ISL90810 Single Digitally Controlled Potentiometer (XDCP™) Data Sheet September 10, 2015 FN8234.3 Low Noise/Low Power/I2C Bus/256 Taps Features The ISL90810 integrates a digitally controlled potentiometer (XDCP) on a monolithic CMOS integrated circuit. • 256 resistor taps - 0.4% resolution The digitally controlled potentiometers are implemented with a combination of resistor elements and CMOS switches. The position of the wipers are controlled by the user through the I2C bus interface. Each potentiometer has an associated Wiper Register (WR) that can be directly written to and read by the user. The contents of the WR controls the position of the wiper. When powered on the ISL90810’s wiper will always commence at mid-scale (128 tap position). The DCP can be used as three-terminal potentiometer or as two-terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing. • I2C serial interface with write/read capability • Power-on preset to mid-scale (128 tap position) • Wiper resistance: 70 typical @ 3.3V • Standby current 5µA max • Power supply: 2.7V to 5.5V • 50k, 10k total resistance • 8 Ld MSOP • Pb-free plus anneal available (RoHS compliant) Pinout ISL90810 (8 LD MSOP) TOP VIEW NC 1 8 VCC SCL 2 7 RH SDA 3 6 RL GND 4 5 RW Ordering Information PART NUMBER PART MARKING RTOTAL (k) TEMP RANGE (°C) PACKAGE PKG. DWG# ISL90810WIU8Z* (Note) (No longer available, recommended replacement: ISL90810UAU8Z-TK) DEN 10 -40 to +85 8 Ld MSOP (Pb-free) M8.118 ISL90810WAU8Z* (Note) (No longer available, recommended replacement: ISL90810UAU8Z-TK) 810WA 10 -40 to +105 8 Ld MSOP (Pb-free) M8.118 ISL90810UIU8Z* (Note) DEM 50 -40 to +85 8 Ld MSOP (Pb-free) M8.118 ISL90810UAU8Z* (Note) 810UA 50 -40 to +105 8 Ld MSOP (Pb-free) M8.118 *Add "-TK" suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas LLC. XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas LLC. 2005, 2006, 2015. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL90810 Block Diagram VCC RH SDA SCL I2C AND WIPER CONTROL REGISTER RL RW GND Equivalent Circuitry Pin Descriptions MSOP PIN SYMBOL 1 NC No connection 2 SCL I2C interface clock 3 SDA Serial data I/O for the I2C interface 4 GND Ground 5 RW “Wiper” terminal of the DCP 6 RL “Low” terminal of the DCP 7 RH “High” terminal of the DCP 8 VCC Power supply DESCRIPTION 2 RTOTAL RH CH 10pF CW CL RL 10pF 25pF RW FN8234.3 September 10, 2015 ISL90810 Absolute Maximum Ratings Thermal Information Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Voltage at Any Digital Interface Pin With Respect to VSS . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3V VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V Voltage at Any DCP Pin With Respect to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA Latchup . . . . . . . . . . . . . . . . . . . . . . . . . Class II, Level A @ +105°C ESD HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6kV MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V Thermal Resistance (Typical, Note 1) JA (°C/W) 8 Ld MSOP Package 130 Maximum Junction Temperature (Plastic Package . . . . . . . . +150°C Recommended Operating Conditions Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C Automotive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5mW Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.0mA CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Analog Specifications SYMBOL RTOTAL Over recommended operating conditions unless