ROHM BD2200GUL

Power Management Switch ICs for PCs and Digital Consumer products
Load Switch ICs
for Portable Equipment
BD2200GUL, BD2201GUL
No.11029EAT22
●Description
BD2200GUL ,BD2201GUL are Load switches for portable device. It is Load switch IC with build-in N channel MOSFET.
This switch IC achieves On-resistance of 100mΩ (Typ.). It has the function of Soft-Start and build-in discharge circuit.
●Features
1) Single Channel Of Low On-resistance (Typ.=100mΩ) N-channel MOSFET Built in
2) 500mA Output Load Current (BD2200GUL)
1000mA Output Load Current (BD2201GUL)
3) Soft-Start Function
4) Output Discharge Circuit
5) VCSP50L1 package
●Application
Mobile phone, Digital still camera, PDA, MP3 player, PC, etc.
●Line up matrix
Part Number
On-resistance
Output current
Discharge circuit
Logic control input
BD2200GUL
100mΩ
500mA
○
High
BD2201GUL
100mΩ
1000mA
○
High
Package
VCSP50L1
1.5×1.0 mm
VCSP50L1
1.5×1.0 mm
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
VIN Supply voltage
VIN
-0.3 ~ 6.0
V
EN input voltage
VEN
-0.3 ~ VIN + 0.3
V
VOUT voltage
VOUT
-0.3 ~ 6.0
V
Storage temperature
TSTG
-55 ~ 150
℃
Pd
575 *1
mW
Power dissipation
*1
*
Mounted on 50mm * 58mm * 1.75mm Glass-epoxy PCB. Derating: 4.6mW / ℃ at Ta > 25℃
This product is not designed for protection against radioactive rays.
●Operation Conditions
Parameter
Symbol
Ratings
Unit
Min.
Typ.
Max.
VIN
2.7
3.3
5.5
V
TOPR
-25
25
85
℃
Output current (BD2200GUL)
ILO
0
-
500
mA
Output current (BD2201GUL)
ILO
0
-
1000
mA
Switch input voltage
Operation temperature
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1/9
2011.02 - Rev.A
Technical Note
BD2200GUL, BD2201GUL
●Electrical Characteristics
○BD2200GUL (unless otherwise specified, VIN = 3.3V, Ta = 25℃)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Condition
[Current consumption]
Operating current
IDD
-
20
30
µA
VEN = 1.2V, VOUT = open
Standby current
ISTB
-
0.01
1
µA
VEN = 0V, VOUT = open
VENH
1.2
-
-
V
High level input
VENL
-
-
0.4
V
Low level input
IEN
-1
-
1
µA
VEN = 0V or VEN = 1.2V
On-resistance
RON
-
100
200
mΩ
ILO = 500mA
Switch leakage current
ILEAK
-
0.01
1
µA
VEN = 0V, VOUT = 0V
Output rise time
TON1
-
1.0
2.0
ms
RL = 10Ω, VOUT :10% → 90%
Output turn-on time
TON2
-
1.2
2.4
ms
RL = 10Ω, VEN :50% →VOUT :90%
Output fall time
TOFF1
-
2.5
5.0
µs
RL = 10Ω, VOUT :90% → 10%
Output turn-off time
TOFF2
-
4.5
9.0
µs
RL = 10Ω, VEN :50% →VOUT :10%
Discharge on-resistance
RDISC
-
70
110
Ω
ILO = -1mA, VEN = 0V
Discharge current
IDISC
-
15
20
mA
VOUT = 3.3V, VEN = 0V
Unit
Condition
[I/O]
EN input voltage
EN input current
[Power switch]
[Discharge circuit]
○BD2201GUL (unless otherwise specified, VIN = 3.3V, Ta = 25℃)
Parameter
Symbol
Limits
Min.
Typ.
Max.
