High-Brightness LED Soldering & Handling

Cree® High‑Brightness LED
Soldering & Handling
CLD-CTAP001 Rev 22
Soldering & handling
Features
The purpose of this document is to provide customers and users with a clear understanding about the ways to use our LED lamps
appropriately.
Description
Generally, LEDs can be used the same way as other general‑purpose semiconductors. When using Cree’s Lamps, the following
precautions must be taken to protect the LED.
P2 and P4 LEDs
1. Cleaning
•
Don’t use unspecified chemical liquids to clean the LED; the chemical could harm the LED. When washing is necessary, please
wipe the LED with alcohol at normal room temperature and dry at normal room temperature for 15 minutes before use.
•
The influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the way the LEDs are mounted.
Ultrasonic cleaning should be pre‑qualified to ensure this will not cause damage to the LEDs.
2. Forming
•
During leads forming, the leads should be bent at a point at least 3 mm from the base of the package.
•
Don’t form the leads during or after soldering. If forming is required, this must be done before soldering.
•
Avoid stressing the LED package during leads forming.
•
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LEDs.
3. Storage
•
25 °C and <40% RH in proper package
4. Soldering
•
A minimal cathode pad area of 0.18 × 0.18 inches squared is recommended for P2 LEDs and 0.18 × 0.18 inches squared × 2 for
P4 LEDs.
•
Soldering LEDs at not less than 3 mm from the base of the package and below the tie‑bar is recommended.
•
The LED soldering specification is shown below (suitable for both leaded solder & lead-free solder).
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo
are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
1
High-Brightness LED Soldering & Handling
Manual Soldering
Solder Dipping
Soldering iron
35 W max
Preheat
110 ºC max
Temperature
300 ºC max
Preheat time
60 seconds max
Solder-bath temperature
260 ºC Max
Soldering time
3 seconds max
Dipping time
5 seconds max
Position
Not less than 3 mm from the base of the package.
Position
Not less than 3 mm from the base of the package.
•
Manual soldering onto the PCB is not recommended because soldering time is uncontrollable.
•
The recommended wave soldering is as below:
300
laminar wave
Temperature ºC
250
200
150
100
50
30
0
Fluxing
Preheat
10
20
30
40
50
60
70
Times (sec)
80
90
100
110
120
Different lead-free solder requires different solder conditions. Please contact us for details.
•
Do not apply any stress to the LED package, particularly when heated.
•
The LEDs must not be re used once they have been extracted from PCB.
•
After LED soldering, the package should be protected against mechanical shock or vibration until the LEDs have reached 40 ºC or
below.
•
Precautions must be taken as mechanical stress on the LEDs may be caused by PCB warpage or from the clinching and cutting of
the LED leads.
•
When clamping of LEDs during soldering is required, it is important to ensure no mechanical stress is exerted on the LEDs.
•
Lead cutting must be performed at normal room temperature. Lead cutting at an elevated temperature may lead to LED failures.
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
2
High-Brightness LED Soldering & Handling
5. Electrostatic Discharge and Surge Current
•
Electrostatic discharge (ESD) or electrical overstress (EOS) may damage LEDs.
•
Precautions such as ESD wrist straps, ESD shoe straps or antistatic gloves must be worn whenever handling the LEDs.
•
All devices, equipment and machinery must be properly grounded.
•
It is recommended to perform electrical tests to screen out ESD failures at final inspection.
•
It is important to eliminate the possibility of electrical overstress during circuitry design.
6. Heat Management
•
Heat management of LEDs must be taken into consideration during the design stage of an LED application. The current should be
de‑rated appropriately by referring to the de‑rating curve included in each product specification.
•
The temperature surrounding the LED shouldn’t be so high that it will make the LED fail when used in an application, and the
temperature surrounding the LED in the application should conform to the de‑rating curve in our LED specification documents.
7. Other Notes
•
Care must be taken so that reverse voltage will not exceed the absolute maximum rating.
•
The leads are plated with solder. Leads will become tarnished if in contact hydrogen sulfide and other gaseous chemicals. Precautions
must be taken to maintain a clean storage atmosphere.
