ISL90840 ® Quad Digitally Controlled Potentiometers (XDCP™) Data Sheet November 14, 2006 FN8086.2 Low Noise, Low Power I2C® Bus, 256 Taps Features The ISL90840 integrates four digitally controlled potentiometers (XDCP) on a monolithic CMOS integrated circuit. • Four potentiometers in one package • 256 resistor taps - 0.4% resolution • I2C serial interface - Three address pins, up to eight devices/bus The digitally controlled potentiometers are implemented with a combination of resistor elements and CMOS switches. The position of the wipers are controlled by the user through the I2C bus interface. Each potentiometer has an associated volatile Wiper Register (WR) that can be directly written to and read by the user. The contents of the WR controls the position of the wiper. When powered on the ISL90810’s wiper will always commence at mid-scale (128 tap position). - Write/Read capability • Power-on preset to mid-scale (128 tap position) • Wiper resistance: 70Ω typical @ 3.3V • Standby current <5µA max • Power supply: 2.7V to 5.5V The DCPs can be used as three-terminal potentiometers or as two-terminal variable resistors in a wide variety of applications including control, parameter adjustments, and signal processing. • 50kΩ, 10kΩ total resistance • 20 Ld TSSOP package • Pb-free plus anneal available (RoHS compliant) Pinout ISL90840 (20 LD TSSOP) TOP VIEW RH3 1 20 RW0 RL3 2 19 RL0 RW3 3 18 RH0 A2 4 17 D.N.C. SCL 5 16 VCC SDA 6 15 A1 GND 7 14 A0 RW2 8 13 RH1 RL2 9 12 RL1 RH2 10 11 RW1 Ordering Information PART NUMBER PART MARKING ISL90840UIV2027Z (Notes 1 and 2) ISL90840UI27Z ISL90840UIV2027 ISL90840UI27 RESIST-ANCE OPTION (Ω) TEMP RANGE (°C) 50k -40 to +85 PACKAGE 20 Ld TSSOP (Pb-free) PKG. DWG # MDP0044 50k -40 to +85 20 Ld TSSOP MDP0044 ISL90840UAV2027Z (Notes 1 and 2) ISL90840UA27Z 50k -40 to +105 20 Ld TSSOP (Pb-free) MDP0044 ISL90840WIV2027Z (Notes 1 and 2) ISL90840WI27Z 10k -40 to +85 20 Ld TSSOP (Pb-free) MDP0044 ISL90840WIV2027 10k -40 to +85 20 Ld TSSOP MDP0044 10k -40 to +105 20 Ld TSSOP (Pb-free) MDP0044 ISL90840WI27 ISL90840WAV2027Z (Notes 1 and 2) ISL90840WA27Z NOTES: 1. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Add “T2” suffix for tape and reel. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) and XDCP are registered trademarks of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005-2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL90840 Functional Diagram VCC RH0 RH1 RH2 RH3 SCL SDA A0 I2C INTERFACE A1 A2 GND RL0 RW0 RL1 RW1 RL2 RW2 RL3 RW3 Block Diagram VCC I2C INTERFACE SDA SCL POWER-UP, INTERFACE, CONTROL AND STATUS LOGIC WR3 DCP3 RH3 RW3 RL3 WR2 DCP2 RH2 RW2 RL2 WR1 DCP1 RH1 RW1 RL1 WR0 DCP0 RH0 RW0 RL0 A2 A1 A0 GND 2 FN8086.2 November 14, 2006 ISL90840 Pin Descriptions TSSOP PIN SYMBOL 1 RH3 “High” terminal of DCP3 2 RL3 “Low” terminal of DCP3 3 RW3 “Wiper” terminal of DCP3 4 A2 5 SCL I2C interface clock 6 SDA Serial data I/O for the I2C interface 7 GND Device ground pin 8 RW2 “Wiper” terminal of DCP2 9 RL2 “Low” terminal of DCP2 10 RH2 “High” terminal of DCP2 11 RW1 “Wiper” terminal of DCP1 12 RL1 “Low” terminal of DCP1 13 RH1 “High” terminal of DCP1 14 A0 Device address for the I2C interface 15 A1 Device address for the I2C interface 16 VCC 17 D.N.C. 18 RH0 “High” terminal of DCP0 19 RL0 “Low” terminal of DCP0 20 RW0 “Wiper” terminal of DCP0 3 DESCRIPTION Device address for the I2C interface Power supply pin Do not connect FN8086.2 November 14, 2006 ISL90840 Absolute Maximum Ratings Thermal Information Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage at Any Digital Interface Pin With Respect to VSS . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3V VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V Voltage at Any DCP Pin With Respect to VSS . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA Latchup . . . . . . . . . . . . . . . . . . . . . . . . . Class II, Level A @ +105°C ESD HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5kV Thermal Resistance (Typical, Note 3) θJA (°C/W) 20 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 90 Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C Recommended Operating Conditions Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C Automotive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5mW Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.0mA CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Analog Specifications SYMBOL RTOTAL Over recommended operating conditions unless otherwise stated. PARAMETER RH to RL resistance TEST CONDITIONS CH/CL/CW ILkgDCP Wiper resistance MAX UNIT 10 kΩ U option 50 kΩ -20 VCC = 3.3V @ +25°C, wiper current = VCC/RTOTAL 70 Potentiometer capacitance (Note 18) Leakage on DCP pins (Note 18) TYP (NOTE 4) W option RH to RL resistance tolerance RW MIN +20 % 200 Ω 10/10/25 Voltage at pin from GND to VCC 0.1 pF 1 µA -1 1 LSB (Note 5) -0.5 0.5 LSB (Note 5) LSB (Note 5) VOLTAGE DIVIDER MODE (0V @ RLi; VCC @ RHi; measured at RWi, unloaded; i = 0, 1, 2, or 3) INL (Note 9) Integral non-linearity DNL (Note 8) Differential non-linearity Monotonic over all tap positions ZSerror (Note 6) Zero-scale error W option 0 1 7 U option 0 0.5 2 FSerror (Note 7) Full-scale error W option -7 -1 0 U option -2 -1 0 VMATCH (Note 10) DCP to DCP matching Any two DCPs at same tap position, same voltage at all RH terminals, and same voltage at all RL terminals -2 TCV (Note 11) Ratiometric temperature coefficient DCP register set to 80 hex 2 ±4 LSB (Note 5) LSB (Note 5) ppm/°C RESISTOR MODE (Measurements between RWi and RLi with RHi not connected, or between RWi and RHi with RLi not connected. i = 0, 1, 2 or 3) RINL (Note 15) Integral non-linearity RDNL (Note 14) Differential non-linearity Roffset (Note 13) Offset RMATCH (Note 16) DCP to DCP matching 4 DCP register set between 20 hex and FF hex; monotonic over all tap positions -1 1 MI (Note 12) -0.5 0.5 MI (Note 12) MI (Note 12) W option 0 1 7 U option 0 0.5 2 Any two DCPs at the same tap position with the same terminal voltages -2 2 MI (Note 12) FN8086.2 November 14, 2006 ISL90840 Analog Specifications SYMBOL TCR (Note 17) Over recommended operating conditions unless otherwise stated. (Continued) PARAMETER Resistance temperature coefficient TEST CONDITIONS MIN DCP register set between 20 hex and FF hex TYP (NOTE 4) MAX ±45 UNIT ppm/°C Operating Specifications Over the recommended operating conditions unless otherwise specified. SYMBOL ICC1 ISB ILkgDig tDCP (Note 18) PARAMETER TEST CONDITIONS MIN TYP (NOTE 4) = 400kHz; SDA = Open; (for I2C, active, MAX UNIT 1 mA VCC supply current (volatile write/read) fSCL read and write states) VCC current (standby) VCC = +5.5V, I2C Interface in Standby State, Temperature range from -40°C to 85°C 2 5 µA VCC = +5.5V, I2C Interface in Standby State, Temperature range from -40°C to 105°C 2 8 µA VCC = +3.6V, I2C Interface in Standby State, Temperature range from -40°C to 85°C 0.8 2 µA VCC = +3.6V, I2C Interface in Standby State, Temperature range from -40°C to 105°C 0.8 5 µA 10 µA Leakage current, at pins A0, A1, A2, SDA, and SCL Voltage at pin from GND to VCC DCP wiper response time SCL falling edge of last bit of DCP data byte to wiper change -10 1 µs SERIAL INTERFACE SPECS VIL A2, A1, A0, SDA, and SCL input buffer LOW