1 kW B LD C Po wer To ol K it User Ma nu al Application Note About this document This Application Note introduces a complete system level solution to drive a BLDC Motor for cordless power tools. It also describes how to quickly get started integrating this demonstration PCB and take advantage of Infineon’s SMD technology featuring 40 V OptiMOS™ MOSFETs and XMC1000 series microcontroller. Scope and purpose To show the efficiency, present a thermal solution for a power stage with SMD MOSFETs and show how to implement the control with the microcontroller to drive a BLDC motor equipped with 3 hall sensors. This enables the power tool manufacturers to minimize time to market. Intended audience Battery driven power tool manufacturers who intend to reduce the system cost and improve the efficiency and increase the power density, which in turn provides longer run time and higher peak power pulse capability. Table of Contents 1 1.1 Overview ........................................................................................................................................ 3 Key Features ........................................................................................................................................ 3 2 2.1 2.2 2.3 2.4 Power Tool Kit Package content .................................................................................................... 5 PCB....................................................................................................................................................... 5 Communication Interface ................................................................................................................... 6 Dedicated Software for the Onboard 32-bit Microcontroller ............................................................ 7 BLDC Motor (BLDCM)........................................................................................................................... 7 3 3.1 Running the Power Tool Kit............................................................................................................ 8 Connecting the board to a BLDC Motor .............................................................................................. 8 4 4.1 4.2 Hardware Description .................................................................................................................. 11 Power Supply: +5V and 12V_boost ................................................................................................... 11 Power Stage....................................................................................................................................... 11 1 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Overview 4.3 4.4 4.4.1 4.5 4.5.1 4.6 4.7 Current measurement ....................................................................................................................... 12 Gate Drivers ....................................................................................................................................... 14 Gate driver 2EDL05N06PF features ............................................................................................ 15 Microcontroller .................................................................................................................................. 15 XMC Microcontroller features ..................................................................................................... 17 Hall Sensors Digital Inputs ................................................................................................................ 18 Free MCU pins .................................................................................................................................... 19 5 5.1 5.2 5.3 5.4 PCB............................................................................................................................................... 20 Schematic .......................................................................................................................................... 20 Layout and Placement ...................................................................................................................... 21 PCB production ................................................................................................................................. 24 Bill of Material.................................................................................................................................... 26 6 6.1 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.2.5 6.2.6 6.2.7 6.2.8 Software ....................................................................................................................................... 28 Overview ............................................................................................................................................ 28 Features ............................................................................................................................................. 28 Unipolar Block Commutation with active rectification ............................................................. 28 Overcurrent shut down ............................................................................................................... 29 Overtemperature shut down ...................................................................................................... 