Power Management Switch ICs for PCs and Digital Consumer products Load Switch ICs for Portable Equipment BD2200GUL, BD2201GUL No.11029EAT22 ●Description BD2200GUL ,BD2201GUL are Load switches for portable device. It is Load switch IC with build-in N channel MOSFET. This switch IC achieves On-resistance of 100mΩ (Typ.). It has the function of Soft-Start and build-in discharge circuit. ●Features 1) Single Channel Of Low On-resistance (Typ.=100mΩ) N-channel MOSFET Built in 2) 500mA Output Load Current (BD2200GUL) 1000mA Output Load Current (BD2201GUL) 3) Soft-Start Function 4) Output Discharge Circuit 5) VCSP50L1 package ●Application Mobile phone, Digital still camera, PDA, MP3 player, PC, etc. ●Line up matrix Part Number On-resistance Output current Discharge circuit Logic control input BD2200GUL 100mΩ 500mA ○ High BD2201GUL 100mΩ 1000mA ○ High Package VCSP50L1 1.5×1.0 mm VCSP50L1 1.5×1.0 mm ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Ratings Unit VIN Supply voltage VIN -0.3 ~ 6.0 V EN input voltage VEN -0.3 ~ VIN + 0.3 V VOUT voltage VOUT -0.3 ~ 6.0 V Storage temperature TSTG -55 ~ 150 ℃ Pd 575 *1 mW Power dissipation *1 * Mounted on 50mm * 58mm * 1.75mm Glass-epoxy PCB. Derating: 4.6mW / ℃ at Ta > 25℃ This product is not designed for protection against radioactive rays. ●Operation Conditions Parameter Symbol Ratings Unit Min. Typ. Max. VIN 2.7 3.3 5.5 V TOPR -25 25 85 ℃ Output current (BD2200GUL) ILO 0 - 500 mA Output current (BD2201GUL) ILO 0 - 1000 mA Switch input voltage Operation temperature www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/9 2011.02 - Rev.A Technical Note BD2200GUL, BD2201GUL ●Electrical Characteristics ○BD2200GUL (unless otherwise specified, VIN = 3.3V, Ta = 25℃) Parameter Symbol Limits Min. Typ. Max. Unit Condition [Current consumption] Operating current IDD - 20 30 µA VEN = 1.2V, VOUT = open Standby current ISTB - 0.01 1 µA VEN = 0V, VOUT = open VENH 1.2 - - V High level input VENL - - 0.4 V Low level input IEN -1 - 1 µA VEN = 0V or VEN = 1.2V On-resistance RON - 100 200 mΩ ILO = 500mA Switch leakage current ILEAK - 0.01 1 µA VEN = 0V, VOUT = 0V Output rise time TON1 - 1.0 2.0 ms RL = 10Ω, VOUT :10% → 90% Output turn-on time TON2 - 1.2 2.4 ms RL = 10Ω, VEN :50% →VOUT :90% Output fall time TOFF1 - 2.5 5.0 µs RL = 10Ω, VOUT :90% → 10% Output turn-off time TOFF2 - 4.5 9.0 µs RL = 10Ω, VEN :50% →VOUT :10% Discharge on-resistance RDISC - 70 110 Ω ILO = -1mA, VEN = 0V Discharge current IDISC - 15 20 mA VOUT = 3.3V, VEN = 0V Unit Condition [I/O] EN input voltage EN input current [Power switch] [Discharge circuit] ○BD2201GUL (unless otherwise specified, VIN = 3.3V, Ta = 25℃) Parameter Symbol Limits Min. Typ. Max. [Current consumption] Operating current IDD - 20 30 µA VEN = 1.2V, VOUT = open Standby current ISTB - 0.01 1 µA VEN = 0V, VOUT = open VENH 1.2 - - V High level input VENL - - 0.4 V Low level input IEN -1 - 1 µA VEN = 0V or VEN = 1.2V On-resistance RON - 100 180 mΩ ILO = 500mA Switch leakage current ILEAK - 0.01 1 µA VEN = 0V, VOUT = 0V Output rise time TON1 - 1.0 2.0 ms RL = 10Ω, VOUT :10% → 90% Output turn-on time TON2 - 1.2 2.4 ms RL = 10Ω, VEN :50% →VOUT :90% Output fall time TOFF1 - 2.5 5.0 µs RL = 10Ω, VOUT :90% → 10% Output turn-off time TOFF2 - 4.5 9.0 µs RL = 10Ω, VEN :50% →VOUT :10% Discharge on-resistance RDISC - 70 110 Ω ILO = -1mA, VEN = 0V Discharge current IDISC - 15 20 mA VOUT = 3.3V, VEN = 0V [I/O] EN input voltage EN input current [Power switch] [Discharge