Chapter 2 Package Materials
CHAPTER 2 PACKAGE MATERIALS
Introduction
IEC62474 Declarable Substance List D7.00
Reporting of 161 Substances of Very High Concern (EU REACH)
Material Declaration Data Sheets
Packages and Packing Methodologies Handbook
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Chapter 2 Package Materials
INTRODUCTION
Spansion is committed to delivering safe and environmentally responsible products to our customers. We monitor voluntary and regulatory standards in all regions of the world where Spansion operates to ensure compliance with all applicable requirements. This chapter of the
Spansion Package and Packaging Guide will provide the information you need to ensure Spansion products meet or exceed regulatory specifications applicable to the sale of your products.
The material content of Spansion packages have been analyzed per the requirements defined in
the latest revision of International Electrotechnical Commission (IEC)’s Material Declaration for
Products of and for the Electrotechnical Industry released in September 2014. IEC's guide identifies three designations for substances/materials: (a) regulated, (b) for assessment, or (c) for
information only. These three designations determine whether the substances/materials are
required to be declared. Materials in Spansion products along with the disclosure designation
and rationale can be found starting on page 2-4.
Spansion's RoHS-compliant products comply with the "maximum concentration" restrictions in
the EU Directive on the Restriction of Hazardous Substances ("RoHS Directive") 2011/65/EU,
with respect to lead (Pb), mercury, cadmium, hexavalent chromium, polybrominated biphenyls
(PBB), and polybrominateddiphenyl ethers (PBDE). Our products also meet the requirements of
China's Administrative Measure on the Control of Pollution Caused by Electronic Information
Products (China RoHS).
All other Spansion products comply with the RoHS Directive 2011/65/EU, with respect to all substance concentration restrictions except lead (Pb). The lead containing products are designated
specifically for lead soldering purposes. Spansion encourages customers who still use Pb products to migrate to Pb-free products
The European Chemical Agency (ECHA) is working to regulate Substances of Very High Concern (SVHCs) consistent with the European Union (EU) Registration, Evaluation, Authorization
and Restriction of Chemical (REACH) Regulation. The first candidate list of SVHCs was published in September 2008. Since that time, additional substances have been added to the candidate list by the European Chemicals Agency (ECHA).
Since the publication of the first list, Spansion has worked closely with our suppliers to ensure we
identify and disclose any substance contained in our products that are on the REACH candidate
list of SVHC. At this time, no Spansion product contains any of the substances identified on the
most recent list published in December 2014.
Reporting of Substances of Very High Concern (EU REACH). Spansion products have been
analyzed per the candidate list of SVHCs. The presence of the latest 161 SVHC candidate substances in Spansion products can be found starting on page 2-6.
Questions or requests for additional information on material contents of Spansion products can
be obtained by e-mail at [email protected].
Packages and Packing Methodologies Handbook
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Chapter 2 Package Materials
Material Declaration Data Sheets. A Material Declaration Data Sheet has been created for
each Spansion package. Each declaration sheet contains the following information:
•
•
•
•
•
•
Company name and contact email address
Package and ball/lead count
Dimensions and weight of package
Temperature rating
MSL (moisture sensitivity level)
Chemicals present in the package
Please note that some variance in the data will be observed from package to package and is
generally reported in hundredths (two decimal values) in the Material Declaration Data Sheets.
The mass values presented are thought to be accurate to within 20 percent. The reports do not
include materials not intentionally added to our products (impurities), or material concentrations
less than 1 ppm.
The Material Declaration Data Sheets for each package family can be found in the following
pages.
To obtain an MDDS of current Spansion package offerings containing lead or other available
options, please submit an email request to [email protected].
Packages and Packing Methodologies Handbook
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Chapter 2 Package Materials
IEC62474 DECLARABLE SUBSTANCE LIST D7.00
The Materials and Substances category are those, which by currently enacted legislation, Criteria Rationale for Disclosure (R-Regulated, A-For Assessment, I-For Information Only). The table
below lists the status of the presence of each regulated, for assessment only and for information
only materials/substances in Spansion packages.
The Substances below are listed in declarable substance list except the ones duplicated in
Annex XVII or SVHC list of REACH.
Material / Substance Category Name
Criteria Rationale
for Disclosure
Status
4-[4,4'-bis (dimethylamino) benzhydrylidene]
cyclohexa-2,5-dien-1-ylidene] dimethyl ammonium
chloride (C.I. Basic Violet 3)
A
Not present in Spansion products.
Asbestos
R
Not present in Spansion products.
Azocolorants & azodyes which form certain
aromatic amines.
R
Not present in Spansion products.
Beryllium Oxide (BeO)
I
Not present in Spansion products.
Brominated Flame Retardants (other than PBBs,
PBDEs or HBCDD)
I
May be present in Spansion products.
See individual Material Declaration
Data Sheet for details.
Cadmium/Cadmium compounds
R
Not present in Spansion products.
Chlorinated Flame Retardants (CFR)
I
Not present in Spansion products.
Chromium (VI) compounds
R
Not present in Spansion products.
Dibutyltin (DBT) Compounds
R
Not present in Spansion products.
Dimethyl Fumarate (DMF)
R
Not present in Spansion products.
Di-n-hexyl Phthalate (DnHP)
R
Not present in Spansion products.
Diisononyl phthalate (DINP)
R
Not present in Spansion products.
Dioctyltin (DOT) Compounds
R
Not present in Spansion products.
Fluorinated Greenhouse gases (PFC, SF6, HFC)
R
Not present in Spansion products.
Formaldehyde
R
Not present in Spansion products.
Lead/Lead Compounds
R
May be present in Spansion products.
See individual Material Declaration
Data Sheet for details.
Mercury/Mercury Compounds
R
Not present in Spansion products.
Nickel
R
May be present in Spansion products
but not in prolonged contact with
human skin. See individual Material
Declaration Data Sheet for details.
Ozone Depleting Substances (CFC, Halon, HBFC,
HCFC & others)
R
Not present in Spansion products.
Perchlorates
R
Not present in Spansion products.
Note: "Not present" means not present above the threshold level specified by IEC62474.
Packages and Packing Methodologies Handbook
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Chapter 2 Package Materials
Material / Substance Category Name
Criteria Rationale
for Disclosure
Status
Perfluorooctane Sulfonate (PFOS)
R
Not present in Spansion products.
Phenol,2-(2H-Benzotriazol-2-yl)-4,6-bis (1,1dimethylethyl)
R
Not present in Spansion products.
Phthalates, Selected Group 1 (BBP, DBP, DEHP)
R
Not present in Spansion products.
Phthalates, Selected Group 2 (DIDP, DINP, DNOP)
R
Not present in Spansion products.
Polybrominated Biphenyls (PBBs)
R
Not present in Spansion products.
Polybrominated Diphenylethers (PBDEs)
R
Not present in Spansion products.
Polychlorinated Biphenyls (PCBs) and specific
substitutes.
R
Not present in Spansion products.
Polychlorinated Naphthalenes (PCNs)
R
Not present in Spansion products.
Polychlorinated Terphenyls (PCTs)
R
Not present in Spansion products.
Radioactive Substances
R
Not present in Spansion products.
Shortchain Chlorinated Paraffins (C10-C13)
R
Not present in Spansion products.
Tributyl Tin Oxide (TBTO)
R
Not present in Spansion products.
Tri-substituted Organostannic Compounds
R
Not present in Spansion products.
Note: "Not present" means not present above the threshold level specified by IEC62474.
Packages and Packing Methodologies Handbook
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2-5
Chapter 2 Package Materials
REPORTING OF 161 SUBSTANCES OF VERY HIGH CONCERN (EU REACH)
Material / Substance Category Name
1,2,3-Trichloropropane
CAS Number
Status
96-18-4
Not present in Spansion products.
1,2-Benzenedicarboxylic acid, di-C6-8branched alkyl esters, C7-rich
71888-89-6
Not present in Spansion products.
1,2-Benzenedicarboxylic acid, di-C7-11branched and linear alkyl esters
68515-42-4
Not present in Spansion products.
1,2-Benzenedicarboxylic acid, dihexyl
ester, branched and linear
68515-50-4
Not present in Spansion products.
1,2-Benzenedicarboxylic acid,
dipentylester, branched and linear
84777-06-0
Not present in Spansion products.
1,2-bis(2-methoxyethoxy)ethane
(TEGDME; triglyme)
112-49-2
Not present in Spansion products.
1,2-Dichloroethane
107-06-2
Not present in Spansion products.
1,2-Diethoxyethane
629-14-1
Not present in Spansion products.
1,2-dimethoxyethane; ethylene glycol
dimethyl ether (EGDME)
110-71-4
Not present in Spansion products.
1,3,5-Tris(oxiran-2-ylmethyl)-1,3,5triazinane-2,4,6-trione (TGIC)
2451-62-9
Not present in Spansion products.
1,3,5-tris[(2S and 2R)-2,3-epoxypropyl]1,3,5-triazine-2,4,6-(1H,3H,5H)-trione (βTGIC)
59653-74-6
Not present in Spansion products.
1-bromopropane (n-propyl bromide)
106-94-5
Not present in Spansion products.
1-Methyl-2-pyrrolidone
872-50-4
Not present in Spansion products.
2,2'-dichloro-4,4'-methylenedianiline
(MOCA)
101-14-4
Not present in Spansion products.
2,4-Dinitrotoluene
121-14-2
Not present in Spansion products.
2-(2H-benzotriazol-2-yl)-4,6ditertpentylphenol (UV-328)
25973-55-1
Not present in Spansion products.
2-benzotriazol-2-yl-4,6-di-tert-butylphenol
(UV-320)
3846-71-7
Not present in Spansion products.
2-Ethoxyethanol
110-80-5
Not present in Spansion products.
2-Ethoxyethyl acetate
111-15-9
Not present in Spansion products.
15571-58-1
Not present in Spansion products.
2-Methoxyaniline; o-Anisidine
90-04-0
Not present in Spansion products.
2-Methoxyethanol
109-86-4
Not present in Spansion products.
3-ethyl-2-methyl-2-(3-methylbutyl)-1,3oxazolidine
143860-04-2
Not present in Spansion products.
4,4'- Diaminodiphenylmethane (MDA)
101-77-9
Not present in Spansion products.
2-ethylhexyl 10-ethyl-4,4-dioctyl-7-oxo-8oxa-3,5-dithia-4-stannatetradecanoate
(DOTE)
Note: "Not present" means not present above the concentration specified by REACH.
Packages and Packing Methodologies Handbook
27 January 2015
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Chapter 2 Package Materials
Material / Substance Category Name
CAS Number
Status
4,4'-bis(dimethylamino)-4''(methylamino)trityl alcohol
561-41-1
Not present in Spansion products.
4,4'-bis(dimethylamino)benzophenone
(Michler’s ketone)
90-94-8
Not present in Spansion products.
4,4'-methylenedi-o-toluidine
838-88-0
Not present in Spansion products.
4,4'-oxydianiline and its salts
101-80-4
Not present in Spansion products.
4-(1,1,3,3-tetramethylbutyl)phenol, (4tert-Octylphenol)
140-66-9
Not present in Spansion products.
-
Not present in Spansion products.
4-Aminoazobenzene
60-09-3
Not present in Spansion products.
4-methyl-m-phenylenediamine (toluene2,4-diamine)
95-80-7
Not present in Spansion products.
4-Nonylphenol, branched and linear
-
Not present in Spansion products.
4-Nonylphenol, branched and linear,
ethoxylated
-
Not present in Spansion products.
5-tert-butyl-2,4,6-trinitro-m-xylene (musk
xylene)
81-15-2
Not present in Spansion products.
6-methoxy-m-toluidine (p-cresidine)
120-71-8
Not present in Spansion products.
[4-[4,4'-bis(dimethylamino)
benzhydrylidene]cyclohexa-2,5-dien-1ylidene]dimethylammonium chloride (C.I.
Basic Violet 3)
548-62-9
Not present in Spansion products.
