July 1, 2013 Subject: Characterization Summary – Copper Bond Wire at ASE Taiwan SUMMARY Per PCN# 03A-13, Lattice is now offering alternate qualified material sets that support Copper bond wire (Cu-wire). This document will summarize the electrical characterization that supports that conversion. The scope of this document covers products manufactured at ASE Kaohsiung, Taiwan (ASET). METHODOLOGY The characterization plan focused on four items: 1) 2) 3) 4) Assembly Yield and Electrical Test Yield Assessment of Critical Parameters SSO (Simultaneous Switching Output) Characteristics SERDES performance (ECP3-150 only) Product/Package combinations were chosen to represent a cross-section of the BOM (Bill of Material) changes specified in the PCN. The product/packages and the critical BOM components are: Product/Pkg ASEM Copper (Control) Mold Wire/ Die Attach Compound Diameter LFE3-150EA/ 1156fpBGA EMEG750SE 0.8mil Pd Coated Cu ABLEBOND 2100A LFXP2-17E/ 256ftBGA EMEG750SE 0.8mil Pd Coated Cu ABLEBOND 2100A LFXP2-5E/ 144TQFP EMEG700Y 0.8mil Pure Cu Yizbond 8143 ASET Copper (New) Mold Wire/ Die Attach Compound Diameter CELABLEBON 0.8mil Pd 9750ZHF10A D 2100A Coated Cu KL-U KE0.8mil Pd ABLEBON G1250LKDS Coated Cu D 2100A EME-G631H 0.8mil Pd Coated Cu CRM1076WA Multiple lots of in various product/package combinations were built as part of the qualification process for the ASET Copper BOM. Samples from the qual lots were characterized and compared to comparable lots processed with the released ASE Malaysia (ASEM) Copper BOM. 5555 Northeast Moore Court Hillsboro, Oregon 97124-6421 • T: +1.503.268.8000 • F: +1.503.268.8347 • www.latticesemi.com ASSEMBLY/ELECTRICAL TEST YIELDS The first step in the characterization process is an analysis of process yields. Yield information is critical to gauge the manufacturability of a new package. As Lattice considers yield information proprietary, the yield information below is normalized with respect to the control material, which in this case is the existing ASEM Copper wire BOM. Assembly Yield ASET Copper Lot Qty= 711 ASEM Copper (control) ASET Copper 1.0 1.01 Electrical Yield ASEM ASET Copper Copper (control) 1.0 0.99 LFE3-150EA 1156fpBGA Yield Summary Assembly Yield ASET Copper Lot Qty= 1100 ASEM Copper (control) ASET Copper 1.0 1.01 Electrical Yield ASEM ASET Copper Copper (control) 1.0 1.0 LFXP2-17E 256ftBGA Yield Summary Assembly Yield ASET Copper Lot Qty= 1448 ASEM Copper (control) ASET Copper 1.0 1.01 Electrical Yield ASEM ASET Copper Copper (control) 1.0 1.01 LFXP2-5E 144TQFP Yield Summary There are no discernable differences in either assembly yield or electrical final test yields between ASEM and ASET copper assembly processes. CRITICAL PARAMETERS For the purposes of this characterization, critical parameters are defined as speed, power and leakage. Samples of the qualification lots from ASET were tested at the same time as comparative product from ASEM. The tabulated statistics, Cpk values and histograms of the actual distributions are shown below. All of the critical parameters are from the device datasheet except for Tpdcounter. Tpdcounter is a Built-in Self Test (BIST) routine that is correlated to datasheet parameters. Higher counts equate to faster devices. Note that there is no significant change in the Cpk values between the various BOMs, which indicates that there is no significant parametric difference between ASEM and ASET copper bond wire. 5555 Northeast Moore Court Hillsboro, Oregon 97124-6421 • T: +1.503.268.8000 • F: +1.503.268.8347 • www.latticesemi.com ASEM Copper Lot Mean 391.73 612.7 Icc(mA) Std Spec 49.04 2693 140.6 2693 LFE3-150EA ASET Copper lot ASEM Copper lot (control) N 704 590 Cpk 2.7 1.5 LFXP2-17E ASET Copper lot ASEM Copper lot (control) 1083 7349 54.75 53.1 11.01 20.71 395 395 1.66 0.9 LFXP2-5E ASET Copper lot ASEM Copper lot (control) 1921 28435 39.3 23.5 8.93 8.08 172 172 1.5 1 FE3-150E XP2-17E XP2-5E SICC_VCC SICC_VCC SICC_VCC ASEM Copper Lot ASEM Copper Lot ASET Copper lot ASET Copper lot ASET