•
The power of high‑brightness LEDs is very strong and may injure human eyes. Precautions must be taken such as avoiding looking
directly into lit LEDs.
•
3‑mm conventional LEDs are not auto‑insertable.
SMD LEDs
1. Cleaning
•
Don’t use unspecified chemical liquids to clean an SMD LED; the chemical could harm the SMD LED. When washing is necessary,
please wipe the LED with alcohol at normal room temperature and dry at normal room temperature for 15 minutes before use.
•
The influence of ultrasonic cleaning on the SMD LED depends on factors such as ultrasonic power and the way the SMD LEDs are
mounted. Ultrasonic cleaning should be pre‑qualified to ensure this will not damage the SMD LED.
2. Moisture‑Proof Packing
•
In order to prevent moisture absorption into the SMD LEDs during the transportation and storage, the LEDs are packed in a
moisture barrier bag. Desiccants and a humidity indicator are packed together with the SMD LEDs as secondary protection. The
humidity‑indicator card indicates the humidity within the SMD packing.
3. Storage
•
Do not open the sealed bag before you are ready to use the products.
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
3
High-Brightness LED Soldering & Handling
•
Shelf life in the original sealed bag at the storage condition of ≤40 ºC and ≤90% RH is 12 months. Baking is required whenever shelf
life is expired.
•
Before opening the sealed bag, please check whether or not the bag leaked air.
•
After opening the sealed bag, the SMD LED must be stored under the condition < 30 ºC and < 60% RH. Under these conditions, the
SMD LEDs must be used (subject to reflow) within 24 hours after bag opening, and baking is required when exceeding 24 hours.
•
For baking, place the SMD LEDs in an oven at 80 ºC ±5 ºC and relative humidity <=10% RH for 24 hours.
•
Take the material out of the packaging bag for re-bake. Do not open the oven door frequently during the baking process.
•
Please refer to the product specifications for more detailed information.
4. Soldering
Manual soldering by soldering iron
•
Since the temperature of manual soldering is not stable, manual soldering by soldering iron is not recommended.
•
If manual soldering is necessary, the use of a soldering iron of less than 25 W is recommended, and the temperature of the iron must
be kept at below 315 ºC, with soldering time within 2 seconds.
•
The epoxy resin of the SMD LED should not contact the tip of the soldering iron.
•
No mechanical stress should be exerted on the resin portion of the SMD LED during soldering.
•
Handling of the SMD LED should be done when the package has been cooled down to below 40 ºC or less. This is to prevent LED
failures due to thermal‑mechanical stress during handling.
Reflow Soldering
•
Document No.: CREE-05-0057
Rev. NO. :
17
The temperature profile (1) is as below (for SMD LED CLV1A-FKB/CLV1L-FKB/CLV6B-FKB/CLV6D-FKB/CLX6B-FKC/CLX6C-FKB/
CLX6D-FKB/CLX6E-FKC/CLX6F-FKC/CLY6C-FKC/CLY6D-FKC/CLYBA-FKA):
Temperature
Melting point
Pre-heat
Reflow
Cooling
Time
Use all SMD besides LP6-NPP1-01-N1
Solder = Sn63-Pb37
Solder = Lead-free
Average ramp-up rate = 4ºC/s max.
Average ramp-up rate = 4ºC/s max
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
Preheat temperature = 100ºC ~150ºC
Preheat temperature = 150ºC ~200ºC
Preheat time = 120s max.
Preheat time = 120s max.
4
High-Brightness LED Soldering & Handling
Solder
•
Average ramp-up rate
4 ºC/second max.
Preheat temperature
150 ºC~200 ºC
Preheat time
120 seconds max.
Ramp-down rate
6 ºC/second max.
Peak temperature
250 ºC max.
Time within 5 ºC of peak temperature
10 seconds max.
Duration above 217 ºC
60 seconds max.
