Document 102-1 Chip Inductors – 1008CT (2520) The 0.055″ profile makes these parts ideal for low clearance applications. Their simple construction ensures high reliability and stability, and they feature much higher Part number1 1008CT-040XJL_ 1008CT-080X_L_ 1008CT-100XJL_ 1008CT-150X_L_ 1008CT-200X_L_ 1008CT-300X_L_ 1008CT-400X_L_ 1008CT-500X_L_ 1008CT-600X_L_ 1008CT-700X_L_ 1008CT-800X_L_ 1008CT-900X_L_ 1008CT-101X_L_ Inductance2 (nH) 4.7 @ 50 MHz 8.2 @ 50 MHz 10 @ 50 MHz 15 @ 50 MHz 20 @ 50 MHz 30 @ 50 MHz 40 @ 50 MHz 50 @ 50 MHz 60 @ 50 MHz 70 @ 50 MHz 80 @ 50 MHz 90 @ 50 MHz 100 @ 50 MHz SRF values than ferrite alternatives. For free evaluation samples, visit www.coilcraft.com or contact Coilcraft. Percent3 SRF min5 DCR max6 Irms7 tolerance Q min4 (MHz) (Ohms)(mA) 5 28 @ 500 MHz 7500 0.15 600 5,2 40 @ 500 MHz 5000 0.22 600 5 40 @ 500 MHz 2700 0.25 600 5,2 40 @ 500 MHz 3000 0.22 600 5,2 50 @ 500 MHz 2400 0.33 600 5,2 50 @ 500 MHz 2400 0.38 600 5,2 60 @ 500 MHz 2000 0.43 600 5,2 60 @ 500 MHz 1900 0.48 600 5,2,1 60 @ 500 MHz 1800 0.52 600 5,2,1 60 @ 500 MHz 1700 0.55 510 5,2,1 60 @ 500 MHz 1400 0.56 510 5,2 65 @ 500 MHz 1400 0.61 500 5,2 60 @ 500 MHz 1000 0.63 480 1. When ordering, specify tolerance, termination and packaging codes: 1008CT-101XJLC Tolerance: F =1% G = 2% J = 5% (Table shows stock tolerances in bold.) Termination:L=RoHS compliant silver-palladium-platinum-glass frit. E =Halogen free component. RoHS compliant silverpalladium-platinum-glass frit terminations. Special order: T = RoHS tin-silver-copper (95.5/4/0.5) or S = non-RoHS tin-lead (63/37). Packaging:C =7″ machine-ready reel. EIA-481 embossed plastic tape (2000 parts per full reel). B=Less than full reel. In tape, but not machine ready. To have a leader and trailer added ($25 charge), use code letter C instead. D =13″ machine-ready reel. EIA-481 embossed plastic tape (7500 parts per full reel). 2. Inductance measured using a Coilcraft SMD-A fixture in an Agilent/HP 4286A impedance analyzer with Coilcraft-provided correlation pieces. 3. Tolerances in bold are stocked for immediate shipment. 4. Q measured at using an Agilent/HP 4291A with an Agilent/HP 16193 test fixture. 5. SRF measured using an Agilent/HP 8720D network analyzer and a Coilcraft SMD‑D test fixture. 6. DCR measured on a Cambridge Technology micro-ohmmeter and a Coilcraft CCF840 test fixture. 7. Current that causes a 15°C temperature rise from 25°C ambient. This information is for reference only and does not represent absolute maximum ratings. 8. Electrical specifications at 25°C. Refer to Doc 362 “Soldering Surface Mount Components” before soldering. Core material Ceramic Environmental RoHS compliant, halogen free optional Terminations RoHS compliant silver-palladium-platinum-glass frit. Other terminations available at additional cost. Weight 17.8 – 17.8 mg Ambient temperature –40°C to +125°C with Irms current Maximum part temperature +140°C (ambient + temp rise). Storage temperature Component: –40°C to +140°C. Tape and reel packaging: –40°C to +80°C Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Temperature Coefficient of Inductance (TCL) +25 to +125 ppm/°C Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity) Failures in Time (FIT) / Mean Time Between Failures (MTBF) One per billion hours / one billion hours, calculated per Telcordia SR-332 Packaging 2000/7″reel; 7500/13″ reel Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth PCB washing Tested to MIL-STD-202 Method 215 plus an additional aqueous wash. See Doc787_PCB_Washing.pdf. Document 102-1 Revised 10/12/15 Document 102-2 1008CT Series (2520) Typical Q vs Frequency Typical L vs Frequency 120 100 100 90 100 80 Q Factor 80 Inductance (nH) 90 60 nH 70 80 nH 60 4.7 nH 50 30 nH 40 30 60 nH 70 60 50 30 nH 40 30 20 20 10 10 0 80 nH 0 10 100 1000 10000 C A E terminal Pick and place material J F I Terminal wraparound: approx 0.010/0,25 both ends E F 1000 10000 I G ABCD maxmaxmax ref 100 H D F 10 Frequency (MHz) Frequency (MHz) B overall 4.7 nH 1 G H Recommended Land Pattern IJ 0.1150.1100.0500.0200.0800.0200.0600.1000.0400.050inches 2,922,791,270,512,030,511,522,541,021,27 mm Note: Height dimension (C) is before optional solder application. For maximum height dimension including solder, add 0.006 in / 0,152 mm. Document 102-2 Revised 10/12/15