29 Wrong hall pattern shut down .................................................................................................... 30 Motor soft start ............................................................................................................................ 30 Monitoring input DC voltage ....................................................................................................... 30 Programmable boost converter ................................................................................................. 30 Asymmetric Authentication Feature .......................................................................................... 30 7 XMC microcontroller development platform DAVE ...................................................................... 31 8 8.1 8.1.1 8.1.2 Test Results .................................................................................................................................. 32 Efficiency measurement ................................................................................................................... 32 Determining the Zth ..................................................................................................................... 35 Zth of the complete power inverter stage including copper elements ...................................... 35 9 Properties of integrated Schottky-like diode ............................................................................... 36 10 Conclusion ................................................................................................................................... 38 11 11.1 Accessories................................................................................................................................... 39 ORIGA™ Authentication ..................................................................................................................... 39 12 Useful material and links.............................................................................................................. 40 Application Note 2 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Overview 1 Overview Infineon´s Power Tool Kit EVAL_SSO8_1kW_BLDC is as complete system solution implemented with a 3-phase bridge MOSFET power stage and a control PCB featuring Infineon’s low cost 32-bit microcontroller XMC1302. This demonstration unit is specifically designed for cordless power tool application by using simple plug and play system, but it can easily be adopted for any 3-phase brushless DC motor application. Its compact design, optimized thermal performance and a ready to use firmware allows the user to effectively and quickly implement this design. The source code is also provided which can be modified to implement additional features. In its original shape the overall PCB measures 90 mm x 36 mm and provides test points to all signals from the microcontroller. This allows the user to monitor the signals of interest. This board can be further split into 3 parts: control PCB, power PCB, and capacitor PCB. These individual PCBs can then be connected via ribbon cable and give users the flexibility to physically insert these boards into practically any power tool. This demonstration board is more than just a reference design. Its unique layout, cooling concept and utilization of surface mount components will result in the highest power density, reliability, and a low cost product. Important Notes: 1. The electrolytic capacitor is provided for filtering, but it is important that the battery wires are kept as short as possible. Otherwise a large ripple current can flow through this capacitor leading to its premature failure. If a power supply with long wires is used, it is recommended to connect in addition a 4700 uF/50 V capacitor as close as possible to the power stage. 2. It is also recommended that UART FTDI communication cable is disconnected from the computer USB connector when the demo board is powered up. Figure 1 1 kW BLDC Motor Control Power Tool PCB (EVAL_SSO8_1kW_BLDC) 1.1 Key Features B6 Inverter for 3-phase BLDC motor Nominal voltage 20 V Continuous phase current 50 A Application Note 3 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Overview 1 kW output power (Test conditions: 100% duty, 50 A RMS per phase; Vsupply=20 V @50 A, open frame/ no forced air, 26°C room temperature; resulting in 60°C temperature rise above ambient in 1 min) Operation down to 6 V battery supply Peak current capability up to 200 A Overcurrent detection by measuring VDS,ON across the MOSFET on all 3 phases Duty cycle controlled BLDC motors with 3 hall sensors 2 parallel MOSFETs BSC010N04LSI in SuperSO8 package – 40 V/1.05 mOhm RDS(ON),max with integrated monolithic Schottky-like diode (low reverse recovery charge (Qrr) and low forward voltage diode drop (VSD) Low PCB parasitic inductance PCB − 90 mm x 36 mm overall dimensions − Power stage PCB : L=45 mm x W=36 mm x H=10 mm − Material - FR4 − 2 layers, 2oz copper (70 m) Low conduction losses Low diode losses, and low reverse recovery charge with an integrated Shottky-like diode (MGD) Low voltage overshoot and low ringing Accessible signals at the PCB interface Good thermal dissipation Temperature sensor 32-bit XMC motor control optimized microcontroller Provides all connections for