MCP9600 Thermocouple IC Evaluation Board User’s Guide 2015 Microchip Technology Inc. DS50002417A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-748-5 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS50002417A-page 2 Object of Declaration: MCP9600 Thermocouple IC Evaluation Board 2015 Microchip Technology Inc. DS50002417A-page 3 NOTES: DS50002417A-page 4 2015 Microchip Technology Inc. MCP9600 THERMOCOUPLE IC EVALUATION BOARD USER’S GUIDE Table of Contents Preface ........................................................................................................................... 7 Introduction............................................................................................................ 7 Document Layout .................................................................................................. 7 Conventions Used in This Guide........................................................................... 8 Recommended Reading........................................................................................ 9 The Microchip Web Site ........................................................................................ 9 Customer Support ................................................................................................. 9 Revision History .................................................................................................... 9 Chapter 1. Product Overview 1.1 Introduction ................................................................................................... 11 1.2 What is the MCP9600 Device? .................................................................... 11 1.3 What is the MCP9600 Thermocouple IC Evaluation Board? ....................... 11 1.4 What the MCP9600 Thermocouple IC Evaluation Board Kit Contains ......... 11 Chapter 2. Installation and Operation 2.1 Introduction ................................................................................................... 13 2.2 Required Tool ............................................................................................... 13 2.3 Getting Started ............................................................................................. 14 2.3.1 Hardware Setup ........................................................................................ 14 2.3.2 Hardware Operation .................................................................................. 14 2.4 Microchip Thermal Management Software GUI ........................................... 15 2.5 Configuring the MCP9600 ............................................................................ 17 2.6 Data Acquisition ........................................................................................... 18 Appendix A. Schematic and Layouts A.1 Introduction .................................................................................................. 19 A.2 Board Schematic .......................................................................................... 20 A.3 Board – Top Silk .......................................................................................... 21 A.4 Board – Top Copper and Silk ....................................................................... 21 A.5 Board – Top Copper .................................................................................... 22 A.6 Board – Bottom Copper ............................................................................... 22 A.7 Board – Bottom Copper and Silk ................................................................. 23 A.8 Board – Bottom Silk ..................................................................................... 23 Appendix B. Bill of Materials (BOM) .................................................................................. 25 Worldwide Sales and Service .................................................................................... 