Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight August, 2008 % of Total Pkg. Wt. Weight (g) Die 1.92% 0.102 Mold 86.41% 4.580 D/A Epoxy 0.13% 0.07% 0.004 Lead Plating 0.58% 0.031 10.89% with SnPb Plating % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 225°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 7.4mm x 9.3mm Mold Compound Density varies between 1.7 and 2.3 grams/cc 75 to 95% Silica Fused (LSC uses 87.7% in our calculation) 4 to 10% Epoxy Resin (LSC uses 7% in our calculation). 2 to 8% Phenol Resin (LSC uses 5% in our calculation). 0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation) 75.78% 6.05% 4.32% 0.26% 4.017 0.321 0.229 0.014 Silica Fused Epoxy Resin Phenol Resin Carbon black 60676-86-0 1333-86-4 0.11% 0.03% 0.006 0.001 Silver-filled Epoxy Silver (Ag) other 7440-22-4 - Gold (Au) 7440-57-5 1.0 mil wire diameter; 1 wire for each package lead; wire length 3 mm 0.007 Wire Leadframe 128 PQFP 5.30 Grams Die attach epoxy Density: 4 grams/cc (silver content: 70-90%; LSC uses 80% in our calculation) 0.49% 0.09% 0.026 0.005 Tin (Sn) Lead (Pb) 7440-31-5 7439-92-1 Nominal: 85% Sn, 15% Pb Thickness is 0.015mm 10.47% 0.33% 0.07% 0.02% 0.555 0.0173 0.004 0.0009 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Leadframe thickness is nominal (per Case Outline) 96.2% Cu 3.0% Ni 0.65% Si 0.15% Mg 0.577 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B1