power tool functions: hall sensors, speed controller pot, motor direction switch, UART communication port, debugger connection High efficiency ~99% Maximized power density ~ 75 W/cm³ Half bridge gate driver 2EDL05N06PF – 0.5 A peak Boost converter for gate driver voltage generation – programmed for 12 V (V_boost) but it can be modified for other gate driver voltages Application Note 4 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Power Tool Kit Package content 2 Power Tool Kit Package content The Power Tool Kit includes following items: Power Tool demo PCB (programmed and ready to use) USB/Serial communication adapter (FTDI Cable) USB memory stick including documentation and software 2 x 15 cm ribbon cable Figure 2 Power Tool Package 2.1 PCB The PCB consists of several building blocks: Linear regulator IFX27001TFV50 DC/DC converter stepping down the battery voltage to +5 V for MCU Boost circuit used for gate drivers and an Opamp Temperature sensor for thermal overload shutdown 3-phase full bridge inverter implemented with 2 in parallel Infineon OptiMOS™ Power MOSFETs BSC010N04LSI (Id=100 A, RDS(on)=1.05 mΩ). Current measurement by using voltage measurement across the MOSFET when turned ON 3 x Half Bridge gate driver with integrated bootstrap diode 32-bit XMC1302 microcontroller Hall sensors signal input circuitry for BLDC motor commutation Serial communication for programming and controlling the MCU Connector for a direct access to MCU debug pins 10 spare MCU pins which can be configured as input or output pins Potentiometer input for speed control L/R motor direction switch Application Note 5 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Power Tool Kit Package content Figure 3 System Block Diagram 2.2 Communication Interface Communication interface is a link between PC user interface and the board. It was realized with a commercially available cable from FTDI TTL-232R-5V-WE. Figure 4 TTL-232R-5V-WE FTDI Cable Connections Application Note 6 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Power Tool Kit Package content 2.3 Dedicated Software for the Onboard 32-bit Microcontroller The XMC microcontroller is already programmed with dedicated software for power drill application. The following functions are implemented in the software: Block commutation for running BLDC motor with voltage control Wrong Hall sensor shut down 2.4 BLDC Motor (BLDCM) The Power Tool Demo Board can run every BLDC motor equipped with 3 hall sensors. Application Note 7 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Running the Power Tool Kit 3 Running the Power Tool Kit In order to run the BLDC motor, the following connections must be made: 1. DC power supply (+20 V, GND) 2. 3 BLDC motor phases (U, V, W) 3. BLDC motor Hall Sensors (+5 V, GND, H1, H2, H3) 3.1 Connecting the board to a BLDC Motor Figure 5 Control Board Connections Note: Hall sensors must match respective phases, otherwise the inverter will immediately shut down. Application Note 8 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Running the Power Tool Kit Figure 6 Interface signals between control board and power board Figure 7 Power Inverter Board Connections Application Note 9 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Running the Power Tool Kit It is recommended that the power connection be made by means of direct soldering to the exposed copper. Since the thermal conductance is very high, use 450ºC soldering iron with a large solder tip to effectively transfer the heat to copper parts and solder the connection wires. Ensure that there are no short circuit connections between phase outputs and battery +/- copper plates. See a sample below. Figure 8 Power Inverter Board Connections Application Note 10 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Hardware Description 4 Hardware Description 4.1 Power Supply: +5 V and 12 V_boost Figure 9 Power Supply Schematic The system input voltage range is 6-24 V. The supplied voltage is stepped down to +5 V by using a low dropout voltage regulator IFX27001TFV50. This +5 V voltage is used to supply MCU, hall sensors, temperature sensor, and as supply voltage to the boost converter. The 12 V_boost voltage, which is used for gate drivers 2EDL05N06PF and the LM324 operational amplifier, is generated by the boost converter built around Q13. 4.2 Power Stage Figure 10 3 Phase Inverter Schematic The power stage is designed to drive a BLDC motor up to 1 kW using two BSC010N04LSI MOSFETs in parallel. The gate resistors have a value of 100 Ohm which can be further modified depending on desired performance. Higher value of gate resistors will increase switching losses, since the MOSFETs are switching slower, but at the same time, the slower switching will generate lower voltage overshoots and require lower filter capacitors value. If the gate resistors values are reduced, it is possible to reduce the dead time between high and low side MOSFETs leading to faster switching and lower switching losses, but on the other hand, the parasitic Application Note 11 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Hardware Description inductance of the battery and the circuit parasitic inductance will have more effect and generate higher voltage overshoot. Multilayer ceramic caps (10 x 2.2 F/50 V MLCC) are place on top side of the PCB which will filter out high frequency currents. The number of MLCCs can be further optimized depending on system requirements. 