Multilayer ceramic c chip capacitors s Sofft-termination MLCCs M with X8 8R therm mal cha aracteristics for automo otive ap pplicatio ons • Su uitable for harsh environmental co onditions fro om -55 °C up to +150 ºC C • Efffective prote ection again nst solder ccracks, flex cracks, and d damage frrom vibratio ons and shocks MLCCs for automotive a applications a s • Brroadest lineup of crack--resistant M • Qu ualified to AEC-Q200 A May 26, 2015 TDK Corporation announce es the introd duction of high h temperature resisttant MLCCs s with soft tterminationss, expandin ng the CGA series of MLCCs M for automotive a aapplications s. These comp ponents em mploy electro odes made of conductive resins th hat provide effective prrotection again nst solder cracks c caused by therm mal cycling, flex cracks caused by stress to th he PCB, and d damage due to vibratio ons and sho ocks. In add dition, the new CGA seeries of MLC CCs emplloy an X8R dielectric material m and d are thus able offer sta able capacittance value es 5 °C to +15 (±15 percent) att temperatures from -55 50 °C. The new compo onents are available a in package sizes of IEC 1005 (EIA 00402) to IEC C 3225 (EIA 1210) and offer rated capacitance es ranging from 150 pF F to 10 µF aand rated voltages from 16 V to 100 0 V. The ne ew series in clude the world’s w only X8R soft-teermination MLCC M in an IE EC 1005 package*. Thu us, TDK offfers the broa adest lineup p of crack-re resistant ML LCCs desig gned for demanding au utomotive a applications.. These com mponents a re especially suitable for E ECUs used in high tem mperature en nvironments s such as engine comppartments and a where spacce is at a pre emium as well w as for u se in smoothing and decoupling ccircuits. Mas ss production of the new MLC CCs, which a are qualified d to AEC-Q Q200, will staart in June 2015. Mode ern cars inccreasingly re ely on electtronic systems and imp plement elecctric operattion, which has lled to a drastic increas se in the num mber of electronic com mponents fo und in such h vehicles. At the same time, there is a strong tre nd towards locating ele ectronic conntrol units in n the engin ne compartment or nea ar other stru uctural parts s in order to o gain moree space for passsengers. Ele ectronic com mponents ussed for such applicatio ons must bee able to witthstand high temperaturres and severe vibratio ons. The new w MLCCs retain all thee advantage es of existting soft-term mination pro oducts and are fully co ompliant with the industtry's most stringent s X8R specificatio ons. * As o of April 2015, according to TDK T investiga ations ----sary Gloss • X8 8R temperatu ure characterristics: Dielecctric material with ±15 pe ercent changge in capacita ance in the tem mperature ra ange from -55 5°C to +150°°C TDK C Corporation 1/ 3 • Fle ex cracks: Affter MLCCs have h been so oldered to a PCB, handling processees such as bo oard splitting g, inssertion of socckets and lea aded compon nents, and sc crew-down can c cause thee PCB to bend, and the acccompanying tensile stres sses can lead d to cracks in n the MLCC itself. • So older cracks: In an environment subje ect to repeate ed and drastic changes bbetween high h and low tem mperatures, thermal t stres ss occurs in the solder se ection of com mponents duee to the diffe erent thermall expansion coeffficients of th he componen nt and the PC CB, leading to t solder craccks. ns Main application utomotive EC CUs in high te emperature e environments such as en ngine compa rtments • Au • Sm moothing circcuits and dec coupling circu uits nd benefits Main features an uitable for harsh environm mental condittions from -55 °C up to +150 ºC • Su • Hig gh resistance e against sollder cracks ccaused by the ermal cycling g, flex crackss caused by stress to the e PC CB, and damage due to vibrations v and d shocks • Wiide capacitan nce range fro om 150 pF to o 10 μF ualified to AE EC-Q200 • Qu data Key d Serie es Packa age size [IEC C] Footprin nt [mm] CGA2 2 CGA3 3 CGA4 4 CGA5 5 CGA6 6 1005 (EIA 0402) 1608 (EIA 0603) 2012 (EIA 0805) 3216 (EIA 1206) 3225 (EIA 1210) 1.0 x 0.5 5 1.6 x 0.8 8 2.0 x 1.2 25 3.2 x 1.6 6 3.2 x 2.5 5 Rated R voltag ge [V] Cap pacitance 16 to 100 1500 pF to 47 nF F 1 nnF to 470 nF 22 nF to 1 μF 1000 nF to 4.7 μF 4700 nF to 10 μF F ----ut TDK Corp poration Abou TDK Corporation is a leading electronics ccompany bas sed in Tokyo o, Japan. It w was establish hed in 1935 to com mmercialize ferrite, a key y material in electronic an nd magnetic products. TD DK's portfolio o includes electrronic components, modules and syste ems* marketted under the e product braands TDK an nd EPCOS, powe er supplies, magnetic m app plication prod ducts as well as energy devices, d flashh memory ap pplication devicces, and othe ers. TDK focu uses on dem manding mark kets in the arreas of inform mation and comm munication te echnology an nd consumerr, automotive e and industrial electroniccs. The comp pany has a netwo ork of design n and manufa acturing loca ations and sa ales offices in n Asia, Europpe, and in No orth and South h America. In n fiscal 2015, TDK posted d total sales of USD 9.0 billion and em mployed abo out 88,000 people worldwide e. * The product portfo olio includes ceramic, c alumiinum electroly ytic and film ca apacitors, ferrittes, inductors, highfreque ency compone ents such as surface s acousttic wave (SAW W) filter produc cts and modulles, piezo and protection compo onents, and sensors. ----ad this text an nd associate ed images fro om You ccan downloa www.global.tdk.co om/news_ce enter/press/2 20150526182 26.htm. ----TDK C Corporation 2/ 3 Conttacts for reg gional media a Regio on Contact Japan n Mr. Akirra TESHIMA ASEA AN Ms. Jian ng MAN Mr. Sho ota KANZAKI Greate er China a Ms. Clover XU Europ pe Mr. Fran nk TRAMPNAU U Ameriica Ms. Sarra M. LAMBETH TDK C Corporation TDK Corpo oration Tokyo, Jap pan TDK Singa apore (Pte) Ltd d. Singapore e TDK China a Co., Ltd. Shanghai, China TDK Europ pe GmbH Duesseldo orf, Germany TDK Corpo oration of Ame erica Irving, TX, USA Phone Mail +813 6852-7102 [email protected] m +65 6273 5022 asean.inquiry@ @sg.tdk.com +86 21 61962307 [email protected] m +49 211 9077 127 [email protected] m +1 972-409-4519 sara.lambeth@ @us.tdk.com 3/ 3