Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight Die % of Total Pkg. Wt. 1.21% Mold 79.42% November, 2010 D/A Epoxy 0.15% Weight (g) 144 TQFP (1.4mm) 1.40 Grams % of Total Pkg. Wt. Weight (g) 0.017 with matte Sn Plating Halogen Free MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Die size: 4.00 x 5.05 mm Notes / Assumptions: 67.51% 4.77% 3.97% 0.32% 2.86% 0.945 0.067 0.056 0.0044 0.040 Silica Fused Epoxy Resin Phenol Resin Carbon black Other (trade secret) 60676-86-0 1333-86-4 - Mold Compound Density between 1.7 and 2.1 grams/cc 75 to 95% (LSC uses 85% in our calculation) 3 to 10% (LSC uses 6% in our calculation) 2 to 8% (LSC uses 5% in our calculation) 0.1 to 0.5% (LSC uses 0.4% in our calculation) 0 to 5% (LSC uses 3.6% in our calculation) 0.12% 0.03% 0.0016 0.0004 Silver (Ag) Esters & resins 7440-22-4 - (silver content: 70-90%; LSC uses 80% in our calculation) Die attach epoxy Density: 4 grams/cc 1.112 0.0021 Wire 0.21% 0.0029 Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per package lead; wire length 3 mm Lead Plating 0.79% 0.011 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 18.22% 0.255 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Leadframe thickness is nominal (per Case Outline) 96.2% Cu 3% Ni 0.65% Si 0.15% Mg 17.53% 0.55% 0.12% 0.03% 0.245 0.0077 0.0017 0.0004 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A