4.3 Current measurement Figure 11 Current Measurements Schematics The current measurement is implemented by means of measuring the voltage across the Drain-Source of the MOSFET. Since the MOSFET behaves like a resistor when in “ON” state, the voltage across it can be measured and the current through MOSFET can be calculated by using Ohm’s law. 𝐼𝑑𝑠 = 𝑉𝑑𝑠 [1] 𝑅𝐷𝑆(𝑜𝑛) Since the RDS(on) is dependent on temperature, we need to compensate for temperature change. In Figure 12 below (found in datasheet of BSC010N04LSI) we can see RDS(on) dependency of temperature. Two curves provided are for a typical and a maximum initial RDS(on) value. The software which is included in this package, is assuming a linear RDS(on dependency of temperature (indicated with the red line). The temperature information is obtained from the temperature sensor RT1. If more accurate current measurements are required, one can create a curve fit formula instead of linear approximation. Also in effort to reduce the measurement error, we can factor out the variation of initial RDS(ON) and op-amp offset by initial calibration. In a calibration process, it is advisable to set a known current on the power supply and cycle through all 3 phases. The readings on microcontroller A/D inputs can be then correlated with this current (suggested range ~10 A). The provided demonstration board is not calibrated. Application Note 12 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Hardware Description Figure 12 RDS(on) dependency of temperature for BSC010N04LSI From the graph above (typical curve), we can see that with increased temperature RDS,(on) is increasing. For example if the temperature rises from 25°C to 100°C, the RDS,(on) will change from 0.8 mOhm to 1.25 mOhm. In order to compensate for temperature change we can calculate the RDS(on),hot as [2] 𝑅𝐷𝑆(𝑜𝑛),ℎ𝑜𝑡 = 𝑅𝐷𝑆(𝑜𝑛),𝑐𝑜𝑙𝑑 ∗ (1 + 𝛼(𝑇ℎ𝑜𝑡 − 𝑇𝑐𝑜𝑙𝑑 ) ) where α is a temperature coefficient. Since we have 2 MOSFETs in parallel and assuming a typical RDS(on)=0.9 mOhm at 25°C, and Tj=100°C we can estimate the RDS(on),hot: 𝑅𝐷𝑆(𝑜𝑛),ℎ𝑜𝑡 = 0.9 𝑚𝑂ℎ𝑚 2 ∗ (1 + 0,45 𝑚𝑂ℎ𝑚 (100°𝐶 100°𝐶 − 25°𝐶)) = 0.60 𝑚𝑂ℎ𝑚 [3] The current is calculated as 𝐼𝑝ℎ𝑎𝑠𝑒 = 𝑉𝐷𝑆 𝑅𝐷𝑆(𝑜𝑛),ℎ𝑜𝑡 [4] Since the measured VDS signal is small due to very low RDS(on) (0.6 mOhm), an op-amp is used to amplify this signal. The op-amp amplification is set to 30 V/V. The current information is used to detect overload condition and shut down the inverter. Application Note 13 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Hardware Description 4.4 Gate Drivers Figure 13 Single Gate Driver Block Diagram Figure 14 Schematic of a 3-Phase Gate Driver Circuit Application Note 14 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Hardware Description 4.4.1 Gate driver 2EDL05N06PF features This demonstration board is using three 2EDL05N06PF Half Bridge gate drivers with integrated bootstrap diode. Main features Output current 500 mA Thin-film-SOI-technology Insensitivity of the bridge output to negative transient voltages up to -50 V given by SOI-technology Ultrafast bootstrap diode Maximum blocking voltage +600 V Individual control circuits for both outputs Filtered detection of under voltage supply All inputs clamped by diodes Off line gate clamping function Asymmetric under voltage lockout thresholds for high side and low side Qualified according to JEDEC1 (high temperature stress tests for 1000 h) for target applications 4.5 Microcontroller Figure 15 XMC1302 Microcontroller schematic The XMC1300 devices are members of the XMC1000 family of microcontrollers based on the ARM® Cortex™-M0 processor core. The XMC1300 series is suitable for the real-time control needs of the BLDC motor. It also controls all input and output signals necessary for the power tool operation. Application Note 15 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Hardware Description Figure 16 XMC1302 Microcontroller Pin out Figure 17 XMC1302 Microcontroller Block Diagram Application Note 16 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Hardware Description 4.5.1 XMC Microcontroller features CPU Subsystem CPU Core − High Performance 32-bit ARM® Cortex™-M0 CPU − Most of 16-bit Thumb instruction set − Subset of 32-bit Thumb2 instruction set − High code density with 32-bit performance − Single cycle 32-bit hardware multiplier − System timer (SysTick) for Operating System support − Ultra low power consumption Nested Vectored Interrupt Controller (NVIC) Event Request Unit (ERU) for programmable processing of external and internal service requests MATH Co-processor (MATH), consists of a CORDIC unit for trigonometric calculation and a division unit On-Chip Memories 8 kbytes on-chip ROM 16 kbytes on-chip high-speed SRAM 200 kbytes on-chip Flash program and data memory Communication Peripherals Two Universal Serial Interface Channels (USIC), usable as UART, double-SPI, quad-SPI, IIC, IIS and LIN interfaces Analog Frontend Peripherals 12 A/D Converters, includes 2 sample and hold stages and a fast 12-bit analog to digital converter with adjustable gain 8 channels of out of range comparators (ORC) 3 fast analog comparators (ACMP) Temperature Sensor (TSE) Industrial Control Peripherals Capture/Compare Units 4 (CCU4) for use as general purpose timers Capture/Compare Units 8 (CCU8) for motor control