MPM01 Datasheet

Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
General Descriptions
Package
 Full molding package SIP9(LF971)
The MPM series is a full molded hybrid IC which contains
a non-insulated buck type DC/DC converter in one
package. A power supply circuit can be composed in a
simple way by using this hybrid IC which requires a small
part count.
By connecting only an input smoothing electrolytic
capacitor, an output smoothing electrolytic capacitor and
an output voltage setting resistor, the hybrid IC can be
operated. Because of this simple composition, time
required for design evaluation is significantly reduced.
Since a power inductor is built in, it is not required to
select and evaluate the inductor separately. By adopting a
full molding package which can be fitted to the heat sink
by screwing, board mounting can be made in
self-supporting state without the heat sink subject to the
output voltage setting and load conditions.
Pin
1,3
2
4
5,6,7
8,9
Features & Benefits
 Current mode type synchronization rectification
PWM control system
 By connecting only an input smoothing electrolytic
capacitor, an output smoothing electrolytic capacitor
and an output voltage setting resistor, the hybrid IC
can be operated.
 Since a power inductor is built in, it is not required to
select and evaluate the inductor separately.
 Maximum efficiency 91%
 Output current range 0 to 3A
 Operating frequency 250kHz
 Reference voltage 0.5V±2%
 Built-in protection function
Over Current Protection (OCP)
Thermal Shutdown (TSD)
Under Voltage Lockout (UVLO)
 Built-in phase compensation
 Built-in Soft-Start function
Symbol
GND
VIN
FB
OUT
SW
Pin Assignment
Function
Ground terminal
Input power supply terminal
Feedback terminal
Output terminal
Switching-Frequency-measurement
Electrical Characteristics
 Input voltage range: MPM01 : 9V to 40V
MPM04 : 16V to 40V
 Output voltage range: MPM01 : 1.8V to 12V
MPM04 : 12V to 24V
 Output current IO = 3A
 Operating frequency: 250kHz
Applications
 FA machine / Communications equipment
Domestic products
 Amusement machine / others
Line up
Product
name
fsw
MPM01
VIN
9V to 40V
Vo
*1 1.8V to 12V
250kHz
MPM04
(1)
Io
3A
16V to 40V *2
12V to 24V
Lead Forming
LF971
LF972
LF971
LF972
Self-supporting
Right angle
Self-supporting
Right angle
The minimum input voltage shall be either of 9V or VO+4V, whichever is higher.
(2)
The minimum input voltage shall be either of 16V or VO+4V, whichever is higher. And than Vin(MIN)36V in
20V<Vo<24V more than Vin(MIN)30V in 18V<Vo<20V.
Rev.3.0
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
Typcal Application Circuits
Load
MPM00 series
fig.1
Absolute maximum ratings
Table 2
symbol
Specifications
units
VIN terminal voltage
Items
VIN
-0.3 to 41
V
FB terminal voltage
VFB
-0.3 to 6
V
OUT terminal voltage
-0.3 to 13
Vo
SW terminal voltage
VIN-SW voltage
Allowable power dissipation
-8 to Vin
Storage temperature
Thermal resistance(between MIC
junction and frame)
MPM04
Pulse width ≦20ns
V
-1.3 to Vin
VVIN-SW
55
V
<30nS
Ploss
2.5
W
without a Radiator
Tj
-20 to 150
°C
Tstg
-20 to 120
°C
θj-f
7.7
°C/W
(3)、(4)
Junction temperature
MPM01
V
-0.3 to 25
Vsw
condition
(5)
(3).(4).Only MIC,However, it is limited for overheat protection. The overheat protection detection temperature is
approximately 160°C. Allowable power dissipation Ploss is applicable only to the semiconductor chip..
(5). Because the highest temperature limit of the circuit board for power-semiconductor chip is 125°C.