[4-[[4-anilino-1-naphthyl][4(dimethylamino)phenyl]methylene]cycloh
exa-2,5-dien-1-ylidene]
dimethylammonium chloride (C.I. Basic
Blue 26)
2580-56-5
Not present in Spansion products.
[Phthalato(2-)]dioxotrilead
69011-06-9
Not present in Spansion products.
Acetic acid, lead salt, basic
51404-69-4
Not present in Spansion products.
7738-94-5 / 13530-68-2
Not present in Spansion products.
79-06-1
Not present in Spansion products.
Alkanes, C10-13, chloro (Short Chain
Chlorinated Paraffins)
85535-84-8
Not present in Spansion products.
Aluminiosilicate, Refractory Ceramic
Fibres
650-017-00-8
Not present in Spansion products.
7789-09-5
Not present in Spansion products.
4-(1,1,3,3-tetramethylbutyl)phenol,
ethoxylated
Acids generated from chromium trioxide
and their oligomers. Names of the acids
and their oligomers: Chromic acid,
Dichromic acid, Dichromic acid,
Oligomers of chromic acid and dichromic
acid
Acrylamide
Ammonium dichromate
Note: "Not present" means not present above the concentration specified by REACH.
Packages and Packing Methodologies Handbook
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2-7
Chapter 2 Package Materials
Material / Substance Category Name
CAS Number
Status
Ammonium pentadecafluorooctanoate
(APFO)
3825-26-1
Not present in Spansion products.
Anthracene
120-12-7
Not present in Spansion products.
Anthracene oil
90640-80-5
Not present in Spansion products.
Anthracene oil, anthracene paste
90640-81-6
Not present in Spansion products.
Anthracene oil, anthracene paste,
anthracene fraction
91995-15-2
Not present in Spansion products.
Anthracene oil, anthracene paste, distn.
Lights
91995-17-4
Not present in Spansion products.
Anthracene oil, anthracene-low
90640-82-7
Not present in Spansion products.
Arsenic acid
7778-39-4
Not present in Spansion products.
Benzyl butyl phthalate (BBP)
85-68-7
Not present in Spansion products.
Biphenyl-4-ylamine
92-67-1
Not present in Spansion products.
Bis (2-ethyl(hexyl)phthalate) (DEHP)
117-81-7
Not present in Spansion products.
Bis (2-methoxyethyl) ether
111-96-6
Not present in Spansion products.
Bis (2-methoxyethyl) phthalate
117-82-8
Not present in Spansion products.
Bis(pentabromophenyl) ether (DecaBDE)
1163-19-5
Not present in Spansion products.
56-35-9
Not present in Spansion products.
Boric acid
10043-35-3 / 11113-50-1
Not present in Spansion products.
Cadmium
7440-43-9
Not present in Spansion products.
Cadmium chloride
10108-64-2
Not present in Spansion products.
Cadmium fluoride
7790-79-6
Not present in Spansion products.
Cadmium oxide
1306-19-0
Not present in Spansion products.
Cadmium sulphate
10124-36-4 / 31119-53-6
Not present in Spansion products.
Cadmium sulphide
1306-23-6
Not present in Spansion products.
Calcium arsenate
7778-44-1
Not present in Spansion products.
Chromium trioxide
1333-82-0
Not present in Spansion products.
Cobalt dichloride
7646-79-9
Not present in Spansion products.
Cobalt(II) carbonate
513-79-1
Not present in Spansion products.
Cobalt(II) diacetate
71-48-7
Not present in Spansion products.
Cobalt(II) dinitrate
10141-05-6
Not present in Spansion products.
Cobalt(II) sulphate
10124-43-3
Not present in Spansion products.
Cyclohexane-1,2-dicarboxylic anhydride ,
cis-cyclohexane-1,2-dicarboxylic
anhydride ,
trans-cyclohexane-1,2-dicarboxylic
anhydride
85-42-7,
13149-00-3,
14166-21-3
Not present in Spansion products.
Bis(tributyltin)oxide (TBTO)
Note: "Not present" means not present above the concentration specified by REACH.
Packages and Packing Methodologies Handbook
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Chapter 2 Package Materials
Material / Substance Category Name
CAS Number
Status
Diarsenic pentaoxide
1303-28-2
Not present in Spansion products.
Diarsenic trioxide
1327-53-3
Not present in Spansion products.
Diazene-1,2-dicarboxamide (C,C'azodi(formamide))
123-77-3
Not present in Spansion products.
Diboron trioxide
1303-86-2
Not present in Spansion products.
Dibutyl phthalate (DBP)
84-74-2
Not present in Spansion products.
Dibutyltin dichloride (DBTC)
683-18-1
Not present in Spansion products.
Dichromium tris (chromate)
24613-89-6
Not present in Spansion products.
Diethyl sulphate
64-67-5
Not present in Spansion products.
Dihexyl phthalate
84-75-3
Not present in Spansion products.
Diisobutyl phthalate (DIBP)
84-69-5
Not present in Spansion products.
Diisopentylphthalate
605-50-5
Not present in Spansion products.
Dimethyl sulphate
77-78-1
Not present in Spansion products.
Dinoseb (6-sec-butyl-2,4-dinitrophenol)
88-85-7
Not present in Spansion products.
Dioxobis(stearato)trilead
12578-12-0
Not present in Spansion products.
Dipentyl phthalate (DPP)
131-18-0
Not present in Spansion products.
Disodium 3,3'-[[1,1'-biphenyl]-4,4'diylbis(azo)]bis(4-aminonaphthalene-1sulphonate) (C.I. Direct Red 28)
573-58-0
Not present in Spansion products.
Disodium 4-amino-3-[[4'-[(2,4diaminophenyl)azo][1,1'-biphenyl]-4yl]azo] -5-hydroxy-6(phenylazo)naphthalene-2,7-disulphonate
(C.I. Direct Black 38)
1937-37-7
Not present in Spansion products.
1303-96-4/ 1330-43-4/ 1217904-3
Not present in Spansion products.
Fatty acids, C16-18, lead salts
91031-62-8
Not present in Spansion products.
Formaldehyde, oligomeric reaction
products with aniline
25214-70-4
Not present in Spansion products.
Formamide
75-12-7
Not present in Spansion products.
Furan
110-00-9
Not present in Spansion products.
Henicosafluoroundecanoic acid
2058-94-8
Not present in Spansion products.
Heptacosafluorotetradecanoic acid
376-06-7
Not present in Spansion products.
25637-99-4 / 3194-55-6 /
(134237-50-6) / (134237-51-7)
/ (134237-52-8)
Not present in Spansion products.
Disodium tetraborate, anhydrous
Hexabromocyclododecane (HBCDD) and
all major diastereoisomers identified:
Alpha-hexabromocyclododecane
Beta-hexabromocyclododecane
Gamma-hexabromocyclododecane
Note: "Not present" means not present above the concentration specified by REACH.
Packages and Packing Methodologies Handbook
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2-9
Chapter 2 Package Materials
Material / Substance Category Name
CAS Number
Hexahydromethylphathalic anhydride,
Hexahydro-4-methylphathalic anhydride,
Hexahydro-1-methylphathalic anhydride,
Hexahydro-3-methylphathalic anhydride
25550-51-0, 19438-60-9,
48122-14-1, 57110-29-9
Not present in Spansion products.
302-01-2 / 7803-57-8
Not present in Spansion products.
96-45-7
Not present in Spansion products.
Lead bis(tetrafluoroborate)
13814-96-5
Not present in Spansion products.
Lead chromate
7758-97-6
Not present in Spansion products.
Lead chromate molybdate sulphate red
(C.I. Pigment Red 104)
12656-85-8
Not present in Spansion products.
Lead cyanamidate
20837-86-9
Not present in Spansion products.
301-04-2
Not present in Spansion products.
Lead diazide Lead azide
13424-46-9
Not present in Spansion products.
Lead dinitrate
10099-74-8
Not present in Spansion products.
Lead dipicrate
6477-64-1
Not present in Spansion products.
Lead hydrogen arsenate
7784-40-9
Not present in Spansion products.
Lead monoxide (lead oxide)
1317-36-8
Not present in Spansion products.
Lead oxide sulfate
12036-76-9
Not present in Spansion products.
Lead styphnate
15245-44-0
Not present in Spansion products.
Lead sulfochromate yellow (C.I. Pigment
Yellow 34)
1344-37-2
Not present in Spansion products.
Lead titanium trioxide
12060-00-3
Not present in Spansion products.
Lead titanium zirconium oxide
12626-81-2
Not present in Spansion products.
Lead(II) bis(methanesulfonate)
17570-76-2
Not present in Spansion products.
Methoxyacetic acid
625-45-6
Not present in Spansion products.
Methyloxirane (Propylene oxide)
75-56-9
Not present in Spansion products.
N,N,N',N'-tetramethyl-4,4'methylenedianiline (Michler’s base)
101-61-1
Not present in Spansion products.
N,N-dimethylacetamide (DMAC)
127-19-5
Not present in Spansion products.
N,N-dimethylformamide
68-12-2
Not present in Spansion products.
N-methylacetamide
79-16-3
Not present in Spansion products.
776297-69-9
Not present in Spansion products.
o-aminoazotoluene
97-56-3
Not present in Spansion products.
o-Toluidine
95-53-4
Not present in Spansion products.
Orange lead (lead tetroxide)
1314-41-6
Not present in Spansion products.
Pentacosafluorotridecanoic acid
72629-94-8
Not present in Spansion products.
Hydrazine
Imidazolidine-2-thione; (2-imidazoline-2thiol)
Lead di(acetate)
N-pentyl-isopentylphtalate
Status
Note: "Not present" means not present above the concentration specified by REACH.
Packages and Packing Methodologies Handbook
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2-10
Chapter 2 Package Materials
Material / Substance Category Name
Pentadecafluorooctanoic acid (PFOA)
CAS Number
Status
335-67-1
Not present in Spansion products.
Pentalead tetraoxide sulphate
12065-90-6
Not present in Spansion products.
Pentazinc chromate octahydroxide
49663-84-5
Not present in Spansion products.
77-09-8
Not present in Spansion products.
-
Not present in Spansion products.
Potassium chromate
7789-00-6
Not present in Spansion products.
Potassium dichromate
7778-50-9
Not present in Spansion products.
Potassium
hydroxyoctaoxodizincatedichromate
11103-86-9
Not present in Spansion products.
Pyrochlore, antimony lead yellow
8012-00-8
Not present in Spansion products.
Reaction mass of 2-ethylhexyl 10-ethyl4,4-dioctyl-7-oxo-8-oxa-3,5-dithia-4stannatetradecanoate and 2-ethylhexyl
10-ethyl-4-[[2-[(2-ethylhexyl)oxy]-2oxoethyl]thio]-4-octyl-7-oxo-8-oxa-3,5dithia-4-stannatetradecanoate (reaction
mass of DOTE and MOTE)
-
Not present in Spansion products.
Silicic acid (H2Si2O5), barium salt (1:1),
lead-doped
68784-75-8
Not present in Spansion products.
Silicic acid, lead salt
11120-22-2
Not present in Spansion products.
Sodium chromate
7775-11-3
Not present in Spansion products.
7789-12-0/ 10588-01-9
Not present in Spansion products.
-
Not present in Spansion products.
Sodium peroxometaborate
7632-04-4
Not present in Spansion products.
Strontium chromate
7789-06-2
Not present in Spansion products.
Sulfurous acid, lead salt, dibasic
62229-08-7
Not present in Spansion products.
Tetraboron disodium heptaoxide, hydrate
12267-73-1
Not present in Spansion products.
78-00-2
Not present in Spansion products.
12202-17-4
Not present in Spansion products.
Trichloroethylene
79-01-6
Not present in Spansion products.
Tricosafluorododecanoic acid
307-55-1
Not present in Spansion products.
Triethyl arsenate
15606-95-8
Not present in Spansion products.