and power conversion Position Interfaces (POSIF) for hall and quadrature encoders and motor positioning Brightness and Color Control Unit (BCCU), for LED color and dimming application System Control Window Watchdog Timer (WDT) for safety sensitive applications Real Time Clock module with alarm support (RTC) System Control Unit (SCU) for system configuration and control Pseudo random number generator (PRNG), provides random data with fast generation times Application Note 17 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Hardware Description Input/Output Lines With Individual Bit Controllability Tri-stated in input mode Push/pull or open drain output mode Configurable pad hysteresis Debug System Access through the standard ARM serial wire debug (SWD) or the single pin debug (SPD) interface A breakpoint unit (BPU) supporting up to 4 hardware breakpoints A watchpoint unit (DWT) supporting up to 2 watchpoints 4.6 Hall Sensors Digital Inputs Figure 18 Hall Sensor Input Schematic Figure 19 Communication Port Schematic Table 1 Communication Port Pin Out Connector X7 Pin Number Name TTL-232R-5V-WE FTDI cable connection 5 Receive Input (Rx) Yellow - RXD 4 Transmit Output (Tx) Orange - TXD 1 Ground (GND) Black - GND Application Note 18 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Hardware Description 4.7 Free MCU pins Since one of the objectives of this reference board is to create a very compact design, the MCU free pins are directly accessible at the PCB bottom side. Free MCU pins are : #2,3,4,5,11,12,19,29,30,35 Application Note 19 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual PCB 5 PCB 5.1 Schematic Figure 20 Complete Schematic Application Note 20 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual PCB 5.2 Layout and Placement Figure 21 PCB Top (90 mm x 36 mm) Figure 22 Gerber File - Copper Top Application Note 21 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual PCB Figure 23 PCB Bottom Figure 24 Gerber file - Copper Bottom Application Note 22 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual PCB Figure 25 Top Overlay – Control PCB Figure 26 Top Overlay – Power PCB Application Note 23 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual PCB Direct access to microcontroller pins Figure 27 Bottom Overlay – Control PCB Figure 28 Bottom Overlay – Power PCB 5.3 PCB production During the PCB production it is important to establish a good connection between the MOSFET and the PCB copper plane. This will ensure a good heat transfer to the copper plates. This demonstration board is produced with the solder profile shown below. The results are displayed in x-ray pictures which indicate an acceptable voids rate of approximetely 5-10%. Application Note 24 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual PCB Figure 29 Solder Profile – temperature versus time; Solder Paste type 3: Indium 8.9 Pb-Free Figure 30 X-ray showing voids distribution of a complete power stage (left); zoomed (right) Figure 31 Stencil patterns (yellow color); Stencil thickness 120 m Application Note 25 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual PCB 5.4 Bill of Material Table 2 BOM Quantity Designator 12 C33,15,16,21, Murata 22,25,29,34,3 5,30,8,5 GRM31MR71E2 MURATA 25KA93L GRM31MR71E225KA93L Capacitor, 1206, 2.2uF, 25V 1206 6 C1, C3, C4, Murata C26, C27, C31 GRM31MR71E2 MURATA 25KA93L GRM31MR71E225KA93L Capacitor, 1206, 2.2uF, 25V 1206 1 C2 NICHICON TVX1V102MCD 6 C12, C13, C18, C19, C23, C24 TDK C2012X7R1E10 Multilayer Ceramic Capacitors 5K125AB MLCC - SMD/SMT 0805 1 uF 25volts X7R 10% 805 2 C6, C7 United ChemiCon EKMGG350ELL 100ME 5x11 mm 6 C10, C11, C14, C17, C20, C38 Kemet C0603C104K5R Multilayer Ceramic Capacitors ACTU MLCC - SMD/SMT 50volts 0.1uF X7R 10% 2 D14, D15 Infineon Technologies BAT 165 E6327 Schottky Diodes & Rectifiers SOD-323 Med-Power AF 750 mA Schottky Diode 40 V 3 D17, D20, D22 ON MM3Z5V1T1G SEMICONDUCT OR ZENER DIODE, 200 mW, 5.1 V SOD-323 1 D18 ON 1SMA5931BT3 SEMICONDUCT G OR Zener Diodes 18 V 1.5 W DO214AC 1 IC1 Infineon Technologies IFX27001TFV50 LDO Voltage Regulators Linear Voltage Regulator PG-TO252-3 1 IC2 Infineon Technologies XMC1302XMC1302 ARM® Cortex™-M0 32T038X0200_AA bit Microcontroller SOP50P64 0X120-38N 1 L1 Bourns CM453232820KL 1812 12 Q1, Q2, Q3, Q4, Q5, Q6, Q7, Q8, Q9, Q10, Q11, Q12 Infineon Technologies BSC010N04LSI MOSFET 40 V 1.05 mOhm 100 A ATMA1 PGTDSON-8 FL 1 Q13 Infineon Technologies BSS670S2LH63 N-Channel Small Signal 27XT MOSFET 55 V/650 mOhm PG-SOT-23 12 R7,8,9,10,11, KOA RK73H1JTTD1 603 Application Note Manufacturer Manufacturer Part Number 26 Description Footprint NICHICON - TVX1V102MCD – Capacitor, 1000uF, 35V Aluminum Electrolytic Capacitors - Leaded 35 V 10uF 5X11 Fixed Inductors 82uH 10% Wirewound Thick Film Resistors - SMD 1/10 13 mm x 31.5 mm Axial 603 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual PCB Quantity Designator Manufacturer 12,22,23,24,2 5,26,27 Manufacturer Part Number 000F Description Footprint watts 100 Ohm 1% 3 R37,R46,R55 KOA RK73H1JTTD7 501F Thick Film Resistors - SMD 1/10 watt 7.5 kOhm 1% 603 7 R39,50,40,43, KOA 32,53,47 RK73H1JTTD1 002F Thick Film Resistors - SMD 1/10 watts 10 kOhm 1% 603 3 R73,R74,R75 KOA RK73H1JTTD1 500F Thick Film Resistors - SMD 1/10 watts 150 Ohm 1% 603 6 R33,42,51,70, KOA 71,72 RK73H1JTTD2 201F Thick Film Resistors - SMD 1/10 watt 2.2 kOhm 1% 603 1 R38 KOA RK73H1JTTD1 