Press release (pdf: 102.9 KB; )

Multilayer ceramic
c
chip capacitors
s
Sofft-termination MLCCs
M
with X8
8R therm
mal cha
aracteristics
for automo
otive ap
pplicatio
ons
• Su
uitable for harsh environmental co
onditions fro
om -55 °C up to +150 ºC
C
• Efffective prote
ection again
nst solder ccracks, flex cracks, and
d damage frrom vibratio
ons and
shocks
MLCCs for automotive
a
applications
a
s
• Brroadest lineup of crack--resistant M
• Qu
ualified to AEC-Q200
A
May 26, 2015
TDK Corporation announce
es the introd
duction of high
h
temperature resisttant MLCCs
s with
soft tterminationss, expandin
ng the CGA series of MLCCs
M
for automotive
a
aapplications
s. These
comp
ponents em
mploy electro
odes made of conductive resins th
hat provide effective prrotection
again
nst solder cracks
c
caused by therm
mal cycling, flex cracks caused by stress to th
he PCB,
and d
damage due to vibratio
ons and sho
ocks. In add
dition, the new CGA seeries of MLC
CCs
emplloy an X8R dielectric material
m
and
d are thus able offer sta
able capacittance value
es
5 °C to +15
(±15 percent) att temperatures from -55
50 °C.
The new compo
onents are available
a
in package sizes of IEC 1005 (EIA 00402) to IEC
C 3225
(EIA 1210) and offer rated capacitance
es ranging from 150 pF
F to 10 µF aand rated voltages
from 16 V to 100
0 V. The ne
ew series in clude the world’s
w
only X8R soft-teermination MLCC
M
in
an IE
EC 1005 package*. Thu
us, TDK offfers the broa
adest lineup
p of crack-re
resistant ML
LCCs
desig
gned for demanding au
utomotive a
applications.. These com
mponents a re especially suitable
for E
ECUs used in high tem
mperature en
nvironments
s such as engine comppartments and
a where
spacce is at a pre
emium as well
w as for u se in smoothing and decoupling ccircuits. Mas
ss
production of the new MLC
CCs, which a
are qualified
d to AEC-Q
Q200, will staart in June 2015.
Mode
ern cars inccreasingly re
ely on electtronic systems and imp
plement elecctric operattion, which
has lled to a drastic increas
se in the num
mber of electronic com
mponents fo und in such
h vehicles.
At the same time, there is a strong tre nd towards locating ele
ectronic conntrol units in
n the
engin
ne compartment or nea
ar other stru
uctural parts
s in order to
o gain moree space for
passsengers. Ele
ectronic com
mponents ussed for such applicatio
ons must bee able to witthstand
high temperaturres and severe vibratio
ons. The new
w MLCCs retain all thee advantage
es of
existting soft-term
mination pro
oducts and are fully co
ompliant with the industtry's most stringent
s
X8R specificatio
ons.
* As o
of April 2015, according to TDK
T
investiga
ations
----sary
Gloss
• X8
8R temperatu
ure characterristics: Dielecctric material with ±15 pe
ercent changge in capacita
ance in the
tem
mperature ra
ange from -55
5°C to +150°°C
TDK C
Corporation
1/ 3
• Fle
ex cracks: Affter MLCCs have
h
been so
oldered to a PCB, handling processees such as bo
oard splitting
g,
inssertion of socckets and lea
aded compon
nents, and sc
crew-down can
c cause thee PCB to bend, and the
acccompanying tensile stres
sses can lead
d to cracks in
n the MLCC itself.
• So
older cracks: In an environment subje
ect to repeate
ed and drastic changes bbetween high
h and low
tem
mperatures, thermal
t
stres
ss occurs in the solder se
ection of com
mponents duee to the diffe
erent thermall
expansion coeffficients of th
he componen
nt and the PC
CB, leading to
t solder craccks.
ns
Main application
utomotive EC
CUs in high te
emperature e
environments such as en
ngine compa rtments
• Au
• Sm
moothing circcuits and dec
coupling circu
uits
nd benefits
Main features an
uitable for harsh environm
mental condittions from -55 °C up to +150 ºC
• Su
• Hig
gh resistance
e against sollder cracks ccaused by the
ermal cycling
g, flex crackss caused by stress to the
e
PC
CB, and damage due to vibrations
v
and
d shocks
• Wiide capacitan
nce range fro
om 150 pF to
o 10 μF
ualified to AE
EC-Q200
• Qu
data
Key d
Serie
es
Packa
age size [IEC
C]
Footprin
nt [mm]
CGA2
2
CGA3
3
CGA4
4
CGA5
5
CGA6
6
1005 (EIA 0402)
1608 (EIA 0603)
2012 (EIA 0805)
3216 (EIA 1206)
3225 (EIA 1210)
1.0 x 0.5
5
1.6 x 0.8
8
2.0 x 1.2
25
3.2 x 1.6
6
3.2 x 2.5
5
Rated
R
voltag
ge [V]
Cap
pacitance
16 to 100
1500 pF to 47 nF
F
1 nnF to 470 nF
22 nF to 1 μF
1000 nF to 4.7 μF
4700 nF to 10 μF
F
----ut TDK Corp
poration
Abou
TDK Corporation is a leading electronics ccompany bas
sed in Tokyo
o, Japan. It w
was establish
hed in 1935
to com
mmercialize ferrite, a key
y material in electronic an
nd magnetic products. TD
DK's portfolio
o includes
electrronic components, modules and syste
ems* marketted under the
e product braands TDK an
nd EPCOS,
powe
er supplies, magnetic
m
app
plication prod
ducts as well as energy devices,
d
flashh memory ap
pplication
devicces, and othe
ers. TDK focu
uses on dem
manding mark
kets in the arreas of inform
mation and
comm
munication te
echnology an
nd consumerr, automotive
e and industrial electroniccs. The comp
pany has a
netwo
ork of design
n and manufa
acturing loca
ations and sa
ales offices in
n Asia, Europpe, and in No
orth and
South
h America. In
n fiscal 2015, TDK posted
d total sales of USD 9.0 billion and em
mployed abo
out 88,000
people worldwide
e.
* The product portfo
olio includes ceramic,
c
alumiinum electroly
ytic and film ca
apacitors, ferrittes, inductors, highfreque
ency compone
ents such as surface
s
acousttic wave (SAW
W) filter produc
cts and modulles, piezo and protection
compo
onents, and sensors.
----ad this text an
nd associate
ed images fro
om
You ccan downloa
www.global.tdk.co
om/news_ce
enter/press/2
20150526182
26.htm.
----TDK C
Corporation
2/ 3
Conttacts for reg
gional media
a
Regio
on
Contact
Japan
n
Mr. Akirra TESHIMA
ASEA
AN
Ms. Jian
ng MAN
Mr. Sho
ota KANZAKI
Greate
er
China
a
Ms. Clover XU
Europ
pe
Mr. Fran
nk TRAMPNAU
U
Ameriica
Ms. Sarra M. LAMBETH
TDK C
Corporation
TDK Corpo
oration
Tokyo, Jap
pan
TDK Singa
apore (Pte) Ltd
d.
Singapore
e
TDK China
a Co., Ltd.
Shanghai, China
TDK Europ
pe GmbH
Duesseldo
orf, Germany
TDK Corpo
oration of Ame
erica
Irving, TX, USA
Phone
Mail
+813 6852-7102
[email protected]
m
+65 6273 5022
asean.inquiry@
@sg.tdk.com
+86 21 61962307
[email protected]
m
+49 211 9077 127
[email protected]
m
+1 972-409-4519
sara.lambeth@
@us.tdk.com
3/ 3