circuit] www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/9 2011.02 - Rev.A Technical Note BD2200GUL, BD2201GUL ●Test Circuit VIN VEN VIN VOUT VIN VOUT EN GND CL RL Fig.1 Measurement circuit ●Switch Output Turn ON/OFF Timing VEN 50% 50% TON2 TOFF2 90% VOUT 90% 10% 10% TON1 TOFF1 Fig.2 Timing diagrams www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/9 2011.02 - Rev.A Technical Note BD2200GUL, BD2201GUL ●Reference Data 40 40 1.0 30 20 10 0 2 3 4 5 VIN=3.3V 30 20 10 0 SUPPLY VOLTAGE : VIN [V] 0.6 0.4 0.2 0.0 1.0 0.5 2 3 4 5 100 50 6 Fig.9 On-resistance vs. VIN 150 100 50 2.0 Ta=25℃ RL=10Ω 6 1.2 0.8 0 50 AMBIENT TEMPERATURE : Ta [°C] Fig.12 Output rise time Fig.13 Output rise time www.rohm.com 600 2.0 Ta=25℃ RL=10Ω 1.6 1.2 0.8 0.4 0.0 -50 SUPPLY VOLTAGE : VIN [V] © 2011 ROHM Co., Ltd. All rights reserved. 100 200 300 400 500 OUTPUT CURRENT : ILO [mA] Fig.11 On-resistance vs. ILO 2.4 0.0 0.0 50 0 VIN=3.3V RL=10Ω 0.4 0.4 100 0 TURN ON TIME : TON2[ms] RISE TIME : TON1[ms] 0.8 150 0 50 100 AMBIENT TEMPERATURE : Ta [°C] 1.6 1.6 1.2 VIN=3.3V Ta=25℃ Fig.10 On-resistance vs. temperature 2.0 0 50 100 AMBIENT TEMPERATURE : Ta [°C] 200 VIN=3.3V ILO=100mA 0 -50 0 5 0.5 Fig.8 EN input voltage ON RESISTANCE : R ON[mΩ] ON RESISTANCE : R ON [mΩ] 150 4 1.0 0.0 -50 6 200 Ta=25℃ ILO=100mA 3 1.5 Fig.7 EN input voltage Fig.6 Standby current EN disable 2 VIN=3.3V SUPPLY VOLTAGE : VIN [V] 200 6 2.0 1.5 100 3 4 5 SUPPLY VOLTAGE : VIN [V] 3 4 5 SUPPLY VOLTAGE : VIN [V] Fig.5 Standby current EN disable Ta=25℃ AMBIENT TEMPERATURE : Ta [°C] ON RESISTANCE : RON [mΩ] 2 0.0 2 0.2 100 ENABLE INPUT VOLTAGE : VEN [V] ENABLE INPUT VOLTAGE: VEN[V] STANDBY CURRENT : ISTB[µA] 0.8 RI SE TIME : TON1[ms ] 50 2.0 VIN=3.3V 50 0.4 Fig.4 Operating current EN enable 1.0 0 0.6 AMBIENT TEMPERATURE : Ta [°C] Fig.3 Operating current EN enable -50 0.8 0.0 0 -50 6 Ta=25℃ STANDBY CURRENT : ISTB[µA] OPERATING CURRENT : IDD [µA] OPERATING CURRENT : IDD [µA] Ta=25℃ 4/9 100 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.14 Output turn-on time 2011.02 - Rev.A Technical Note BD2200GUL, BD2201GUL 5.0 VIN=3.3V RL=10Ω 2.0 1.2 0.8 0.4 0.0 3.0 2.0 50 2 AMBIENT TEMPERATURE : Ta [℃] 3 4 5 SUPPLY VOLTAGE : VIN [V] Fig.15 Output turn-on time Fig.16 Output fall time 9 Ta=25℃ RL=10Ω 6 5 3 2 0 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 6 5 3 2 0 -50 DISCHARSE ON RESISTANCE : RDISC [Ω] Fig.18 Output turn-off time -50 6 VIN=3.3V RL=10Ω 8 TURN OFF TIME : TOFF2 [µs] 8 2.0 0.0 100 0 50 100 AMBIENT TEMPERATURE : Ta [℃] Fig.17 Output fall time DISCHARSE ON RESISTANCE : RDISC [Ω] 9 0 3.0 1.0 1.0 0.0 -50 VIN=3.3V RL=10Ω 4.0 FALL TI ME : TOFF1[ µs] 1.6 TURN OFF TIME : TOFF2 [µs] 5.0 Ta=25℃ RL=10Ω 4.0 FALL TIME : TOFF1 [µs] TURN ON TIME : TON2 [ms] 2.4 120 Ta=25℃ 100 80 60 40 20 0 0 50 100 AMBIENT TEMPERATURE : Ta [℃] 2 3 4 5 SUPPLY VOLTAGE : VIN [V] 6 Fig.19 Output turn-off time Fig.20 Discharge on-resistance 120 VIN=3.3V 100 80 60 40 20 0 -50 0 50 100 AMBIENT TEMPERATURE : Ta [℃] Fig.21 Discharge on-resistance ●Waveform Data (BD2200GUL) VEN (1.0V/div.) VEN (1.0V/div.) VOUT (2.0V/div.) CL=22µF VOUT (2.0V/div.) VOUT (2.0V/div.) VIN=3.3V RL=10kΩ CL=4.7µF IOUT (20mA/div.) CIN=10µF VIN=3.3V RL=10kΩ CL=4.7µF IOUT (20mA/div.) TIME (0.5ms/div.) TIME (0.5ms/div.) Fig.22 Output turn-on response Fig.23 Output turn-off response www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. VIN=3.3V RL=10kΩ 5/9 IOUT CL=4.7µF (20mA/div.) TIME (0.5ms/div.) Fig.24 Rush current response 2011.02 - Rev.A Technical Note