28 2015 Microchip Technology Inc. DS50002417A-page 5 MCP9600 Thermocouple IC Evaluation Board User’s Guide NOTES: DS50002417A-page 6 2015 Microchip Technology Inc. MCP9600 THERMOCOUPLE IC EVALUATION BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files. INTRODUCTION This chapter contains general information that will be useful to know before using the MCP9600 Thermocouple IC Evaluation Board. Items discussed in this chapter include: • • • • • • Document Layout Conventions Used in This Guide Recommended Reading The Microchip Web Site Customer Support Revision History DOCUMENT LAYOUT This document describes how to use the MCP9600 Thermocouple IC Evaluation Board as a development tool. The document is organized as follows: • Chapter 1. “Product Overview” – This chapter includes important information about the MCP9600 Thermocouple IC Evaluation Board. • Chapter 2. “Installation and Operation” – This chapter includes a detailed description of each function of the evaluation board and instructions on how to begin using the board. • Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for MCP9600 Thermocouple IC Evaluation Board. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the MCP9600 Thermocouple IC Evaluation Board. 2015 Microchip Technology Inc. DS50002417A-page 7 MCP9600 Thermocouple IC Evaluation Board User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, Italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer “Save project before build” A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4‘b0010, 2‘hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text Represents code supplied by user DS50002417A-page 8 Examples File>Save Press <Enter>, <F1> #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, ‘A’ file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} var_name [, var_name...] void main (void) { ... } 2015 Microchip Technology Inc. Preface RECOMMENDED READING This user's guide describes how to use MCP9600 Thermocouple IC Evaluation Board. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources: • MCP9600 Data Sheet – “Thermocouple Voltage to Temperature Converter, ±1.5°C Maximum Accuracy” (DS20005426) This data sheet provides detailed information regarding the MCP9600 device. • PIC18F2455/2550/4455/4550 Data Sheet – “28/40/44-Pin, High-Performance, Enhanced Flash, USB Microcontrollers with nanoWatt Technology” (DS39632) This data sheet provides detailed information regarding the PIC18F2455/2550/4455/4550 devices. THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support. REVISION HISTORY Revision A (September 2015) • Original release of this document. 2015 Microchip Technology Inc. DS50002417A-page 9 MCP9600 Thermocouple IC Evaluation Board User’s Guide NOTES: DS50002417A-page 10 2015 Microchip Technology Inc. MCP9600 THERMOCOUPLE IC EVALUATION BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the MCP9600 Thermocouple IC Evaluation Board and covers the following topics: • What is the MCP9600 Device? • What is the MCP9600 Thermocouple IC Evaluation Board? • What the MCP9600 Thermocouple IC Evaluation Board Kit Contains 1.2 WHAT IS THE MCP9600 DEVICE? The MCP9600 is a Thermocouple Electromotive Force (EMF) to temperature converter. This device converts thermocouple EMF to degree Celsius with integrated Cold-Junction compensation. MCP9600 corrects the thermocouple nonlinear error characteristics of eight thermocouple types and outputs ±1.5°C accurate temperature data for the selected thermocouple. The correction coefficients are derived from the National Institute of Standards and Technology (NIST) ITS-90 Thermocouple Database. 