Trilead bis(carbonate)dihydroxide
1319-46-6
Not present in Spansion products.
Trilead diarsenate
3687-31-8
Not present in Spansion products.
Trilead dioxide phosphonate
12141-20-7
Not present in Spansion products.
Tris(2-chloroethyl)phosphate
115-96-8
Not present in Spansion products.
25155-23-1
Not present in Spansion products.
Phenolphthalein
Pitch, Coal tar, high temp.
Sodium dichromate
Sodium perborate; perboric acid, sodium
salt
Tetraethyllead
Tetralead trioxide sulphate
Trixylyl phosphate
Note: "Not present" means not present above the concentration specified by REACH.
Packages and Packing Methodologies Handbook
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2-11
Chapter 2 Package Materials
Material / Substance Category Name
Zirconia Aluminosilicate, Refractory
Ceramic Fibres
α,α-Bis[4-(dimethylamino)phenyl]-4
(phenylamino)naphthalene-1-methanol
(C.I. Solvent Blue 4)
CAS Number
Status
650-017-00-8
Not present in Spansion products.
6786-83-0
Not present in Spansion products.
Note: "Not present" means not present above the concentration specified by REACH.
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2-12
Chapter 2 Package Materials
Material Declaration Data Sheet: SOA 008 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
8-pin SOIC, Pb-free
4.9 mm x 3.9 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
SOA 008
73 mg
260°C
Package Chemistry Substances Analysis Table
Description
Chemicals Present
Silicon Die
#1
Silicon
Bond Wire
#1
Gold
7440-21-3
1.12
7440-57-5
Subtotal
Subtotal
Die Attach
#1
Epoxy Resin
1.54
15,362
0.35
3,522
0.26
0.35
3,522
0.014
0.02
191
Bisphenol A Glycidylether
25068-38-6
0.007
0.01
102
60676-86-0
0.065
0.09
891
#4
Additive
0.007
0.01
89
0.093
0.13
1,273
#1
Copper
7440-50-8
22.87
31.32
313,232
#2
Iron
12604-58-9
0.52
0.72
7,157
#3
Phosphorus
7723-14-0
0.008
0.01
112
#4
Zinc
7440-66-6
0.032
0.04
443
23.43
32.09
320,944
#1
Silver
0.48
0.66
6,550
0.48
0.66
6,550
40.64
55.66
556,650
2.80
3.84
38,390
0.93
1.28
12,797
2.29
3.14
31,352
0.047
0.06
640
46.71
63.98
639,827
0.91
1.25
12,522
0.91
1.25
12,522
73.00
100.00
1,000,000
7440-22-4
#1
Silica Fused
60676-86-0
#2
Epoxy Resin
#3
Epoxy, Cresol Novolac
#4
Phenol Resin
#5
Carbon Black
#1
Tin
29690-82-2
1333-86-4
Subtotal
External Plating
1.12
0.26
FusedSilica
Subtotal
Mold
Compound
15,362
#3
Subtotal
Internal Plating
1.54
#2
Subtotal
Leadframe
Amount
(ppm)
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-13
Chapter 2 Package Materials
Material Declaration Data Sheet: SOC 008 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
8-pin SOIC, Pb-free
5.28 mm x 5.28 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
SOC 008
132 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Subtotal
Bond Wire
#1
Gold
Die Attach
#1
Silver flake
#2
7440-57-5
Subtotal
6.30
4.76
47,575
6.30
4.76
47,575
0.060
0.05
453
0.060
0.05
453
0.91
0.68
6,846
Acrylic Resin
0.10
0.08
771
#3
Plybutadiene derivative
0.066
0.05
499
#4
Butadiene copolymer
0.012
0.01
91
#5
Acrylate
0.066
0.05
499
#6
Epoxy Resin
0.030
0.02
227
#7
Peroxide
0.006
0.00
45
#8
Additive
0.012
0.01
91
1.20
0.91
9,068
7440-22-4
Subtotal
Leadframe
Amount
(ppm)
#1
Copper
7440-50-8
47.97
36.25
362,496
#2
Iron
7439-89-6
1.19
0.90
8,969
#3
Phosphorus
7723-14-0
0.042
0.03
317
#4
Zinc
7440-66-6
0.063
0.05
476
49.26
37.23
372,259
7440-22-4
1.26
0.95
9,544
1.26
0.95
9,544
60676-86-0
61.30
46.32
463,208
Subtotal
Internal Plating
#1
Silver
Mold
Compound
#1
Silica Fused
#2
Epoxy Resin-1
2.45
1.85
18,513
#3
Epoxy Resin-2
3.85
2.91
29,092
#4
Phenol Resin
3.50
2.64
26,447
#5
Carbon Black
0.11
0.08
793
71.21
53.81
538,054
3.05
2.30
23,047
3.05
2.30
23,047
Subtotal
1333-86-4
Subtotal
External Plating
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
132.34
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-14
Chapter 2 Package Materials
Material Declaration Data Sheet: SOC 008 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
8-pin SOIC, Pb-free
5.28 mm x 5.28 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
SOC 008
132 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Subtotal
Bond Wire
4.76
47,590
6.30
4.76
47,590
Copper
7440-50-8
0.019
0.01
144
#2
Palladium
7440-05-3
0.001
0.00
8
0.020
0.015
151
0.91
0.68
6,848
#1
Silver flake
7440-22-4
#2
Acrylic Resin
0.10
0.08
771
#3
Plybutadiene derivative
0.066
0.05
499
#4
Butadiene copolymer
0.012
0.01
91
#5
Acrylate
0.066
0.05
499
#6
Epoxy Resin
0.030
0.02
227
#7
Peroxide
0.006
0.00
45
#8
Additive
0.012
0.01
91
1.20
0.91
9,070
47.97
36.26
362,606
Subtotal
Leadframe
6.30
#1
Subtotal
Die Attach
Amount
(ppm)
#1
Copper
7440-50-8
#2
Iron
7439-89-6
1.19
0.90
8,972
#3
Phosphorus
7723-14-0
0.042
0.03
317
#4
Zinc
7440-66-6
0.063
0.05
476
49.26
37.24
372,371
7440-22-4
1.26
0.95
9,547
1.26
0.95
9,547
60676-86-0
61.30
46.33
463,348
Subtotal
Internal Plating
#1
Silver
Mold
Compound
#1
Silica Fused
#2
Epoxy Resin-1
2.45
1.85
18,519
#3
Epoxy Resin-2
3.85
2.91
29,101
#4
Phenol Resin
3.50
2.65
26,455
#5
Carbon Black
0.11
0.08
794
71.21
53.82
538,217
3.05
2.31
23,054
3.05
2.31
23,054
132.30
100.00
1,000,000
Subtotal
1333-86-4
Subtotal
External Plating
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-15
Chapter 2 Package Materials
Material Declaration Data Sheet: SO3016 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
16-pin SOIC, Pb-free
7.5 mm x 10.3 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
SO3 016
490 mg
260°C
Package Chemistry Substances Analysis Table
Description
Chemicals Present
Silicon Die
#1
Silicon
Bond Wire
#1
Gold
7440-21-3
Subtotal
7440-57-5
Subtotal
Die Attach
#1
Silver Flake
7440-22-4
5.41
54,051
0.12
0.02
238
0.12
0.02
238
1.48
0.30
3,019
Acrylic Resin
0.17
0.03
344
0.079
0.02
162
#4
Butadiene Copolymer
0.040
0.01
81
#5
Acrylate
0.11
0.02
223
#6
Epoxy Resin
0.050
0.01
101
#7
Peroxide
0.020
0.00
41
#8
Additive
0.040
0.01
81
1.98
0.41
4,052
#1
Copper
7440-50-8
155.33
31.73
317,294
#2
Iron
7439-89-6
1.50
0.31
3,058
#3
Zinc
7440-66-6
0.10
0.02
197
#4
Phosphorus
7723-14-0
0.016
0.00
33
156.94
32.06
320,582
#1
Silver
4.02
0.82
8,220
4.02
0.82
8,220
270.54
55.26
552,636
7440-22-4
#1
Silica Fused
60676-86-0
#2
Epoxy Resin-1
4.19
0.85
8,549
#3
Epoxy Resin-2
1.20
0.24
2,443
#4
Epoxy Resin-3
11.96
2.44
24,426
#5
Hardener
10.46
2.14
21,373
#6
Carbon Black
1333-86-4
Subtotal
External Plating
26.46
Polybutadiene derivative
Subtotal
Mold
Compound
54,051
#3
Subtotal
Internal Plating
5.41
#2
Subtotal
Leadframe
26.46
Amount
(ppm)
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
0.60
0.12
1,221
298.94
61.06
610,648
1.08
0.22
2,209
1.08
0.22
2,209
489.54
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-16
Chapter 2 Package Materials
Material Declaration Data Sheet: SO3016 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
16-pin SOIC, Pb-free
7.5 mm x 10.3 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
SO3 016
490 mg
260°C
Package Chemistry Substances Analysis Table
Description
Chemicals Present
Silicon Die
#1
Silicon
Bond Wire
#1
Copper
7440-21-3
26.46
7440-50-8
Subtotal
Subtotal
Die Attach
#1
Silver Flake
#2
Acrylic Resin
7440-22-4
5.41
54,057
26.46
5.41
54,057
0.054
0.01
111
0.054
0.01
111
1.48
0.30
3,019
0.17
0.03
344
#3
Polybutadiene derivative
0.079
0.02
162
#4
Butadiene Copolymer
0.040
0.01
81
#5
Acrylate
0.11
0.02
223
#6
Epoxy Resin
0.050
0.01
101
#7
Peroxide
0.020
0.00
41
#8
Additive
0.040
0.01
81
1.98
0.41
4,053
155.33
31.73
317,334
Subtotal
Leadframe
Amount
(ppm)
#1
Copper
7440-50-8
#2
Iron
7439-89-6
1.50
0.31
3,058
#3
Zinc
7440-66-6
0.10
0.02
197
#4
Phosphorus
7723-14-0
0.016
0.00
33
156.94
32.06
320,623
7440-22-4
4.02
0.82
8,221
4.02
0.82
8,221
60676-86-0
270.54
55.27
552,707
Subtotal
Internal Plating
#1
Silver
Mold
Compound
#1
Silica Fused
#2
Epoxy Resin-1
4.19
0.86
8,550
#3
Epoxy Resin-2
1.20
0.24
2,443
Subtotal
#4
Epoxy Resin-3
11.96
2.44
24,429
#5
Hardener
10.46
2.14
21,375
#6
Carbon Black
0.60
0.12
1,221
298.94
61.07
610,726
1.08
0.22
2,209
1333-86-4
Subtotal
External Plating
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
1.08
0.22
2,209
489.48
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-17
Chapter 2 Package Materials
Material Declaration Data Sheet: SO 044 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
44-pin SO, Pb-free
28.2 mm x 13.3 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
SO 044
1,773 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Subtotal
Bond Wire
#1
Gold
7440-57-5
Subtotal
Die Attach
#1
Copper
#2
Epoxy Resin
#3
Silver
7440-50-8
7440-22-4
Subtotal
Leadframe
8,099
0.81
8,099
0.71
0.04
400
0.71
0.04
400
0.083
0.00
47
0.23
0.01
127
1.20
0.07
675
1.50
0.08
849
Copper
7440-50-8
287.65
16.23
162,274
Iron
7439-89-6
7.08
0.40
3,996
#3
Zinc
7440-66-6
0.30
0.02
167
#4
Phosphorus
7723-14-0
0.15
0.01
83
295.17
16.65
166,520
#1
Silver
0.024
0.00
14
0.024
0.00
14
1273.36
71.84
718,357
7440-22-4
#1
SiO2 Filler
60676-86-0
#2
Carbon Black
4.36
0.25
2,457
#3
Phenol Resin
133-86-4
72.60
4.10
40,955
#4
Epoxy Resin
101.64
5.73
57,338
1451.95
