KSM3N80 800V N-channel MOSFET KERSMI ELECTRONIC CO.,LTD. Description This N-channel MOSFETS use advanced trench technology and design to provide excellent RDS(on) with low gate charge. It can be used in a wide variety of applications. Features 1) 2) 3) 4) BVDSS RDSON ID 800V 4.8Ω 3A Low gate charge. Green device available. Advanced high cell denity trench technology for ultra RDS(ON) Excellent package for good heat dissipation. TO-220 Absolute Maximum RatingsTC=25℃,unless otherwise noted Symbol Parameter Ratings Units VDS Drain-Source Voltage 800 VGS Gate-Source Voltage ±30 V V Continuous Drain Current-1 3.0 Continuous Drain Current-T=100℃ 1.9 Pulsed Drain Current2 12 EAS Single Pulse Avalanche Energy3 320 PD Power Dissipation4 107 TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 ID A mJ W ℃ Thermal Characteristics www.kersemi.com 1 KSM3N80 KERSMI ELECTRONIC CO.,LTD. Symbol Parameter Ratings RƟJC Thermal Resistance, Junction to Case1 1.17 RƟJA Thermal Resistance, Junction to Ambient1 62.5 Units ℃/W Package Marking and Ordering Information Part NO. Marking Package KSM3N80 KSM3N80 TO-220 Electrical Characteristics TC=25℃ Symbol Parameter unless otherwise noted Conditions Min Typ Max Units Off Characteristics BVDSS Drain-Sourtce Breakdown Voltage VDS=0V,ID=250μA 800 — — IDSS Zero Gate Voltage Drain Current VDS=0V, VDS=32V — — 10 IGSS Gate-Source Leakage Current VDS=±20V, VDS=0A — — ±100 v μA nA VDS=VDS, ID=250μA 3.0 — 5.0 V VDS=10V,ID=6A — 3.8 4.8 VDS=2.5V,ID=5A — — — VDS=5V,ID=12A — 2.8 — — 530 690 — 57 75 — 7.0 9.0 — 15 40 — 40 90 — 30 70 On Characteristics VGS(th) GATE-Source Threshold Voltage RDS(ON) Drain-Source On Resistance² GFS Forward Transconductance Ω S Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS=15V,VGS=0V, f=1MHz pF Switching Characteristics td(off) Turn-Off Delay Time tf Fall Time — 30 70 Qg Total Gate Charge — 15 19 Qgs Gate-SourceCharge VGS=4.5V, VDS=20V, — 3.5 — Qgd Gate-Drain “Miller” Charge ID=6A — 7.7 — ns ns ns ns nC nC nC — — 1.4 V — 530 — ns — 2.8 — nC td(on) Turn-On Delay Time tr Rise Time VDS=20V, VGS=10V,RGEN=3.3Ω Drain-Source Diode Characteristics VSD Source-Drain Diode ForwardVoltage² trr Reverse Recovery Time Qrr Reverse Recovery Charge VGS=0V,IS =1A IF=7A,di/dt=100A/μS www.kersemi.com 2 KSM3N80 KERSMI ELECTRONIC CO.,LTD. Notes: 1. The data tested by surface mounted on a 1 inch²FR-4 board 2OZ copper. 2. The data tested by pulsed,pulse width≤300us,duty cycle≤2% 3. The EAS data shows Max.rating.The test condition is VDD=25v,VGS=10V,L=0.1mH,iAS=17.8A 4. The power dissipation is limited by 150℃ junction temperature. Typical Characteristics TJ=25℃ unless otherwise noted Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics Figure 3. Capacitance Characteristics Figure 4. On-Resistance Variation vs Drain Current and Gate Voltage www.kersemi.com 3 KSM3N80 KERSMI ELECTRONIC CO.,LTD. Figure 5. Gate Charge Characteristics Figure 7. Breakdown Voltage Variation vs. Temperature Figure 6. Body Diode Forward Voltage Variation vs. Source Current and Temperature Figure 8. Maximum Safe Operating Area Figure 9. Transient Thermal Response Curve www.kersemi.com 4