voltage -0.3 0.3*VCC V VIH A2, A1, A0, SDA, and SCL input buffer HIGH voltage 0.7*VCC VCC+0.3 V Hysteresis (Note 18) SDA and SCL input buffer hysteresis 0.05* VCC VOL (Note 18) SDA output buffer LOW voltage, sinking 4mA Cpin (Note 18) fSCL 0 V 0.4 V A2, A1, A0, SDA, and SCL pin capacitance 10 pF SCL frequency 400 kHz tIN (Note 18) Pulse width suppression time at SDA and SCL inputs Any pulse narrower than the max spec is suppressed 50 ns tAA (Note 18) SCL falling edge to SDA output data valid SCL falling edge crossing 30% of VCC, until SDA exits the 30% to 70% of VCC window 900 ns tBUF (Note 18) Time the bus must be free before the start of a new transmission SDA crossing 70% of VCC during a STOP condition, to SDA crossing 70% of VCC during the following START condition 1300 ns tLOW Clock LOW time Measured at the 30% of VCC crossing 1300 ns tHIGH Clock HIGH time Measured at the 70% of VCC crossing 600 ns tSU:STA START condition setup time SCL rising edge to SDA falling edge; both crossing 70% of VCC 600 ns tHD:STA START condition hold time From SDA falling edge crossing 30% of VCC to SCL falling edge crossing 70% of VCC 600 ns tSU:DAT Input data setup time From SDA exiting the 30% to 70% of VCC window, to SCL rising edge crossing 30% of VCC 100 ns tHD:DAT Input data hold time From SCL rising edge crossing 70% of VCC to SDA entering the 30% to 70% of VCC window 0 ns 5 FN8086.2 November 14, 2006 ISL90840 Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued) SYMBOL PARAMETER TEST CONDITIONS MIN TYP (NOTE 4) MAX UNIT tSU:STO STOP condition setup time From SCL rising edge crossing 70% of VCC, to SDA rising edge crossing 30% of VCC 600 ns tHD:STO STOP condition hod time for read, or volatile only write From SDA rising edge to SCL falling edge; both crossing 70% of VCC 600 ns tDH (Note 18) Output data hold time From SCL falling edge crossing 30% of VCC, until SDA enters the 30% to 70% of VCC window 0 ns tR (Note 18) SDA and SCL rise time From 30% to 70% of VCC 20 + 0.1 * Cb 250 ns tF (Note 18) SDA and SCL fall time From 70% to 30% of VCC 20 + 0.1 * Cb 250 ns Cb (Note 18) Capacitive loading of SDA or SCL Total on-chip and off-chip 10 400 pF Rpu (Note 18) SDA and SCL bus pull-up resistor off- Maximum is determined by tR and tF chip For Cb = 400pF, max is about 2~2.5kΩ. For Cb = 40pF, max is about 15~20kΩ 1 kΩ tSU:A A2, A1 and A0 setup time Before START condition 600 ns tHD:A A2, A1 and A0 hold time After STOP condition 600 ns NOTES: 4. Typical values are for TA = 25°C and 3.3V supply voltage. 5. LSB: [V(RW)255 – V(RW)0]/255. V(RW)255 and V(RW)0 are V(RW) for the DCP register set to FF hex and 00 hex respectively. LSB is the incremental voltage when changing from one tap to an adjacent tap. 6. ZS error = V(RW)0/LSB. 7. FS error = [V(RW)255 – VCC]/LSB. 8. DNL = [V(RW)i – V(RW)i-1]/LSB-1, for i = 1 to 255. i is the DCP register setting. 9. INL = [V(RW)i – i • LSB – V(RW)]/LSB for i = 1 to 255. 10. VMATCH = [V(RWx)i – V(RWy)i]/LSB, for i = 0 to 255, x = 0 to 3 and y = 0 to 3. Max ( V ( RW ) i ) – Min ( V ( RW ) i ) 10 6 11. TC V = ---------------------------------------------------------------------------------------------- × ----------------- for i = 16 to 240 decimal, T = -40°C to +105°C. Max( ) is the maximum value of the wiper [ Max ( V ( RW ) i ) + Min ( V ( RW ) i ) ] ⁄ 2 145°C voltage and Min ( ) is the minimum value of the wiper voltage over the temperature range. 12. MI = |R255 – R0|/255. R255 and R0 are the measured resistances for the DCP register set to FF hex and 00 hex respectively. 13. Roffset = R0/MI, when measuring between RW and RL. Roffset = R255/MI, when measuring between RW and RH. 14. RDNL = (Ri – Ri-1)/MI-1, for i = 32 to 255. 