FTBGA Halogenfree Cuwire256

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
1.00%
0.0071
Mold
55.89%
0.3940
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.16%
0.49%
13.78%
23.42%
5.27%
256 ftBGA
0.705
Grams
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
Halogen Free
Copper Bond Wire version
MSL: 3 Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 3.35 x 3.35 mm
48.06%
2.51%
1.68%
1.68%
1.68%
0.28%
0.3388
0.0177
0.0118
0.0118
0.0118
0.0020
Silica Fused
Epoxy Resin
Phenol Resin
Phenol Novolac
Metal Hydroxide
Carbon Black
60676-86-0
9003-35-4
1333-86-4
0.13%
0.03%
0.0009
0.0002
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound composition:
75 to 95% Silica Fused (LSC uses 86% in our calculation)
2 to 8% Epoxy resin (LSC uses 4.5% in our calculation)
1 - 5% Phenol resin (LSC uses 3% in our calculation)
1 - 5% Phenol Novolac (LSC uses 3% in our calculation)
1 - 5% Metal Hydroxide (LSC uses 3% in our calculation)
0.1 - 0.5% Carbon Black (LSC uses 0.5% in our calculation)
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
0.48%
0.01%
0.0034
0.0001
Copper
Palladium
7440-50-8
7440-05-3
Pd coated Copper, 0.8 mil diameter
98.5%
1.5%
13.30%
0.41%
0.07%
0.0937
0.0029
0.0005
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
SAC305
96.5% Sn
3% Ag
0.5% Cu
15.92%
7.49%
0.1123
0.0528
Glass fiber
BT Resins
65997-17-3
-
Copper (Cu)
7440-50-8
0.0011
0.0035
0.0971
0.1651
0.0371
60 to 75% glass fiber (LSC uses 68% in our calculation)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. K