Single Chip System Module Comparison Table

SINGLE-CHIP SYSTEM MODULE (SCM) COMPARISON TABLE
Single-Chip System Modules (SCM) is a disruptive new technology from NXP that provides an extremely high level of integration in a tiny form-factor. Built with industry-leading NXP technology, these SCMs include i.MX
applications processors and PF series advanced power management devices. SCM devices are proven to significantly simplify your design, miniaturize your form factor and accelerate your product development.
Features
SCM-i.MX 6Quad
SCM-i.MX 6Dual
SCM-i.MX 6SoloX
CPU
4 x ARM® Cortex®-A9 core
2 x Cortex-A9 core
Cortex-A9 and Cortex-M-4 cores
Maximum clock speed
800 MHz
800 MHz
(A9) 800 MHz (M4) 227 MHz
I-Cache/D-Cache
32 KB/32 KB L1, 1 MB L2
32 KB/32 KB L1, 1 MB L2
(A9) 32 KB/32 KB L1, 256 KB L2
(M4) 16 KB/16 KB L1
Embedded SRAM
256 KB
256 KB
128 KB
Embedded SPI-NOR
16 MB
16 MB
-
Integrated power management
MMPF0100
MMPF0100
MMPF0100
External memory interface and DDR bus speed
2 x 32 LP-DDR2 up to 400 MHz
2 x 32 LP-DDR2 up to 400 MHz
1 x 32 LP-DDR2 up to 400 MHz
Flash support
rawNAND
rawNAND
rawNAND
Display interface
HDMI + PHY, 2x parallel, 2x LVDS, MIPI DSI
HDMI + PHY, 2 x parallel, 2 x LVDS, MIPI DSI
1 x parallel, 1 x LVDS
LCD resolution
2 x 4 XGA (2048 x 1536) or 2 x WXGA (1280 x 720)
2 x 4 XGA (2048 x 1536) or 2 x WXGA (1280 x 720)
2 x WXGA (1280 x 720)
Hardware video acceleration
HD1080p60 Video Decode, Dual HD720p Video Encode
HD1080p60 video decode, Dual HD720p video encode
SW Only
Hardware 2D/3D graphics acceleration
OpenGL® ES 1.1/2.0/3.0
OpenCL™ 1.1 EP
OpenVG™ 1.1
2DBLT
OpenGL® ES 1.1/2.0/3.0
OpenCL™ 1.1 EP
OpenVG™ 1.1
2DBLT
OpenGL® ES 1.1/2.0
OpenVG™ 1.1
2DBLT
Camera sensor interface (CSI)
Parallel CSI, MIPI CSI
Parallel CSI, MIPI CSI
Parallel CSI
Universal asynchronous receiver/transmitter (UART)
5
5
5
Serial peripheral interface (SPI)/I2C
5/3
5/3
5/4
USB controller
1 x HS USB 2.0 OTG + PHY
1 x HS USB 2.0 Host + PHY
2 x HS USB 2.0 Host (HSIC)
1 x HS USB 2.0 OTG + PHY
1 x HS USB 2.0 Host + PHY
2 x HS USB 2.0 Host (HSIC)
2 x HS USB 2.0 OTG + PHY
Number of linear/LDO regulators
7
7
3
Number of regulators-buck switching
6
6
3
Number of regulators-boost switching
1
1
1
Digital audio interface
SSI/I2S x 3, ESAI, S/PDIF, ASRC
SSI/I2S x 3, ESAI, S/PDIF, ASRC
SSI/I2S x 5, ESAI, S/PDIF, ASRC
Ethernet
1 Gbit/s + IEEE® 1588
1 Gbit/s + IEEE® 1588
1 Gbit/s + IEEE® 1588
PCI Express®
PCIe v2.0
PCIe® v2.0
-
CAN
2
2
2
Multimedia card (eMMC)/secure digital controller (SDIO)
4 x eMMC 4.5 / SD 3.0
4 x eMMC 4.5 / SD 3.0*
3 x eMMC 4.5 / SD 3.0*
Hard disk drive interface
S-ATA II 3 Gbit/s
S-ATA II 3 Gbit/s
-
Security
Secure Boot, RNG, tamper detection, secure storage
AES-128, DES 3DES, ARC4, MD5, SHA-1, SHA-224, SHA-256
16 KB secure RAM, tamper-resistant RTC, secure debug,
OTP space
Secure Boot, RNG, tamper detection, secure storage
AES-128, DES 3DES, ARC4, MD5, SHA-1, SHA-224, SHA-256
16 KB secure RAM, tamper-resistant RTC, secure debug,
OTP space
Secure Boot, RNG, tamper detection, secure storage AES-128,
DES 3DES, ARC4, MD5, SHA-1, SHA-224, SHA-256 16 KB secure
RAM, tamper-resistant RTC, secure debug, OTP space
Timer
3
3
3
Real-Time clock
Secure RTC
Secure RTC
Secure RTC
Pulse width modulation
4
4
8
Package
14 x 17 mm P0.65 mm 2D PoP
14 x 17 mm P0.65 mm 2D PoP
13 x 13 mm P0.75 mm 2D PoP
Qualifications
Commercial (0 °C to +85 °C)
Industrial (-40 °C to +105 °C)
Commercial (0 °C to +85 °C)
Industrial (-40 °C to +105 °C)
Commercial (0 °C to +85 °C)
Industrial (-40 °C to +105 °C)
* SD4 not available in ePoP configuration
Please note: The product data sheet and reference manual are your best source for the most current and detailed technical data on the SCM products. For documentation on single-chip system modules, visit www.nxp.com/SCM.
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© 2016 NXP B.V.
Document Number: IMX6COMPATBL REV 1