Document 913-1 Chip Inductors – 0402HL (1005) • Higher inductance values than other 0402 ceramic chip inductors Part number1 Inductance2 ±5% (nH) 0402HL-271XJR_ 0402HL-301XJR_ 0402HL-331XJR_ 0402HL-361XJR_ 0402HL-391XJR_ 0402HL-471XJR_ 0402HL-511XJR_ 0402HL-561XJR_ 0402HL-601XJR_ 0402HL-681XJR_ 0402HL-741XJR_ 0402HL-821XJR_ Q 270 300 330 360 390 470 510 560 600 680 740 820 •12 inductance values from 270 nH to 820 nH DCR max5 Irms6 SRF typ4 typ3 (MHz)(Ohms) (mA) 11 @ 25 MHz 11 @ 25 MHz 11 @ 25 MHz 11 @ 25 MHz 11 @ 25 MHz 11 @ 25 MHz 12 @ 25 MHz 12 @ 25 MHz 12 @ 25 MHz 13 @ 25 MHz 12 @ 25 MHz 13 @ 25 MHz 590 600 513 485 260 220 450 420 440 380 165 385 1.95 2.15 2.23 2.36 2.35 2.67 3.50 3.70 3.78 5.15 5.45 5.85 190 190 170 170 170 160 150 140 130 120 110 90 1. When ordering, please specify termination and packaging codes: Core material Ceramic 0402HL-821XJRW Termination:R=RoHS compliant matte tin over nickel over silverplatinum-glass frit. Special order: Q = RoHS tin-silver-copper (95.5/4/0.5) or P = non-RoHS tin-lead (63/37). Packaging:W =7″ machine-ready reel. EIA-481 punched paper tape (2000 parts per full reel). U=Less than full reel. In tape, but not machine ready. To have a leader and trailer added ($25 charge), use code letter W instead. 2. Inductance measured at 25 MHz using a Coilcraft SMD-F test fixture and Coilcraft-provided correlation pieces with an Agilent/HP 4286 impedance analyzer. 3. Q measured using a Coilcraft SMD-F fixture in Agilent/HP 4287A impedance analyzer or equivalent. 4. SRF measured using Agilent/HP 8753D network analyzer and Coilcraft SMD‑D test fixture. 5. DCR measured on Cambridge Technology micro-ohmmeter and a Coilcraft CCF858 test fixture. 6. Current that causes a 15°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. 7. Electrical specifications at 25°C. Refer to Doc 362 “Soldering Surface Mount Components” before soldering. Environmental RoHS compliant without exemption, halogen free A max B max C max D E F G H Terminations RoHS compliant matte tin over nickel over silverplatinum-glass frit. Other terminations available at additional cost. Weight 0.7 – 1.3 mg Ambient temperature –40°C to +125°C with Irms current, Storage temperature Component: –40°C to +140°C. Tape and reel packaging: –40°C to +80°C Maximum part temperature +140°C (ambient + temp rise). Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Temperature Coefficient of Inductance (TCL) +25 to +150 ppm/°C Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity) Failures in Time (FIT) / Mean Time Between Failures (MTBF) One per billion hours / one billion hours, calculated per Telcordia SR-332 Packaging 2000 per 7″ reel. Paper tape: 8 mm wide, 0.66 mm thick, 2 mm pocket spacing PCB washing Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf. I 0.048 0.031 0.022 0.010 0.0180.0080.0260.0140.025inches 1,22 0,79 0,56 0,25 0,460,200,660,360,64mm Note: Height dimension (C) is before optional solder application. For maximum height dimension including solder, add 0.006 in / 0,152 mm. Document 913-1 Revised 01/18/12 Document 913-2 Chip Inductors – 0402HL Series L vs Frequency Typical Q vs Frequency Typical Impedance vs Frequency Document 913-2 Revised 01/18/12