The temperature profile (2) is as below (for SMD LED CLMVB-DKA/CLMVB-FKA/CLMVC-FKA/CLMUC-FKA/CLP6CFKB/CLV1S-FKB/
CLV6A-FKB/CLX6A-FKB/CLVBA-FKA and other products not listed herein):
Temperature
Melting point
Pre-heat
Soak
Reflow
Cooling
Time
Solder
Average ramp-up rate
4 ºC/s max.
Preheat temperature
150 ºC~200 ºC
Preheat time
120 seconds max.
Ramp-down rate
6 ºC/s max.
Peak temperature
235 ºC max.
Time within 5 ºC of peak temperature
10 seconds max.
Duration above 217 ºC
45 seconds max.
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
5
High-Brightness LED Soldering & Handling
Theunit
unitisismillimeter
millimeter(mm)
(mm)ininthe
thegraphs
graphsbelow.
below.
The
LM1
series
recommended
solder
pad
design
forheat
heatdissipation:
dissipation:
LM1
series
recommended
solder
pad
design
for
The
unit
is
millimeter
(mm)
in
the
graphs
Theunits
unit in
is the
millimeter
theinbelow.
graphs
below.
The
graphs (mm)
belowinare
millimeters
(mm).
LM1 series
solder pad
design
heatfor
dissipation:
LM1recommended
series recommended
solder
pad for
design
heat dissipation:
it is millimeter
in the graphs
The unit(mm)
is millimeter
(mm) below.
in the graphs below.
7.0
7.0
eries recommended
solder
pad design
forpad
heat
dissipation:
LM1
series
recommended
solder
design
for
heat
dissipation:
LM1
series
recommended
solder‑pad
design
for
heat
dissipation:
7.0
7.0
7.0
2.6
2.6
2.6
7.0
1.5 1.5
2.6
1.5 1.5 4.5
4.5
0.5
1.5 1.5
7.5
0.5
0.5
7.5
7.5
0.5
7.5
0.5
0.5
7.5
7.5
4.5
4.5
4.5
1.5 1.5
1.5 1.5
4.5
1.5 1.5
2.6
2.6
2.6
2.61.1
1.1
1.1
1.1 2.6
2.6
2.6
1.1
1.1
2.6
7.0
7.0
7.0
0.4
7.0
0.4
0.4
0.4
7.0
7.0
0.4
0.4
LM4& &LM2
LM2series
seriesrecommended
recommendedsolder
solderpad
paddesign
designfor
forheat
heatdissipation:
dissipation:
LM4
LM4 & LM2
solder pad
design
heatfor
dissipation:
LM4series
& LM2recommended
series recommended
solder
pad for
design
heat dissipation:
LM4 & LM2 series recommended solder‑pad design for heat dissipation:
7.5
7.5
& LM2 series
solder pad design
forpad
heat
dissipation:
LM4 recommended
& LM2 series recommended
solder
design
for heat dissipation:
0.5 7.5
0.5
7.5
0.5
4.5
0.5
4.5
7.5
7.5
1.5 1.5
1.5
1.5
4.5
4.5
0.5
0.5
1.5 1.51.5 1.5
4.5
4.5
1.5 1.5
1.5 1.5
LV1& &LA1
LA1& &LVB
LVBseries
seriesrecommended
recommendedsolder
solderpad
paddesign
designfor
forheat
heatdissipation:
dissipation:
LV1
LV1 & LA1 & LVB series recommended solder-pad design for heat dissipation:
LV1 & LA1
solder pad
design
heatfor
dissipation:
LV1&&LVB
LA1series