Copper lot 5555 Northeast Moore Court Hillsboro, Oregon 97124-6421 • T: +1.503.268.8000 • F: +1.503.268.8347 • www.latticesemi.com LFE3-150EA ASET Copper lot ASEM Copper lot (control) N 704 590 LFXP2-17E ASET Copper lot ASEM Copper lot (control) 1083 7349 39037.61 38086.52 1446.19 1588.47 32000 32000 1.622 1.277 ASET Copper lot ASEM Copper lot (control) *Slowest speed grade 1921 28435 41980.36 39530.12 1659.5 1731.77 32000 32000 2 1.45 LFXP2-5E Mean 32479 32817 TPDcount(counts) Std Spec 687.8 26561 913.9 26561 Cpk 2.868 2.282 FE3-150E XP2-17E XP2-5E TPD_COUNT TPD_COUNT TPD_COUNT ASEM Copper Lot ASEM Copper Lot ASEM Copper Lot ASET Copper lot ASET Copper lot ASET Copper lot Mean -0.56 Cpk 7.025 LFE3-150EA ASET Copper lot ASEM Copper lot (control) LFXP2-17E ASET Copper lot ASEM Copper lot (control) 1083 7349 -0.14 -0.15 0.01 0.06 10 10 195.8 47.4 LFXP2-5E ASET Copper lot ASEM Copper lot (control) 1921 28435 -0.24 -0.17 0.04 0.04 10 10 62.2 60.4 FE3-150E NPU_LEAK_MIN ASEM Copper Lot N 704 IO Leakage(uA) Std Spec 0.092 10 No Data Available (Tested with Released Production Program) ASEM Copper Lot XP2-17E XP2-5E NPU_LEAK_MIN NPU_LEAK_MIN ASEM Copper Lot ASET Copper lot ASET Copper lot ASET Copper lot ASET Copper lot ASEM Copper lot (control) LFXP2-17E ASET Copper lot ASEM Copper lot (control) 1083 7349 119.2 118.82 2.96 2.88 210 210 9.7 10 LFXP2-5E ASET Copper lot ASEM Copper lot (control) 1921 28435 120.7 120 2.8 2.9 210 210 10 9.65 PD_LEAK_MAX ASET Copper lot Cpk 10.3 LFE3-150EA FE3-150E ASEM Copper Lot N 704 PullDown Leakage(uA) Mean Std Spec 127.26 2.68 210 No Data Available (Tested with Released Production Program) XP2-17E XP2-5E PD_LEAK_MAX PD_LEAK_MAX ASEM Copper Lot ASEM Copper Lot ASET Copper lot ASET Copper lot SIMULTANEOUS OUTPUT SWITCHING PERFORMANCE To qualify a copper wire bond for the second source assembly site, it is important to quantify the Simultaneous Switching Output (SSO) performance. This characteristic is also referred to as Ground Bounce although it can affect both power and ground supply rails. Different assembly site may have different process or tooling which can affect SSO performance. Since copper build in ASE Malaysia and ASE Taiwan have the same bond wire geometry (length and diameter), SSO results are expected to be comparable. A delta greater than 10% is considered significant. Ground Bounce Device-Pkg Supply Bounce Wire # Output Switching Overshoot Undershoot Overshoot Undershoot mil mV mV V V LFE3-150EA/ 60 0.8Cu(ASEM) 39.12 -28.88 1.932 1.576 1156fpBGA 60 0.8Cu(ASET) 39.6 -31.28 1.94 1.58 Delta -0.48 2.4 -0.008 -0.004 % Delta -1.23% -8.31% -0.41% -0.25% LFXP2-17E/ 10 0.8Cu(ASEM) 25.92 -31.04 0.039 -0.022 256ftBGA 10 0.8Cu(ASET) 24.32 -33.44 0.041 -0.023 Delta 1.6 2.4 -0.002 0.0005 % Delta 6.17% -7.73% -4.91% -2.15% LFXP2-5E/ 18 0.8Cu(ASEM) 290 -190 1.812 0.94 144TQFP 18 0.8Cu(ASET) 272 -176 1.772 0.936 Delta 18 -14 0.04 0.004 % Delta 6.21% 7.37% 2.21% 0.43% 5555 Northeast Moore Court Hillsboro, Oregon 97124-6421 • T: +1.503.268.8000 • F: +1.503.268.8347 • www.latticesemi.com SERDES PERFORMANCE Similar to SSO performance, increased inductance due to reduced wire diameter could affect high-speed operation. The LFE3-150EA was chosen as a characterization vehicle so that SERDES performance could be quantified. Three units of LFE3-150EA were programmed with a BIST pattern that generates a PN7 pattern that was then transmitted over the SERDES channel. Eye diagrams and jitter measurements were collected at nominal temperature and voltage to compare relative performance. LFE3-150EA 1156fpBGA Eye Diagrams (3.126Gbps) ASEM ASEM ASEK DutyCycle Distortion (%) 2.30 2.27 ASET Eye Height Crossing(%) Qfactor (mV) 478.8 49.1 10.4 483.6 49.3 10.9 SERDES Jitter Statistics RMS Eye Jitter (ps) 7.10 7.11 As can be seen by the eye diagrams above, SERDES performance has not been measurably affected by the BOM change. SUMMARY There are no significant electrical performance issues related to the addition of the alternate qualified material from ASET.