Assembly: ASEM Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight January, 2016 % of Total Pkg. Wt. Weight (g) Die 0.36% 0.00026 Mold 46.61% 0.03352 Die attach Wire 0.06% 0.36% 32 QFNS 0.072 Grams % of Total Pkg. Wt. Weight (g) with matte Sn Plating ICE40LP MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Die size: 1.04 x 1.07 mm 55.79% 3.17% 3.17% 1.11% 0.16% 0.03347 0.00190 0.00190 0.00067 0.00010 Silica (fused) Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 Mold Compound: Sumitomo EME-G770 75 to 95% Fused silica filler (LSC uses 88% in our calculation) 2 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 10% Phenol resin (LSC uses 5% in our calculation) 1 to 2% Metal Hydroxide (LSC uses 1.75% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation) 0.01% 0.01% 0.00% 0.04% 0.000006 0.000006 0.000002 0.00003 Epoxy Resin Phenol Resin SiO2 Filler (Meta)Acrylic Copolymer 99439-28-8 - Die attach (tape): Hitachi FH-900 HR-9004 series 15% 15% 5% 65% 0.355% 0.006% 0.00026 0.000005 Copper (Cu) Palladium (Pd) 7440-50-8 7440-05-3 Pd coated Cu - Assume 1 wire per lead 98.25% 1.75% Tin (Sn) 7440-31-5 Tin plating is 400 to 800 microinches (LSC uses 600 microinches in our calculation) Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) 7440-50-8 7439-89-6 7723-14-0 7440-66-6 C194 97.46% 2.35% 0.07% 0.12% 0.00004 0.00026 Plating 3.91% 0.00281 Leadframe 48.71% 0.03503 Notes / Assumptions: 47.48% 1.14% 0.03% 0.06% 0.03414 0.00082 0.00002 0.00004 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. D Assembly: Unisem Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] 32 QFNS Package: Total Device Weight 0.1126 Grams January, 2016 % of Total Pkg. Wt. Weight (g) Die 1.70% 0.00192 Mold 68.90% 0.07760 Die attach 0.43% % of Total Pkg. Wt. Weight (g) with matte Sn Plating PAC-POWR, PAC-CLK MSL: 1 Peak Reflow Temp: 260°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 1.80 x 1.75 x 0.254 mm 55.79% 3.17% 3.17% 1.11% 0.16% 0.03347 0.00190 0.00190 0.00067 0.00010 Silica (fused) Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 Mold Compound: Sumitomo G770 75 to 95% Fused silica filler (LSC uses 88% in our calculation) 2 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 10% Phenol resin (LSC uses 5% in our calculation) 1 to 2% Metal Hydroxide (LSC uses 1.75% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation) 0.32% 0.04% 0.06% 0.00036 0.00005 0.00007 Silver (Ag) Epoxy Resin A Organic esters and resins 7440-22-4 9003-36-5 - Die attach epoxy: Sumitomo CRM1066 series 75.00% 10.00% 15.00% 0.00048 Wire 0.38% 0.00043 Gold (Au) 7440-57-5 1.0mil diameter. Assume 1 wire per lead Plating 1.24% 0.00140 Tin (Sn) 7440-31-5 Tin plating is 400 to 800 microinches (LSC uses 600 microinches in our calculation) Leadframe 27.35% 0.03080 Copper Iron Phosphorus Zinc Silver 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 A194 97.50% 2.19% 0.08% 0.12% 0.12% 26.66% 0.60% 0.02% 0.03% 0.03% 0.03003 0.00067 0.00002 0.00004 0.00004 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. D Assembly: ASET Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight January, 2016 % of Total Pkg. Wt. Weight (g) Die 3.68% 0.0021 Mold 68.05% 0.0380 Die attach 0.64% 32 QFNS 0.056 Grams % of Total Pkg. Wt. Weight (g) with matte Sn Plating LCMXO2 MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 1.88 x 1.88 mm 5.44% 5.44% 47.63% 6.80% 2.04% 0.68% 0.0030 0.0030 0.0266 0.0038 0.0011 0.0004 Epoxy Resin Phenol Resin Silica(Amorphous) A Silica(Amorphous) B Metal Hydroxide Carbon Black 60676-86-0 7631-86-9 1333-86-4 Mold Compound: Sumitomo G631H 8.00% 8.00% 70.00% 10.00% 3.00% 1.00% 0.10% 0.10% 0.03% 0.42% 0.00005 0.00005 0.00002 0.00023 Epoxy Resin Phenol Resin SiO2 Filler (Meta)Acrylic Copolymer 99439-28-8 - Die attach (tape): Hitachi FH-900 HR-9004 series 15% 15% 5% 65% 0.0004 Wire 1.29% 0.0007 Gold (Au) 7440-57-5 Assume 1 wire per lead Plating 0.60% 0.0003 Tin (Sn) 7440-31-5 Tin plating is 400 to 800 microinches (LSC uses 600 microinches in our calculation) Leadframe 33.07% 0.0185 Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) 7440-50-8 7439-89-6 7723-14-0 7440-66-6 C194 97.46% 2.35% 0.07% 0.12% 32.23% 0.78% 0.02% 0.04% 0.01802 0.00043 0.00001 0.00002 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. D