15. RINL = [Ri – (MI • i) – R0]/MI, for i = 32 to 255. 16. RMATCH = (Ri,x – Ri,y)/MI, for i = 0 to 255, x = 0 to 3 and y = 0 to 3. 6 [ Max ( Ri ) – Min ( Ri ) ] 10 17. TC R = ---------------------------------------------------------------- × ----------------- for i = 32 to 255, T = -40°C to +105°C. Max( ) is the maximum value of the resistance and Min ( ) is [ Max ( Ri ) + Min ( Ri ) ] ⁄ 2 145°C the minimum value of the resistance over the temperature range. 18. This parameter is not 100% tested 6 FN8086.2 November 14, 2006 ISL90840 SDA vs SCL Timing tF tHIGH SCL tLOW tR tSU:DAT tSU:STA tHD:DAT tSU:STO tHD:STA SDA (INPUT TIMING) tAA tDH tBUF SDA (OUTPUT TIMING) A0, A1, and A2 Pin Timing STOP START SCL CLK 1 SDA IN tSU:A tHD:A A0, A1, OR A2 Typical Performance Curves 1.8 160 VCC=2.7, T=+85°C VCC=2.7, T=-40°C 1.6 VCC=2.7, T=+25°C 120 1.4 STANDBY ICC (µA) WIPER RESISTANCE (Ω) 140 100 80 60 40 1.2 -40°C 1 0.8 +85°C 0.6 0.4 20 VCC=5.5, T=-40°C 0 0 50 VCC= 5.5, T=+85°C VCC=5.5, T=+25°C 100 150 200 TAP POSITION (DECIMAL) FIGURE 1. WIPER RESISTANCE vs TAP POSITION [I(RW) = VCC / RTOTAL] FOR 50kΩ (U) 7 250 0.2 0 2.7 +25°C 3.2 3.7 4.2 4.7 5.2 VCC (V) FIGURE 2. STANDBY ICC vs VCC FN8086.2 November 14, 2006 ISL90840 Typical Performance Curves 0.2 0.3 VCC=5.5, T=-40°C 0.15 (Continued) VCC=2.7, T=-40°C VCC=2.7, T=-40°C VCC=2.7, T=+25°C VCC=5.5, T=-40°C 0.2 VCC=5.5, T=+85°C 0.1 0.1 INL (LSB) DNL (LSB) 0.05 0 -0.05 0 VCC=2.7, T=+25°C -0.1 -0.1 VCC=5.5, T=+25°C -0.15 -0.2 VCC=5.5, T=+85°C VCC=2.7, T=+85°C VCC=2.7, T=+85°C 0.3 -0.2 0 50 100 150 200 0 250 50 0.4 0 0.35 -0.2 0.3 2.7V 0.25 0.15 -40 0 20 -0.6 VCC=2.7V -0.8 40 60 -1 -40 80 -20 20 0 40 60 80 TEMPERATURE (°C) FIGURE 5. ZSerror vs TEMPERATURE FOR 50kΩ (W) FIGURE 6. FSerror vs TEMPERATURE FOR 50kΩ (W) 0.3 0.5 VCC=2.7, T=+25°C VCC=2.7, T=+25°C VCC=5.5, T=+25°C 0.3 VCC=5.5, T=-40°C 0.1 INL (LSB) DNL (LSB) 250 VCC=5.5V TEMPERATURE (°C) 0.2 200 -0.4 5.5V -20 150 FIGURE 4. INL vs TAP POSITION IN VOLTAGE DIVIDER MODE FOR 10kΩ (W) FSerror (LSB) ZSerror (LSB) FIGURE 3. DNL vs TAP POSITION IN VOLTAGE DIVIDER MODE FOR 10kΩ (W) 0.2 100 TAP POSITION (DECIMAL) TAP POSITION (DECIMAL) 0 VCC=5.5, T=+85°C 0.1 VCC=2.7, T=+85°C -0.1 -0.1 VCC=5.5, T=+85°C -0.2 -0.3 32 VCC=2.7, T=-40°C VCC=2.7, T=+85°C -0.3 VCC=5.5, T=-40°C 82 132 182 232 TAP POSITION (DECIMAL) FIGURE 7. DNL vs TAP POSITION IN RHEOSTAT MODE FOR 50kΩ (U) 8 -0.5 32 VCC=2.7, T=-40°C VCC=5.5, T=+25°C 82 132 182 232 TAP POSITION (DECIMAL) FIGURE 8. INL vs TAP POSITION IN RHEOSTAT MODE FOR 50kΩ (U) FN8086.2 November 14, 2006 ISL90840 Typical Performance Curves (Continued) 20 1 10 0.5 2.7V 0 5.5V TC (ppm/°C) END TO END RTOTAL CHANGE (%) 1.5 -0.5 0 -10 -1 -1.5 -40 -20 20 0 40 60 80 -20 32 82 132 182 232 TAP POSITION (DECIMAL) TEMPERATURE (°C) FIGURE 10. TC FOR VOLTAGE DIVIDER MODE IN ppm FOR 50kΩ (W) FIGURE 9. END TO END RTOTAL % CHANGE vs TEMPERATURE FOR 50kΩ (W) 35 TC (ppm/°C) 25 INPUT 15 5 OUTPUT -5 -15 -25 32 82 132 182 232 TAP POSITION = MID POINT RTOTAL=9.4k TAP POSITION (DECIMAL) FIGURE 11. TC FOR RHEOSTAT MODE IN ppm FOR 50kΩ (W) SIGNAL AT WIPER (WIPER UNLOADED) FIGURE 12. FREQUENCY RESPONSE (2.2MHz) SCL SIGNAL AT WIPER (WIPER UPLOADED MOVEMENT FROM ffh TO 00h WIPER MOVEMENT MID POINT FROM 80h TO 7fh FIGURE 13. MIDSCALE GLITCH, CODE 80h TO 7Fh (WIPER 0) 9 FIGURE 14. LARGE SIGNAL SETTLING TIME FN8086.2 November 14, 2006 ISL90840 Principles of Operation The ISL90840 is an integrated circuit incorporating four DCPs with their associated registers, and an I2C serial interface providing direct communication