Recommended operating conditions (6)
Items
Input voltage range
Output current range (7)
Junction temperature in
operation
Symbol
Specifications
Min
Max
Units
9
40
16
40
Io
0
3
A
Tjop
-20
125
°C
1.8
12
12
24
-20
85
VIN
Output voltage setup
range
Vout
Ambient temperature
range in operation(7)
Ta
Rev.3.0
Table 3
V
MPM01 (8)
MPM04 (9)
V
MPM01 (8)
MPM04 (9)
°C
Note:refer to Thermal
derating curve
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Conditions
2
Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
(6). The recommended operating conditions means operating conditions required to maintain normal circuit functions
shown in the electrical characteristics and in the actual use, they should be maintained within these recommended
conditions.
(7).However, you must use it within Thermal derating curve. Refer to the fig.6.
(8).The minimum input voltage shall be either of 9V or VO+4V, whichever is higher.
(9).The minimum input voltage shall be either of 16V or VO+4V, whichever is higher. And than Vin(MIN)36V in
20V<Vo<24V more than Vin(MIN)30V in 18V<Vo<20V.
Electrical characteristics (Ta = 25℃) (10)
Table 4
Parameter
Symbol
Ratings
Units
Conditions
Min
typ
Max
VFBref
0.490
0.500
0.510
V
VIN=33V,Io=1A
η
-
91
-
%
VIN=33V,Vo=12V,Io=3A
fo
212
250
288
kHz
Line regulation (12)
Vline
-
-
±2
%
Load regulation (12)
Overcurrent protection
threshold
Vload
-
-
±3
%
VIN=33V,Vo=12V,Io=3A
VIN=16-40V,
Vo=12V,Io=1A
VIN=33V,Vo=12V,Io=0-3A
Is
3.2
5.60
6.41
A
Iin
-
12
-
mA
VIN=33V、Io=0A、VFB=1V
Tj
151
160
-
℃
VIN=16V to 40V
UVLO
-
7.3
8.0
V
Tstart
-
50
-
ms
Reference voltage
Efficiency (11)
Switching frequency
Supply Current
Thermal shutdown threshold
temperature (14)
Under voltage lockout
protection
Start-up delay time
VIN=33V、Vo=12V
Auto-restart (13)
Applied at VIN = 16 to 40V
up to the Vo constant
voltage accuracy
(10) The electrical characteristics mean the characteristics to be assured in the case that the IC is operated under the
above-mentioned measurement conditions in the measurement circuit diagram.
(11) The efficiency can be calculated by the equation 1 as follows:
・・・(1)
(12) The line/load regulation does not include any set deviation of output voltage.
It should be noted that the deviation of set output voltage is affected by the accuracy of the external RFB.
As for details, please refer to the fig.10.
(13) At the time of setting the output voltages except Vo = 12V, it should be noted that the OCP operation point may
fluctuate from the values of Vo = 12V because the inductance of the built-in coil and the frequency are constant.
(14) Overheat protection is of automatic recovery type.
Rev.3.0
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
A representative characteristic example .
(1) Load regulation
fig.1
(2) Efficiency
fig.2
Rev.3.0
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
(3)Input current
fig.3
(3)Input power
fig.4
Rev.3.0
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
(4) Overcurrent protection Vo drooping curve
fig.5
(5)Thermal derating curve
fig.6
*condition : self-cooling, MPM00 self-standing on circuit board without a radiator.
Rev.3.0
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
About thermal derating curve of output current *It is a setup of commonness of MPM01/04.
Thermal derating curve of the figure 6 is without the radiator which is a standard use condition fundamentally of MPM01/04.
By the use of cooling-fan / radiator installation, output current beyond 3A can't be agreed.
OCP(overcurrent protection) threshold value can't be changed, because it is fixed by built-in MIC.
*With package design of MPM00, though radiator installation is possible by the screw, keep the following strictly:
1) You must surely use load current with less than 3Amps.
2) You must use the radiator of the form that package surface temperature is less than 100℃.
(But, ambient temperature "Ta" makes 85℃ an upper limit.)
