Document 158 SPICE Model – 0402HL This lumped-element (SPICE) model data simulates the frequency-dependent behavior of Coilcraft RF surface mount inductors from 1 MHz to the upper frequency limit shown in the accompanying table. The equivalent lumped element model schematic is shown below. The element values R1, R2, C, and L are listed for each component value. The value of the frequencydependent variable resistor RVAR relates to the skin effect and is calculated from: RVAR = k * • k is shown for each value in the accompanying table. • f is the frequency in Hz Table 1. Test Gap Size 0302 0402,0403 0603 0805 1008 1206 1812 Gap Width (inch / mm) 0.017 / 0.432 0.017 / 0.432 0.026 / 0.660 0.040 / 1.016 0.060 / 1.524 0.080 / 2.032 0.120 / 3.048 (50 Ohm) wide traces of tinned gold over 25 mil thick alumina, and were not included in the gap. The TRL* calibration plane is also illustrated in Figure 1. Pad The data represents de-embedded measurements, as described below. Effects due to different customer circuit board traces, board materials, ground planes or interactions with other components are not included and can have a significant effect when comparing the simulation to measurements of the inductors using typical production verification instruments and fixtures. Each model should only be analyzed at the input and output ports. Individual elements of the model are not determined by parameter measurement. The elements are determined by the overall performance of the lumped element model compared to the measurements taken of the component. Typically, the Self-Resonant Frequency (SRF) of the component model will be higher than the measurement of the component mounted on a circuit board. The parasitic reactive elements of a circuit board or fixture will effectively lower the circuit resonant frequency, especially for very small inductance values. Since data sheet specifications are based on typical production measurements, and the SPICE models are based on de-embedded measurements as described below, the model results may be different from the data sheet specifications. Lumped Element Modeling Method The measurements were made over a brass ground plane with each component centered over an air gap, as illustrated in Figure 1. The gap width for each size component is given in Table 1. The test pads were 30 mil Air gap Pad Brass ground plane Calibration plane Figure 1. Test Setup The lumped element values were determined by matching the simulation model to an average of the measurements. This method results in a model that represents as closely as possible the typical frequency-dependent behavior of the component up to a frequency just above the self-resonant frequency of the model. The lumped element models were used to generate our 2‑port S‑parameters and therefore give identical results. The S-parameters are available on our web site at http://www.coilcraft.com/models.cfm. Disclaimer Coilcraft makes every attempt to provide accurate measurement data and software, representative of our components, in a usable format. Coilcraft, however, disclaims all warrants relating to the use of its data and software, whether expressed or implied, including without limitation any implied warranties of merchantability or fitness for a particular purpose. Coilcraft cannot and will not be liable for any special, incidental, consequential, indirect or similar damages occurring with the use of the data and/or software. Document 158-1 Revised 11/03/15 Document 158 SPICE Model for Coilcraft 0402HL Chip Inductors Upper R1R2 limit Part number ()() C (pF) L (nH) k (MHz) 0402HL-271 0402HL-301 0402HL-331 0402HL-361 0402HL-391 0402HL-471 0402HL-511 0402HL-561 0402HL-601 0402HL-741 0402HL-821 78 1.95 95 2.15 802.23 1002.36 652.35 602.67 1303.50 1303.70 150 3.78 1005.45 2005.85 0.160 0.190 0.225 0.230 0.730 1.10 0.220 0.185 0.172 1.00 0.220 270 300 330 360 390 470 510 560 600 740 820 6.00E-041000 7.00E-041000 6.00E-04 800 9.00E-04 700 8.00E-04 400 5.00E-04 400 8.00E-04 700 7.00E-04 900 4.00E-061000 7.00E-04 400 7.00E-04 500 Document 158-26 Revised 08/02/12