otherwise stated. PARAMETER RH to RL Resistance TEST CONDITIONS MIN W, U versions respectively CH/CL/CW ILkgDCP Wiper resistance -20 VCC = 3.3V @ +25°C Wiper current = VCC/RTOTAL 70 Potentiometer Capacitance (Note 14, Equivalent circuitry) Leakage on DCP pins (Note 14) MAX 10, 50 RH to RL Resistance Tolerance RW TYP (Notes 2) k +20 % 200 10/10/25 Voltage at pin from GND to VCC 0.1 UNIT pF 1 µA 1 LSB (Note 3) VOLTAGE DIVIDER MODE (0V @ RL; VCC @ RH; measured at RW, unloaded) INL (Note 7) Integral Non-Linearity DNL (Note 6) Differential Non-Linearity ZSerror (Note 4) Zero-Scale Error FSerror (Note 5) Full-Scale Error -1 Monotonic over all tap positions W option -0.75 +0.75 LSB (Note 3) U option +0.5 LSB (Note 3) LSB (Note 3) -0.5 W option 0 1 7 U option 0 0.5 2 W option -7 -1 0 U option -2 -0.5 0 TCV (Notes 8, 14) Ratiometric Temperature Coefficient DCP Register set to 80 hex ±4 LSB (Note 3) ppm/°C RESISTOR MODE (Measurements between RW and RL with RH not connected, or between RW and RH with RL not connected) RINL (Note 12) Integral Non-Linearity DCP register set between 20 hex and FF hex. Monotonic over all tap positions RDNL (Note 6) Differential Non-Linearity DCP register set between 20 hex W option -0.75 and FF hex. Monotonic over all tap U option -0.5 positions Roffset (Note 10) Offset TCR (Notes 13, 14) 1 MI (Note 9) +0.75 MI (Note 9) +0.5 MI (Note 9) W option 0 1 7 MI (Note 9) U option 0 0.5 2 MI (Note 9) Resistance Temperature Coefficient DCP register set between 20 hex and FF hex 3 -1 ±35 ppm/°C FN8234.3 September 10, 2015 ISL90810 Operating Specifications Over the recommended operating conditions unless otherwise specified. SYMBOL ICC1 ISB ILkgDig PARAMETER VCC Supply Current (Volatile Write/Read) VCC Current (Standby) Leakage Current at Pins SDA and SCL tDCP (Note 14) DCP Wiper Response Time Vpor Power-On Recall Voltage VCCRamp VCC Ramp Rate tD (Note 14) Power-Up Delay TYP (Note 1) MAX UNITS fSCL = 400kHz; SDA = Open; (for I2C, Active, 20 100 µA VCC = +5.5V, I2C Interface in Standby State, Temperature range from -40°C to +85°C 2 5 µA VCC = +5.5V, I2C Interface in Standby State, Temperature range from -40°C to +105°C 2 8 µA VCC = +3.6V, I2C Interface in Standby State, Temperature range from -40°C to +85°C 0.8 2 µA VCC = +3.6V, I2C Interface in Standby State, Temperature range from -40°C to +105°C 0.8 5 µA 10 µA 1 µs TEST CONDITIONS MIN Read and Volatile Write States only) Voltage at pin from GND to VCC -10 SCL falling edge of last bit of DCP Data Byte to wiper change Minimum VCC at which memory recall occurs 1.8 2.6 0.2 VCC above Vpor, to DCP Initial Value Register recall completed, and I2C Interface in standby state V V/ms 3 ms SERIAL INTERFACE SPECIFICATIONS VIL SDA, and SCL Input Buffer LOW Voltage -0.3 0.3*VCC V VIH SDA, and SCL Input Buffer HIGH Voltage 0.7*VCC VCC+0.3 V Hysteresis (Note 14) SDA and SCL Input Buffer Hysteresis V 0.05* VCC VOL (Note 14) SDA Output Buffer LOW Voltage, Sinking 4mA 0.4 V Cpin (Note 14) SDA, and SCL Pin Capacitance 10 pF SCL Frequency 400 kHz 50 ns 900 ns fSCL 0 tIN (Note 14) Pulse Width Suppression Time at SDA and SCL Inputs Any pulse narrower than the max spec is suppressed. tAA (Note 14) SCL Falling Edge to SDA Output Data SCL falling edge crossing 30% of VCC, until SDA Valid exits the 30% to 70% of VCC window. tBUF (Note 14) Time the Bus Must be Free Before the SDA crossing 70% of VCC during a STOP Start of a New Transmission condition, to SDA crossing 70% of VCC during the following START condition. 