BD2200GUL, BD2201GUL ●Block Diagram VIN VOUT B VIN A VIN VOUT VOUT EN GND 1 2 3 BD2200GUL,BD2201GUL (Bottom view) charge pump Fig.26 Pin configuration GND EN Fig.25 Bock diagram ●Pin Description Pin number Pin name Pin function A3 GND Ground B2, B3 VOUT Switch output (connect each pin externally) A1, B1 VIN Switch input (connect each pin externally) A2 EN Enable input (Active-High Switch on input) ●I/O Equivalent Circuit Pin name Pin number Equivalent circuit VIN EN A2 VIN A1, B1 VOUT B2, B3 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. EN VIN VOUT 6/9 2011.02 - Rev.A Technical Note BD2200GUL, BD2201GUL ●Operation Description 1. Switch operation Each VIN and VOUT pins are connected to MOSFET’s drain and source. By setting EN input to High level, the internal charge pump operates and turns on MOSFET. When MOSFET is turned on, the switch becomes bidirectional characteristics. Consequently, in case of VIN < VOUT, the current is flowing from VOUT to VIN. 2. Output discharge circuit Discharge circuit operates when switch is off. When discharge circuit operates, 70Ω (Typ.) resistor is connected between VOUT pin and GND pin. This discharges the electrical charge quickly. VIN EN VOUT Discharge circuit ON OFF ON OFF ON Fig.27 Operation timing ●Application Circuit Example ●Power Dissipation Characteristics 700 ON/OFF VOUT VIN VOUT EN GND 600 LOAD Fig.28 Application circuit example POWER DISSIPATION : Pd [mW] VIN VIN 500 400 300 200 100 **This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including static and transitional characteristics as well as dispersion of the IC. 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE : Ta [ ℃] Fig.29 Power dissipation curve (Pd-Ta Curve) (VCSP50L1 package) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/9 2011.02 - Rev.A Technical Note BD2200GUL, BD2201GUL ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and GND line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the external circuits, separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the Occurrence of capacity dropout at a low temperature, thus determining the constant. (3) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (4) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal design Perform thermal design in which there are adequate margins by taking into account the power dissipation (PD) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/9 2011.02 - Rev.A Technical Note BD2200GUL, BD2201GUL ●Ordering part number B D 2 Part No. 2 0 0 G Part No. 2200 2201 U L Package GUL: VCSP50L1 - E 2 Packaging and forming specification E2: Embossed tape and reel VCSP50L1(BD2200GUL) 1.00±0.05 <Tape and Reel information> 1.50±0.05 Tape Embossed carrier tape Quantity 3000pcs Direction of feed 0.55MAX 0.10±0.05 1PIN MARK E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.06 S (φ0.15)INDEX POST 6-φ0.25±0.05 0.05 A B A 0.5 B B 0.25±0.05 S A 1 0.25±0.05 2 3 1pin P=0.5×2 Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. VCSP50L1(BD2201GUL) <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed 0.55MAX 1.00±0.05 1.50±0.05 0.10±0.05 1PIN MARK E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.06 S (φ0.15)INDEX POST 6-φ0.25±0.05 0.05 A B A B 0.5 B A 0.25 0.25±0.05 0.25±0.05 S 1 2 3 1pin P=0.5×2 Reel (Unit : mm) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/9 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2011.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. 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