Block diagram
*It is a setup of commonness of MPM01/04.
MPM01
3704
①
⑨
fig.7
fig.8
Pin assign & function/name
Terminal
number
①
Table 5
symbol
Functions/names
GND
Ground terminal
②
VIN
Input power supply terminal
③
GND
Ground terminal
④
FB
⑤⑥⑦
OUT
Feedback terminal/resistor RFB connection terminal for output voltage setting
Output terminal
SW
Oscillating frequency measurement terminal (15)
⑧⑨
(15) The "SW" terminal is for the measurement(switching frequency) in the manufacture process. Connect nothing
on the circuit board in case of use.
*Confirm a terminal number referring to the fig.8.
Rev.3.0
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
Application circuit example *It is a setup of commonness of MPM01/04.
Load
Conditions:
VIN=24V,
Vo=12V,
Io=3A,
Cin=1000μF,
Co=1000μF×2,
RFB=200Ω
MPM00 series
fig.9
A design guide for add-on parts .
(1)Input capacitor “Cin”
・If output impedance of the VIN power supply is ideally endless and it is near-zero, the ripple-current doesn't flow to
Cin. To make stabilize movement of MPM01/04, You must connect the input capacitor "Cin" between ②pin to ①
③pin in the shortest path. As for Cin, The withstand-voltage and allowable ripple-current ask for the selection which
has a margin.
(2)Output capacitor “Co”
・The ripple-current that is switching frequency flows to output-capacitor "Co".Refer to an application notebook for
the way of calculating the output-ripple-current. As for Co, Use the capacitor which has low-impedance character for
the switch mode power-supply. To reduce the output-ripple-noise, You must connect the output capacitor "Co"
between ⑤⑥⑦pin - ①③pin at shortest. As well as the case of Cin , The withstand-voltage and allowable
ripple-current ask for the selection which has a margin.
(3) Output voltage setup resistor RFB
・With MPM01/04, An output voltage Vo can be set up by adjusting R FB. Refer to an application notebook for the
details. fig.10 becomes output voltage value for RFB. Connect RFB between ④pin - ①③pin at shortest.
Setup of the Vo by RFB resistance value.
*Attention .
As for a setup of Vo of
MPM01, 12V is an
upper limit.
Use MPM04 when an
output voltage exceeds
12V.
*Example.
In case of Vo=5V,
RFB=510Ω
In case of Vo=12V,
RFB=200Ω
200
300
400
500
700
2000
fig.10
Rev.3.0
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
PCB layout recommendation
(1) As for GND-line, give priority to and connect ①&③pin to the (-) side of output-capacitor Co.
(2) Arrange RFB near MPM01/04, and connect a pattern to R FB at shortest as much as possible. It has the possibility that
the aggravation of Line and Load regulation and a un-stable movement happen when the pattern route of R FB is long.
(3) ⑧&⑨pin are terminal for switching-frequency measurement in the manufacture process. In case of use, make it
electrically open. But, install LAND for the lead-pin fixation in the circuit board.
fig.11
PCB layout /parts mounting side(single side circuit board)
Note:
1)PCB size: 50mm × 35mm
2) Drawing is not to scale.
Rev.3.0
(The part occupation area of the outline .)
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
Package outline, dimensions
(Units:mm)
SIP9, “3GR-S” package (Sanken original)
Lead-forming : LF971(self-supporting)
MPM**
Lot.No
*Material of terminal:Cu
*Processing of terminal:
Ni plating + solder
dipping
*Product weight:
approximately 20g
*Screwing torque:
0.588~0.785(N・m)
fig.12
*In the fig.12 of front view which is common to MPM01-04, product numbers of each model name should be printed in **.