1300 ns tLOW Clock LOW Time Measured at the 30% of VCC crossing. 1300 ns tHIGH Clock HIGH Time Measured at the 70% of VCC crossing. 600 ns tSU:STA START Condition Setup Time SCL rising edge to SDA falling edge. Both crossing 70% of VCC. 600 ns tHD:STA START Condition Hold Time From SDA falling edge crossing 30% of VCC to SCL falling edge crossing 70% of VCC. 600 ns tSU:DAT Input Data Setup Time From SDA exiting the 30% to 70% of VCC window, to SCL rising edge crossing 30% of VCC 100 ns tHD:DAT Input Data Hold Time From SCL rising edge crossing 70% of VCC to SDA entering the 30% to 70% of VCC window. 0 ns tSU:STO STOP Condition Setup Time From SCL rising edge crossing 70% of VCC, to SDA rising edge crossing 30% of VCC. 600 ns 4 FN8234.3 September 10, 2015 ISL90810 Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued) SYMBOL PARAMETER TEST CONDITIONS MIN STOP Condition Hold Time for Read, From SDA rising edge to SCL falling edge. Both or Volatile Only Write crossing 70% of VCC. tHD:STO tDH (Note 14) TYP (Note 1) MAX UNITS 600 ns 0 ns Output Data Hold Time From SCL falling edge crossing 30% of VCC, until SDA enters the 30% to 70% of VCC window. tR (Note 14) SDA and SCL Rise Time From 30% to 70% of VCC 20 + 0.1 * Cb 250 ns tF (Note 14) SDA and SCL Fall Time From 70% to 30% of VCC 20 + 0.1 * Cb 250 ns Cb (Note 14) Capacitive Loading of SDA or SCL Total on-chip and off-chip 10 400 pF Maximum is determined by tR and tF. For Cb = 400pF, max is about 2~2.5k. For Cb = 40pF, max is about 15~20k 1 Rpu (Note 14) SDA and SCL Bus Pull-Up Resistor Off-Chip k SDA vs SCL Timing tHIGH tF SCL tLOW tR tSU:DAT tSU:STA SDA (INPUT TIMING) tHD:DAT tHD:STA tSU:STO tAA tDH tBUF SDA (OUTPUT TIMING) NOTES: 2. Typical values are for TA = +25°C and 3.3V supply voltage. 3. LSB: [V(RW)255 – V(RW)0]/255. V(RW)255 and V(RW)0 are V(RW) for the DCP register set to FF hex and 00 hex respectively. LSB is the incremental voltage when changing from one tap to an adjacent tap. 4. ZS error = V(RW)0/LSB. 5. FS error = [V(RW)255 – VCC]/LSB. 6. DNL = [V(RW)i – V(RW)i-1]/LSB-1, for i = 1 to 255. i is the DCP register setting. 7. INL = (V(RW)i – i • LSB – V(RW)0)/LSB, for i = 1 to 255. Max V RW i – Min V RW i 10 6 8. TC V = ---------------------------------------------------------------------------------------------- ----------------- for i = 16 to 240 decimal, T = -40°C to +105°C. Max( ) is the maximum value of the wiper Max V RW i + Min V RW i 2 145°C voltage and Min ( ) is the minimum value of the wiper voltage over the temperature range. 9. MI = |R255 – R0|/255. R255 and R0 are the measured resistances for the DCP register set to FF hex and 00 hex respectively. Roffset = R0/MI, when measuring between RW and RL. 10. Roffset = R255/MI, when measuring between RW and RH. 11. RDNL = (Ri – Ri-1)/MI, for i = 32 to 255. 12. RINL = [Ri – (MI • i) – R0]/MI, for i = 32 to 255. 6 Max Ri – Min Ri 10 13. TC R = --------------------------------------------------------------- ----------------- for i = 32 to 255, T = -40°C to +105°C. Max( ) is the maximum value of the resistance and Min ( ) is the Max Ri + Min Ri 2 145°C minimum value of the resistance over the temperature range. 14. This parameter is not 100% tested. 