Multistage Series MS2,024,06,06,11,11 Thermoelectric Modules Innovative Technology for a Connected World The MS Series of thermoelectric modules (TEMs) are designed to reach cool down temperatures that are not achievable with single stage TEMs. This product line is available in numerous heat pumping capacities, geometric shapes and temperature differentials. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the MS Series is designed for higher current and lower heat-pumping applications. applicationS FeatureS • • • • • • High temperature differential Precise temperature control Reliable solid state operation Environmentally friendly DC operation RoHS compliant • • • • • • • CCD cameras Electron microscope Calibration equipment Photonics laser systems Gas analyzers infrared (IR) Sensors Guidance Systems perforMance SpecificaTionS hot Side Temperature (°c) 25 Qmax (Watts) 0.8 delta Tmax (°c) 92 imax (amps) 1.1 Vmax (Volts) 2.2 Suffix ThickneSS (prior To Tinning) flaTneSS & paralleliSM hoT face cold face lead lengTh 00 0.189”± 0.008” 0.001” / 0.004” Metallized Metallized 1.97” 11 0.181”± 0.008” 0.001” / 0.002” Lapped Lapped 1.97” 22 0.189”± 0.008” 0.001” / 0.004” Pre-tinned Pre-tinned 1.97” Sealing option global solutions: local support Americas: +1 888.246.9050 Europe: +46.31.420530 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com TM Suffix SealanT color TeMp range deScripTion rT RTV White -60 to 204 °C Non-corrosive, silicone adhesive sealant ep Epoxy Black -55 to 150 °C Low density syntactic foam epoxy encapsulant Multistage Series MS2,024,06,06,11,11 Thermoelectric Modules Innovative Technology for a Connected World Performance Curves at Th = 25°C therMo electric 0.40 0.6 2.4 0.8 1.0 1.8 0.30 0.25 0.20 0.15 1.2 Qc (W) 1.1 0.6 Voltage (V) 0.35 0.10 0.0 0.05 100 90 80 70 60 50 40 30 20 10 0 0.00 100 90 80 70 60 50 40 Delta T (°C) 30 Delta T (°C) +INPUT (RED) 0.240 [6.1] 24 AWG PVC INSULATED 0.161 [4.1] -INPUT (BLACK) 0.161 [4.1] 0.240 [6.1] COLD FACE 0.02 A THICKNESS SEE TABLE 0.04 A 0.02 HOT FACE 100% Alumina Ceramics operating tipS • Max Operating Temperature: 80°C • Do not exceed Imax or Vmax when operating module • Reference assembly guidelines for recommended installation • Solder tinning also available on metallized ceramics THR-DS-MS2,024,06,06,11,11 0612 0609 THR-DS-MS2.024,06,06,11,11 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials materials withuser, the since end user, Laird Technologies and its agents be all aware of all uses. potential Laird Technologies no warranties as to the fitness, rests with rests the end Lairdsince Technologies and its agents cannot becannot aware of potential Lairduses. Technologies makes no makes warranties as to the fitness, merchantability or merchantability suitability of any Laird Technologies materials products for any uses. specificLaird or general uses. Laird Technologies shall not be liable for incidentaldamages or suitability of anyorLaird Technologies materials or products for anyorspecific or general Technologies shall not be liable for incidental or consequential of any kind. consequential damagesproducts of any kind. All pursuant Laird Technologies products are soldTerms pursuant to the LairdofTechnologies’ and Conditions of sale effect time to time, a request. All Laird Technologies are sold to the Laird Technologies’ and Conditions sale in effectTerms from time to time, a copy of in which willfrom be furnished upon copy of which2012 will be furnished upon request. © Copyright 2009 LairdLaird Technologies, Inc.the All Rights Reserved. Laird, thetrade Lairdmarks Technologies Logo, trade and other © Copyright Laird Technologies, Inc. All Rights Reserved. Laird, Technologies, Laird Technologies Logo,Laird and Technologies, other marks are or registered marks marks trade marksInc. or registered tradecompany marks ofthereof. Laird Technologies, Inc.ororservice an affiliate thereof. Other or service names mayprovides be the property third any parties. of Lairdare Technologies, or an affiliate Other product namescompany may be the property of product third parties. Nothing herein a licenseofunder Laird Nothing herein license under anyproperty Laird Technologies or any third party intellectual property rights. Technologies or provides any thirdaparty intellectual rights.