*Marking
1) Product number:MPM01or MPM04
2) Lot number (four digit) (Lot.No)
3)Marking device:
CO2/YAG Laser marker
1st letter : The last digit of the year
2nd letter : Month
January to September : 1 to 9
October : O November : N December : D
3rd &4th letter : manufacturing day:01~31
Rev.3.0
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
(Units:mm)
Sep./15/2015
SIP9, “3GR-S” package (Sanken original)
Lead-forming : LF972(right angle)
MPM**
Lot.No
*Material of terminal:Cu
*Processing of terminal:
Ni plating + solder
dipping
*Product weight:
approximately 20g
*Screwing torque:
0.588~0.785(N・m)
fig.13
*In the fig.13 of front view which is common to MPM01-04, product numbers of each model name should be printed in **.
*The marking method is the same as the self-supporting lead forming type LF971.
Rev.3.0
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends
on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set
by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve
the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc.,
environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of
semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into
consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating
value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please observe the
following cautions.
Cautions for Storage
 Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
 Avoid locations where dust or harmful gases are present and avoid direct sunlight.
 Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power surges
from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the
ratings specified by Sanken for the products.
Remarks About Using Thermal Silicone Grease
 When thermal silicone grease is used, it shall be applied evenly and thinly. If more silicone grease than required is
applied, it may produce excess stress.
 The thermal silicone grease that has been stored for a long period of time may cause cracks of the greases, and it cause
low radiation performance. In addition, the old grease may cause cracks in the resin mold when screwing the products to
a heatsink.
 Fully consider preventing foreign materials from entering into the thermal silicone grease. When foreign material is
immixed, radiation performance may be degraded or an insulation failure may occur due to a damaged insulating plate.
 The thermal silicon greases that are recommended for the resin molded semiconductor should be used.
Our recommended thermal silicone grease is the following, and equivalent of these.
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive Performance Materials Japan LLC
SC102
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
 When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an
extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. For
mounting the products, the mounting surface flatness should be 0.05mm or less.
 Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to the
products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the hole
diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That may stress the
products and may cause failures.
 Recommended screw torque: 0.588 to 0.785 N・m (6 to 8 kgf・cm).
 For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress
fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. Tightening
with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can be applied and
the package may be damaged. Therefore, an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with
the specified torque. When using a power driver, torque control is mandatory.
Soldering
 When soldering the products, please be sure to minimize the working time, within the following limits:
• 260 ± 5 °C
10 ± 1 s (Flow, 2 times)
• 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time)
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Io=3A non-isorated step-down DC/DC Converter module
MPM00 Series
Sep./15/2015
 Soldering should be at a distance of at least 1.5 mm from the body of the products.
When soldering the products, please be sure to minimize the working time, within the following limits:
・Reflow
Preheat ; 180 °C / 90 ± 30 s
Solder heating ; 250 °C / 10 ± 1s (260 °C peak, 2 times)
・Soldering iron ; 380 ± 10 °C / 3.5 ± 0.5s (1 time)
Electrostatic Discharge
 When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ of
resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
 Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats.
 When using measuring equipment such as a curve tracer, the equipment should be grounded.
 When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak
voltages generated by them from being applied to the products.
 The products should always be stored and transported in Sanken shipping containers or conductive containers, or be
wrapped in aluminum foil.
IMPORTANT NOTES
 The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure
that this is the latest revision of the document before use.
 Application examples, operation examples and recommended examples described in this document are quoted for the
sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any
infringement of industrial property rights, intellectual property rights, life, body, property or any other rights of Sanken
or any third party which may result from its use.
 Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or implied, as
to the products, including product merchantability, and fitness for a particular purpose and special environment, and the
information, including its accuracy, usefulness, and reliability, included in this document.
 Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of
semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk,
preventative measures including safety design of the equipment or systems against any possible injury, death, fires or
damages to the society due to device failure or malfunction.
 Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety
devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus,
please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is
required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
 When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically,
chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from
all such uses in advance and proceed therewith at your own responsibility.
 Anti radioactive ray design is not considered for the products listed herein.
 Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of
Sanken’s distribution network.
 The contents in this document must not be transcribed or copied without Sanken’s written consent.
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