5 FN8234.3 September 10, 2015 ISL90810 Typical Performance Curves 160 1.8 Vcc = 2.7, T = +85°C Vcc = 2.7, T = -40°C 1.6 Vcc = 2.7, T = +25°C 1.4 120 100 80 60 40 20 0 1.2 STANDBY ICC (µA) WIPER RESISTANCE () 140 50 150 200 +85°C 0.6 0.4 0.2 Vcc = 5.5, T = +25°C 100 -40°C 0.8 Vcc = 5.5, T = +85°C Vcc = 5.5, T = -40°C 0 1.0 +25°C 0.0 2.7 250 3.2 3.7 FIGURE 1. WIPER RESISTANCE vs TAP POSITION [I(RW) = VCC/Rtotal] FOR 50k (U) 0.2 Vcc = 5.5, T = -40°C 0.15 4.2 4.7 5.2 VCC (V) TAP POSITION (DECIMAL) FIGURE 2. STANDBY ICC vs VCC 0.3 Vcc = 2.7, T = -40°C Vcc = 5.5, T = -40°C Vcc = 2.7, T = -40°C Vcc = 2.7, T = +25°C 0.2 Vcc = 5.5, T = +85°C 0.1 0.05 INL (LSB) DNL (LSB) 0.1 0 -0.05 -0.1 -0.15 Vcc = 5.5, T = +25°C Vcc = 2.7, T = +85°C Vcc = 5.5, T = +85°C -0.2 0 50 100 150 200 0 Vcc = 2.7, T = +25°C Vcc = 2.7, T = +85°C -0.1 Vcc = 5.5, T = +25°C -0.2 -0.3 250 0 50 100 150 200 250 TAP POSITION (DECIMAL) TAP POSITION (DECIMAL) FIGURE 3. DNL vs TAP POSITION IN VOLTAGE DIVIDER MODE FOR 10k (W) FIGURE 4. INL vs TAP POSITION IN VOLTAGE DIVIDER MODE FOR 10k (W) 0.4 0 -0.1 -0.2 Vcc = 5.5V -0.3 FSerror (LSB) ZSerror (LSB) 0.35 0.3 2.7V 0.25 -0.4 Vcc = 2.7V -0.5 -0.6 -0.7 0.2 -0.8 5.5V -0.9 0.15 -40 -20 0 20 40 TEMPERATURE (°C) FIGURE 5. ZSerror vs TEMPERATURE 6 60 80 -1 -40 -20 0 20 40 60 80 TEMPERATURE (°C) FIGURE 6. FSerror vs TEMPERATURE FN8234.3 September 10, 2015 ISL90810 Typical Performance Curves (Continued) 0.5 0.3 Vcc = 2.7, T = +25°C 0.4 Vcc = 5.5, T = +25°C 0.2 0.1 INL (LSB) DNL (LSB) Vcc = 5.5, T = -40°C 0.2 0.1 0 Vcc = 5.5, T = +85°C 0 -0.1 -0.1 -0.2 Vcc = 5.5, T = +85°C -0.3 Vcc = 2.7, T = +85°C Vcc = 2.7, T = -40°C Vcc = 5.5, T = -40°C -0.2 -0.3 32 82 132 182 TAP POSITION (DECIMAL) -0.4 Vcc = 2.7, T = +85°C Vcc = 5.5, T = +25°C -0.5 32 82 132 232 Vcc = 2.7, T = -40°C 182 232 TAP POSITION (DECIMAL) FIGURE 7. DNL vs TAP POSITION IN RHEOSTAT MODE FOR 50k (U) FIGURE 8. INL vs TAP POSITION IN RHEOSTAT MODE FOR 50k (U) 1.50 20 1.00 10 0.50 2.7V TC (ppm/°C) END TO END RTOTAL CHANGE (%) Vcc = 2.7, T = +25°C 0.3 5.5V 0.00 -0.50 0 -10 -1.00 -1.50 -40 -20 0 20 40 60 80 TEMPERATURE (°C) -20 32 82 132 182 232 TAP POSITION (DECIMAL) FIGURE 9. END TO END RTOTAL % CHANGE vs TEMPERATURE FIGURE 10. TC FOR VOLTAGE DIVIDER MODE IN ppm 35 INPUT 25 TC (ppm/°C) 15 5 OUTPUT -5 -15 -25 32 Tap Position = Mid Point RTOTAL = 9.4K 57 82 107 132 157 182 207 232 TAP POSITION (DECIMAL) FIGURE 11. TC FOR RHEOSTAT MODE IN ppm 7 FIGURE 12. FREQUENCY RESPONSE (2.2MHz) FN8234.3 September 10, 2015 ISL90810 Typical Performance Curves (Continued) Signal at Wiper (Wiper Unloaded) SCL Signal at Wiper (Wiper Unloaded Movement From ffh to 00h) Wiper Movement Mid Point From 80h to 7fh FIGURE 13. MIDSCALE GLITCH, CODE 80h TO 7Fh (WIPER 0) Principles of Operation The ISL90810 is an integrated circuit incorporating one DCP with its associated registers, and an I2C serial interface providing direct communication between a host and the potentiometer. DCP Description The DCP is implemented with a combination of resistor elements and CMOS switches. The physical ends of the DCP are equivalent to the fixed terminals of a mechanical potentiometer (RH and RL pins). The RW pin of the DCP is connected to intermediate nodes, and is equivalent to the wiper terminal of a mechanical potentiometer. The position of the wiper terminal within the DCP is controlled by an 8-bit volatile Wiper Register (WR). When the WR of the DCP contains all zeroes (WR[7:0]: 00h), its wiper terminal (RW) is closest to its “Low” terminal (RL). When the