& LVBrecommended
series recommended
solder
pad for
design
heat dissipation:
1.1
2.61.1
1.1
1.1
1.1 2.6
2.6
2.6
0.5
1.65
1.5
4.5
4.5
1.5 1.5
1.5
1.5
4.5
4.5
1.5 1.51.5 1.5
4.5
4.5
1.5 1.5
1.5 1.5
1.1
2.6
0.5 2.5 2.5 1.5 2.5
1.5
7.0
2.5
1.5
2.5
3.3
0.5
2.5
2.5
9.5
0.4
1.65
3.3
7.0 1.65
3.3
1.65
3.3
0.5
0.4
0.5
0.4
1.65
3.3 0.4
0.5
7.0
7.0
1.650.4
0.5
7.0 3.3
0.5 7.0
0.4
2.5
0.5 9.5 0.5
2.6
9.5
9.5
LA1 & LVB
solder pad design
forpad
heat
dissipation:
LV1series
& LA1 recommended
& LVB series recommended
solder
design
for heat dissipation:
2.5 9.52.5
0.5
2.5 9.51.5
1.5
2.5
0.5
LP6series
seriesrecommended
recommendedsolder
solderpad
paddesign
designfor
forheat
heatdissipation:
dissipation:
LP6
LP6 series
solder pad
design
heatfor
dissipation:
LP6recommended
series recommended
solder
pad for
design
heat dissipation:
eries recommended
solder pad design
forpad
heat
dissipation:
LP6 series recommended
solder
design
for heat dissipation:
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
6
High-Brightness LED Soldering & Handling
LP6 series recommended solder-pad design for heat dissipation:
4
4
A
Note
2.0 1.6 2.0
2.0 1.6 2.0
2.0 1.6 2.0
2.0 1.6 2.0
44
4
3
2.0 1.6 2.0
33
0.5
6.6
5
5
3
55
5
2
0.5
6.6
6.6 0.5
22
2
2
6
6
1
1
3
6
6.6
6.6
0.5
0.5
11
1
8.4
8.4
2.4
3.0
3.0 2.4
8.4
3.0
8.4 2.48.4
66
3.0 2.4 3.0 2.4
Metal
area at 1, 2, 3 should not
Note:
Note:
Note:
each
for
less
Metal
area40 1,2,2,32 3should
should
not
area be
at 1,
2, 3than
should
Note:
Metal
area
atatnot
1,mm
not
Note: Metal
2
2 heat
sufficient
dissipation.
less
than
40mm
eachfor
for
less
than
for
Metal
area
atbe
1,
2,each
3than
should
not2 each
be
less
40mm
Metal be
area
at 1,
2, 340mm
should
not
2
2sufficient
sufficient
heatdissipation.
dissipation.
heat
dissipation.
be less
than
40mm
for
heat
be lesssufficient
than
40mm
each
for each
heat dissipation.
sufficientsufficient
heat dissipation.
AA
0.8
0.8
0.35
0.35
0.35
44
Note:
Note:
4.74.7
Note:
Note
1.65
1.4
1.65 1.4Note: Metal
areaatat1,
1,2,2,3 3should
shouldnot
not
area atMetal
1,Metal
2, area
3area
should
Note:
Metal
at 1,not
2, 3 should not
2
2 than 16mm
2
be
less
each
for
less
than
for
Metal
area
at
1,
2,each
3
should
not2each
be
less
than
16mm
forfor
Metal be
area
at 1,
2, be
316mm
should
not
each
less
than
16 mm
2
2
sufficient
heat
dissipation.
heat
dissipation.
be less
than
16mm
each
for
sufficient
heat
dissipation.
be lesssufficient
than
16mm
each
forheat
sufficient
dissipation.
heat dissipation.
sufficientsufficient
heat dissipation.