601F Thick Film Resistors - SMD 1/10 watt 1.6 kOhm 1% 603 3 R34,44,52 KOA RK73H1JTTD2 203F Thick Film Resistors - SMD 1/10 watt 220 kOhm 1% 603 1 R35 KOA RK73H1JTTD3 302F Thick Film Resistors - SMD 1/10 watt 33 kOhm 1% 603 1 R41 KOA RK73H1JTTD2 002F Thick Film Resistors - SMD 1/10 watt 20 kOhm 1% 603 6 R36,13,14,15, KOA 28,29,30 RK73H1JTTD1 003F Thick Film Resistors - SMD 1/10 watt 100 kOhm 1% 603 1 R36 KOA RK73H1JTTD1 003F Thick Film Resistors - SMD 1/10 watt 100 kOhm 1% 603 1 RT1 Microchip Technology MCP9700TE/TT Board Mount Temperature Sensors Lin Active Therm 10 mV / C SOT-23-3 1 U1 Texas Instruments LM324PWR Operational Amplifiers Quad GP Opamp TSSOP-14 3 U2, U3, U4 Infineon 2EDL05N06PF EiceDRIVER™ high voltage gate driver IC SOIC127P 600X1758N-2 3 Dulling Elektro 9015_006 & Metal GmBH Copper plate U-Teil 6 custom made 4 Dulling Elektro 9015_007 & Metal GmBH Copper plate U -Teil 7 custom made 2 X1, X4 Samtec Inc HTSW-102-07L-S CONN HEADER 2POS .100" T/H GOLD vertical, single row 1 X3 Samtec Inc HTSW-103-07G-S CONN HEADER 3POS .100" T/H GOLD vertical, single row 1 X7 Samtec Inc HTSW-106-07G-S CONN HEADER 6POS .1" T/H GOLD vertical, single row 1 X8 Samtec Inc HTSW-105-07G-S CONN HEADER 5POS .100" T/H GLD vertical, single row Application Note 27 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Software 6 Software 6.1 Overview The motor control software is based on a voltage control block commutation algorithm of the BLDC motor. The microcontroller reads 3 hall switch patterns in order to determine the correct switching sequence for the phase commutation. Other input variables such as phase current, temperature, supply voltage, and a wrong hall pattern sequence are also being monitored by the microcontroller. According to their values, the microcontroller takes an action and controls the power inverter stage accordingly. This demonstration board is already programmed with dedicated software for cordless power drill and is ready for use. 6.2 Features Unipolar Block Commutation with active rectification Overcurrent shut down Over temperature shut down Wrong hall pattern shut down Motor soft start Monitoring input DC voltage Programmable boost converter 6.2.1 Unipolar Block Commutation with active rectification In a unipolar voltage control, while the low side switch (LS) is ON, the PWM pulses are applied to the high sided switch (HS). In addition, the Synch_FET is turned ON when the body diode of the Synch_FET is conducting. In this way the diode losses are minimized. The dead time between HS and LS MOSFETs should be set depending on turn-on and turn-off time of the HS which is directly related to the value of the gate resistors. In this particular example the dead time is set to 2 s (using Rg=100 Ohm). The Figure 32 below shows active components while energizing phases U and V, and Figure 32/Figure 33 shows control signals for commutation of all 3 phases. Application Note 28 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Software Figure 32 Unipolar voltage switching with synchronous rectification for a single phase Figure 33 Unipolar voltage switching with synchronous rectification for all 3 phases 6.2.2 Overcurrent shut down Each phase current is monitored by measuring and amplifying the drain-source voltage of the low side MOSFET during its ON state. This voltage is evaluated and temperature compensated by XMC microcontroller (refer to RDS(on) vs. temperature diagram). The current threshold is set to 150 A. If the phase current exceeds 150 A, the inverter will shut down and stay in de-energized state until the next power cycle. 6.2.3 Overtemperature shut down The temperature sensor is placed in vicinity of high side MOSFET of W-phase. When temperature of 80°C is reached the inverter will shut down until the temperature sensor cools down to 50°C. When 50°C is reached, the inverter will automatically turn ON again and resume the operation. Application Note 29 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Software 6.2.4 Wrong hall pattern shut down If the hall patterns do not match the expected sequence (wrong connection), the power stage will shut down to prevent the MOSFET overstress. Each time this condition is encountered, the unit needs to be reset. 6.2.5 Motor soft start In order to prevent high inrush current, the motor control regulates the rate of duty cycle i.e. voltage increment applied to the motor. 6.2.6 Monitoring input DC voltage The input DC voltage is monitored by the XMC microcontroller A/D input which reads the voltage across the resistive voltage divider connected across the battery terminals. The operating voltage range is 6-24 V. 6.2.7 Programmable boost converter The boost converter regulates the gate driver voltage to 12 V. The XMC microcontroller A/D input reads the boost voltage and regulates it accordingly. The boost converter output voltage of 12 V is also used for Opamp voltage supply. 