WR of the DCP contains all ones (WR[7:0]: FFh), its wiper terminal (RW) is closest to its “High” terminal (RH). As the value of the WR increases from all zeroes (0 decimal) to all ones (255 decimal), the wiper moves monotonically from the position closest to RL to the closest to RH. At the same time, the resistance between RW and RL increases monotonically, while the resistance between RH and RW decreases monotonically. While the ISL90810 is being powered up, The WR is reset to 80h (128 decimal), which locates RW roughly at the center between RL and RH. The WR can be read or written to directly using the I2C serial interface as described in the following sections. The I2C interface Address Byte has to be set to 00hex to access the WR. 8 FIGURE 14. LARGE SIGNAL SETTLING TIME I2C Serial Interface The ISL90810 supports a bidirectional bus oriented protocol. The protocol defines any device that sends data onto the bus as a transmitter and the receiving device as the receiver. The device controlling the transfer is a master and the device being controlled is the slave. The master always initiates data transfers and provides the clock for both transmit and receive operations. Therefore, the ISL90810 operates as a slave device in all applications. All communication over the I2C interface is conducted by sending the MSB of each byte of data first. Protocol Conventions Data states on the SDA line must change only during SCL LOW periods. SDA state changes during SCL HIGH are reserved for indicating START and STOP conditions (See Figure 15). On power-up of the ISL90810 the SDA pin is in the input mode. All I2C interface operations must begin with a START condition, which is a HIGH to LOW transition of SDA while SCL is HIGH. The ISL90810 continuously monitors the SDA and SCL lines for the START condition and does not respond to any command until this condition is met (See Figure 15). A START condition is ignored during the powerup for the device. All I2C interface operations must be terminated by a STOP condition, which is a LOW to HIGH transition of SDA while SCL is HIGH (See Figure 15) A STOP condition at the end of a read operation, or at the end of a write operation places the device in its standby mode. An acknowledge (ACK) is a software convention used to indicate a successful data transfer. The transmitting device, either master or slave, releases the SDA bus after transmitting eight bits. During the ninth clock cycle, the receiver pulls the SDA line LOW to acknowledge the reception of the eight bits of data (See Figure 16). FN8234.3 September 10, 2015 ISL90810 The ISL90810 responds with an ACK after recognition of a START condition followed by a valid Identification Byte, and once again after successful receipt of an Address Byte. The ISL90810 also responds with an ACK after receiving a Data Byte of a write operation. The master must respond with an ACK after receiving a Data Byte of a read operation. A valid Identification Byte contains 0101000 as the seven MSBs. The LSB is the Read/Write bit. Its value is “1” for a Read operation, and “0” for a Write operation (See Table 1) The address byte is set to 00h and follows the identification byte. Read and write operations always point to address 00h, indicating the WR for the device. TABLE 1. IDENTIFICATION BYTE FORMAT 0 1 0 1 0 0 0 R/W (MSB) (LSB) Write Operation A Write operation requires a START condition, followed