0.8
0.8
9.5
9.5
0.8
9.5 4.0
9.5
5
4
3
3
5
33
3
4.0
4.0
4.0
2
2
6
9.5
22
2
4.7 6
6
1.65
1.4
4.7
6 4.7
1.65
1.4
1.65 1.4
5
55
6
0.35
0.35
9.4
11
4.0
1
1.8
1.8
9.4
1.8
1
1.8
1
1.8
A
A
LU6
series
recommended
solder
pad design
forheat
heatdissipation:
dissipation:
LU6LU6
series
recommended
solder
pad design
forpad
heat
dissipation:
LU6
series recommended
solder
for
series
recommended
solder‑pad
design
fordesign
heat
dissipation:
LU6
series recommended
solder
pad
for heat dissipation:
LU6 series
recommended
solder pad
design
fordesign
heat dissipation:
9.4
9.49.4
4
4
Small
TopSMD
SMD
LM3series
seriesrecommended
recommended
solder
paddesign
design
forheat
heatdissipation:
dissipation:
Small Top SMD
LM3Top
series
recommended
solder
pad design
forpad
heat
dissipation:
Small
LM3
solder
for
Small-top SMD LM3 series recommended solder-pad design
for
heat
dissipation:
9.3 dissipation:
LM3
series recommended
pad
for heat dissipation:
mall TopSmall
SMDTop
LM3SMD
series
recommended
solder pad
design
fordesign
heat
9.3solder
9.3
4.4
4.4
4.4
9.3
4.4
4.4
1.55
1.55
1.55
2.2
2.2
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
2.2
4.0
4.0
4.0
4.0
4.0
1.55
1.55
2.2
2.2
9.3
Mini
side
0.8mm
SMD
LS8series
seriesrecommended
recommended
solder
paddesign
design
forheat
heatdissipation:
dissipation:
Mini side 0.8mm
SMD
LS8
series
recommended
solder
pad design
forpad
heat
dissipation:
Mini
side
0.8mm
SMD
LS8
solder
for
sideSMD
0.8mm
LS8
series recommended
solder
pad
for 3.8
heat
Mini side Mini
0.8mm
LS8SMD
series
recommended
solder
pad
design
fordesign
heat dissipation:
3.8 dissipation:
1.0
3.8
1.0
1.0
3.8
1.03.8
1.0
1.0
1.4
1.4
0.9
1.4
1.4
0.9
1.4
1.0
1.0
0.9
0.9
1.0
0.9
1.0
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
LA6series
seriesrecommended
recommended
solder
paddesign
design
forheat
heatdissipation:
dissipation:
LA6 series recommended
solder
pad design
forpad
heat
dissipation:
LA6
solder
for
LA6
series recommended
solder
pad
for heat dissipation:
A6 series
recommended
solder pad
design
fordesign
heat dissipation:
7
2.2
1.55
2.2
4.0
4.0
1.55
High-Brightness LED Soldering & Handling
1.3
1.3
1.3
1.3
Mini sideMini
0.8-mm
LS8SMD
series
solder‑pad
design
for
heat
dissipation:
side SMD
Mini
0.8mm
side
0.8mm
LS8recommended
SMD
seriesLS8
recommended
series
recommended
solder
padsolder
design
pad
for
design
heat dissipation:
for heat dissipation:
1.0
3.8
3.8
1.0
1.0
1.4
0.9
1.4
0.9
1.0
LA6 series
recommended
solder‑pad
design
for
heat
dissipation:
series
recommended
pad
for heat dissipation:
LA6
seriesLA6
recommended
solder
padsolder
design
fordesign
heat dissipation:
6/13
6/13
0.8
0.8
0.3
0.3
2.9
2.9
0.8
0.70.8
0.7
4.5
4.5
1.5 1.5
1.5 1.5
LB6 series recommended solder pad design for heat dissipation:
LB6 series
recommended
solder‑pad
design
for heat
LB6 series
recommended
solder
pad design
fordissipation:
heat dissipation:
5.2
1.5 1.4 1.5
1.5 5.2
1.4 1.5
0.4
0.4
1.8
1.8
7.4
7.4
3.8
3.8
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
LT6 series recommended solder pad design for heat dissipation:
LT6 series recommended solder pad design for heat dissipation:
8
High-Brightness LED Soldering & Handling
LT6 series recommended solder pad design for heat dissipation
:
LT6 series recommended solder‑pad design for heat dissipation:
2.7
0.85
0.7
0.3
2.6
0.65
1.0
LMV series recommended solder‑pad design for heat dissipation:
LMV series recommended solder pad design for heat dissipation
2.5
7/13
1
0.8
1.9
0.8
1
:
LMU series recommended solder pad design for heat dissipation:
2.5
1
0.8
1.9
0.8
1
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
9
High-Brightness LED Soldering & Handling
LMU series
recommended
solder‑pad
design
fordesign