6.2.8 Asymmetric Authentication Feature XMC1302 support Infineon’s Asymmetric Authentication Solution ORIGA™. The authentication chip normally will be embedded in the battery and it can be used to detect and authenticate genuine batteries before charging or operating the tool. ORIGA™ single wire interface (SWI) can be connected to P0.15 and this device can operate in 2 wire mode (SWI and GND). The complete host code is already integrated in the XMC1302 library (would require recompilation with compiler directive). If this feature is implemented, the motor will not start in the event of authentication failure. This authentication feature benefits the user by providing safe reliable operating and charging environment. For ORIGA™ hardware and more information, please visit http://www.infineon.com/origa Application Note 30 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual XMC microcontroller development platform DAVE™ 7 XMC microcontroller development platform DAVE™ Further Information: http://www.infineon.com/dave Figure 34 Block diagram of XMC microcontroller DAVE™ software is a free development platform which reduces software development time for XMC microcontrollers. It includes a complete free tool chain including a GNU compiler, debugger, and a data visualization tool. DAVE™ Apps are application components for a wide range of use which makes it easy to fully utilize flexible peripherals. A resource solver ensures conflict free mapping of chip resources. Application Note 31 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Test Results 8 Test Results 8.1 Efficiency measurement For the efficiency measurement following setup is used: Figure 35 Measurement Setup Test setup description: A regulated power supply is used to provide the voltage to the demo board. The supplied current and voltage is fed to the power analyzer. At the output of the DEMO PCB, all 3 phase voltages and currents are fed to the power analyzer. In order to apply the load, another LOAD BLDC motor is used to break the BLDC MOTOR. These two motors are interconnected with a mechanical coupling. When the BLDC motor spins, the load motor acts as a generator and induces voltage which is rectified with a 3 phase diode bridge. This output voltage is further filtered with a DC link cap. A DC electronic load is connected at the output of the 3 phase diode bridge. By applying different setting on the electronic load, different loading conditions can be achieved. In effort to improve the efficiency of the power stage, Infineon has developed a MOSFET with integrated monolithic Schottky-like diode which reduces the diode forward voltage drop losses and also diode reverse recovery losses. In order to show the benefits of this technology, two equivalent measurements are performed. The Table 3 shows the measurements without the Schottky-like diode, and the Table 4 shows the measurements with the Schottky-like diode. The details of measurements are shown below. Table 3 Efficiency measurement with BSC010N04LS in block commutated BLDC motor drive Input Power [W] Output Power [W] Efficiency [%] Power Losses [W] 833 825 99.0 8.0 968 953 98.5 15.0 1099 1076 97.9 23.0 1172 1142 97.4 30.0 Application Note 32 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Test Results Table 4 Efficiency measurement with BSC010N04LSI in block commutated BLDC motor drive Input Power [W] Output Power [W] Efficiency [%] Power Losses [W] 832.24 825.83 99.2 6.4 975.34 962.56 98.7 12.8 1100.6 1080.81 98.2 19.8 1229.3 1202.63 97.8 26.7 The table below shows the difference in power loss between BSC010N04LS and BSC010N04LSI. Table 5 Figure 36 Efficiency summary of BSC010N04LS vs. BSC010N04LSI Output Power [W] Δ Power Losses [W] Efficiency Gain [%] 825 1.6 0.2 953 2.2 0.2 1076 3.2 0.3 Phase voltage (yellow trace) and phase current (green trace) waveforms The temperature measurements are performed on BSC010N04LSI and BSC010N04LS with the infrared camera. As previous efficiency tables indicates, we expect a longer run time with the MOSFET with integrated monolithic Schottky-like diode BSC010N04LSI. Test conditions: full power; 100% duty, Iphase=50 A(rms), Vbat=20 V , no forced air, room temperature; Application Note 33 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Test Results Figure 37 Temperature rise at full power with BSC010N04LSI Figure 38 Temperature rise at full power with BSC010N04LS Application Note 34 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Test Results 8.1.1 Determining the Zth 8.1.2 Zth of the complete power inverter stage including copper elements As mentioned in earlier chapter, it is essential to establish a good thermal connection between the MOSFET and the PCB. This ensures a good thermal connection between a MOSFET and cooling copper plates. In order to determine how a system behaves thermally, we refer to a Zth diagram. The Zth diagram provides the information of how much power we are able to dissipate for a specified duration and what will be the resultant temperature of the MOSFET at the end of power pulse. The Zth diagram below is shown for this system. Figure 39 Zth diagram of the power inverter Note: The Zth diagram above should not be confused with the MOSFET Zth diagram. For power pulses less than 0.1 s, please refer to MOSFET data sheet Zth diagram. Application Note 35 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Properties of integrated Schottky-like diode 9 Properties of integrated Schottky-like diode The efficiency measurements and the temperature graphs show that the BSC010N04LSI has about 20% power loss reduction or 20% longer running time as compared to BSC010N04LS under the same loading conditions. This efficiency gain is due to integrated monolithic Schottky-like diode. If we take a closer look at the diode forward voltage graph, we can see that the