Spansion ® GL-S NOR Flash Memory 45% Faster Read for Fast Data Access, Interactivity & Boot Times The Spansion® GL-S family of 3V NOR Flash memory is fabricated on 65 nm MirrorBit® charge trapping technology. These devices offer a fast page access time of 15 ns with a corresponding random access time as fast as 90 ns. The family features a write buffer that allows up to 256 words (512-bytes) to be programmed in one operation, resulting in faster effective programming time (up to 1.5 MB/s) than standard NOR programming algorithms. This makes these devices ideal for embedded applications that require higher density, better performance for both XIP and data storage, and lower power consumption. key features suitable applications 128 Mb – 2 Gb Automotive 65 nm MirrorBit Charge-Trapping Technology Consumer Electronics 98.5 MB/s read performance Medical 1.5 MB/s program performance Military/Aerospace 655 KB/s erase performance Networking 40% smaller BGA package, with same industry-standard footprint Telecommunications Industrial Industry-standard TSOP package Wide temperature ranges Industrial (-40°C to +85°C) Automotive in-cabin (-40°C to +105°C) Complementary drivers & Spansion Flash file system (FFS) datasheet summary > 65 nm MirrorBit Charge Trapping Technology > Single supply (VCC) for read / program / erase (2.7V to 3.6V) > Versatile I/O Feature Wide I/O voltage range (VIO): 1.65V to VCC > x16 data bus > Asynchronous 32-byte Page read > 512-byte Programming Buffer Programming in Page multiples, up to a maximum of 512 bytes > Sector Erase Uniform 128-kbyte sectors > Suspend and Resume commands for Program and Erase operations > Status Register, Data Polling, and Ready/Busy pin methods to determine device status > Advanced Sector Protection (ASP) Volatile and non-volatile protection methods for each sector > Separate 1024-byte One Time Program (OTP) array with two lockable regions > Common Flash Interface (CFI) parameter table > Industrial temperature range (-40°C to +85°C) > Automotive in-cabin temperature range (-40°C to +105°C) > 100,000 erase cycles for any sector typical > 20-year data retention typical > Packaging Options 56-pin TSOP 64-ball LAE Fortified BGA, 9 mm x 9 mm 64-ball LAA Fortified BGA, 13 mm x 11 mm maximize your system performance The Spansion GL-S was designed to provide higher performance while supporting backwards compatibility to the GL-N/P. Implementing the recommended software modifications for the GL-S will provide the optimal system performance. SPANSION GL-S SPANSION GL-N/P MODIFICATION NO MODIFICATION MODIFICATION READ THROUGHPUT* 57.6 MB/s 78 MB/s 98.5 MB/s Implementing the full, larger 32-byte read page buffer of the Spansion GL-S yields higher read throughput. PROGRAM THROUGHPUT* 0.133 MB/s GL-N: 0.190 MB/s GL-P: 0.348 MB/s 1.5 MB/s Implementing programming operations using the full, larger 512-byte write buffer of the Spansion GL-S yields higher programming throughput. EMBEDDED OPERATION STATUS 3-5 cycles 3-5 cycles 2 cycles Implementing the Status Register as an alternative to Data Polling for determination of embedded operation status for the Spansion GL-S reduces system overhead. * Maximum values listed for program and erase throughput. migration notes FEATURE SPANSION GL-N/P SPANSION GL-S COMMON FLASH INTERFACE (CFI) VERSION Ver 1.3 Ver 1.5 The Spansion GL-S supports an extended address range revision of CFI. A Linux driver patch which verifies specific values in the CFI register to assure support for the GL-S can be downloaded from www.spansion.com. UNLOCK BYPASS Yes No Legacy feature that minimizes command overhead for the single-word Program command. Designs that implement Unlock Bypass programming must be modified to not use Unlock Bypass commands with Spansion GL-S flash. MULTI-SECTOR ERASE Yes No Legacy feature that minimizes command overhead. Applications that support multi-sector erase require modification to issue separate erase commands for each sector erase operation on the Spansion GL-S. ordering part number guide Product Series 29 = NOR Flash 70 = Dual Die Package NOR Flash Prefix S Prefix S = Spansion Series 2 Density 128 - 512 = 128 Mb-512 Mb 01G - 02G = 1 Gb-2 Gb Family 9 G Speed Option 11 = 110 ns 90 = 90 ns 10 = 100 ns 12 = 120 ns Density L 0 Family GL = 3V Page Mode 1 Tech G S Process Technology S = 65 nm MirrorBit (Eclipse) migrating from spansion gl-n/gl-p to the gl-s family? Key design and support resources are offered at www.spansion.com in the solutions section. Speed 1 Packaging Type 0 = Tray 3 = 13” Tape and Reel Temperature Grade I = Industrial Temp (-40°C to +85°C) V = In Cabin (-40°C to +105°C) Package 0 D H Temp I Model Number 0 1 Pack type 3 Package DH = Fortified BGA (LAE064) 9 mm x 9 mm x 1.4 mm, Low Halogen, Pb- Free FH = Fortified BGA (LAA064) 13 mm x 11 mm x 1.4 mm, Low Halogen, Pb- Free TF = 56-pin TSOP, Pb-Free Model Number 01 = VIO = VCC = 2.7 to 3.6V, highest address sector protected 02 = VIO = VCC = 2.7 to 3.6V, lowest address sector protected V1 = VIO = 1.65 to VCC , VCC = 2.7 to 3.6V, highest address sector protected V2 = VIO = 1.65 to VCC , VCC = 2.7 to 3.6V, lowest address sector protected Spansion: 915 DeGuigne Drive, PO Box 3453, Sunnyvale, CA 94088-3453 USA +1 (408) 962-2500 | 1 866 SPANSION | www.spansion.com © 2011 Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™ and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.