SKiiP 24ACC12T4V10 Absolute Maximum Ratings Symbol Conditions Values Unit IGBT 1 - 6 MiniSKiiP® 2 Twin 6-pack VCES Tj = 25 °C 1200 V IC λpaste=0.8 W/(mK) Ts = 25 °C Tj = 175 °C Ts = 70 °C 41 A 34 A IC λpaste=2.5 W/(mK) Ts = 25 °C Tj = 175 °C Ts = 70 °C 45 A ICnom ICRM ICRM = 3 x ICnom VGES VCC = 800 V VGE ≤ 15 V VCES ≤ 1200 V tpsc SKiiP 24ACC12T4V10 Features • Trench 4 IGBTs • Robust and soft freewheeling diodes in CAL technology • Highly reliable spring contacts for electrical connections • UL recognised: File no. E63532 Typical Applications* Tj A A 75 A -20 ... 20 V 10 µs -40 ... 175 °C 1200 V IGBT 7 - 12 VCES Tj = 25 °C IC λpaste=0.8 W/(mK) Ts = 25 °C Tj = 175 °C Ts = 70 °C 52 A 43 A λpaste=2.5 W/(mK) Ts = 25 °C Tj = 175 °C Ts = 70 °C 58 A 48 A 35 A ICRM = 3 x ICnom 105 A -20 ... 20 V 10 µs -40 ... 175 °C IC ICnom ICRM VGES • 4Q inverters tpsc Remarks Tj • Max. case temperature limited to TC=125°C • Product reliability results valid for Tj≤150°C (recommended Tj,op=-40...+150°C) • Terminal distances sufficient for basic insulation in 3-phase 480VAC TN systems • DC-link voltage VDC≤800V • Temperature sensor: no basic insulation to main circuit, signal processing with reference to –DC potential • Please refer to MiniSKiiP “Technical Explanations” and “Mounting Instructions” for further information Tj = 150 °C 37 25 VCC = 800 V VGE ≤ 15 V VCES ≤ 1200 V Tj = 150 °C Diode 1 - 6 VRRM Tj = 25 °C 1200 V IF λpaste=0.8 W/(mK) Ts = 25 °C Tj = 175 °C Ts = 70 °C 32 A 26 A IF λpaste=2.5 W/(mK) Ts = 25 °C Tj = 175 °C Ts = 70 °C 35 A IFnom 28 A 25 A IFRM IFRM = 3xIFnom 75 A IFSM 10 ms, sin 180°, Tj = 150 °C 100 A -40 ... 175 °C Tj Diode 7 - 12 VRRM Tj = 25 °C 1200 V IF λpaste=0.8 W/(mK) Ts = 25 °C Tj = 175 °C Ts = 70 °C 44 A 35 A λpaste=2.5 W/(mK) Ts = 25 °C Tj = 175 °C Ts = 70 °C 49 A IF IFnom IFRM IFRM = 3 x IFnom IFSM 10 ms, sin 180°, Tj = 150 °C Tj 40 A 35 A 105 A 170 A -40 ... 175 °C Module It(RMS) 20 A per spring Tstg Visol AC sinus 50 Hz, 1 min 40 A -40 ... 125 °C 2500 V ACC © by SEMIKRON Rev. 4.0 – 20.11.2015 1 SKiiP 24ACC12T4V10 Characteristics Symbol Conditions IGBT 1 - 6 VCE(sat) VCE0 MiniSKiiP® 2 Twin 6-pack chiplevel typ. max. Unit Tj = 25 °C 1.85 2.10 V Tj = 150 °C 2.25 2.45 V Tj = 25 °C 0.80 0.90 V Tj = 150 °C 0.70 0.80 V Tj = 25 °C 42 48 mΩ rCE VGE = 15 V chiplevel VGE(th) VGE = VCE V, IC = 1 mA ICES VGE = 0 V VCE = 1200 V Cies SKiiP 24ACC12T4V10 IC = 25 A VGE = 15 V chiplevel min. Coes Cres VCE = 25 V VGE = 0 V Tj = 150 °C 62 66 mΩ 5.8 6.5 V Tj = 25 °C 0.1 0.3 mA f = 1 MHz 1.43 nF f = 1 MHz 0.12 nF f = 1 MHz mA 0.09 nF QG VGE = - 8 V...