heat dissipation:
LMU
series
recommended
solder
pad
forfor
heat
dissipation:
LMU
series
recommended
solder
pad design
heat
dissipation:
2.52.5
1 1
1.9
1.9
0.8
0.8
0.8
0.8
1 1
LV6
series
recommended
solder
padpad
design
forfor
heat
dissipation:
LV6
series
recommended
solder
design
heat
dissipation:
LV6 series recommended
solder‑pad design
for heat
dissipation:
0.475
0.475
5.65
5.65
1.7 1.3 1.7
1.7 1.3 1.7
8.28.2
2.72.7 2.82.8
LX6
series
recommended
solder
padpad
design
forfor
heat
dissipation:
LX6
series
recommended
solder
design
heat
dissipation:
8/13
8/13
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
10
High-Brightness LED Soldering & Handling
LX6 series recommended solder‑pad design for heat dissipation:
5.0
1.85.0
0.35
0.7
0.35
0.7
0.7
2.8
0.7
0.7
2.8
0.7
1.8
1.6 1.6
LY6 series recommended solder pad design for heat dissipation:
LY6 series
recommended
solder
design for heat dissipation:
LY6 series recommended
solder‑pad
design for
heat pad
dissipation:
4.0
0.40
0.5
0.5
0.5
2.3
1.6
1.2
Modification
of an SMD
is notLED
recommended
after soldering.
If modification
cannot becannot
avoided,
the modifications
Modification
ofLED
an SMD
is not recommended
after soldering.
If modification
be avoided,
the modifications
must be pre-qualified
to
avoid
damaging
SMD
LED.
must be pre-qualified to avoid damaging SMD LED.
Reflow soldering
should not
be done
thanmore
one than
time.one time.
Reflow soldering
should
notmore
be done
No stressNo
should
beshould
exerted
the package
soldering.
stress
beon
exerted
on the during
package
during soldering.
The PCB
not
be wrapped
after
soldering
tosubject
allow
natural
cooling
down
®
Copyright © 2011-2015
Cree, should
Inc. AllPCB
rights
reserved.
The
information
in this
document
is
to change
without
notice. Cree
andto
the40ºC.
Cree logoto
are40ºC.
registered trademarks of Cree, Inc.
The
should
not
be wrapped
after soldering
to allow
natural
cooling
down
11
High-Brightness LED Soldering & Handling
•
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications must be
pre‑qualified to avoid damaging the SMD LED.
•
Reflow soldering should not be done more than one time.
•
No stress should be exerted on the package during soldering.
•
The PCB should not be wrapped after soldering to allow natural cooling down to 40°.
5. Important Notes (Small-top and Mini-side 0.8-mm SMD Products)
Document No.: CREE-05-0057
Rev. NO. :
16
pick up SMD products during the process of SMT production . If handling is necessary, it should take more
•
The packaging sizes of these SMD products are very small and the resin is still soft after solidification. Users are required to handle
•
To avoid damaging the product’s surface and interior device, it is recommended to choose a special nozzle to pick up the SMD
to pick
upthe
these
with careful
care. Never
touch
resinproducts.
surface ofThe
SMDfollowing
products.two methods are necessary :
products during the process of SMT production. If handling is necessary, take special care when picking up these products. The
following two methods are necessary:
Fig. 1a: For Small Top SMD

•
Fig. 1a: For Small Top SMD
Fig. 1b: For Mini side 0.8mm SMD
Fig. 1b: For Mini‑slde 0.8 mm SMD
For Small Top SMD series , it is recommended to use rubber material Nozzle to pick up SMD products .Two
SMDfigure
nozzlesize for reference :
For a.)
example:
CLA1B
Circular
Nozzle: inner diameter: Ø1.8mm+/-0.05mm, outer diameter: Ø2.3mm+/-0.05mm.
For silicone-covered SMD LEDs, it is recommended to use non-metallic nozzles. Cree and several of Cree’s customers have had
b.) Rectangle Nozzle: inner size: 1.3mm x 2.3mm, outer size > SMD size.
success using nozzles fabricated from Teflon or from 90d urethane.
