03026

REVISIONS
LTR
DESCRIPTION
Add pure tin, manufacturer eligibility, and high
power pulse paragraphs. Removal of the short
time overload test. Manufacturer requested
changes. Editorial changes throughout.
A
DATE
APPROVED
28 MAR 2014
M. Radecki
CURRENT DESIGN ACTIVITY CAGE CODE 037Z3
HAS CHANGED NAMES TO:
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.100
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PMIC N/A
Original date of
drawing
17 December 2004
PREPARED BY
Andrew R. Ernst
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OH
CHECKED BY
Andrew R. Ernst
TITLE
RESISTOR, CHIP, FIXED, FILM,
APPROVED BY
Kendall A. Cottongim
SIZE
A
REV
AMSC N/A
CODE IDENT. NO.
HIGH VOLTAGE, STYLE 2010
DWG NO.
037Z3
A
03026
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5905-2011-E27
1. SCOPE
1.1 Scope. This drawing describes the requirements for a high voltage, fixed, film, chip resistor, style 2010.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
03026

Drawing
number
****


Resistance value
(see 3.3.2)
*


Tolerance
(see 3.3.3)
*


Termination
(see 3.3.8)
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of
this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-55342
-
Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space
Level, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-690
MIL-STD-790
*
*
-
Failure Rate Sampling Plans and Procedures.
Standard Practice for Established Reliability and High Reliability Qualified Products List
(QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications.
(Copies of these documents are available online at http://quicksearch.dla.mil.)
2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of
this document and the references cited herein (except for related, specification sheets), the text of this document takes
precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption
has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be as specified herein.
3.2 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342
and herein (see figure 1). Passivation is not applicable, however, a protective coating over the element shall be provided.
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Inch
0.200
±0.006
L
mm
5.080
±0.152
Inch
0.100
±0.006
W
mm
2.540
±0.152
T (max)
Inch
mm
0.025
0.635
±0.002 ±0.051
Inch
0.025
max.
D
mm
0.635
max.
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. The pictorial view of the styles above is given as representative of the envelope of the item. Slight deviations from
the outline shown, which are contained within the envelope and do not alter the functional aspects of the device,
are acceptable.
FIGURE 1. Chip resistor.
3.3 Electrical characteristics.
3.3.1 Resistance. The nominal resistance expressed in ohms is identified by four characters, consisting of three digits
and a letter. The letter is used simultaneously as a decimal point and as a multiplier. For resistance values:
a. Greater than or equal to 6 megohm but less than 1 gigohms, the letter "M" is used to represent a decimal point.
b. Greater than or equal to 1 gigohm but less than 35 gigohms, the letter "G" is used to represent a decimal point.
All digits preceding and following the letters (M or G) of the group represent significant figures. The resistance value
designations are shown in table I. Minimum and maximum resistance values shall be as specified herein (see table II).
The resistance values for tolerances F, G, J, and K may be any value within the limits specified herein. Resistance values
not listed in the "10 to 100" decade table of MIL-PRF-55342 for the appropriate resistance tolerance shall be considered
as not conforming to the specification. The standard values for every decade shall follow the sequence demonstrated for
the "10 to 100" decade table specified in MIL-PRF-55342.
3.3.2 Resistance range. The resistance range shall be from 6 Megohms to 35 Gigohms.
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TABLE I. Designation of resistance values.
Designation
6M00
10M0
100M
1G00
10G0
to
to
to
to
to
9M99
99M9
999M
9G99
35G0
Resistance ohms
incl.
incl.
incl.
incl.
incl.
6,000,000 to
9,999,999 incl.
10,000,000 to
99,999,999 incl.
100,000,000 to
999,999,999 incl.
1,000,000,000 to 9,999,999,999 incl.
10,000,000,000, to 35,000,000,000, incl.
3.3.3 Resistance tolerance. Resistors are available in resistance tolerances as specified in table II.
TABLE II. Resistance tolerance.
Symbol
F
G
J
K
Resistance
tolerance percent
±1.0
±2.0
±5.0
±10.0
3.3.4 Power rating. The power rating for chip resistors shall be .500 watt at +70°C derated to +150°C at zero power
(see figure 2).
3.3.5 Voltage rating. The maximum continuous working voltage shall not exceed 2000 volts. Voltage derating should
be applied if low pressure or high humidity is encounter.
*
3.3.6 Resistance temperature coefficient. The resistance temperature coefficient shall be ±100 ppm/°C. For resistance
values greater than 1 gigohm the resistance temperature coefficient shall be ±300 ppm/°C.
3.3.7 Operating temperature. The operating temperature shall be -25°C to +150°C.
3.3.8 Termination. The termination material shall be in accordance with MIL-PRF-55342, code letter B, C, G, and U.
FIGURE 2. Derating curve.
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*
