S66G2 is a 1ch analog switch IC encapsulated in an SSOP5 package, and can replace 1 circuit of the
general-purpose CMOS two-way analog switch BU4066B IC.
●Features
1) Low power consumption
2) Surface mount package (SSOP5)
3) Broad operating supply voltage range: 3V-16V
4) L-TTL2 and LS-TTL1 inputs can be driven directly
5) Function compatible with BU4066BC series (1ch).
6) Excellent linearity
●Applications
Can be used as a digital/analog switch, ON/OFF switch, or changeover switch in a high speed line, with no deterioration of
the analog signals. Connection to a low impedance circuit is possible, due to the low ON resistance.
●Lineup
Single gate
analog switch
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© 2009 ROHM Co., Ltd. All rights reserved.
1
circuit
Switch
BU4S66G2 (Single analog switch)
1/7
2009.06 - Rev.A
Technical Note
BU4S66G2
●Absolute Maximum Ratings
Parameter
Power Supply Voltage
Supply Current
Operating Temperature
Storage Temperature
Input Voltage
Maximum Junction Temperature
Symbol
VDD
Iin
Topr
Tstg
VIN
Tjmax
Limit
-0.3 to 18
±10
-40 to 85
-55 to 150
-0.3 to VDD+0.3
150
Unit
V
mA
℃
℃
V
℃
●Recommended Operating Conditions
Parameter
Operating Power Supply
Input Voltage
Symbol
VDD
VIN
Limit
3 to 16
0 to VDD
Unit
V
V
●Thermal Derating Curve
1400
Power Dissipation Pd [mW]
1200
660[mW] BU4S66G2 ( *1)
1000
800
600
400
200
0
(*1)
5.3
85℃
25
50
75
100
125
Ambient Temperature Ta [℃]
150
175
Unit
mW/℃
Reduced per 1C at Ta>25℃. Power Dissipation measured when sample mounted on
a 70mm×70mm×1.6mm FR4 glass-epoxy PCB (copper area less than 3%)
●Input / Output Equivalent Circuits
VDD
VDD
VDD
GND
GND
GND
<Analog Switch Input/Output>
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© 2009 ROHM Co., Ltd. All rights reserved.
<Control Input>
2/7
2009.06 - Rev.A
Technical Note
BU4S66G2
●Electrical Characteristics (BU4S66G2)
DC Characteristics (Unless otherwise noted : VSS=0[V],Ta=25[℃])
Limits
Parameter
Symbol
Min
Typ
Max
3.5
-
-
Control “H”input voltage
VIH
7.0
-
-
11.0
-
-
-
-
1.5
Control “L”input voltage
VIL
-
-
3.0
-
-
4.0
-
290
950
ON resistance
RON
-
120
250
-
85
160
-
-
0.3
Channel-OFF
LOFF
Leakage current
-
-
-0.3
-
-
1.0
Static supply current
IDD
-
-
2.0
-
-
4.0
Input capacitance(control input)
CC
-
8
-
Input capacitance(switch input)
CS
-
10
-
Unit
V
V
Ω
μA
μA
pF
pF
VDD[V]
5
10
15
5
10
15
5
10
15
15
15
5
10
15
-
-
Switching Characteristics (Unless otherwise noted : VSS=0[V],Ta=25[℃],CL=50[pF])
Limits
Parameter
Symbol
Unit
Min
Typ
Max
VDD[V]
-
15
-
5
tPLH
-
8
-
ns
10
-
5
-
15
Propagation delay time
(I/O→O/I)
-
15
-
5
tPHL
-
8
-
ns
10
-
5
-
15
-
100
-
5
tPHZ
ns
-
70
-
10
-
65
-
15
-
100
-
5
tPLZ
-
70
-
ns
10
-
65
-
15
Propagation delay time
(CONTROL→O/I)
-
80
-
5
tPZH
-
35
-
ns
10
-
25
-
15
-
80
-
5
tPZL
-
35
-
ns
10
-
25
-
15
-
10
-
5
fmax
Maximum control frequency
-
12
-
MHz
10
(C)
-
12
-
15
Fmax
-
30
-
MHz
5
Maximum propagation frequency
(I-O)*1
*2
Feedthrough attenuation
FT
-
600
-
kHz
5
Sine wave distortion (1[kHz])
THD*3
-
0.05
-
%
5
Cross talk (CONTROL→O/I)
CTc
-
-
-
200
400
600
-
-
-
mV
mV
mV
5
10
15
Condition
Fig.No
Current between in and
out=10[μA]
-
Current between in and out
=10[μA]
-
0≦VIN≦VDD
RL=10[kΩ]
1
VIN=15[V],VOUT=0[V]
VIN=0[V],VOUT=15[V]
-
VIN=VDD or GND
-
f=1[MHz]
f=1[MHz]
-
-
Condition
Fig.No
RL=10[kΩ]
CL=50[pF]
2
RL=10[kΩ]
CL=50[pF]
3
RL=10[kΩ]
CL=50pF
4
RL=10[kΩ]
CL=50[pF]
5
RL=10[kΩ]
CL=50[pF]
6
RL=10[kΩ]
CL=50[pF]
7
RL=1[kΩ]
CL=50[pF]
-
VSS=-5[V],RL=1[kΩ]
CL=50[pF]
VSS=-5[V],RL=1[kΩ]
VSS=-5[V],RL=10[kΩ]
CL=50[pF]
-
RIN=1[kΩ]
ROUT=10[kΩ]
CL=15[pF]
-
-
-
*1 Frequency where 20log(VOUT/VIN)=3[dB]
*2 Frequency where 20log(VOUT/VIN)=50[dB]
*1 *2 *3 Must be sine wave of VIN±2.5[Vp-p].