1.3 WHAT IS THE MCP9600 THERMOCOUPLE IC EVALUATION BOARD? The MCP9600 Thermocouple IC Evaluation Board is used to evaluate MCP9600 Thermocouple EMF voltage to degree Celsius converter. Users can easily evaluate all device features using a Type K thermocouple. The device also supports Types J, T, N, E, B, S and R thermocouples. Each of these types can be evaluated by replacing the Type K thermocouple connector with the corresponding connectors. In addition, the MCP9600 Thermocouple IC Evaluation Board connects to a PC via a USB interface. Temperature can be data-logged using the Microchip Thermal Management Software Graphical User Interface (GUI). 1.4 WHAT THE MCP9600 THERMOCOUPLE IC EVALUATION BOARD KIT CONTAINS The MCP9600 Thermocouple IC Evaluation Board package includes: • • • • MCP9600 Thermocouple IC Evaluation Board (ADM00665) Type K Thermocouple Mini USB Cable Important Information Sheet 2015 Microchip Technology Inc. DS50002417A-page 11 MCP9600 Thermocouple IC Evaluation Board User’s Guide NOTES: DS50002417A-page 12 2015 Microchip Technology Inc. MCP9600 THERMOCOUPLE IC EVALUATION BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION The MCP9600 Thermocouple IC Evaluation Board enables users to easily evaluate all user-programmable features such as thermocouple selection, temperature alert limit settings, temperature resolutions and Power mode. Items discussed in this chapter include: • • • • • 2.2 Required Tool Getting Started Microchip Thermal Management Software GUI Configuring the MCP9600 Data Acquisition REQUIRED TOOL The Personal Computer (PC) shown in Figure 2-1 needs to run on Windows® 98 SE or later. It provides a convenient interface for the user, communicates with the board and provides power through the USB connection. FIGURE 2-1: 2015 Microchip Technology Inc. MCP9600 Thermocouple IC Evaluation Board Setup. DS50002417A-page 13 MCP9600 Thermocouple IC Evaluation Board User’s Guide 2.3 GETTING STARTED This section describes how to power up and interface with the MCP9600 Thermocouple IC Evaluation Board. 2.3.1 Hardware Setup 1. The MCP9600 Thermocouple IC Evaluation Board has a mini USB connector for a PC interface. Connect the USB cable from the evaluation board to a PC. Mini USB connector FIGURE 2-2: MCP9600 Thermocouple IC Evaluation Board. 2.3.2 Hardware Operation The MCP9600 Thermocouple IC Evaluation Board is fully powered from a PC USB 5V source. Once power is applied via USB and the USB is successfully enumerated, the PIC® microcontroller is ready to receive commands from the host PC to program the MCP9600 settings or transfer temperature data. I2C bus MCP9600 K+ PIC18F2550 K+ Type K Connector Type K Thermocouple 4 Alert Output Test Points USB Interface PC FIGURE 2-3: DS50002417A-page 14 Functional Block Diagram. 2015 Microchip Technology Inc. The block diagram (Figure 2-3) shows that the thermocouple connector is directly connected to the MCP9600. The four Alert outputs are connected to test points for external connections. Additionally, these outputs are also connected to the microcontroller I/O pins so that the Alert Output statuses can be detected in software. 2.4 MICROCHIP THERMAL MANAGEMENT SOFTWARE GUI The Microchip Thermal Management Graphical User Interface allows users to evaluate the MCP9600 for temperature-sensing applications. This software tool can be downloaded and installed from the evaluation board product page. The software requires the ‘Microsoft.NET Framework’ package. If this framework package is not installed on the computer, then the software will automatically download and install it. After the installation is successfully completed, the hardware is required to start the graphical user interface. Once the hardware is connected, the software recognizes the device ID and displays the corresponding GUI for the evaluation board. Disconnecting the USB will close the GUI. This tool enables the user to evaluate the sensor features and perform temperature data logging. Figure 2-4 shows the data acquisition interface with a plot of the thermocouple Hot-Junction and Cold-Junction temperature data. The Y1 axis is the Hot-Junction temperature and the Y2 axis is the Cold-Junction temperature. This data can also be exported by right-clicking the plot and following the export options. FIGURE 2-4: Data Acquisition Interface. 