81.91
819,108
8.88
0.50
5,011
8.88
0.50
5,011
1772.60
100.00
1,000,000
Subtotal
External Plating
0.81
14.36
#2
Subtotal
Mold
Compound
14.36
#1
Subtotal
Internal Plating
Amount
(ppm)
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-18
Chapter 2 Package Materials
Material Declaration Data Sheet: UNE 008 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
8-pin USON, Pb-free
5.0 mm x 6.0 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
UNE 008
48 mg
260°C
Package Chemistry Substances Analysis Table
Description
Chemicals Present
Silicon Die
#1
Silicon
Bond Wire
#1
Gold
CAS
Number
Unit
Weight
(mg)
Unit
Weight/
package (%)
Amount
(ppm)
7440-21-3
3.58
7.41
74,117
3.58
7.41
74,117
7440-57-5
0.069
0.14
1,438
0.069
0.14
1,438
Subtotal
Subtotal
Die Attach
#1
Acrylate Resin
0.24
0.50
4,998
#2
Heterocyclic Organic Compound
0.010
0.02
200
#3
Treated Silica
0.010
0.02
200
#4
Silver
0.70
1.46
14,593
0.97
2.00
19,990
7440-22-4
Subtotal
Leadframe
#1
Copper
7440-50-8
9.89
20.48
204,802
#2
Chromium
7440-47-3
0.025
0.05
516
#3
Tin
7440-31-5
0.025
0.05
516
#4
Zinc
7440-66-6
0.022
0.05
454
9.96
20.63
206,288
Internal
Plating
#1
Silver
7440-22-4
0.20
0.42
4,210
0.20
0.42
4,210
Mold
Compound
#1
27.53
57.01
570,069
Subtotal
Subtotal
Silica Fused
60676-86-0
#2
Epoxy Resin
1.43
2.96
29,606
#3
Phenol Resin
1.43
2.96
29,606
#4
Carbon Black
0.030
0.06
630
30.42
62.99
629,911
3.09
6.40
64,046
3.09
6.40
64,046
48.29
100.00
1,000,000
1333-86-4
Subtotal
External
Plating
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-19
Chapter 2 Package Materials
Material Declaration Data Sheet: WNF 008 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
8-pin WSON, Pb-free
6.0 mm x 8.0 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
WNF 008
127 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Subtotal
7440-57-5
Amount
(ppm)
9.04
7.10
70,962
9.04
7.10
70,962
0.19
0.15
1,524
Bond Wire
#1
Gold
0.19
0.15
1,524
Die Attach
#1
Acrylate Monomer
0.24
0.19
1,875
#2
Acrylate oligomer
0.18
0.14
1,406
#3
Bismaleimide resin
0.06
0.05
469
#4
Epoxy resin
#5
Silver
Subtotal
7440-22-4
Subtotal
Leadframe
#1
14,905
2.39
1.87
18,748
17.62
13.83
138,294
#2
Iron
7439-89-6
0.40
0.32
3,160
#3
Phosphorus
7723-14-0
0.01
0.00
50
#4
Zinc
7440-66-6
0.02
0.02
196
18.05
14.17
141,699
0.37
0.29
2,892
0.37
0.29
2,892
83.26
65.36
653,560
4.32
3.39
33,942
4.32
3.39
33,942
0.09
0.07
722
92.00
72.22
722,166
5.35
4.20
42,008
#1
Silver
7440-22-4
#1
Silica Fused
#2
Epoxy Resin
#3
Phenol Resin
#4
Carbon Black
60676-86-0
1333-86-4
Subtotal
External Plating
94
1.49
7440-50-8
Subtotal
Mold
Compound
0.01
Copper
Subtotal
Internal Plating
0.01
1.90
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
5.35
4.20
42,008
127.39
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-20
Chapter 2 Package Materials
Material Declaration Data Sheet: SSO 056 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
56-pin SSOP, Pb-free
23.7 mm x 13.3 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
SSO 056
963 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Amount
(ppm)
58.03
6.03
60,281
58.03
6.03
60,281
7440-57-5
0.79
0.08
824
0.79
0.08
824
7440-50-8
0.52
0.05
543
1.43
0.15
1,482
7440-22-4
7.56
0.79
7,854
Subtotal
Bond Wire
#1
Gold
Die Attach
#1
Copper
#2
Epoxy Resin
#3
Silver
9.51
0.99
9,879
#1
Copper
7440-50-8
200.21
20.80
207,970
#2
Iron
7439-89-6
4.93
0.51
5,122
#3
Zinc
7440-66-6
0.21
0.02
213
#4
Phosphorus
Subtotal
Subtotal
Leadframe
7723-14-0
Subtotal
Internal Plating
#1
Silver
7440-22-4
Subtotal
Mold
Compound
0.01
107
21.34
213,412
0.34
0.03
349
0.34
0.03
349
#1
SiO2 Filler
60676-86-0
593.14
61.61
616,139
#2
Bismuth
7440-69-9
0.34
0.04
354
#3
Carbon Black
1333-86-4
2.04
0.21
2,122
#4
Phosphoric Catalyst
3.75
0.39
3,891
#5
Epoxy
Subtotal
External Plating
0.10
205.45
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
81.72
8.49
84,887
680.99
70.74
707,392
7.57
0.79
7,863
7.57
0.79
7,863
962.67
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-21
Chapter 2 Package Materials
Material Declaration Data Sheet: PL 032 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
32-pin PLCC, Pb-free
18.4 mm x 11.9 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
PL 032
1129 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Amount
(ppm)
10.60
0.94
9,386
10.60
0.94
9,386
7440-57-5
1.20
0.11
1,063
1.20
0.11
1,063
7440-22-4
3.47
0.31
3,068
Subtotal
Bond Wire
#1
Gold
Die Attach
#1
Silver
#2
Acrylic Resin
0.36
0.03
319
#3
Polybutadiene derivative
0.23
0.02
199
0.14
0.01
120
0.32
0.03
279
4.50
0.40
3,985
29.44
294,378
Subtotal
#4
Epoxy Resin
#5
Misc
25928-94-3
Subtotal
Leadframe
#1
Copper
7440-50-8
332.45
#2
Silver
7440-22-4
4.28
0.38
3,790
#3
Zirconium
7440-67-7
0.30
0.03
266
337.03
29.84
298,434
660.63
58.50
584,971
Subtotal
Mold
Compound
#1
SiO2 Filler
60676-86-0
#2
Epoxy Resin
25928-94-3
#3
Phenol Resin
#4
Epoxy, Cresol Novolac
#5
Carbon Black
#1
Tin
37.75
3.34
33,427
37.75
3.34
33,427
29690-82-2
15.10
1.34
13,371
1333-86-4
3.78
0.33
3,343
755.00
66.85
668,538
21.00
1.86
18,595
21.00
1.86
18,595
1129.33
100.00
1,000,000
Subtotal
External Plating
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-22
Chapter 2 Package Materials
Material Declaration Data Sheet: PQR 080 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
80-pin PQFP, Pb-free
20 mm x 14 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
PQR 080
1,209 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Subtotal
7440-57-5
Amount
(ppm)
16.25
1.34
13,442
16.25
1.34
13,442
1.96
0.16
1,618
Bond Wire
#1
Gold
1.96
0.16
1,618
Die Attach
#1
Anhydride
0.42
0.03
343
#2
Epoxy Resin
0.83
0.07
687
#3
Silver
7440-22-4
2.91
0.24
2,405
4.15
0.34
3,435
#1
Silicon
7440-21-3
1.40
0.12
1,157
#2
Nickel
7440-02-0
6.45
0.53
5,337
#3
Magnesium
7439-95-4
0.32
0.03
267
#4
Copper
7440-50-8
206.84
17.12
171,155
215.01
17.79
177,916
0.77
0.06
635
0.77
0.06
635
810.14
67.04
670,362
142.97
11.83
118,299
953.10
78.87
788,661
17.27
1.43
14,293
Subtotal
Subtotal
Leadframe
Subtotal
Internal Plating
#1
Silver
7440-22-4
Subtotal
Mold
Compound
#1
Silica Fused
#2
Epoxy Resin
60676-86-0
Subtotal
External Plating
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
17.27
1.43
14,293
1208.50
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-23
Chapter 2 Package Materials
Material Declaration Data Sheet: TS 032 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
32-pin TSOP, Pb-free
18.4 mm x 8.0 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
TS 032
363 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Amount
(ppm)
6.01
1.66
16,551
6.01
1.66
16,551
7440-57-5
0.51
0.14
1,405
0.51
0.14
1,405
7440-50-8
0.022
0.01
60
0.059
0.02
163
7440-22-4
0.31
0.09
862
Subtotal
Bond Wire
#1
Gold
Die Attach
#1
Copper
#2
Epoxy Resin
#3
Silver
0.39
0.11
1,085
#1
Copper
7440-50-8
88.80
24.44
244,421
#2
Iron
7439-89-6
2.19
0.60
6,020
#3
Zinc
7440-66-6
0.091
0.03
251
#4
Phosphorus
7723-14-0
0.046
0.01
125
91.12
25.08
250,817
0.082
0.02
226
0.08
0.02
226
Subtotal
Subtotal
Leadframe
Subtotal
Internal Plating
#1
Silver
7440-22-4
Subtotal
Mold
Compound
#1
SiO2 Filler
60676-86-0
228.65
62.94
629,359
#2
Bismuth
7440-69-9
0.13
0.04
361
#3
Carbon Black
1333-86-4
0.79
0.22
2,168
#4
Phosphoric Catalyst
1.44
0.40
3,974
#5
Epoxy
Subtotal
External Plating
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
31.50
8.67
86,708
262.51
72.26
722,570
2.67
0.73
7,345
2.67
0.73
7,345
363.30
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-24
Chapter 2 Package Materials
Material Declaration Data Sheet: TS 040 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
40-pin TSOP, Pb-free
18.4 mm x 10.0 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
TS 040
448 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Amount
(ppm)
11.01
2.46
24,613
11.01
2.46
24,613
7440-57-5
0.58
0.13
1,305
0.58
0.13
1,305
7440-50-8
0.03
0.01
66
0.08
0.02
180
7440-22-4
0.43
0.10
956
Subtotal
Bond Wire
#1
Gold
Die Attach
#1
Copper
#2
Epoxy Resin
#3
Silver
0.54
0.12
1,203
#1
Copper
7440-50-8
82.67
18.47
184,748
#2
Iron
7439-89-6
2.04
0.45
4,550
#3
Zinc
7440-66-6
0.08
0.02
190
#4
Phosphorus
Subtotal
Subtotal
Leadframe
7723-14-0
Subtotal
Internal Plating
#1
Silver
7440-22-4
Subtotal
Mold
Compound
0.01
95
18.96
189,582
0.11
0.03
255
0.11
0.03
255
#1
SiO2 Filler
60676-86-0
307.25
68.66
686,596
#2
Carbon Black
1333-86-4
0.69
0.16
1,552
#3
Phosphoric Catalyst
1.74
0.39
3,879
#4
Epoxy
37.49
8.38
83,788
347.17
77.58
775,815
#1
Tin
3.23
0.72
7,228
3.23
0.72
7,228
447.49
100.00
1,000,000
Subtotal
External Plating
0.04
84.84
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-25
Chapter 2 Package Materials
Material Declaration Data Sheet: TS 048 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
48-pin TSOP, Pb-free
18.4 mm x 12.0 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
TS 048
507 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Amount
(ppm)
11.00
2.17
21,709
11.00
2.17
21,709
7440-57-5
0.58
0.12
1,153
0.58
0.12
1,153
7440-50-8
0.03
0.01
57
0.08
0.02
154