between a host and the potentiometers. DCP Description Each DCP is implemented with a combination of resistor elements and CMOS switches. The physical ends of each DCP are equivalent to the fixed terminals of a mechanical potentiometer (RH and RL pins). The RW pin of each DCP is connected to intermediate nodes, and is equivalent to the wiper terminal of a mechanical potentiometer. The position of the wiper terminal within the DCP is controlled by an 8-bit volatile Wiper Register (WR). Each DCP has its own WR. When the WR of a DCP contains all zeroes (WR[7:0]: 00h), its wiper terminal (RW) is closest to its “Low” terminal (RL). When the WR of a DCP contains all ones (WR[7:0]: FFh), its wiper terminal (RW) is closest to its “High” terminal (RH). As the value of the WR increases from all zeroes (0 decimal) to all ones (255 decimal), the wiper moves monotonically from the position closest to RL to the closest to RH. At the same time, the resistance between RW and RL increases monotonically, while the resistance between RH and RW decreases monotonically. While the ISL90840 is being powered up, all four WRs are reset to 80h (128 decimal), which locates RW roughly at the center between RL and RH. The WRs can be read or written to directly using the I2C serial interface as described in the following sections. The I2C interface Address Byte has to be set to 00h, 01h, 02h, and 03h to access the WR of DCP0, DCP1, DCP2, and DCP3 respectively I2C Serial Interface All I2C interface operations must begin with a START condition, which is a HIGH to LOW transition of SDA while SCL is HIGH. The ISL90840 continuously monitors the SDA and SCL lines for the START condition and does not respond to any command until this condition is met (See Figure 15). A START condition is ignored during the powerup of the device. All I2C interface operations must be terminated by a STOP condition, which is a LOW to HIGH transition of SDA while SCL is HIGH (See Figure 15). A STOP condition at the end of a read operation, or at the end of a write operation places the device in its standby mode. An acknowledge (ACK) is a software convention used to indicate a successful data transfer. The transmitting device, either master or slave, releases the SDA bus after transmitting eight bits. During the ninth clock cycle, the receiver pulls the SDA line LOW to acknowledge the reception of the eight bits of data (See Figure 16). The ISL90840 responds with an ACK after recognition of a START condition followed by a valid Identification Byte, and once again after successful receipt of an Address Byte. The ISL90840 also responds with an ACK after receiving a Data Byte of a write operation. The master must respond with an ACK after receiving a Data Byte of a read operation A valid Identification Byte contains 0101 as the four MSBs, and the following three bits matching the logic values present at pins A2, A1, and A0. The LSB is the Read/Write bit. Its value is “1” for a Read operation, and “0” for a Write operation (See Table 1). TABLE 1. IDENTIFICATION BYTE FORMAT Logic values at pins A2, A1, and A0 respectively 0 (MSB) 1 0 1 A2 A1 A0 R/W (LSB) The ISL90840 supports a bidirectional bus oriented protocol. The protocol defines any device that sends data onto the bus as a transmitter and the receiving device as the receiver. The device controlling the transfer is a master and the device being controlled is the slave. The master always initiates data transfers and provides the clock for both transmit and receive operations. Therefore, the ISL90840 operates as a slave device in all applications. All communication over