by a valid Identification Byte, a valid Address Byte, a Data Byte, and a STOP condition. After each of the three bytes, the ISL90810 responds with an ACK. At this time the device enters its standby state (See Figure 17). Data Protection A valid Identification Byte. Address Byte, and total number of SCL pulses act as a protection for the registers. During a Write sequence, the Data Byte is loaded into an internal shift register as it is received. The Data Byte is transferred to the Wiper Register (WR) at the falling edge of the SCL pulse that loads the last bit (LSB) of the Data Byte. Read Operation A Read operation consists of a three byte instruction followed by one Data Byte (See Figure 18). The master initiates the operation issuing the following sequence: a START, the identification byte with the R/W bit set to "0", an Address Byte, a second START, and a second Identification byte with the R/W bit set to "1". After each of the three bytes, the ISL90810 responds with an ACK. The the ISL90810 transmits Data Bytes as long as the master responds with an ACK during the SCL cycle following the eighth bit of each byte. The master terminates the read operation (issuing a ACK and a STOP condition) following the last bit of the Data Byte (See Figure 18). SCL SDA START DATA STABLE DATA CHANGE DATA STABLE STOP FIGURE 15. VALID DATA CHANGES, START, AND STOP CONDITIONS SCL FROM MASTER 1 8 SDA OUTPUT FROM TRANSMITTER 9 HIGH IMPEDANCE HIGH IMPEDANCE SDA OUTPUT FROM RECEIVER START ACK FIGURE 16. ACKNOWLEDGE RESPONSE FROM RECEIVER 9 FN8234.3 September 10, 2015 ISL90810 WRITE SIGNALS FROM THE MASTER SIGNAL AT SDA S T A R T IDENTIFICATION BYTE ADDRESS BYTE 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 SIGNALS FROM THE ISL90810 A C K A C K A C K S T O P DATA BYTE FIGURE 17. BYTE WRITE SEQUENCE SIGNALS FROM THE MASTER S T A R T SIGNAL AT SDA IDENTIFICATION BYTE WITH R/W=0 ADDRESS BYTE 0 0 0 0 0 0 0 0 0 1 0 1 0 0 0 0 SIGNALS FROM THE SLAVE S T A IDENTIFICATION R BYTE WITH T R/W=1 A C K A S C T K O P 0 1 0 1 0 0 0 1 A C K A C K DATA BYTE FIGURE 18. READ SEQUENCE 10 FN8234.3 September 10, 2015 ISL90810 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION September 10, 2015 FN8234.3 CHANGE Updated the Ordering Information table on page 1. Added Revision History and About Intersil sections. Updated Package Outline Drawing M8.118 to the latest revision. -Revision 2 to Revision 3 changes - Updated to new intersil format by adding land pattern and moving dimensions from table onto drawing. -Revision 3 to Revision 4 changes - Corrected lead width dimension typo in side view 1 from "0.25 0.036" to "0.25 - 0.36". About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 FN8234.3 September 10, 2015 ISL90810 Package Outline Drawing M8.118 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE Rev 4, 7/11 5 3.0±0.05 A DETAIL "X" D 8 1.10 MAX SIDE VIEW 2 0.09 - 0.20 4.9±0.15 3.0±0.05 5 0.95 REF PIN# 1 ID 1 2 B 0.65 BSC GAUGE PLANE TOP VIEW 0.55 ± 0.15 0.25 3°±3° 0.85±010 H DETAIL "X" C SEATING PLANE 0.25 - 0.36 0.08 M C A-B D 0.10 ± 0.05 0.10 C SIDE VIEW 1 (5.80) NOTES: (4.40) (3.00) 1. Dimensions are in millimeters. (0.65) (0.40) (1.40) TYPICAL RECOMMENDED LAND PATTERN 12 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.15mm max per side are not included. 5. Dimensions are measured at Datum Plane "H". 6. Dimensions in ( ) are for reference only. FN8234.3 September 10, 2015