+ 15 V 142 nC RGint 0.0 Ω 96 ns 400 ns 51 ns 2.6 mJ 1 K/W 0.84 K/W • 4Q inverters Rth(j-s) Tj = 25 °C VCC = 600 V Tj = 150 °C IC = 25 A Tj = 150 °C RG on = 39 Ω Tj = 150 °C RG off = 39 Ω di/dton = 250 A/µs Tj = 150 °C di/dtoff = 400 A/µs Tj = 150 °C du/dt = 3600 V/µs VGE = +15/-15 V Tj = 150 °C Ls = 22 nH per IGBT, λpaste=0.8 W/(mK) Remarks Rth(j-s) per IGBT, λpaste=2.5 W/(mK) Features • Trench 4 IGBTs • Robust and soft freewheeling diodes in CAL technology • Highly reliable spring contacts for electrical connections • UL recognised: File no. E63532 Typical Applications* • Max. case temperature limited to TC=125°C • Product reliability results valid for Tj≤150°C (recommended Tj,op=-40...+150°C) • Terminal distances sufficient for basic insulation in 3-phase 480VAC TN systems • DC-link voltage VDC≤800V • Temperature sensor: no basic insulation to main circuit, signal processing with reference to –DC potential • Please refer to MiniSKiiP “Technical Explanations” and “Mounting Instructions” for further information 5 td(on) tr Eon td(off) tf Eoff IGBT 7 - 12 IC = 35 A VCE(sat) VGE = 15 V chiplevel VCE0 chiplevel rCE VGE(th) ICES Cies Coes Cres VGE = 15 V chiplevel VCE = 25 V VGE = 0 V 1.85 2.10 V Tj = 150 °C 2.25 2.45 V Tj = 25 °C 0.80 0.90 V Tj = 150 °C 0.70 0.80 V Tj = 25 °C 30 34 mΩ Tj = 150 °C 44 47 mΩ 5.8 6.5 V Tj = 25 °C 0.1 0.3 mA - mA f = 1 MHz 1.95 nF f = 1 MHz 0.16 nF f = 1 MHz 0.12 nF 200 nC QG VGE = - 8 V...+ 15 V RGint Rth(j-s) Tj = 25 °C VCC = 600 V Tj = 150 °C IC = 35 A Tj = 150 °C RG on = 16 Ω Tj = 150 °C RG off = 16 Ω di/dton = 680 A/µs Tj = 150 °C di/dtoff = 560 A/µs Tj = 150 °C du/dt = 4000 V/µs VGE = +15/-15 V Tj = 150 °C Ls = 22 nH per IGBT, λpaste=0.8 W/(mK) Rth(j-s) per IGBT, λpaste=2.5 W/(mK) td(on) tr Eon td(off) tf Eoff ns mJ Tj = 25 °C VGE = VCE V, IC = 1 mA VGE = 0 V VCE = 1200 V 80 4.2 5 0 Ω 52 ns 34 ns 3.9 mJ 337 ns 53 ns 3.5 mJ 0.85 K/W 0.7 K/W ACC 2 Rev. 4.0 – 20.11.2015 © by SEMIKRON SKiiP 24ACC12T4V10 Characteristics Symbol Conditions Diode 1 - 6 VF = VEC VF0 rF MiniSKiiP® 2 Features • Trench 4 IGBTs • Robust and soft freewheeling diodes in CAL technology • Highly reliable spring contacts for electrical connections • UL recognised: File no. E63532 Typical Applications* • 4Q inverters Remarks • Max. case temperature limited to TC=125°C • Product reliability results valid for Tj≤150°C (recommended Tj,op=-40...+150°C) • Terminal distances sufficient for basic insulation in 3-phase 480VAC TN systems • DC-link voltage VDC≤800V • Temperature sensor: no basic insulation to main circuit, signal processing with reference to –DC potential • Please refer to MiniSKiiP “Technical Explanations” and “Mounting Instructions” for further information chiplevel max. Unit Tj = 25 °C 2.41 2.74 V Tj = 150 °C 2.45 2.79 V Tj = 25 °C 1.30 1.50 V Tj = 150 °C 0.90 1.10 V Tj = 25 °C 44 50 mΩ 62 68 mΩ 4 µC 1.4 mJ Rth(j-s) 1.52 K/W Rth(j-s) per Diode, λpaste=2.5 W/(mK) 1.31 K/W