[Current consumption]
Operating current
IDD
-
20
30
µA
VEN = 1.2V, VOUT = open
Standby current
ISTB
-
0.01
1
µA
VEN = 0V, VOUT = open
VENH
1.2
-
-
V
High level input
VENL
-
-
0.4
V
Low level input
IEN
-1
-
1
µA
VEN = 0V or VEN = 1.2V
On-resistance
RON
-
100
180
mΩ
ILO = 500mA
Switch leakage current
ILEAK
-
0.01
1
µA
VEN = 0V, VOUT = 0V
Output rise time
TON1
-
1.0
2.0
ms
RL = 10Ω, VOUT :10% → 90%
Output turn-on time
TON2
-
1.2
2.4
ms
RL = 10Ω, VEN :50% →VOUT :90%
Output fall time
TOFF1
-
2.5
5.0
µs
RL = 10Ω, VOUT :90% → 10%
Output turn-off time
TOFF2
-
4.5
9.0
µs
RL = 10Ω, VEN :50% →VOUT :10%
Discharge on-resistance
RDISC
-
70
110
Ω
ILO = -1mA, VEN = 0V
Discharge current
IDISC
-
15
20
mA
VOUT = 3.3V, VEN = 0V
[I/O]
EN input voltage
EN input current
[Power switch]
[Discharge circuit]
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2/9
2011.02 - Rev.A
Technical Note
BD2200GUL, BD2201GUL
●Test Circuit
VIN VEN
VIN
VOUT
VIN
VOUT
EN
GND
CL
RL
Fig.1 Measurement circuit
●Switch Output Turn ON/OFF Timing
VEN
50%
50%
TON2
TOFF2
90%
VOUT
90%
10%
10%
TON1
TOFF1
Fig.2 Timing diagrams
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3/9
2011.02 - Rev.A
Technical Note
BD2200GUL, BD2201GUL
●Reference Data
40
40
1.0
30
20
10
0
2
3
4
5
VIN=3.3V
30
20
10
0
SUPPLY VOLTAGE : VIN [V]
0.6
0.4
0.2
0.0
1.0
0.5
2
3
4
5
100
50
6
Fig.9 On-resistance vs. VIN
150
100
50
2.0
Ta=25℃
RL=10Ω
6
1.2
0.8
0
50
AMBIENT TEMPERATURE : Ta [°C]
Fig.12 Output rise time
Fig.13 Output rise time
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600
2.0
Ta=25℃
RL=10Ω
1.6
1.2
0.8
0.4
0.0
-50
SUPPLY VOLTAGE : VIN [V]
© 2011 ROHM Co., Ltd. All rights reserved.
100
200
300
400
500
OUTPUT CURRENT : ILO [mA]
Fig.11 On-resistance vs. ILO
2.4
0.0
0.0
50
0
VIN=3.3V
RL=10Ω
0.4
0.4
100
0
TURN ON TIME : TON2[ms]
RISE TIME : TON1[ms]
0.8
150
0
50
100
AMBIENT TEMPERATURE : Ta [°C]
1.6
1.6
1.2
VIN=3.3V
Ta=25℃
Fig.10 On-resistance vs. temperature
2.0
0
50
100
AMBIENT TEMPERATURE : Ta [°C]
200
VIN=3.3V
ILO=100mA
0
-50
0
5
0.5
Fig.8 EN input voltage
ON RESISTANCE : R ON[mΩ]
ON RESISTANCE : R ON [mΩ]
150
4
1.0
0.0
-50
6
200
Ta=25℃
ILO=100mA
3
1.5
Fig.7 EN input voltage
Fig.6 Standby current
EN disable
2
VIN=3.3V
SUPPLY VOLTAGE : VIN [V]
200
6
2.0
1.5
100
3
4
5
SUPPLY VOLTAGE : VIN [V]
3
4
5
SUPPLY VOLTAGE : VIN [V]
Fig.5 Standby current
EN disable
Ta=25℃
AMBIENT TEMPERATURE : Ta [°C]
ON RESISTANCE : RON [mΩ]
2
0.0
2
0.2
100
ENABLE INPUT VOLTAGE : VEN [V]
ENABLE INPUT VOLTAGE: VEN[V]
STANDBY CURRENT : ISTB[µA]
0.8
RI SE TIME : TON1[ms ]
50
2.0
VIN=3.3V
50
0.4
Fig.4 Operating current
EN enable
1.0
0
0.6
AMBIENT TEMPERATURE : Ta [°C]
Fig.3 Operating current
EN enable
-50
0.8
0.0
0
-50
6
Ta=25℃
STANDBY CURRENT : ISTB[µA]
OPERATING CURRENT : IDD [µA]
OPERATING CURRENT : IDD [µA]
Ta=25℃
4/9
100
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
Fig.14 Output turn-on time
2011.02 - Rev.A
Technical Note
BD2200GUL, BD2201GUL
5.0
VIN=3.3V
RL=10Ω
2.0
1.2
0.8
0.4
0.0
3.0
2.0
50
2
AMBIENT TEMPERATURE : Ta [℃]
3
4
5
SUPPLY VOLTAGE : VIN [V]
Fig.15 Output turn-on time
Fig.16 Output fall time
9
Ta=25℃
RL=10Ω
6
5
3
2
0
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
6
5
3
2
0
-50
DISCHARSE ON RESISTANCE : RDISC [Ω]
Fig.18 Output turn-off time
-50
6
VIN=3.3V
RL=10Ω
8
TURN OFF TIME : TOFF2 [µs]
8
2.0
0.0
100
0
50
100
AMBIENT TEMPERATURE : Ta [℃]
Fig.17 Output fall time
DISCHARSE ON RESISTANCE : RDISC [Ω]
9
0
3.0
1.0
1.0
0.0
-50
VIN=3.3V
RL=10Ω
4.0
FALL TI ME : TOFF1[ µs]
1.6
TURN OFF TIME : TOFF2 [µs]
5.0
Ta=25℃
RL=10Ω
4.0
FALL TIME : TOFF1 [µs]
TURN ON TIME : TON2 [ms]
2.4
120
Ta=25℃
100
80
60
40
20
0
0
50
100
AMBIENT TEMPERATURE : Ta [℃]
2
3
4
5
SUPPLY VOLTAGE : VIN [V]
6
Fig.19 Output turn-off time
Fig.20 Discharge on-resistance
120
VIN=3.3V
100
80
60
40
20
0
-50
0
50
100
AMBIENT TEMPERATURE : Ta [℃]
Fig.21 Discharge on-resistance
●Waveform Data (BD2200GUL)
VEN
(1.0V/div.)