7440-22-4
0.41
0.08
818
Subtotal
Bond Wire
#1
Gold
Die Attach
#1
Copper
#2
Epoxy Resin
#3
Silver
0.52
0.10
1,029
#1
Copper
7440-50-8
91.01
17.96
179,621
#2
Iron
7439-89-6
2.24
0.44
4,424
#3
Zinc
7440-66-6
0.09
0.02
184
#4
Phosphorus
Subtotal
Subtotal
Leadframe
7723-14-0
Subtotal
Internal Plating
#1
Silver
7440-22-4
Subtotal
Mold
Compound
0.01
92
18.43
184,321
0.14
0.03
266
0.14
0.03
266
#1
SiO2 Filler
60676-86-0
351.62
69.40
693,956
#2
Carbon Black
1333-86-4
0.79
0.16
1,568
#3
Phosphoric Catalyst
1.99
0.39
3,921
#4
Epoxy
42.91
8.47
84,686
397.32
78.41
784,131
#1
Tin
3.74
0.74
7,390
3.74
0.74
7,390
506.70
100.00
1,000,000
Subtotal
External Plating
0.05
93.39
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-26
Chapter 2 Package Materials
Material Declaration Data Sheet: TS 048 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
48-pin TSOP, Pb-free
18.4 mm x 12.0 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
TS 048
507 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Amount
(ppm)
11.00
2.17
21,709
11.00
2.17
21,709
7440-50-8
0.58
0.12
1,153
0.58
0.12
1,153
7440-50-8
0.03
0.01
57
0.08
0.02
154
7440-22-4
0.41
0.08
818
Subtotal
Bond Wire
#1
Copper
Die Attach
#1
Copper
#2
Epoxy Resin
#3
Silver
0.52
0.10
1,029
#1
Copper
7440-50-8
91.01
17.96
179,621
#2
Iron
7439-89-6
2.24
0.44
4,424
#3
Zinc
7440-66-6
0.09
0.02
184
#4
Phosphorus
Subtotal
Subtotal
Leadframe
7723-14-0
Subtotal
Internal Plating
#1
Silver
7440-22-4
Subtotal
Mold
Compound
0.01
92
18.43
184,321
0.14
0.03
266
0.14
0.03
266
#1
SiO2 Filler
60676-86-0
351.62
69.40
693,956
#2
Carbon Black
1333-86-4
0.79
0.16
1,568
#3
Phosphoric Catalyst
1.99
0.39
3,921
#4
Epoxy
42.91
8.47
84,686
397.32
78.41
784,131
#1
Tin
3.74
0.74
7,390
3.74
0.74
7,390
506.70
100.00
1,000,000
Subtotal
External Plating
0.05
93.39
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-27
Chapter 2 Package Materials
Material Declaration Data Sheet: TS 056 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
56-pin TSOP, Pb-free
18.4 mm x 14.0 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
TS 056
601 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Amount
(ppm)
91.42
15.21
152,106
91.42
15.21
152,106
7440-57-5
0.13
0.02
221
0.13
0.02
221
7440-50-8
0.29
0.05
481
0.79
0.13
1,311
7440-22-4
4.18
0.69
6,950
Subtotal
Bond Wire
#1
Gold
Die Attach
#1
Copper
#2
Epoxy Resin
#3
Silver
5.25
0.87
8,742
#1
Copper
7440-50-8
133.04
22.14
221,361
#2
Iron
7439-89-6
3.28
0.55
5,452
#3
Zinc
7440-66-6
0.14
0.02
227
#4
Phosphorus
Subtotal
Subtotal
Leadframe
7723-14-0
Subtotal
Internal Plating
#1
Silver
7440-22-4
Subtotal
Mold
Compound
0.01
114
22.72
227,154
0.32
0.05
540
0.32
0.05
540
#1
SiO2 Filler
60676-86-0
320.25
53.29
532,863
#2
Carbon Black
1333-86-4
0.72
0.12
1,204
#3
Phosphoric Catalyst
1.81
0.30
3,011
#4
Epoxy
39.08
6.50
65,027
361.87
60.21
602,106
#1
Tin
5.49
0.91
9,132
5.49
0.91
9,132
601.00
100.00
1,000,000
Subtotal
External Plating
0.07
136.52
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-28
Chapter 2 Package Materials
Material Declaration Data Sheet: TS 056 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
56-pin TSOP, Pb-free
18.4 mm x 14.0 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
TS 056
601 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
91.42
15.21
152,106
91.42
15.21
152,106
7440-50-8
0.13
0.02
221
0.13
0.02
221
7440-50-8
0.29
0.05
481
0.79
0.13
1,311
4.18
0.69
6,950
5.25
0.87
8,742
Subtotal
Bond Wire
#1
Copper
Die Attach
#1
Copper
#2
Epoxy Resin
#3
Silver
Subtotal
7440-22-4
Subtotal
Leadframe
#1
Copper
7440-50-8
133.04
22.14
221,361
#2
Iron
7439-89-6
3.28
0.55
5,452
#3
Zinc
7440-66-6
0.14
0.02
227
#4
Phosphorus
7723-14-0
0.07
0.01
114
136.52
22.72
227,154
#1
Silver
0.32
0.05
540
0.32
0.05
540
Subtotal
Internal Plating
7440-22-4
Subtotal
Mold
Compound
#1
SiO2 Filler
60676-86-0
320.25
53.29
532,863
#2
Carbon Black
1333-86-4
0.72
0.12
1,204
#3
Phosphoric Catalyst
1.81
0.30
3,011
#4
Epoxy
39.08
6.50
65,027
361.87
60.21
602,106
5.49
0.91
9,132
5.49
0.91
9,132
601.00
100.00
1,000,000
Subtotal
External Plating
Amount
(ppm)
#1
Tin
7440-31-5
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-29
Chapter 2 Package Materials
Material Declaration Data Sheet: ZSA 024 (Pb-free, Low Halogen) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
24-ball BGA, Pb-free, Low Halogen
6 mm x 8 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
ZSA 024
88 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
#3
Silica (fused)
Subtotal
18.19
181,946
16.06
18.19
181,946
0.11
0.12
1,196
0.12
1,196
4.30
42,952
9002-84-0
0.34
0.38
3,836
60676-86-0
1.45
1.64
16,399
5.58
6.32
63,187
#1
Aluminum Hydroxide
21645-51-2
4.31
4.88
48,790
#2
Copper
7440-50-8
1.12
1.27
12,671
#3
Gold
7440-57-5
0.018
0.021
208
#4
Nickel
7440-02-0
0.15
0.17
1,743
#5
Epoxy Resin
9.00
10.19
101,947
#6
SiO2 Glass Cloth
8.45
9.57
95,704
23.04
26.11
261,062
33.57
38.04
380,448
65997-17-3
#1
Silica (fused)
60676-86-0
#2
Carbon Black
1333-86-4
0.10
0.11
1,119
#3
Epoxy Resin
5.47
6.20
61,991
#4
Phosphoric Organic Catalyst
0.12
0.13
1,343
#5
Metal Oxides
0.24
0.27
2,686
39.50
44.76
447,586
Subtotal
External
Plating
16.06
0.11
Subtotal
Mold
Compound
Amount
(ppm)
3.79
Subtotal
Substrate
Unit Weight Unit Weight/
(mg)
package (%)
#1
Tin
7440-31-5
3.83
4.34
43,447
#2
Silver
7440-22-4
0.12
0.14
1,351
#3
Copper
7440-50-8
0.020
0.023
225
3.97
4.50
45,023
88.25
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-30
Chapter 2 Package Materials
Material Declaration Data Sheet: LAE 064 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball Fort-BGA, Pb-free
9 mm x 9 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
LAE 064
189 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
Unit Weight
(mg)
Unit Weight/
package (%)
Amount
(ppm)
7440-21-3
4.14
2.20
21,956
4.14
2.20
21,956
0.46
0.24
2,424
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
2,424
0.05
542
0.08
0.04
443
0.19
0.10
985
BrominatedEpoxy Resin
3.69
1.96
19,551
#2
Copper
7440-50-8
7.05
3.74
37,422
#3
Gold
7440-57-5
0.04
0.02
222
#4
Nickel
7440-02-0
0.23
0.12
1,208
#5
Epoxy Resin
15.45
8.20
81,972
#6
Silica
14808-60-7
3.12
1.65
16,543
#7
SiO2 Glass Cloth
65997-17-3
13.61
7.22
72,187
43.19
22.91
229,104
#1
Silica (fused)
60676-86-0
77.14
40.92
409,207
#2
Carbon Black
1333-86-4
0.17
0.09
925
#3
Epoxy Resin
9.41
4.99
49,937
#4
Phosphoric Organic Catalyst
0.44
0.23
2,312
87.16
46.24
462,381
#1
Tin
7440-31-5
51.51
27.32
273,240
#2
Silver
7440-22-4
1.60
0.85
8,494
#3
Copper
7440-50-8
0.27
0.14
1,416
Subtotal
External Plating
0.24
#1
Subtotal
Mold
Compound
0.46
0.10
Subtotal
TOTAL PACKAGE WEIGHT
53.38
28.31
283,150
188.51
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-31
Chapter 2 Package Materials
Material Declaration Data Sheet: LAE 064 (Pb-free, Low Halogen) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball Fort-BGA, Pb-free, Low Halogen
9 mm x 9 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
LAE 064
192 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
2.16
21,558
4.14
2.16
21,558
0.46
0.24
2,380
0.46
0.24
2,380
0.10
0.05
532
0.08
0.04
435
0.19
0.10
967
7.27
3.78
37,844
Aluminum Hydroxide
21645-51-2
#2
Copper
7440-50-8
8.10
4.22
42,187
#3
Gold
7440-57-5
0.04
0.02
226
#4
Nickel
7440-02-0
0.23
0.12
1,194
#5
Epoxy Resin
16.78
8.74
87,390
#6
SiO2 Glass Cloth
65997-17-3
14.25
7.42
74,233
46.67
24.31
243,075
#1
Silica (fused)
60676-86-0
77.14
40.18
401,792
#2
Carbon Black
1333-86-4
0.17
0.09
908
#3
Epoxy Resin
9.41
4.90
49,032
#4
Phosphoric Organic Catalyst
0.44
0.23
2,270
87.16
45.40
454,002
Subtotal
External Plating
4.14
#1
Subtotal
Mold
Compound
Amount
(ppm)
#1
Tin
7440-31-5
51.51
26.83
268,288
#2
Silver
7440-22-4
1.60
0.83
8,341
#3
Copper
7440-50-8
Subtotal
TOTAL PACKAGE WEIGHT
0.27
0.14
1,390
53.38
27.80
278,018
191.99
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-32
Chapter 2 Package Materials
Material Declaration Data Sheet: LAE 064 (Pb-free, Low Halogen) Copper
Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball Fort-BGA, Pb-free, Low Halogen
9 mm x 9 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
LAE 064
190 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
7.65
4.03
40,326
7.65
4.03
40,326
7440-50-8
0.19
0.10
1,018
7440-05-3
0.00
0.00
18
0.20
0.10
1036
0.47
0.25
2,461
0.38
0.20
2,013
0.85
0.45
4,474
Subtotal
Bond Wire
#1
Copper
#2
Palladium (Pd)
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
9002-84-0
Subtotal
Substrate
#1
Aluminum Hydroxide
21645-51-2
7.27
3.83
38,287
#2
Copper
7440-50-8
8.10
4.27
42,681
#3
Gold
7440-57-5
0.04
0.02
228
#4
Nickel
7440-02-0
0.23
0.12
1,208
#5
Epoxy Resin
16.78
8.84
88,413
#6
SiO2 Glass Cloth
65997-17-3
14.25
7.51
75,102
46.67
24.59
245,921
68.87
36.29
362,924
Subtotal
Mold
Compound
#1
Silica (fused)
60676-86-0
#2
Carbon Black
1333-86-4
0.20
0.11
1,067
#3
Epoxy Resin
11.22
5.91
59,135
#4
Phosphoric Organic Catalyst
0.24
0.13
1,281
#5
Metal Oxides
0.49
0.26
2,562
81.02
42.70
426970
Subtotal
External Plating
Amount
(ppm)
#1
Tin
7440-31-5