Err SKiiP 24ACC12T4V10 chiplevel typ. Tj = 150 °C IF = 25 A Tj = 150 °C di/dtoff = 380 A/µs T = 150 °C j VGE = -15 V T j = 150 °C VCC = 600 V per Diode, λpaste=0.8 W/(mK) IRRM Qrr Twin 6-pack IF = 25 A VGE = 0 V chiplevel min. Diode 7 - 12 VF = VEC IF = 35 A VGE = 0 V chiplevel VF0 chiplevel rF chiplevel 2.30 2.62 V Tj = 150 °C 2.29 2.62 V Tj = 25 °C 1.30 1.50 V Tj = 150 °C 0.90 1.10 V Tj = 25 °C 29 32 mΩ 40 43 mΩ Rth(j-s) Rth(j-s) per Diode, λpaste=2.5 W/(mK) Qrr Err A Tj = 25 °C Tj = 150 °C IF = 35 A Tj = 150 °C di/dtoff = 720 A/µs T = 150 °C j VGE = -15 V Tj = 150 °C VCC = 600 V per Diode, λpaste=0.8 W/(mK) IRRM 17 28 A 5.8 µC 2.3 mJ 1.2 K/W 1 K/W Module 30 LCE Ms to heat sink w 2 nH 2.5 Nm 55 g 1670 ± 3% Ω Temperature Sensor R100 Tr=100°C (R25=1000Ω) R(T) R(T)=1000Ω[1+A(T-25°C)+B(T-25°C)2 ], A = 7.635*10-3 °C-1, B = 1.731*10-5 °C-2 ACC © by SEMIKRON Rev. 4.0 – 20.11.2015 3 SKiiP 24ACC12T4V10 IGBT 1-6 - Fig. 1: Typ. output characteristic IGBT 1-6 - Fig. 2: Typ. rated current vs. temperature IC = f(TS) IGBT 1-6 - Fig. 3: Typ. turn-on /-off energy = f(IC) IGBT 1-6 - Fig. 4: Typ. turn-on /-off energy = f(RG) IGBT 1-6 - Fig. 5: Typ. transfer characteristic IGBT 1-6 - Fig. 6: Typ. gate charge characteristic 4 Rev. 4.0 – 20.11.2015 © by SEMIKRON SKiiP 24ACC12T4V10 IGBT 1-6 - Fig. 7: Typ. switching times vs. IC IGBT 1-6 - Fig. 8: Typ. switching times vs. gate resistor RG IGBT 1-6 - Fig. 9: Transient thermal impedance of IGBT and Diode IGBT 1-6 - Fig. 10: CAL diode forward characteristic IGBT 1-6 - Fig. 11: Typ. CAL diode peak reverse recovery current IGBT 1-6 - Fig. 12: Typ. CAL diode recovery charge © by SEMIKRON Rev. 4.0 – 20.11.2015 5 SKiiP 24ACC12T4V10 IGBT 7-12 - Fig. 1: Typ. output characteristic IGBT 7-12 - Fig. 2: Typ. rated current vs. temperature IC = f(TS) IGBT 7-12 - Fig. 3: Typ. turn-on /-off energy = f(IC) IGBT 7-12 - Fig. 4: Typ. turn-on / -off energy = f(RG) IGBT 7-12 - Fig. 5: Typ. transfer characteristic IGBT 7-12 - Fig. 6: Typ. gate charge characteristic 6 Rev. 4.0 – 20.11.2015 © by SEMIKRON SKiiP 24ACC12T4V10 IGBT 7-12 - Fig. 7: Typ. switching times vs. IC IGBT 7-12 - Fig. 8: Typ. switching times vs. gate resistor RG IGBT 7-12 - Fig. 9: Transient thermal impedance of IGBT and Diode IGBT 7-12 - Fig. 10: CAL diode forward characteristic IGBT 7-12 - Fig. 11: Typ. CAL diode peak reverse recovery current IGBT 7-12 - Fig. 12: Typ. CAL diode recovery charge © by SEMIKRON Rev. 4.0 – 20.11.2015 7 SKiiP 24ACC12T4V10 pinout, dimensions pinout 8 Rev. 4.0 – 20.11.2015 © by SEMIKRON SKiiP 24ACC12T4V10 This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, chapter IX. *IMPORTANT INFORMATION AND WARNINGS The specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes. © by SEMIKRON Rev. 4.0 – 20.11.2015 9