6. Electrostatic Discharge and Surge current

Electrostatic discharge (ESD) or surge current (EOS) may damage SMD LED.

Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of SMD LED.

All devices, equipment and machinery must be properly grounded.

It is recommended to perform electrical test to screen out ESD failures at final inspection.

It is important to eliminate the possibility of surge current during circuitry design
7. Heat Management
Heat management of SMD LED must be taken into consideration during the design stage of SMD LED application. The
current should be de-rated appropriately by referring to the de-rating curve attached on each product specification.
Data is subject to change without prior notice.
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
12
High-Brightness LED Soldering & Handling
•
Items to notice before opening the bag:
1. Check the shelf life (counting from the FQC stamping date on the product label). If the shelf life is over 12 months, re‑baking is
required.
2. Record the lot number of the SMD product to aid investigation.
3. Avoid external damage to the packaging bag after product is taken out of the box. For example, many SMD products are stacked
without box; re‑packing with bubble plastic bag for protection is recommended.
4. Before opening the vacuum‑sealed bag, check for air leakage.
5. Recommendation for product opening and storage: use scissors to cut the bag along the sealing mark in order to re‑pack
conveniently for product not to be used within 24 hours.
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
13
High-Brightness LED Soldering & Handling
•
Items to notice after opening the bag:
1. Check the color of the humidity‑indication card (30% RH) at the time of opening the vacuum‑sealed bag. If the color is slight
green or blue, baking is required before usage.
Normal
Color change
2. Record the date and time on the reel.
3. The product should be used within 24 hours.
4. If SMD products can’t be used within 24 hours, they should be re‑packed in a vacuum‑sealed bag. Before attempting to use again,
baking is required.
•
Baking is required when the following conditions occur:
1. Shelf life has expired (over 12 months).
2. The vacuum‑sealed bag has an air leak.
3. The humidity‑indication card has change color at 30% RH at the time of opening the vacuum‑sealed bag.
4. The vacuum‑sealed bag has been opened, but the steps listed under “Notice items after opening the bag” (above) have not been
followed.
•
Baking method:
1. The SMD LED should not be baked within the packaging bag. The baking condition is 80 ºC for 24 hours. The oven door should
not be opened frequently during the baking process.
2. Refer to the photo below for a baking model that can help avoid reel deformation.
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
14
High-Brightness LED Soldering & Handling
For small reels
For large reels
3. Baked products should cool down to 40 ºC in the oven before being removed for use.
6. Electrostatic Discharge and Electrical Overstress
•
Electrostatic discharge (ESD) or electrical overstress (EOS) may damage an SMD LED.
•
Precautions such as ESD wrist straps, ESD shoe straps or antistatic gloves must be worn whenever handling SMD LEDs.
•
All devices, equipment and machinery must be properly grounded.
•
It is recommended to perform electrical test to screen out ESD failures at final inspection.
•
It is important to eliminate the possibility of electrical overstress during circuitry design.
7. Heat Management
Heat management of SMD LEDs must be taken into consideration during the design stage of SMD LED applications. The current should
be de‑rated appropriately by referring to the de‑rating curve included in each product specification.
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
15
High-Brightness LED Soldering & Handling
8. SMD Screen Product Moisture Sensitivity Level
Product Family
P/N
Moisture Sensitivity Level
CLMVB-DKA
CLMVB-FKA
CLMVC-FKA
CLMUC-FKA
CLP6C-FKB
CLV1A-FKB
CLV1L-FKB
CLV1S-FKB
CLV6A-FKB
CLV6B-FKB
SMD LEDs
CLV6D-FKB
5a
CLVBA-FKA
CLX6A-FKB
CLX6B-FKC
CLX6C-FKB
CLX6D-FKB
CLX6E-FKC
CLX6F-FKC
CLY6C-FKC
CLY6D-FKC
CLYBA-FKA
The information in this document is subject to change without notice.
Copyright © 2011-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo are registered trademarks of Cree, Inc.
16