51.51
27.14
271,429
#2
Silver
7440-22-4
1.60
0.84
8,438
#3
Copper
7440-50-8
0.27
0.14
1,406
53.38
28.13
281,273
189.77
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-33
Chapter 2 Package Materials
Material Declaration Data Sheet: VBH 064 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball Fort-BGA, Pb-free
11.6 mm x 8 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBH 064
140 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
17.17
12.27
122,713
17.17
12.27
122,713
0.76
0.54
5,449
0.76
0.54
5,449
0.22
0.16
1,556
0.18
0.13
1,273
0.40
0.28
2,830
BrominatedEpoxy Resin
2.81
2.01
20,114
#2
Copper
7440-50-8
9.05
6.46
64,642
#3
Gold
7440-57-5
0.07
0.05
522
#4
Nickel
7440-02-0
0.34
0.24
2,408
#5
Epoxy Resin
16.41
11.73
117,277
#6
Silica
14808-60-7
2.38
1.70
17,019
#7
SiO2 Glass Cloth
65997-17-3
10.39
7.43
74,267
41.46
29.62
296,249
#1
Silica (fused)
60676-86-0
61.56
43.99
439,893
#2
Carbon Black
1333-86-4
0.14
0.10
994
#3
Epoxy Resin
7.51
5.37
53,682
#4
Phosphoric Organic Catalyst
0.35
0.25
2,485
69.56
49.71
497,054
#1
Tin
7440-31-5
10.22
7.31
73,056
#2
Silver
7440-22-4
0.32
0.23
2,271
#3
Copper
7440-50-8
0.05
0.04
379
Subtotal
External Plating
Amount
(ppm)
#1
Subtotal
Mold
Compound
Unit Weight Unit Weight/
(mg)
package (%)
Subtotal
TOTAL PACKAGE WEIGHT
10.59
7.57
75,706
139.95
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-34
Chapter 2 Package Materials
Material Declaration Data Sheet: VBH 064 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball Fort-BGA, Pb-free
11.6 mm x 8 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBH 064
140 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
#1
Copper
#2
Palladium
12.31
123,117
17.17
12.31
123,117
7440-50-8
0.30
0.21
2,142
7440-05-3
0.005
0.004
37
0.30
0.22
2179
0.22
0.16
1,561
0.18
0.13
1,277
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
#1
BrominatedEpoxy Resin
#2
Copper
#3
9002-84-0
Subtotal
Substrate
0.40
0.28
2,839
2.81
2.02
20,180
7440-50-8
9.05
6.49
64,854
Gold
7440-57-5
0.07
0.05
524
#4
Nickel
7440-02-0
#5
Epoxy Resin
#6
Silica
#7
SiO2 Glass Cloth
#1
0.34
0.24
2,416
16.41
11.77
117,663
14808-60-7
2.38
1.71
17,075
65997-17-3
10.39
7.45
74,511
41.46
29.72
297,223
Silica (fused)
60676-86-0
61.56
44.13
441,339
#2
Carbon Black
1333-86-4
0.14
0.10
997
#3
Epoxy Resin
7.51
5.39
53,858
#4
Phosphoric Organic Catalyst
Subtotal
Mold
Compound
Subtotal
External Plating
Amount
(ppm)
17.17
Subtotal
Bond Wire
Unit Weight Unit Weight/
(mg)
package (%)
0.35
0.25
2,493
69.56
49.87
498,688
#1
Tin
7440-31-5
10.22
7.33
73,296
#2
Silver
7440-22-4
0.32
0.23
2,279
#3
Copper
7440-50-8
Subtotal
TOTAL PACKAGE WEIGHT
0.05
0.04
380
10.59
7.60
75,955
139.49
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-35
Chapter 2 Package Materials
Material Declaration Data Sheet: LAA 064 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball Fort-BGA, Pb-free
13 mm x 11 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
LAA 064
263 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
8.59
3.26
32,609
8.59
3.26
32,609
0.57
0.22
2,163
0.57
0.22
2,163
0.13
0.05
505
0.11
0.04
413
0.24
0.09
918
BrominatedEpoxy Resin
5.56
2.11
21,099
#2
Copper
7440-50-8
22.33
8.48
84,761
#3
Gold
7440-57-5
0.34
0.13
1,289
#4
Nickel
7440-02-0
1.57
0.59
5,943
#5
Epoxy Resin
23.90
9.07
90,740
#6
Silica
14808-60-7
4.70
1.79
17,853
#7
SiO2 Glass Cloth
65997-17-3
20.52
7.79
77,906
78.92
29.96
299,592
#1
Silica (fused)
60676-86-0
114.61
43.51
435,090
#2
Carbon Black
1333-86-4
0.26
0.10
983
#3
Epoxy Resin
13.99
5.31
53,096
#4
Phosphoric Organic Catalyst
0.65
0.25
2,458
129.50
49.16
491,627
#1
Tin
7440-31-5
44.00
16.70
167,033
#2
Silver
7440-22-4
1.37
0.52
5,193
#3
Copper
7440-50-8
0.23
0.09
865
Subtotal
External Plating
Amount
(ppm)
#1
Subtotal
Mold
Compound
Unit Weight Unit Weight/
(mg)
package (%)
Subtotal
TOTAL PACKAGE WEIGHT
45.60
17.31
173,091
263.42
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-36
Chapter 2 Package Materials
Material Declaration Data Sheet: LAA 064 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball Fort-BGA, Pb-free
13 mm x 11 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
LAA 064
263 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
#1
Copper
#2
Palladium
3.26
32,639
8.59
3.26
32,639
7440-50-8
0.32
0.12
1,233
7440-05-3
0.01
0.00
21
0.33
0.13
1,254
0.13
0.05
506
0.11
0.04
414
0.24
0.09
919
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
9002-84-0
Subtotal
Substrate
#1
BrominatedEpoxy Resin
5.56
2.11
21,119
#2
Copper
7440-50-8
22.33
8.48
84,839
#3
Gold
7440-57-5
0.34
0.13
1,290
#4
Nickel
7440-02-0
1.57
0.59
5,949
#5
Epoxy Resin
23.90
9.08
90,822
#6
Silica
14808-60-7
4.70
1.79
17,870
#7
SiO2 Glass Cloth
65997-17-3
20.52
7.80
77,977
78.92
29.99
299,864
Subtotal
Mold
Compound
#1
Silica (fused)
60676-86-0
114.61
43.55
435,486
#2
Carbon Black
1333-86-4
0.26
0.10
984
#3
Epoxy Resin
13.99
5.31
53,144
#4
Phosphoric Organic Catalyst
0.65
0.25
2,460
129.50
49.21
492,075
Subtotal
External Plating
Amount
(ppm)
8.59
Subtotal
Bond Wire
Unit Weight Unit Weight/
(mg)
package (%)
#1
Tin
7440-31-5
44.00
16.72
167,185
#2
Silver
7440-22-4
1.37
0.52
5,197
#3
Copper
7440-50-8
0.23
0.09
866
45.60
17.32
173,249
263.18
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-37
Chapter 2 Package Materials
Material Declaration Data Sheet: LAA 064 (Pb-free, Low Halogen) Copper
Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball Fort-BGA, Pb-free, Low Halogen
13 mm x 11 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
LAA 064
269 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
7.65
2.85
28,491
7.65
2.85
28,491
7440-50-8
0.31
0.12
1,162
7440-05-3
0.004
0.002
15
0.32
0.12
1,177
0.13
0.05
495
0.11
0.04
405
0.24
0.09
901
Subtotal
Bond Wire
#1
Copper
#2
Palladium
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
9002-84-0
Subtotal
Substrate
#1
Aluminum Hydroxide
21645-51-2
12.83
4.78
47,755
#2
Copper
7440-50-8
26.14
9.73
97,311
#3
Gold
7440-57-5
0.40
0.15
1,480
#4
Nickel
7440-02-0
1.83
0.68
6,823
18.94
7.05
70,498
25.16
9.37
93,673
85.29
31.75
317,540
110.08
40.98
409,819
#5
Epoxy resin
#6
SiO2 Glass Cloth
65997-17-3
Subtotal
Mold
Compound
#1
Silica (fused)
60676-86-0
#2
Carbon Black
1333-86-4
0.32
0.12
1,205
#3
Epoxy Resin
17.94
6.68
66,776
#4
Phosphoric Organic Catalyst
0.39
0.14
1,446
#5
Metal Oxide
0.78
0.29
2,893
129.50
48.21
482,140
Subtotal
External Plating
Amount
(ppm)
#1
Tin
7440-31-5
44.00
16.38
163,810
#2
Silver
7440-22-4
1.37
0.51
5,093
#3
Copper
7440-50-8
0.23
0.08
849
45.60
16.98
169,751
268.60
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-38
Chapter 2 Package Materials
Material Declaration Data Sheet: VBG 080 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
80-ball Fort-BGA, Pb-free
11 mm x 8 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBG 080
134 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
17.17
12.86
128,615
17.17
12.86
128,615
0.60
0.45
4,505
0.60
0.45
4,505
0.22
0.16
1,631
0.18
0.13
1,335
0.40
0.30
2,966
BrominatedEpoxy Resin
2.67
2.00
19,991
#2
Copper
7440-50-8
5.74
4.30
42,988
#3
Gold
7440-57-5
0.17
0.13
1,282
#4
Nickel
7440-02-0
0.79
0.59
5,912
#5
Epoxy Resin
15.47
11.58
115,832
#6
Silica
14808-60-7
2.26
1.69
16,915
#7
SiO2 Glass Cloth
65997-17-3
9.86
7.38
73,812
36.95
27.67
276,733
#1
Silica (fused)
60676-86-0
57.67
43.19
431,879
#2
Carbon Black
1333-86-4
0.13
0.10
976
#3
Epoxy Resin
7.04
5.27
52,704
#4
Phosphoric Organic Catalyst
0.33
0.24
2,440
65.16
48.80
487,999
#1
Tin
7440-31-5
12.78
9.57
95,712
#2
Silver
7440-22-4
0.40
0.30
2,975
#3
Copper
7440-50-8
0.07
0.05
496
Subtotal
External Plating
Amount
(ppm)
#1
Subtotal
Mold
Compound
Unit Weight Unit Weight/
(mg)
package (%)
Subtotal
TOTAL PACKAGE WEIGHT
13.24
9.92
99,183
133.53
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-39
Chapter 2 Package Materials
Material Declaration Data Sheet: VBG 080 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
80-ball Fort-BGA, Pb-free
11 mm x 8 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBG 080
133 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
#1
Copper
#2
Palladium
12.90
128,993
17.17
12.90
128,993
7440-50-8
0.21
0.16
1,551
7440-05-3
0.004
0.003
27
0.21
0.16
1,577
0.22
0.16
1,636
0.18
0.13
1,338
0.40
0.30
2,974
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
9002-84-0
Subtotal
Substrate
#1
BrominatedEpoxy Resin
2.67
2.00
20,050
#2
Copper
7440-50-8
5.74
4.31
43,115
#3
Gold
7440-57-5
0.17
0.13
1,286
#4
Nickel
7440-02-0
0.79
0.59
5,930
#5
Epoxy Resin
15.47
11.62
116,173
#6
Silica
14808-60-7
2.26
1.70
16,965
#7
SiO2 Glass Cloth
65997-17-3
9.86
7.40
74,029
36.95
27.75
277,547
Subtotal
Mold
Compound
#1
Silica (fused)
60676-86-0
57.67
43.31
433,149
#2
Carbon Black
1333-86-4
0.13
0.10
979
#3
Epoxy Resin
7.04
5.29
52,859
#4
Phosphoric Organic Catalyst
0.33
0.24
2,447
65.16
48.94
489,434
Subtotal
External Plating
Amount
(ppm)
17.17
Subtotal
Bond Wire
Unit Weight Unit Weight/
(mg)
package (%)
#1
Tin
7440-31-5
12.78
9.60
95,993
#2
Silver
7440-22-4
0.40
0.30
