Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight 144 TQFP (1.4mm) 1.40 Grams with matte Sn Plating Copper Bond Wire Version MSL: 3 Peak Reflow Temp: 260°C Die % of Total Pkg. Wt. 1.20% Mold 79.25% June, 2011 D/A Epoxy 0.11% Weight (g) % of Total Pkg. Wt. Weight (g) 0.0168 Substance CAS # Silicon chip 7440-21-3 Die size: 4.0 x 5.0 mm Notes / Assumptions: 68.79% 6.34% 3.17% 0.79% 0.16% 0.9630 0.0888 0.0444 0.0111 0.0022 Silica Epoxy resin Phenol resin Other (trade secret) Carbon black 60676-86-0 1333-86-4 Mold Compound Density between 1.87 and 2.17 grams/cc 82 to 94% Silica (LSC uses 86.8% in our calculation) 1.5 to 11% Epoxy Resin (LSC uses 8% in our calculation). 3 to 6% Phenol Resin (LSC uses 4% in our calculation). 2% Other (max), (LSC uses 1% in our calculation) 0.2% Carbon black(typical), (LSC uses 0.2% in our calculation) 0.09% 0.02% 0.0012 0.0003 Silver filled epoxy Silver (Ag) Esters & resins 7440-22-4 - Die attach epoxy Density: 3 grams/cc (silver content: 70-90%; LSC uses 80% in our calculation) 1.1095 0.0015 Wire 0.09% 0.0012 Copper (Cu) 7440-50-8 0.8 mil wire diameter; 1 wire for each package lead; wire length 3 mm Lead Plating 0.79% 0.0110 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 18.22% 0.2551 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Leadframe thickness is nominal (per Case Outline) Cu 96.2% Ni 3.0% Si 0.65% Mg 0.15% Copper area is fixed at 55% package area 17.53% 0.55% 0.12% 0.03% 0.2454 0.0077 0.0017 0.0004 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com rev. A