BSC010N04LSI diode has a lower forward voltage drop, and also lower recovery charge which account for higher efficiency. Figure 40 BSC010N04LSI BSC010N04LS Forward characteristics of reverse diode for BSC010N04LSI and BSC010N04LS The positive effect of the integrated Schottky-like diode has also some drawbacks. Some of the parameters of interest are: Leakage current, RDS(on), and avalanche capability. The summary is shown in the table below. Table 6 Comparison of parameters of interest for BSC010N04LS and BSC010N04LSI Parameter Description Test conditions BSC010N04LS BSC010N04LSI IDSS Zero gate voltage drain current VGS=0, VDS=32 V, Tj=25°C 1 mA 500 mA RDS(on),max Drain-source on-state resistance VGS=10 V, ID=50 A 1.00 mOhm 1.05 mOhm EAS Avalanche energy, single pulse ID=50 A, RGS=25 Ohm 330 mJ 230 mJ Nevertheless, in power tool application the advantage of integrated diode outweighs its drawbacks. Application Note 36 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Properties of integrated Schottky-like diode Leakage current: In most designs the relevance of leakage current, which is important for a stand by operation, is minimized since the power trigger switch separates battery from the circuit and the stand by current is virtually reduced to zero. In the ON state during normal operation this leakage current is negligible compared to the load current. The leakage current is greatly reduced at lower voltages. For BSC010N04LSI at 10 V, the voltage which a MOSFET will experience in a half bridge configuration connected to 20 V source, is 5 A. The leakage current increases with the temperature. The leakage current graph as a function of applied voltage and temperature is given below. Figure 41 Leakage current versus Drain-Source voltage RDS(on) : In case of BSC010N04LSI, the RDS(on) is increased by 5% which increases conduction losses. Nevertheless, despite the slightly increased conduction losses, the power loss reduction due to integrated monolithic Schottky-like diode is greater. Avalanche: The avalanche rating of a MOSFET becomes important only if the breakdown voltage V(BR)DSS is exceeded. This demonstration board has very low voltage overshoot due to low reverse recovery charge Qrr of the integrated monolithic Schottky-like diode, and a low PCB layout parasitic inductance. It is not recommended to exceed the maximum breakdown voltage V(BR)DSS of a MOSFET at any time. The avalanche energy contained in a voltage overshoot is difficult to quantify, thus it present a risk to exceed the maximum avalanche EAS rating of a MOSFET if the V(BR)DSS is exceeded. Application Note 37 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Conclusion 10 Conclusion The presented demonstration board provides a plug and play solution for driving BLDC motors in cordless power tool applications. The optimized size allows a quick integration in cordless power drills. With Infineon developed dedicated software, and a free software development platform DAVE™, the user is able to integrate additional functions. The generated Zth diagram for the inverter power stage allows the designer to determine the MOSFET temperature for a given condition. This can be very useful especially for motor start up and locked rotor conditions. It was shown that in BLDC motor power inverter, the body diode plays a key role. The power loss and temperature measurements show an improvement of up to 20% of BSC010N04LSI MOSFET with integrated Schottky-like diode. The Infineon’s patented Schottky-like diode MOSFET technology, enables the tool manufacturers to implement their solution with a cost effective packages such as SuperSO8 and achieve more motor torque, higher current operation, and up to 20% saving in power losses which is directly proportional to longer operation time in the application. Application Note 38 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Accessories 11 Accessories 11.1 ORIGA™ Authentication This demonstration board can in addition be equipped with an authentication hardware and software which ensures usage of OEM batteries only. For more information and implementation of the ORIGA™ go to http://www.infineon.com/origa Application Note 39 Revision 2.0, 2014-10-09 1 kW BLDC Power Tool Kit User Manual Useful material and links 12 Useful material and links DAVE™ - Free Development Platform for Code Generation: http://www.infineon.com/dave OptiMOS™ 40V/60V Webpage: http://www.infineon.com/optimos5-40v60v Product Brief OptiMOS™ 40V/60V: http://www.infineon.com/dgdl/Infineon+-+Product+Brief+-+Power+MOSFETs++OptiMOS+5+40V+and+60V.pdf?folderId=db3a304314dca38901154c20869c1b30&fileId=db3a3043353fdc 16013543568a1731a7 Video OptiMOS™ 5 40V/60V http://www.edge-cdn.net/index.php?ct=1353&vid=163276&setlang=en ORIGA™ – Battery Authentication - Webpage http://www.infienon.com/origa XMC 1000 Webpage http://www.infineon.com/xmc1000 EiceDRIVER™ Compact Webpage http://www.infineon.com/eicedriver-compact Revision History Major changes since the last revision Page or Reference -- Application Note Description of change First Release 40 Revision 2.0, 2014-10-09 Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2011-11-11 www.infineon.com Edition 2014-10-09 Published by Infineon Technologies AG 81726 Munich, Germany © 2015 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? 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