2,984
#3
Copper
7440-50-8
0.07
0.05
497
13.24
9.95
99,475
133.14
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-40
Chapter 2 Package Materials
Material Declaration Data Sheet: LAA 080 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
80-ball Fort-BGA, Pb-free
13 mm x 11 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
LAA 080
269 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
16.36
6.08
60,814
16.36
6.08
60,814
0.77
0.29
2,876
0.77
0.29
2,876
0.20
0.07
745
0.16
0.06
609
0.36
0.14
1,354
BrominatedEpoxy Resin
5.92
2.20
21,990
#2
Copper
7440-50-8
14.85
5.52
55,211
#3
Gold
7440-57-5
0.23
0.08
839
#4
Nickel
7440-02-0
1.04
0.39
3,871
#5
Epoxy Resin
31.68
11.78
117,764
#6
Silica
14808-60-7
5.01
1.86
18,607
#7
SiO2 Glass Cloth
65997-17-3
21.84
8.12
81,193
80.56
29.95
299,475
#1
Silica (fused)
60676-86-0
92.23
34.29
342,882
#2
Carbon Black
1333-86-4
0.21
0.08
775
#3
Epoxy Resin
11.26
4.18
41,843
#4
Phosphoric Organic Catalyst
0.52
0.19
1,937
104.22
38.74
387,437
#1
Tin
7440-31-5
64.39
23.94
239,361
#2
Silver
7440-22-4
2.00
0.74
7,441
#3
Copper
7440-50-8
0.33
0.12
1,240
Subtotal
External Plating
Amount
(ppm)
#1
Subtotal
Mold
Compound
Unit Weight Unit Weight/
(mg)
package (%)
Subtotal
TOTAL PACKAGE WEIGHT
66.72
24.80
248,043
268.99
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-41
Chapter 2 Package Materials
Material Declaration Data Sheet: FBB 048 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
48-ball FBGA, Pb-free
6.0 mm x 9.0 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
FBB 048
98 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
Subtotal
Bond Wire
#1
Gold
Die Attach
#1
Epoxy Resin
#2
Silica (fused)
7440-57-5
Subtotal
68611-44-9
Subtotal
Substrate
15.77
16.10
161,027
15.77
16.10
161,027
0.46
0.47
4,656
0.46
0.47
4,656
0.67
0.68
6,841
0.17
0.17
1,710
0.84
0.86
8,552
BrominatedEpoxy Resin
3.11
3.18
31,766
#2
Copper
7440-50-8
2.13
2.17
21,729
#3
Gold
7440-57-5
0.025
0.03
253
#4
Nickel
7440-02-0
0.11
0.12
1,166
#5
Epoxy Resin
10.11
10.32
103,223
#6
Silica
14808-60-7
2.63
2.69
26,879
#7
SiO2 Glass Cloth
65997-17-3
11.49
11.73
117,290
29.60
30.23
302,306
#1
Silica (fused)
60676-86-0
40.94
41.80
418,039
#2
Carbon Black
1333-86-4
0.093
0.09
945
#3
Epoxy Resin
5.00
5.10
51,015
#4
Phosphoric Organic Catalyst
0.23
0.24
2,362
46.26
47.24
472,361
#1
Tin
7440-31-5
4.83
4.93
49,311
#2
Silver
7440-22-4
0.15
0.15
1,533
#3
Copper
7440-50-8
0.025
0.03
255
Subtotal
External Plating
Amount
(ppm)
#1
Subtotal
Mold
Compound
Unit Weight Unit Weight/
(mg)
package (%)
Subtotal
TOTAL PACKAGE WEIGHT
5.00
5.11
51,099
97.93
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-42
Chapter 2 Package Materials
Material Declaration Data Sheet: VBK 048 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
48-ball FBGA, Pb-free
8.15 mm x 6.15 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBK 048
84 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
Unit Weight
(mg)
Unit Weight/
package (%)
Amount
(ppm)
7440-21-3
9.66
11.49
114,865
9.66
11.49
114,865
0.52
0.62
6,199
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
6,199
1,809
0.12
0.15
1,480
0.28
0.33
3,289
BrominatedEpoxy Resin
1.52
1.81
18,084
#2
Copper
7440-50-8
10.91
12.98
129,807
#3
Gold
7440-57-5
0.05
0.06
621
#4
Nickel
7440-02-0
0.24
0.29
2,865
#5
Epoxy Resin
9.05
10.77
107,650
#6
Silica
14808-60-7
1.29
1.53
15,302
#7
SiO2 Glass Cloth
65997-17-3
5.61
6.68
66,773
28.68
34.11
341,104
#1
Silica (fused)
60676-86-0
32.74
38.94
389,422
#2
Carbon Black
1333-86-4
0.07
0.09
880
#3
Epoxy Resin
4.00
4.75
47,523
#4
Phosphoric Organic Catalyst
0.18
0.22
2,200
36.99
44.00
440,025
#1
Tin
7440-31-5
7.67
9.12
91,210
#2
Silver
7440-22-4
0.24
0.28
2,836
#3
Copper
7440-50-8
0.04
0.05
473
Subtotal
Solder ball
0.62
0.18
#1
Subtotal
Mold
Compound
0.52
0.15
Subtotal
TOTAL PACKAGE WEIGHT
7.95
9.45
94,518
84.07
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-43
Chapter 2 Package Materials
Material Declaration Data Sheet: VBK 048 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
48-ball FBGA, Pb-free
8.15 mm x 6.15 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBK 048
84 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
#1
Copper
#2
Palladium
11.52
115,212
9.66
11.52
115,212
7440-50-8
0.25
0.30
3,008
7440-05-3
0.00
0.01
52
0.26
0.31
3,060
0.15
0.18
1,814
0.12
0.15
1,484
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
#1
Brominated Epoxy Resin
#2
Copper
#3
9002-84-0
Subtotal
Substrate
0.28
0.33
3,299
1.52
1.81
18,139
7440-50-8
10.91
13.02
130,199
Gold
7440-57-5
0.05
0.06
623
#4
Nickel
7440-02-0
0.24
0.29
2,874
#5
Epoxy Resin
9.05
10.80
107,975
#6
Silica
14808-60-7
1.29
1.53
15,348
#7
SiO2 Glass Cloth
65997-17-3
5.61
6.70
66,975
28.68
34.21
342,134
#1
Silica (fused)
60676-86-0
32.75
39.07
390,721
#2
Carbon Black
1333-86-4
0.07
0.09
883
#3
Epoxy Resin
4.00
4.77
47,681
#4
Phosphoric Organic Catalyst
Subtotal
Mold
Compound
Subtotal
Solder ball
Amount
(ppm)
9.66
Subtotal
Bond Wire
Unit Weight Unit Weight/
(mg)
package (%)
0.19
0.22
2,207
37.01
44.15
441,492
#1
Tin
7440-31-5
7.67
9.15
91,485
#2
Silver
7440-22-4
0.24
0.28
2,844
#3
Copper
7440-50-8
0.04
0.05
474
7.95
9.48
94,803
83.82
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-44
Chapter 2 Package Materials
Material Declaration Data Sheet: VBK 048 (Pb-free, Low Halogen) Copper
Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
48-ball FBGA, Pb-free
8.15 mm x 6.15 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
VBK 048
81 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
6.94
8.58
85,810
6.94
8.58
85,810
7440-50-8
0.37
0.45
4,533
7440-05-3
0.006
0.008
78
0.37
0.46
4,612
0.13
0.16
1,586
0.10
0.13
1,298
0.23
0.29
2,884
Subtotal
Bond Wire
#1
Copper
#2
Palladium
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
9002-84-0
Subtotal
Substrate
#1
Aluminium Hydroxide
21645-51-2
3.00
3.71
37,053
#2
Copper
7440-50-8
8.25
10.19
101,930
#3
Gold
7440-57-5
0.04
0.05
488
#4
Nickel
7440-02-0
0.18
0.22
2,250
#5
Epoxy resin
9003-36-5
9.60
11.86
118,634
#6
SiO2 Glass Cloth
65997-17-3
5.88
7.27
72,681
26.94
33.30
333,036
32.69
40.41
404,113
Subtotal
Mold
Compound
#1
Silica (fused)
60676-86-0
#2
Carbon Black
1333-86-4
0.10
0.12
1,189
#3
Epoxy Resin
5.33
6.58
65,847
#4
Phosphoric Organic Catalyst
0.12
0.14
1,426
#5
Metal Oxides
0.23
0.29
2,853
38.46
47.54
475,427
Subtotal
External Plating
Amount
(ppm)
#1
Tin
7440-31-5
7.67
9.48
94,794
#2
Silver
7440-22-4
0.24
0.29
2,947
#3
Copper
7440-50-8
0.04
0.05
491
7.95
9.82
98,232
80.89
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-45
Chapter 2 Package Materials
Material Declaration Data Sheet: VBN 048 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
48-ball FBGA, Pb-free
10 mm x 6 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBN 048
98 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
Unit Weight
(mg)
Unit Weight/
package (%)
Amount
(ppm)
7440-21-3
12.48
12.70
126,965
12.48
12.70
126,965
0.45
0.45
4,548
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
4,548
1,874
0.15
0.15
1,533
0.33
0.34
3,407
BrominatedEpoxy Resin
1.82
1.85
18,513
#2
Copper
7440-50-8
12.10
12.30
123,039
#3
Gold
7440-57-5
0.19
0.19
1,908
#4
Nickel
7440-02-0
0.87
0.88
8,799
#5
Epoxy Resin
10.33
10.51
105,123
#6
Silica
14808-60-7
1.54
1.57
15,665
#7
SiO2 Glass Cloth
65997-17-3
6.72
6.84
68,355
33.56
34.14
341,403
#1
Silica (fused)
60676-86-0
38.53
39.19
391,922
#2
Carbon Black
1333-86-4
0.09
0.09
886
#3
Epoxy Resin
4.70
4.78
47,828
#4
Phosphoric Organic Catalyst
0.22
0.22
2,214
43.54
44.28
442,849
#1
Tin
7440-31-5
7.67
7.80
77,999
#2
Silver
7440-22-4
0.24
0.24
2,425
#3
Copper
7440-50-8
0.04
0.04
404
Subtotal
External Plating
0.45
0.19
#1
Subtotal
Mold
Compound
0.45
0.18
Subtotal
TOTAL PACKAGE WEIGHT
7.95
8.08
80,828
98.31
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-46
Chapter 2 Package Materials
Material Declaration Data Sheet: FBE 063 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
63-ball FBGA, Pb-free
11 mm x 12 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
FBE 063
239 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
Unit Weight
(mg)
Unit Weight/
package (%)
Amount
(ppm)
7440-21-3
48.36
20.28
202,759
48.36
20.28
202,759
0.69
0.29
2,894
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
2,894
1,186
0.23
0.10
970
0.51
0.22
2,156
#1
Brominated Epoxy Resin
8.01
3.36
33,576
Copper
7440-50-8
6.77
2.84
28,365
#3
Gold
7440-57-5
0.072
0.03
300
#4
Nickel
7440-02-0
0.33
0.14
1,383
#5
Epoxy Resin
26.05
10.92
109,214
#6
Silica
14808-60-7
6.78
2.84
28,410
#7
SiO2 Glass Cloth
65997-17-3
29.57
12.40
123,972
77.57
32.52
325,220
#1
Silica (fused)
60676-86-0
92.75
38.89
388,900
#2
Carbon Black
1333-86-4
0.21
0.09
879
#3
Epoxy Resin
11.32
4.75
47,459
#4
Phosphoric Organic Catalyst
0.52
0.22
2,197
104.81
43.94
439,435
#1
Tin
7440-31-5
6.34
2.66
26,574
#2
Silver
7440-22-4
0.20
0.08
826
#3
Copper
7440-50-8
0.033
0.01
138
Subtotal
External Plating
0.29
0.12
#2
Subtotal
Mold
Compound
0.69
0.28
Subtotal
TOTAL PACKAGE WEIGHT