the I2C interface is conducted by sending the MSB of each byte of data first. Protocol Conventions Data states on the SDA line must change only during SCL LOW periods. SDA state changes during SCL HIGH are reserved for indicating START and STOP conditions (See Figure 15). On power-up of the ISL90840 the SDA pin is in the input mode. 10 FN8086.2 November 14, 2006 ISL90840 SCL SDA START DATA STABLE DATA CHANGE DATA STABLE STOP FIGURE 15. VALID DATA CHANGES, START, AND STOP CONDITIONS SCL FROM MASTER 1 8 SDA OUTPUT FROM TRANSMITTER 9 HIGH IMPEDANCE HIGH IMPEDANCE SDA OUTPUT FROM RECEIVER START ACK FIGURE 16. ACKNOWLEDGE RESPONSE FROM RECEIVER 11 FN8086.2 November 14, 2006 ISL90840 WRITE SIGNALS FROM THE MASTER SIGNAL AT SDA S T A R T IDENTIFICATION BYTE ADDRESS BYTE 0 1 0 1 A2 A1 A0 0 0 0 0 0 0 0 SIGNALS FROM THE ISL90840 S T O P DATA BYTE A C K A C K A C K FIGURE 17. BYTE WRITE SEQUENCE SIGNALS FROM THE MASTER S T A R T SIGNAL AT SDA IDENTIFICATION BYTE WITH R/W=0 ADDRESS BYTE 0 1 0 1 A2 A1 A0 0 A C K S A T C O K P A C K 0 1 0 1 A2 A1 A0 1 0 0 0 0 0 0 A C K SIGNALS FROM THE SLAVE S T A IDENTIFICATION R BYTE WITH T R/W=1 A C K A C K FIRST READ DATA BYTE LAST READ DATA BYTE FIGURE 18. READ SEQUENCE Write Operation Read Operation A Write operation requires a START condition, followed by a valid Identification Byte, a valid Address Byte, a Data Byte, and a STOP condition. After each of the three bytes, the ISL90840 responds with an ACK. At this time, the device enters its standby state (See Figure 17). A Read operation consist of a three byte instruction followed by one or more Data Bytes (See Figure 18). The master initiates the operation issuing the following sequence: a START, the Identification byte with the R/W bit set to “0”, an Address Byte, a second START, and a second Identification byte with the R/W bit set to “1”. After each of the three bytes, the ISL90840 responds with an ACK. Then the ISL90840 transmits Data Bytes as long as the master responds with an ACK during the SCL cycle following the eighth bit of each byte. The master terminates the read operation (issuing a ACK and STOP condition) following the last bit of the last Data Byte (See Figure 18). The Data Bytes are from the registers indicated by an internal pointer. This pointer initial value is determined by the Address Byte in the Read operation instruction, and increments by one during transmission of each Data Byte. After reaching the memory location 03h, the pointer “rolls over” to 00h, and the device continues to output data for each ACK received. 12 FN8086.2 November 14, 2006 ISL90840 Thin Shrink Small Outline Package Family (TSSOP) MDP0044 0.25 M C A B D THIN SHRINK SMALL OUTLINE PACKAGE FAMILY A SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE (N/2)+1 N PIN #1 I.D. E E1 0.20 C B A 1 (N/2) B 2X N/2 LEAD TIPS TOP VIEW 0.05 e C H A 1.20 1.20 1.20 1.20 1.20 Max A1 0.10 0.10 0.10 0.10 0.10 ±0.05 A2 0.90 0.90 0.90 0.90 0.90 ±0.05 b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 5.00 6.50 7.80 9.70 ±0.10 E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 ±0.10 e 0.65 0.65 0.65 0.65 0.65 Basic L 0.60 0.60 0.60 0.60 0.60 ±0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference Rev. E 12/02 NOTES: SEATING PLANE 0.10 M C A B b 0.10 C N LEADS SIDE VIEW 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm per side. 3. Dimensions “D” and “E1” are measured at dAtum Plane H. SEE DETAIL “X” c 4. Dimensioning and tolerancing per ASME Y14.5M-1994. END VIEW L1 A A2 GAUGE PLANE 0.25 L A1 0° - 8° DETAIL X All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 13 FN8086.2 November 14, 2006