3.3.9 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin
content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3
percent lead, by mass (see 6.4).
3.4 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified
tolerance of the nominal resistance.
*
3.5 Thermal shock. When resistors are tested as specified in 4.7, the thermal shock change in resistance shall not
exceed ±0.5 percent +0.01 ohm.
*
3.6 Low temperature operation. When resistors are tested as specified in 4.9, the low temperature operation
change in resistance shall not exceed ±.5 percent +0.01 ohm for ohmic values ≤ 6 gigohms, and ±2.0 percent +0.01 ohm
for ohmic values > 6 gigohm to ≤ 35 gigohms.
*
3.7 Resistance to solder heat. When resistors are tested as specified in 4.10, the resistance to bonding exposure
change in resistance shall not exceed ±0.5 percent +0.01 ohm.
3.8 Resistance temperature characteristic. When resistors are tested as specified in 4.11, the RTC shall not exceed the
values specified (see 3.3.6).
3.9 Moisture resistance. When resistors are tested as specified in 4.12, the moisture resistance change in
resistance shall not exceed ±0.5 percent +0.01 ohm.
3.10 High temperature exposure. When resistors are tested as specified in 4.13 the high temperature exposure
change in resistance shall not exceed ±0.5 percent +0.01 ohm.
*
*
3.11 Life. When resistors are tested as specified in 4.14, the life change in resistance shall not exceed ±5.0 percent
+0.01 ohm for ohmic values ≤ 6 gigohms, and ±10.0 percent +0.01 ohm for ohmic values > 6 gigohm to ≤ 35 gigohms.
3.12 Solderability. The requirement for solderability shall be as specified in 4.8 and 4.4.1.1.3.
3.13 Marking. Marking is not required on this resistor; however, each waffle pack shall be marked with the PIN
assigned herein (see 1.2), the manufacturer’s identification code, the date code, and the lot code. At the option of the
manufacturer, the resistor may be marked (i.e., laser, color dot, etc.). The marking shall remain legible after all tests.
3.14 Recycled, recovered, environmentally preferable, or biobased materials. Recycled, recovered, environmentally
preferable or biobased materials should be used to the maximum extent possible provided that the material meets or
exceeds the operational and maintenance requirements and promotes economically advantageous life cycle costs.
*
3.15 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed
on the MIL-PRF-55342 Qualified Products List for at least one part, or perform the group A and group B inspections
specified herein on a sample agreed upon by the manufacturer and DLA Land and Maritime-VAT.
*
3.15.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an
approved source of supply.
3.16 Workmanship. Resistors shall be processed in such a manner as to be uniform in quality and be free from defects
that will affect life, serviceability, or appearance.
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4. VERIFICATION
4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in
accordance with MIL-STD-790 is not applicable to this document.
4.2 Qualification inspection. Qualification inspection is not applicable to this document.
4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 and MIL-STD-690 is not
applicable to this document.
4.4 Conformance inspection.
4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of groups A and B inspections.
4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table III, and shall be made
on the same set of sample units, in the order shown. Part per million testing and verification as specified in
MIL-PRF-55342 is not applicable to this document.
TABLE III. Group A inspection.
*
Inspection
Subgroup I
Thermal shock
DC resistance
Subgroup II
Visual inspection
Subgroup III
Solderability
Requirement
paragraph
Method
paragraph
3.5
3.4
4.7
4.6
3.2, 3.13, 3.16
4.5
3.12
4.8
Sampling
procedure
100 percent
13 samples,
0 failures
5 samples
0 failures
4.4.1.1.1 Subgroup I. Subgroup I tests shall be performed on 100 percent of the product supplied under this document.
Resistors that are out of resistance tolerance, or which experience a change in resistance greater than that permitted for
the tests of this subgroup shall be removed from the lot. Lots having more than 5 percent total rejects, due to exceeding
the specified resistance tolerance change limit shall not be furnished on contracts.
4.4.1.1.2 Subgroup II. A sample of 13 parts shall be randomly selected, if one or more defects are found, the lot shall
be rescreened and defects removed. A new sample of 13 parts shall then be randomly selected. If one or more defects
are found in this second sample, the lot shall be rejected and shall not be supplied against this document.
4.4.1.1.3 Subgroup III. A sample of five parts shall be randomly selected, if one or more defects are found, the lot shall
be rejected/rescreened in accordance with MIL-PRF-55342.
4.4.1.2 Group B inspection. Group B inspection shall consist of the inspections specified in table IV, and shall be made
on the same set of sample units, in the order shown.
4.4.1.2.1 Certification. The procuring activity may accept a certificate of compliance in lieu of group B inspection (see
6.2d).