6.57
2.75
27,537
238.51
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-47
Chapter 2 Package Materials
Material Declaration Data Sheet: VDD 064 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball FBGA, Pb-free
8 mm x 9.2 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VDD 064
110 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
19.03
17.33
173,294
19.03
17.33
173,294
0.64
0.58
5,809
0.64
0.58
5,809
0.22
0.20
1,969
0.18
0.16
1,611
0.39
0.36
3,580
BrominatedEpoxy Resin
2.23
2.03
20,335
#2
Copper
7440-50-8
8.92
8.13
81,270
#3
Gold
7440-57-5
0.05
0.05
470
#4
Nickel
7440-02-0
0.28
0.26
2,560
#5
Epoxy Resin
11.10
10.11
101,059
#6
Silica
14808-60-7
1.89
1.72
17,207
#7
SiO2 Glass Cloth
65997-17-3
8.24
7.51
75,083
32.71
29.80
297,983
#1
Silica (fused)
60676-86-0
44.59
40.61
406,119
#2
Carbon Black
1333-86-4
0.10
0.09
918
#3
Epoxy Resin
5.44
4.96
49,560
#4
Phosphoric Organic Catalyst
0.25
0.23
2,294
50.38
45.89
458,892
#1
Tin
7440-31-5
6.52
5.94
59,385
#2
Silver
7440-22-4
0.08
0.07
725
#3
Copper
7440-50-8
0.03
0.03
302
#4
Nickel
7440-02-0
0.003
0.003
30
6.64
6.04
60,443
109.79
100.00
1,000,000
Subtotal
External Plating
Amount
(ppm)
#1
Subtotal
Mold
Compound
Unit Weight Unit Weight/
(mg)
package (%)
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-48
Chapter 2 Package Materials
Material Declaration Data Sheet: VDD 064 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
64-ball FBGA, Pb-free
8 mm x 9.2 mm
Compliant
3
Package Code:
Weight of Unit Package:
Temperature Rating:
CAS
Number
Unit Weight Unit Weight/
(mg)
package (%)
MSL:
VDD 064
110 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
7440-21-3
19.03
17.39
173,945
19.03
17.39
173,945
7440-57-5
0.22
0.20
1,970
2023568
0.004
0.003
34
0.22
0.20
2,004
0.22
0.20
2,013
0.18
0.16
1,647
0.40
0.37
3,661
2.23
2.04
20,411
Subtotal
Bond Wire
#1
Copper
#2
Palladium
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
#1
Brominated Epoxy Resin
#2
Copper
7440-50-8
8.92
8.16
81,575
#3
Gold
7440-57-5
0.05
0.05
471
#4
Nickel
7440-02-0
#5
Epoxy Resin
#6
Silica
#7
SiO2 Glass Cloth
#1
9002-84-0
Subtotal
Substrate
0.28
0.26
2,569
11.10
10.14
101,439
14808-60-7
1.89
1.73
17,271
65997-17-3
8.24
7.54
75,365
32.71
29.91
299,103
Silica (fused)
60676-86-0
44.59
40.76
407,646
#2
Carbon Black
1333-86-4
0.10
0.09
921
#3
Epoxy Resin
5.44
4.97
49,747
#4
Phosphoric Organic Catalyst
Subtotal
Mold
Compound
Subtotal
External Plating
Amount
(ppm)
0.25
0.23
2,303
50.38
46.06
460,617
#1
Tin
7440-31-5
6.52
5.96
59,609
#2
Silver
7440-22-4
0.08
0.07
728
#3
Copper
7440-50-8
0.03
0.03
303
#4
Nickel
7440-02-0
0.003
0.003
30
6.64
6.07
60,670
109.38
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-49
Chapter 2 Package Materials
Material Declaration Data Sheet: VBH 084 (Pb-free) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
84-ball FBGA, Pb-free
11.6 mm x 8 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBH 084
144 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
20.38
14.18
141,824
20.38
14.18
141,824
0.70
0.49
4,884
0.70
0.49
4,884
0.23
0.16
1,615
0.19
0.13
1,322
0.42
0.29
2,937
#1
Brominated Epoxy Resin
2.81
1.96
19,592
Copper
7440-50-8
8.98
6.25
62,501
#3
Gold
7440-57-5
0.19
0.13
1,346
#4
Nickel
7440-02-0
0.89
0.62
6,208
#5
Epoxy Resin
15.96
11.11
111,115
#6
Silica
14808-60-7
2.38
1.66
16,578
#7
SiO2 Glass Cloth
65997-17-3
10.39
7.23
72,339
41.62
28.97
289,679
#1
Silica (fused)
60676-86-0
58.99
41.05
410,544
#2
Carbon Black
1333-86-4
0.13
0.09
928
#3
Epoxy Resin
7.20
5.01
50,100
#4
Phosphoric Organic Catalyst
0.33
0.23
2,319
66.65
46.39
463,892
#1
Tin
7440-31-5
13.42
9.34
93,397
#2
Silver
7440-22-4
0.42
0.29
2,904
#3
Copper
7440-50-8
0.07
0.05
484
Subtotal
External Plating
Amount
(ppm)
#2
Subtotal
Mold
Compound
Unit Weight Unit Weight/
(mg)
package (%)
Subtotal
TOTAL PACKAGE WEIGHT
13.91
9.68
96,785
143.68
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-50
Chapter 2 Package Materials
Material Declaration Data Sheet: VBH 084 (Pb-free, Low Halogen) Gold Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
84-ball FBGA, Pb-free, Low Halogen
11.6 mm x 8 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBH 084
145 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
Unit Weight
(mg)
Unit Weight/
package (%)
Amount
(ppm)
7440-21-3
20.38
14.01
140,098
20.38
14.01
140,098
0.70
0.48
4,824
Subtotal
Bond Wire
#1
Gold
7440-57-5
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
Subtotal
9002-84-0
Subtotal
Substrate
4,824
1,596
0.19
0.13
1,306
0.42
0.29
2,901
5.55
3.82
38,154
Aluminum Hydroxide
21645-51-2
#2
Copper
7440-50-8
8.98
6.17
61,740
#3
Gold
7440-57-5
0.19
0.13
1,330
#4
Nickel
7440-02-0
0.89
0.61
6,133
#5
Epoxy Resin
16.98
11.67
116,717
#6
SiO2 Glass Cloth
65997-17-3
10.89
7.48
74,840
43.48
29.89
298,912
#1
Silica (fused)
60676-86-0
58.99
40.55
405,546
#2
Carbon Black
1333-86-4
0.13
0.09
916
#3
Epoxy Resin
7.20
4.95
49,490
#4
Phosphoric Organic Catalyst
0.33
0.23
2,291
66.65
45.82
458,244
Subtotal
External Plating
0.48
0.16
#1
Subtotal
Mold
Compound
0.70
0.23
#1
Tin
7440-31-5
13.61
9.36
93,596
#2
Silver
7440-22-4
0.14
0.10
950
#3
Copper
7440-50-8
Subtotal
TOTAL PACKAGE WEIGHT
0.07
0.05
475
13.82
9.50
95,021
145.45
100.00
1,000,000
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-51
Chapter 2 Package Materials
Material Declaration Data Sheet: VBH 084 (Pb-free) Copper Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
84-ball FBGA, Pb-free
11.6 mm x 8 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBH 084
143 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
#1
Copper
#2
Palladium
14.22
142,172
20.38
14.22
142,172
7440-50-8
0.34
0.24
2,400
7440-05-3
0.01
0.00
42
0.35
0.24
2,442
0.23
0.16
1,619
0.19
0.13
1,325
0.42
0.29
2,944
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
9002-84-0
Subtotal
Substrate
#1
Brominated Epoxy Resin
2.81
1.96
19,640
#2
Copper
7440-50-8
8.98
6.27
62,654
#3
Gold
7440-57-5
0.19
0.13
1,350
#4
Nickel
7440-02-0
0.89
0.62
6,223
#5
Epoxy Resin
15.96
11.14
111,388
#6
Silica
14808-60-7
2.38
1.66
16,618
#7
SiO2 Glass Cloth
65997-17-3
10.39
7.25
72,516
41.62
29.04
290,390
Subtotal
Mold
Compound
#1
Silica (fused)
60676-86-0
58.99
41.16
411,552
#2
Carbon Black
1333-86-4
0.13
0.09
930
#3
Epoxy Resin
7.20
5.02
50,223
#4
Phosphoric Organic Catalyst
0.33
0.23
2,325
66.65
46.50
465,030
Subtotal
External Plating
Amount
(ppm)
20.38
Subtotal
Bond Wire
Unit Weight Unit Weight/
(mg)
package (%)
#1
Tin
7440-31-5
13.42
9.36
93,626
#2
Silver
7440-22-4
0.42
0.29
2,911
#3
Copper
7440-50-8
0.07
0.05
485
13.91
9.70
97,022
143.33
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-52
Chapter 2 Package Materials
Material Declaration Data Sheet: VBH 084 (Pb-free, Low Halogen) Copper
Wire
Company Name:
Contact Name and Address:
Package Type:
Dimension:
RoHS:
Spansion, Inc.
[email protected]
84-ball FBGA, Pb-free, Low Halogen
11.6 mm x 8 mm
Compliant
MSL:
3
Package Code:
Weight of Unit Package:
Temperature Rating:
VBH 084
145 mg
260°C
Package Chemistry Substances Analysis Table
Description
Silicon Die
Chemicals Present
#1
Silicon
CAS
Number
7440-21-3
#1
Copper
#2
Palladium
14.04
140,437
20.38
14.04
140,437
7440-50-8
0.34
0.24
2,371
7440-05-3
0.006
0.004
41
0.35
0.24
2,412
0.23
0.16
1,600
0.19
0.13
1,309
0.42
0.29
2,908
Subtotal
Die Attach
#1
Epoxy Resin
#2
Polytetrafluoroethylene
9002-84-0
Subtotal
Substrate
#1
Aluminum Hydroxide
21645-51-2
5.55
3.82
38,246
#2
Copper
7440-50-8
8.98
6.19
61,890
#3
Gold
7440-57-5
0.19
0.13
1,333
#4
Nickel
7440-02-0
0.89
0.61
6,148
#5
Epoxy Resin
16.98
11.70
116,999
#6
SiO2 Glass Cloth
65997-17-3
10.89
7.50
75,021
43.48
29.96
299,637
406,529
Subtotal
Mold
Compound
#1
Silica (fused)
60676-86-0
58.99
40.65
#2
Carbon Black
1333-86-4
0.13
0.09
919
#3
Epoxy Resin
7.20
4.96
49,610
#4
Phosphoric Organic Catalyst
0.33
0.23
2,297
66.65
45.94
459,354
Subtotal
External Plating
Amount
(ppm)
20.38
Subtotal
Bond Wire
Unit Weight Unit Weight/
(mg)
package (%)
#1
Tin
7440-31-5
13.61
9.38
93,823
#2
Silver
7440-22-4
0.14
0.10
953
#3
Copper
7440-50-8
0.07
0.05
476
13.82
9.53
95,251
145.10
100.00
1,000,000
Subtotal
TOTAL PACKAGE WEIGHT
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-53
Chapter 2 Package Materials
Material Declaration Data Sheet: Known Good Wafer
Company Name:
Contact Name and Address:
Spansion, Inc.
[email protected]
Package Name: Integrated Circuit, Flash Memory
Thickness:
> 725 μm
Package Type:
Known Good Wafer
Materials and Substances
Material /Substance
Silicon
Silicon Nitride
Arsenic
Aluminum
Concentration
(ppm, μg/g)
Concentration
(wt%)
> 996,000
> 99.60
< 2,600
< 0.26
< 4.0
< 0.00040
< 1,100
< 0.11
Note: In general, two decimal values are shown. However, some variance remains from package to package. The mass values presented are thought to be accurate to within 20 percent. The report does not include materials not intentionally added to our products
(impurities), or material concentrations less than 1 ppm.
Packages and Packing Methodologies Handbook
27 January 2015
2-54