2015 Microchip Technology Inc. DS50002417A-page 15 MCP9600 Thermocouple IC Evaluation Board User’s Guide Use the Thermal Management Software Graphical User Interface (GUI) for temperature data logging or to evaluate the sensor board features. If the hardware is properly connected, the software will recognize the hardware, otherwise, the software will show the ‘Hardware Not Detected’ message box, as indicated in Figure 2-5. FIGURE 2-5: DS50002417A-page 16 Hardware Not Detected Message Box. 2015 Microchip Technology Inc. 2.5 CONFIGURING THE MCP9600 Figure 2-6 shows the user interface for various sensor options. Once these options are selected, the software programs the device and refreshes the GUI from the device. Therefore the GUI displays the updated device settings. Thermocouple selection: Data acquisition options Type K, J, T, N, S, E, B, R Read/Read-Write registers from the MCP9600 GUI update button Sensor configuration options such as Shutdown and Burst modes, sensor resolution, and temperature filter options Temperature Alert options Thermocouple temperature to detect Temperature change direction Output polarity Output mode Temperature limit Temperature hysteresis limit FIGURE 2-6: 2015 Microchip Technology Inc. Temperature Alert and Hysteresis update button Sensor Configuration Options. DS50002417A-page 17 MCP9600 Thermocouple IC Evaluation Board User’s Guide 2.6 DATA ACQUISITION The black “Play”, “Stop”, and “Reset” icons (Figure 2-7) can be used to perform continuous data acquisitions. The red “Record” icon enables the user to data log to an external file. The logging interval can be adjusted using the Interval scroll bar from 100 ms to 30s, as shown in Figure 2-4. Stop recording real-time acquisition Start/Record real-time acquisition Reset real-time acquisition Stop real-time acquisition Start real-time acquisition FIGURE 2-7: Real-Time Acquisition. The data acquisition display chart (Figure 2-4) can be customized. The customizing options (Figure 2-8) can be selected by either double-clicking or right-clicking the chart (Figure 2-4). The displayed data can also be exported. Export Data FIGURE 2-8: DS50002417A-page 18 Chart Setup Options. 2015 Microchip Technology Inc. MCP9600 THERMOCOUPLE IC EVALUATION BOARD USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the MCP9600 Thermocouple IC Evaluation Board: • • • • • • • Board Schematic Board – Top Silk Board – Top Copper and Silk Board – Top Copper Board – Bottom Copper Board – Bottom Copper and Silk Board – Bottom Silk 2015 Microchip Technology Inc. DS50002417A-page 19 3 GND 4 VIN- Alert 2 5 GND Alert 1 12 GND ALERT 2 11 11 12 13 14 15 16 17 18 ALERT 1 N/C ALERT 1 GND 9 8 19 13 GND VDD C3 0.47uF 16V 0805 1 GND C2 GND 0.1uF 0603 VDD RA0/AN0/C12IN0RA1/AN1/C12IN1RA2/AN2/VREF-/CVREF/C2IN+ RA3/AN3/VREF+/C1IN+ RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT OSC2/CLKOUT/RA6 OSC1/CLKIN/RA7 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2 RC2/CCP1/P1A RB0/INT0/FLT0/AN12 RB1/INT1/AN10/C12IN3-/P1C RC3/SCK/SCL RC4/SDI/SDA RB2/INT2/AN8/P1B RC5/SDO RB3/AN9/C12IN2-/CCP2 RC6/TX/CK RB4/KBI0/AN11/P1D RC7/RX/DT RB5/KBI1/PGM RB6/KBI2/PGC MCLR/VPP/RE3 RB7/KBI3/PGD VSS VSS PIC18F2520-I/SO 2 3 4 5 6 7 10 9 ALERT ALERT ALERT ALERT 4 3 2 1 X1 2 C1 0.1uF ALERT 3 10 8 VDD GND 7 ALERT 4 14 Alert 3 U3 20 15 GND VDD 1 R1 4.99k 0805 1% 12 MHz 21 22 23 24 25 26 27 28 J1 6 N/C 5 GND 4 3 2 1 VCC N/C R5 0 R6 DNP GND ID D+ DVBUS VDD + SCL J3 USB MINI-B Female FB1 2 Ferrite Bead C7 FB2 0805 1 Ferrite Bead Thermocoupler 2015 Microchip Technology Inc. R9 DNP R10 DNP VIN - GND GND GND 0.1uF 50V VIN + CBL1 GND VDD GND PAD GND GND VDD GND USB-A Male to Mini USB-B Male GND VDD 10uH C5 10uF 6.3V 0805 0 GND TC1 - SDA SCL R4 L1 10R 0805 