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3/7
2009.06 - Rev.A
Technical Note
BU4S66G2
●Electrical Characteristics Curves
200
400
85[℃]
VDD=10[V]
85[℃]VDD=15[V]
25[℃]
-40[℃]
100
25[℃]
85[℃]
-40[℃]
25[℃]
-40[℃]
0
150
100
VDD=3[V]
VDD=5[V]
VDD=10[V]
VDD=16[V]
50
5
10
-50
15
-25
0
25
50
75
VDD=5[V]
VDD=16[V]
VDD=10[V]
150
VDD=5[V]
100
VDD=16[V]
VDD=10[V]
50
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature [℃]
Ambient Temperature [℃]
Fig.4 Propagation delay tPHZ
(CONT-OUT)
50
75
100
VDD=3[V]
150
100
VDD=5[V]
VDD=10[V]
50
VDD=16[V]
0
0
25
[BU4S66G2]
Operating Temperature Range
Operating Temperature Range
Operating Temperature Range
-25
0
Fig.3 Propagation delay tPHL
(IN-OUT)
200
VDD=3[V]
-25
Ambient Temperature [℃]
Propagation Delay Time[ns]
Propagation Delay Time[ns]
VDD=3[V]
-50
50
-50
[BU4S66G2]
[BU4S66G2]
50
VDD=3[V]
VDD=5[V]
VDD=10[V]
VDD=16[V]
0
100
200
200
100
100
Fig.2 Propagation delay tPLH
(IN-OUT)
Fig.1 Output current-voltage
150
150
Ambient Temperature [℃]
Input Voltage [V]
Propagation Delay Time[ns]
Operating Temperature Range
0
0
[BU4S66G2]
Operating Temperature Range
Propagation Delay Time[ns]
VDD=5[V]
Propagation Delay Time[ns]
On Resistance [Ω]
300
200
200
[BU4S66G2]
[BU4S66G2]
Fig.5 Propagation delay tPLZ
(CONT-OUT)
0
-50
-25
0
25
50
75
Ambient Temperature [℃]
100
Fig.6 Propagation delay tPZH
(CONT-OUT)
200
Propagation Delay Time[ns]
[BU4S66G2]
VDD=3[V]
150
Operating Temperature Range
100
VDD=5[V]
VDD=10[V]
50
VDD=16[V]
0
-50
-25
0
25
50
75
100
Ambient Temperature [℃]
Fig.7 Propagation delay tPZL
(CONT-OUT)
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© 2009 ROHM Co., Ltd. All rights reserved.
4/7
2009.06 - Rev.A
Technical Note
BU4S66G2
●Pinout Diagram・Pin Description・Input / Output Table
Pinout Diagram
Input / Output Table
VDD
CONT
5
4
CONT
SW
L
OFF
H
ON
Pin Description
1
2
3
I/O
O/I
VSS
Pin No
Symbol
I/O
Function
1
I/O
I/O
Analog Switch Input / Output
2
O/I
I/O
Analog Switch Input / Output
3
VSS
―
Power supply(-)
4
CONT
I
Control Input
5
VDD
―
Power supply(+)
20[ns]
●Measurement Circuit
90%
50%
VDD
RL
SW 1
Input 10%
入力波形
CL
tpLH
SW 2
SW 12
VDD
A
SW 4
SW 5
SW 6
PG
VIN
50%
~
SW 9
PG
tTLH
SW 15 SW 16 SW 17
tTHL
Switching Characteristics
RL
CL
入力波形
Input
RL
50%
50%
CONT
VSS
SW 10 SW 11
VIN
10%
O/I
SW 7
A
SW 8
I/O
tpHL
90%
SW 13 SW 14
Output
出力波形
SW 3
20[ns]
~
50%
Output
出力波形
10%
tPZL
tPLZ
Propagation delay
●Switching Table
Parameter
SW
1
Input voltage/current
ON resistance
Channel-OFF
Leakage current
OFF
OFF
Switching Characteristics
ON
OFF
tPLZ
OFF
OFF
OFF
tPZL
OFF
ON
OFF
ON
OFF
OFF
Propagation time
CONT→OUT
SW
2
SW
3
SW
4
SW
5
SW
6
SW
7
SW
8
SW
9
SW
10
SW
11
SW
12
SW
13
SW
14
SW
15
SW
16
SW
17
OFF
ON
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
ON
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
ON
OFF
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
ON
ON
OFF
ON
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
ON
OFF
Sine wave distortion
Feedthrough attenuation
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
ON
ON
OFF
Control
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
ON
OFF
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© 2009 ROHM Co., Ltd. All rights reserved.
5/7
2009.06 - Rev.A
Technical Note
BU4S66G2
●Notes for use
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2. Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
3. Power supply lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
4. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
5. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8. Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
9. Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the
GND wiring pattern of any external components, either.
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6/7
2009.06 - Rev.A
Technical Note
BU4S66G2
●Ordering part number
B
U
4
Part No.
S
6
6
G
Part No.
4S66
2
-
T
Package
G2: SSOP5
R
Packaging and forming specification
TR: Embossed tape and reel
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
0.05±0.05
1.1±0.05
1.25Max.
)
+0.05
0.42 −0.04
0.95
0.1
Direction of feed
Reel
(Unit : mm)
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7/7
∗ Order quantity needs to be multiple of the minimum quantity.
2009.06 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
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More detail product informations and catalogs are available, please contact us.
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