Publication 26012a PACKAGE INFORMATION PACKAGE MECHANICAL CHARACTERISTICS FOR ALL HALL DEVICE AND GTS2000 PACKAGES (LH, LM, LR, LT, K, KA, U, UA, SE, SG and SH PACKAGES) Co m p o n en t Mat er i al Fu n c t i o n Un i t s Sensor Face Thermoset epoxy Maximum temperature 170°C2 FOR SA AND SB PACKAGES 1 Co m p o n en t Mat er i al Fu n c t i o n Un i t s Sensor Face Thermoset epoxy Maximum temperature 170°C2 Plastic Housing Thermoplastic PBT 264 psi deflection temp. (DTUL) 66 psi deflection temp. (DTUL) Approximate melting temperature 204°C2 216°C 225°C Lead Pull -- Minimum lead pull force 8N FOR ALL PACKAGE TYPES EXCE PT THOSE LISTED ABOVE Co m p o n en t Mat er i al Fu n c t i o n Un i t s Package Face Thermoset epoxy Maximum temperature 150°C3 FOR ALL PACKAGE TYPES Co m p o n en t Mat er i al Fu n c t i o n Un i t s Lead Finish 90% Tin / 10% Lead Solder Plating4 Thickness 300 – 800 microinches Lead Material Copper -- -- Flame Class Rating -- -- UL94V-0 1 Except for the ATS630/32LSA. See the product data sheet for additional information. Industry-accepted soldering techniques are permitted for these packages as described in Application Note 26009. If reflow soldering is required, be sure to observe the precautions for SA/SB packages listed in the “Reflow Soldering of Through-Hole Devices” section of 26009. 3 Temperature excursions above this limit for soldering are allowed, as described in Application Note 26009 4 Except for packages with “Pb-Free” finishes, which are 100% tin. 2