ID.06-09-0122 MSOP ASSEMBLY FLOWCHART ASSEMBLY FLOWCHART MSOP/MSOP (EXPOSED) PACKAGE Updated 02/26/13 Linear Technology Corporation MSOP /MSOP (EXPOSED) Package LTC - Penang - Malaysia UTAC - Thailand Linear Technology Corp., Milpitas, CA.,& Singapore Linear Technology Corp., Milpitas, CA.,& Singapore Linear Technology Corp., Milpitas, CA.,& Singapore Naib Girn, LTC Milpitas, CA (408) 432-1900 Ext. 2519 Vendor: Package: Assembly: Final Test: Q.C. Test: Source Accept Test: Quality Contact: FLOW CHART INCOMING ASSY REWORK REV. B PROCESS STEP WAFER SORT DESCRIPTION INSPECTION/TEST CRITERIA 100% DIE LEVEL ELECTRICAL TEST REJECTS ARE INKED MONITOR ND PROBE DEFECTS PROBING AND 2 ND 2 OPTICAL OPTICAL QUALITY DEFECTS KIT FOR OVERSEAS ASSEMBLY (N/A FOR PENANG) WAFERS ARE KITTED WITH LTC BONDING DIAGRAM AND LTC ASSEMBLY TRAVELER PREPARATION FOR DIE SEPERATION QUALITY INSPECTION AND GATE MANUFACTURING PROCESS QUALITY MONITOR / SURVEILLANCE REWORK SAMPLING PLAN SPC TECHNIQUE WAFER PROBER WAFER SORT MONITOR WAFER MOUNT METHOD & EQUIPMENT INCOMING VISUAL INSPECTION 75X MICROSCOPE MINIMUM OF 1 TIME PER SHIFT S/S= 1, ACC= Ø UNAIDED EYE 3 WAFERS/SHIFT Ø PPM TARGET TV ALIGNMENT MICRO AUTOMATION OR DISCO SAW 10X TO 30X MICROSCOPE EVERY WAFER LOT/MACHINE, Ø PPM TARGET BACTERIA CULTURE 1X PER WEEK VISUAL EA WAFER LOT COUNT USAGE N/A TM MICROSCOPE OR EQUIVALENT ONCE PER SHIFT 4CUTS PER MACHINE PER SPEC 1X PER SHIFT VISUAL 1X PER WEEK REISISTIVITY METER 1X PER WEEK LOG GO/NO GO INSPECTION WAFER MOUNT MONITOR WAFER SAW DIE SEPERATION BACTERIA COUNT SET-UP CHECK ALIGNMENT ACCURACY 10 COL/100 CC BACTERIA CULTURE PER SPEC INSPECTION 45K IN SAW LINE BLADE LIFE SAW KERF PARAMETERS PARAMETERS DI WATER QUALITY 1.0 TO 2.2 MILS PRESSURE, SPEED, CUT COUNT PER SPEC PRESSURE, SPEED, CUT, COUNT PER SPEC RESISTIVITY LINEAR TECHNOLOGY CORPORATION 12M OHM MIN LOG LOG LOG LOG nP CHART LOG LOG LOG PAGE 1 OF 4 ID.06-09-0122 REV. B MSOP ASSEMBLY FLOWCHART Page 2 of 4 FLOW CHART INCOMING ASSY REWORK PROCESS STEP DESCRIPTION INSPECTION/TEST CRITERIA METHOD & EQUIPMENT SAMPLING PLAN SPC TECHNIQUE DIE SORT nd 2 OPT VISUAL INSPECTION PER SPEC 75X MICROSCOPE YIELD TRIGGER 93.0% LOG DIE SORT BUY OFF VISUAL INSPECTION PER SPEC 75X MICROSCOPE 32/LOT ACC= Ø, REJ= 1 LOG DIE ATTACH DIE BONDED WITH EPOXY PER SPEC AUTO DIE ATTACHER 20X MICROSCOPE 1 STRIP/MAG ACC= Ø, REJ= 1 LOG VISUAL PER SPEC 20X TO 40X MICROSCOPE 1 STRIP/WAFER