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4.4.1.2.2 Action in case of failure. If any of the subgroups fail the group B inspection and an appropriate lot screen can
be established, the lot shall be screened and a new set of samples (see table IV) from the screened lot, shall be submitted
to the subgroup that failed. If one or more defects are found in the resubmitted samples, the lot shall be rejected and shall
not be supplied to this specification.
4.4.1.2.3 Disposition of sample units. Sample units which have been subjected to group B inspections shall not be
supplied to this specification.
*
TABLE IV. Group B inspection.
Inspection
Subgroup I
Life
Subgroup II
Thermal shock
Low temperature operation
Subgroup III
Resistance to soldering heat
Resistance temperature characteristic
Moisture resistance
Subgroup IV
High temperature exposure
Requirement
paragraph
Method
paragraph
3.11
4.14
Sampling
procedure
10 samples,
0 failures
3.5
3.6
4.7
4.9
30 samples,
0 failures
3.7
3.8
3.9
4.10
4.11
4.12
30 samples,
0 failures
3.10
4.13
30 samples
0 failures
4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction,
physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342.
4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342.
4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342.
*
4.8 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342 and 4.4.1.1.3 herein.
a. Coating durability: 1 hour ±5 minutes steam aging.
4.9 Low temperature operation. Low temperature operation shall be tested in accordance with MIL-PRF-55342.
4.10 Resistance to soldering heat. Resistance to soldering heat shall be tested in accordance with MIL-PRF-55342.
4.11 Resistance temperature characteristic. Resistance temperature characteristic shall be tested in accordance with
MIL-PRF-55342.
4.12 Moisture resistance. Moisture resistance shall be tested in accordance with MIL-PRF-55342.
4.13 High temperature exposure. High temperature exposure shall be tested in accordance with MIL-PRF-55342.
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*
4.14 Life. Life shall be tested in accordance with MIL-PRF-55342 with the following exception.
a. Test condition: One thousand hours elapsed time for inspection with all samples.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see
6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to
contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained
by the Inventory Control Point's packaging activity within the Military Department or Defense Agency, or within the military
service’s system commands. Packaging data retrieval is available from the managing Military Department's or Defense
Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. Chip resistors are intended to be used in thick or thin film circuits where microcircuity is intended,
also, for use in surface mounting application.
6.2 Ordering data. The contract or purchase order should specify the following:
a. Complete PIN (see 1.2).
b. Requirements for delivery: One copy of the conformance inspection data or a certificate of compliance that
parts have passed conformance inspection with each shipment of parts by the manufacturer.
c. Packaging requirements (see 5.1). (i.e. Electrostatic discharge sensitive packaging).
d. Whether the manufacturer performs the group B tests or provides certificate of compliance with group B
(see 4.4.1.2.1).
6.3 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged, by
electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shipping
resistors. Direct shipment to Government is controlled by MIL-DTL-39032 that specifies a preventative packaging
procedure.
*
6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker
growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can
develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a
whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to
inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification
for Electrodeposited Coatings of Tin).
*
6.5 Pulse applications. Designers are CAUTIONED on using the above resistors in high power pulse applications.
Since they have not been qualified nor tested for such applications, damage and premature failure are possible.
*
6.6 User of record. Coordination of this document for future revisions is coordinated only with the approved source of
supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be
achieved online at [email protected] or in writing to: DLA Land and Maritime-VAT, Post Office Box 3990, Columbus, OH
43218-3990 or by telephone (614) 692-0552 or DSN 850-0552.
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*
6.7 Approved source of supply. Approved source of supply is listed herein. Additional sources will be added as they
become available. Assistance in the use of this drawing may be obtained online at [email protected] or contact
DLA Land and Maritime-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN
850-0552.
DLA Land and Maritime
drawing PIN
Vendor similar
designation or type
number 1/
Vendor
CAGE
CRHVTCX* (2010)
91637
Vendor name
and address
Vishay Techno
1122 23rd St.
Columbus, NE 68601
1/ Parts must be purchased to the DLA Land and Maritime PIN to assure all performance requirements
and tests are met.
03026-******
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