1% R8 100k 0805 0.1% 5 4 3 2 1 VDD R7 DNP R2 4.99k SDA 0805 1% GND VCC GND VDD 3 HDR-2.54 Male 1x6 VIN+ MCP9600 ALERT 3 ALERT 4 16 Vadd 17 GND 20 19 18 GND VCC 2 6 VIN - GND Alert 4 GND VIN + GND SCL 1 SDA U2 ALERT 2 SDA SCL BOARD SCHEMATIC C4 10uF 6.3V 0805 GND 10R 0805 1% C6 1uF 16V 0805 MCP9600 Thermocouple IC Evaluation Board User’s Guide DS50002417A-page 20 A.2 A.3 BOARD – TOP SILK A.4 BOARD – TOP COPPER AND SILK 2015 Microchip Technology Inc. DS50002417A-page 21 MCP9600 Thermocouple IC Evaluation Board User’s Guide A.5 BOARD – TOP COPPER A.6 BOARD – BOTTOM COPPER DS50002417A-page 22 2015 Microchip Technology Inc. A.7 BOARD – BOTTOM COPPER AND SILK A.8 BOARD – BOTTOM SILK 2015 Microchip Technology Inc. DS50002417A-page 23 MCP9600 Thermocouple IC Evaluation Board User’s Guide NOTES: DS50002417A-page 24 2015 Microchip Technology Inc. MCP9600 THERMOCOUPLE IC EVALUATION BOARD USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: Qty BILL OF MATERIALS (BOM) Reference Description Manufacturer Part Number 9 Alert 1, Alert 2, Alert 3, Connector TP tab silver mini 3.8x2.03 SMD Alert 4, GND, GND, SCL, SDA, VDD Keystone Electronics Corp. 5019 2 C1, C7 Ceramic capacitor,1 µF, 50V, 10%, X7R SMD, 0805 Cal-Chip Electronics Inc. GMC21X7R104K50NTLF 1 C2 Ceramic Capacitor, 0.1 µF, 25V, 20%, Y5V SMD, 0603 Cal-Chip Electronics Inc. GMC10Y5V104Z25NTLF 1 C3 Ceramic capacitor, 0.47 µF, 16V, 10%, X7R SMD, 0805 Panasonic® - ECG ECJ-2YB1C474K 2 C4, C5 Ceramic capacitor, 10 µF, 6.3V, Taiyo Yuden Co., Ltd. JMK212BJ106MG-T 20%, X5R SMD, 0805 1 C6 Ceramic capacitor, 1 µF, 16V, 20%, Y5V SMD, 0805 AVX Corporation 0805YG105ZAT2A 2 FB1, FB2 Ferrite chip beads, 800 mA, 0.15R SMD, 0805 Laird Technologies® LI0805H151R-10 0 J1 Connector header, 2.54 male 1x6, tin, 5.84 mm, Through Hole, vertical – DO NOT POPULATE Sullins Connector Solutions PEC06SAAN 1 J3 Connector, Mini USB, B-Type, female, SMD R/A Hirose Electric Co., Ltd. UX60-MB-5ST 1 L1 Inductor, 10 µH, 100 mA, 20%, Murata Electronics® SMD, 0805 LQM21FN100M70L 4 PAD1, PAD2, PAD3, PAD4 Mechanical HW rubber pad, square, L12.1xW12.1xH3.1, black Hammond Manufacturing Ltd. 1421T8BK 0 PCB MCP9600 Thermocouple IC Evaluation Board – Printed Circuit Board — 04-10413-R2 2 R1, R2 Resistor, TKF 4.99K ohm, 1%, 1/8W,SMD, 0805 ROHM Semiconductor MCR10EZHF4991 2 R4, R5 Resistor, TKF 10R, 1%, 1/8W, SMD 0805 ROHM Semiconductor MCR10EZHF10R0 0 R6, R7 Resistor, TKF 100K, 1%, 1/8W, NIC Components SMD 0805 – DO NOT Corp. POPULATE NRC10F1003TRF 1 R8 Resistor TF, 100K, 0.1%, 1/8W, Panasonic® - ECG SMD 0805 ERA-6AEB104V 0 R9, R10 Resistor TKF, 47.5K, 1%, 1/8W, SMD 0805 – DO NOT POPULATE Note: Panasonic® - ECG ERJ-6ENF4752V The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 2015 Microchip Technology Inc. DS50000000A-page 25 TABLE B-1: Qty BILL OF MATERIALS (BOM) (CONTINUED) Reference Description Manufacturer Part Number ® 1 TC1 Mechanical HW adapter thermocouple TH R/A Omega Engineering PCC-SMP-K-100 Inc. (100 pcs. per package) 1 U2 Sensor temp. ratiometric, 20MQFN Microchip Technology MCP9600-I/MX Inc. 1 U3 Microchip MCU 8-bit, 40 MHz, 32K, 1536B PIC18F2520-I/SO SOIC-28 Microchip Technology PIC18F2550T-I/SO Inc. 1 X1 Resonator, 12 MHz, 33 pF, SMD, CSTCE-G Murata Electronics® Note: CSTCE12M0G55Z-R0 The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. BILL OF MATERIALS – MECHANICAL PARTS Qty Reference Description Manufacturer 1 CBL1 Mech. HW cable USB, A-Type, Qualtek Electronics male to Mini USB, B-Type, 3 ft, Corporation black 1 Plugs in TC1 Ready-made insulated thermocouples with Kapton®, PFA, Glass braid insulation and Molded connectors Note: Part Number 3021003-03 Omega® Engineering 5SRTC-TT-K-24-36 Inc. (100 pcs. per package) The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 2015 Microchip Technology Inc. DS50000000A-page 26 NOTES: 2015 Microchip Technology Inc. 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