VEN
(1.0V/div.)
VOUT
(2.0V/div.)
CL=22µF
VOUT
(2.0V/div.)
VOUT
(2.0V/div.)
VIN=3.3V
RL=10kΩ
CL=4.7µF
IOUT
(20mA/div.)
CIN=10µF
VIN=3.3V
RL=10kΩ
CL=4.7µF
IOUT
(20mA/div.)
TIME (0.5ms/div.)
TIME (0.5ms/div.)
Fig.22 Output turn-on response
Fig.23 Output turn-off response
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VIN=3.3V
RL=10kΩ
5/9
IOUT
CL=4.7µF
(20mA/div.)
TIME (0.5ms/div.)
Fig.24 Rush current response
2011.02 - Rev.A
Technical Note
BD2200GUL, BD2201GUL
●Block Diagram
VIN
VOUT
B
VIN
A
VIN
VOUT VOUT
EN
GND
1
2
3
BD2200GUL,BD2201GUL
(Bottom view)
charge
pump
Fig.26 Pin configuration
GND
EN
Fig.25 Bock diagram
●Pin Description
Pin number
Pin name
Pin function
A3
GND
Ground
B2, B3
VOUT
Switch output
(connect each pin externally)
A1, B1
VIN
Switch input
(connect each pin externally)
A2
EN
Enable input
(Active-High Switch on input)
●I/O Equivalent Circuit
Pin name
Pin number
Equivalent circuit
VIN
EN
A2
VIN
A1, B1
VOUT
B2, B3
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EN
VIN
VOUT
6/9
2011.02 - Rev.A
Technical Note
BD2200GUL, BD2201GUL
●Operation Description
1. Switch operation
Each VIN and VOUT pins are connected to MOSFET’s drain and source. By setting EN input to High level, the internal
charge pump operates and turns on MOSFET.
When MOSFET is turned on, the switch becomes bidirectional characteristics. Consequently, in case of VIN < VOUT, the
current is flowing from VOUT to VIN.
2. Output discharge circuit
Discharge circuit operates when switch is off. When discharge circuit operates, 70Ω (Typ.) resistor is connected between
VOUT pin and GND pin. This discharges the electrical charge quickly.
VIN
EN
VOUT
Discharge circuit ON
OFF
ON
OFF
ON
Fig.27 Operation timing
●Application Circuit Example
●Power Dissipation Characteristics
700
ON/OFF
VOUT
VIN
VOUT
EN
GND
600
LOAD
Fig.28 Application circuit example
POWER DISSIPATION : Pd [mW]
VIN
VIN
500
400
300
200
100
**This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants,
make sure to leave an adequate margin for external components including
static and transitional characteristics as well as dispersion of the IC.
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE : Ta [ ℃]
Fig.29 Power dissipation curve (Pd-Ta Curve)
(VCSP50L1 package)
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7/9
2011.02 - Rev.A
Technical Note
BD2200GUL, BD2201GUL
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit.
If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take
physical safety measures including the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and
GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the
external circuits, separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a capacitor
between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly check to be
sure the characteristics of the capacitor to be used present no problem including the Occurrence of capacity dropout at
a low temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (PD) in
actual states of use.
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8/9
2011.02 - Rev.A
Technical Note
BD2200GUL, BD2201GUL
●Ordering part number
B
D
2
Part No.
2
0
0
G
Part No.
2200
2201
U
L
Package
GUL: VCSP50L1
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
VCSP50L1(BD2200GUL)
1.00±0.05
<Tape and Reel information>
1.50±0.05
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.55MAX
0.10±0.05
1PIN MARK
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.06 S
(φ0.15)INDEX POST
6-φ0.25±0.05
0.05 A B
A
0.5
B B
0.25±0.05
S
A
1
0.25±0.05
2
3
1pin
P=0.5×2
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
VCSP50L1(BD2201GUL)
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.55MAX
1.00±0.05
1.50±0.05
0.10±0.05
1PIN MARK
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.06 S
(φ0.15)INDEX POST
6-φ0.25±0.05
0.05 A B
A
B
0.5
B
A
0.25
0.25±0.05
0.25±0.05
S
1
2
3
1pin
P=0.5×2
Reel
(Unit : mm)
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9/9
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.02 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
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More detail product informations and catalogs are available, please contact us.
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R1120A