LOT ACC=Ø, REJ= 1 LOG VISUAL PER SPEC 75X TO 200X MICROSCOPE 4 UNITS/WAFER LOT CHIPS, CRACKS LOG VISUAL QUALITY DIE SHEAR TESTER 30X TO 60X MICROSCOPE 3 UNITS PER OVEN LOAD nP CHART 2 STRIPS/OVEN/DAY ZERO BLEED LOG 1X/DAY LOG 10 UNITS/LOT ACC= Ø, REJ=1 LOG 10 UNITS/MAG ACC= Ø, REJ=1 LOG 1X PER LOT LOG DIE PLACEMENT DIE BACK CRACK DIE ATTACH MONITOR RESIN BLEED VISUAL 20X TO 40X MICROSCOPE EPOXY CURE CURE TEMP WIRE BOND BALL BONDS EPOXY CURE +175°C +/-5°C GOLD WIRE PYROMETER/TC AUTO THERMOSONIC BALL BONDER 2X TO 40X SURVEILLANCE VISUAL PER SPEC 20X TO 40X MICROSCOPE PER SPEC PARAMETERS VISUAL CAPILLARY LIFE VISUAL SET-UP VISUAL WIRE BOND MONITOR WIRE PULL COUNT USAGE BALL SHEAR PRAMETERS VISUAL VISUAL EVERY 6 SHIFTS (<800K BONDS) 20X TO 40X MICROSCOPE 5GM (1MIL), 7GM (1.3MIL), 8GM (1.5 MIL), 12GM (2MIL), 15gm (3MIL) 35GM (1MIL), 40GM (OTHER SIZES) GND BOND 60GM (1MIL), 80GM (1.3MIL), 120GM (1.5MIL) BOND PULL TESTER BALL SHEAR TESTER (POWER, FORCE TIME, TEMP) BOND PEEL TEST VISUAL >25% AU REMAINING BOND CRATER VISUAL NO CRATERING 75X MICROSCOPE VISUAL INSPECTION PER SPEC PER SPEC RD RD QA 3 OPTICAL INSPECTION CHECK FOR WORKMANSHIP QUALITY LINEAR TECHNOLOGY CORPORATION LOG EACH LOT/CAP CHANGE (ALL WIRES) X BAR R CHART EACH LOT/CAP CHANGE (5 WIRES INCLUDING GND BONDS) X BAR R CHART LOG 1X/ DAY 75X MICROSCOPE 3 OPTICAL INSPECTION 10 UNITS/LOT ACC= Ø, REJ=1 1 WIRE/MACH/DAY LOG 1X/MACH/DAY (10 UNITS) LOG 20X TO 40X MICROSCOPE TIELD TRIGGER 95% LOG MIN 30X MICROSCOPE 125 PER LOT ACC=Ø, REJ=1 (MRB>10%, 3X REJ) LOG PAGE 2 OF 4 ID.06-09-0122 REV. B MSOP ASSEMBLY FLOWCHART Page 3 of 4 FLOW CHART INCOMING ASSY REWORK PROCESS STEP MOLD – EPOXY NOVOLAC SURVEILANCE TEMPERATURE SURVEILLANCE COMPOUND AGEING CHECK DESCRIPTION ENCAPSULATIO N PARAMETER VISUAL MOLD TEMP VISUAL VISUAL OFFSET INSPECTIO N/TEST CRITERIA PER SPEC METHOD & EQUIPMENT VISUAL PER SPEC MIN 3X +175°C +/5°C PER SPEC PYROMETER 30X TO 40X MICROSCOPE AGE LIFE VISUAL <2.5MIL (SSOP) TOOLMAKER’S MISMATCH PARAMETERS MOLD QUALITY POST MOLD CURE POST MOLD CURE MONITOR DEFASH VISUAL DEFLASH MONITOR MARKING SET-UP CHECK PERMANENCY PRESS, SPEED XRAY VISUAL TEMPERATURE TEMPERATURE REMOVE MOLD FLASH FROM PACKAGE PRESSURE VISUAL INSPECTION VISUAL MARK PERMANENCY IR, VISCOSITY VISUAL SOLDER PLATE INSPECTION PARAMETERS VISUAL PER SPEC SPC TECHNIQUE 1X / SHIFT CHECKLIST 1 HOT/ LOT ACC= Ø, REJ = 1 1X/SHIFT/MACH/ MOLD CHANGE 6 STRIPS/MACH/SHIFT/ CONVERSION CHECKLIST X BAR R CHART 1X / SHIFT LOG 1X/DAY/MC 4 UNITS/SHOT 1X/ MACH/DAY 1X/ DAY LOG LOG SOFT XRAY EVERY LOT 20 UNITS ACC= Ø, REJ = 1 PYROMETER CONTINUOUS +175°C +/5°C 6 HOURS PYROMETER 1X/ OVEN/ DAY PER SPEC UNAIDED EYE PER SPEC PRESSURE GAGE 2X/ SHIFT/ PKG CHANGE – 5 STRIPS ACC=Ø, REJ = 1 2X/ SHIFT/ MACH SWEEP, VOIDS WIRE DEFECTS +175°C +/5°C 6 HOURS PER SPEC UNAIDED EYE PER SPEC 1 SOLUTION UNAIDED EYE 3 SOLUTIONS UNAIDED EYE PER SPEC PER SPEC THICKNESS AND 300 – 800 µ COMPOSITION INCH 85% ± 10% SOLDERABILITY (W&WO AGING) 95% COVERAGE PACKAGE CLEANLINESS 1.7 µG/INCH SQUARED LINEAR TECHNOLOGY CORPORATION SAMPLING PLAN 2 STRIPS/ 3X/ SHIFT ACC= Ø, REJ =1 1X / SHIFT LOG LOG LOG CHECKLIST 1 LOT/ MACH/ SHIFT 11 UNITS ACC= Ø, REJ= 1 1X/WEEK (11 UNITS/SOLUTION ACC= Ø, REJ = 1 1X/SHIFT LOG nP CHART UNAIDED EYE 1X/ PKG/ SHIFT XRF 1X/ SHIFT/ MACH/ CHANGE OF SOLDER BATH – MIN OF 10 READINGS 20X TO 40X MICROSCOPE 1X/ SHIFT 10 UNITS IONOGRAPH 3 LOTS/ SHIFT 3 TESTS/ LOT LOG nP CHART LOG LOG PAGE 3 OF 4 ID.06-09-0122 REV. B MSOP ASSEMBLY FLOWCHART Page 4 of 4 FLOW CHART INCOMING ASSY REWORK PROCESS STEP SOLDER PLATE BUYOFF TRIM & FORM SINGULATION DESCRIPTION VISUAL SET-UP CHECK COPLANARITY LEAD SPREAD STANDOFF LEAD FATIQUE CRACK/ GAP BUYOFF VISUAL DELAMINATION/ CRACK VISUAL DEJUNK SET-UP CHECK VISUAL FINAL VISUAL INSPECTION QA FINAL VISUAL INSPECTION INSPECTIO N/TEST CRITERIA SOLDER QUALITY ETC PER SPEC SHIP TO LTC ANTISTATIC TUBES LINEAR TECHNOLOGY CORPORATION UNAIDED EYE COMPARATOR PER SPEC PER SPEC PER SPEC LEAD TESTER 30X TO 45X MICROSCOPE (SINGULATED) SCANNING ACOUSTIC MICROSCOPE (STRIP FORM) PER SPEC UNAIDED EYE PER SPEC 30X TO 40X MICROSCOPE CORRECT PER SPEC MARK, MARKING PERMANENCY TEST (IF INK MARKED) VISUAL: BENT LEADS MOLD FLASH, SOLDER QULAITY ETC PACKING & PREPARATION FOR DELIVERY 3X TO 10X MICROSCOPE PER SPEC VISUAL QUALITY PER SPEC QA PACK & DOCUMENTATIO N CHECK METHOD & EQUIPMENT PER SPEC UNAIDED EYE SAMPLING PLAN SPC TECHNIQUE S/S= 125 ACC=Ø, REJ= 1 LOG 5 UNITS/ SHIFT 2 UNITS/ LOT ACC= Ø, REJ= 1 1X/ DAY/ MACH 5 UNITS CHECKLIST nP CHART 1X/WK/ MACH 2 LEADS ST 45/ LOT/CONVERSION 200/1 LOT OF SHIFT ACC= Ø, REJ= 1 MIN 2 LOTS/ SHIFT/ MACHINE ACC= Ø, REJ= 1 5 UNITS/ SHIFT 2 UNITS/ LOT ACC= Ø, REJ =1 LOG LOG LOG LOG LOG 100% - YIELD TRIGGER 95%.0% LOG UNAIDED EYE S/S = 125 ACC= Ø, REJ= 1 LOG UNAIDED EYE 5 TUBES ACC= Ø, REJ= 1 LOG EVERY LOT 100% BASIS PAGE 4 OF 4