DM(R)、NDI(R)、DL(R)、DJ SPECIFICATION 文 件 編 號 : E-B-AD05 版 次 : F 頁 次 : 1 / 4 1.Style: This specification describes "DUAL IN-LINE PACKAGE SWITCHES" mainly used as signal switch of electric devices with the general requirements of mechanical and electrical characteristics. 1.1 Operating Temperature Range : -20℃ ~ +85℃ 1.2 Storage Temperature Range : -40℃ ~ +85℃ 2. Current Range : 2.1 Non-Switching : 100mA, 50V DC 2.2 Switching : 25mA , 24V DC 3. Type of Actuation: Actuated by sliding 4. Test Sequence : ELECTRIC PERFORMANCE ITEM DESCRIPTION 1 2 3 4 MECHANICAL PERFORMANCE 5 6 TEST CONDITIONS Visual By visual examination check without Examination any out pressure & testing. REQUIREMENTS There shall be no defects that affect the serviceability of the product. cTo be measured between the two terminals associated with each Contact switch pole. 50mΩ max. (initial) Resistance dMeasurements shall be made with a 1kHz shall current contact resistance meter. Insulation 500V DC, 1 minute ± 5 sec. 100MΩ min. Resistance 500V AC (50Hz or 60 Hz) shall be Dielectric There shall be no applied between all the adjacent withstandbreakdown or terminals and between the terminal ing Voltage flashover. and the frame for 1 minute. Capacitance 1 MHz ± 10 kHz 5 pF max. Applied in the direction of operation. ON→OFF 1000gf max Operation OFF→ON Force （9.8N max） 文 件 編 號 : E-B-AD05 版 次 : F 頁 次 : 2 / 4 DM(R)、NDI(R)、DL(R)、DJ SPECIFICATION 7 Stop Strength A static load of 1 kgf is applied in the operating direction and pulling direction operated for a period of 15 seconds. There shall be no sign of damage mechanically. MECHANICAL PERFORMANCE 1.Soldering Temperature : Soldering Heat 8 Resistance 9 Vibration 10 Shock 11 Solderability PROD SERIES TEMP TIME THROUGH HOLE TYPE NDI(R) 260℃±5℃ 5±1 sec. SMT TYPE SEE PAGE 4/4 DM(R)、DL(R) 2.Duration of Solder Immersion: 5±1 sec. 3.Frequency of Soldering Process: 2 times max. (PCB is 1.6mm in thickness.) Shall be vibrated in accordance with Method 201A of MIL-STD-202F cFrequency: 10-55-10 Hz 1 min/cycle. dDirection: 3 vertical directions including the direction of operation. eTest Time: 2 hours each direction. Shall be shocked in accordance with Method 213B condition A of MIL-STD-202F cAcceleration: 50G. dAction Time : 11 ± 1 m sec. eTesting Direction: 6 sides. fTest cycle : 3 times in each direction cNDI(R)Soldering Temperature:230±5℃ dDM(R)、DL(R)Soldering Temperature: SEE PAGE 4/4 eSoldering Temperature: SEE PAGE 4/4 fFlux: 5-10 seconds. gDuration of solder Immersion:3±0.5 sec. As shown in item 2~6 As shown in item 2~6 As shown in item 2~6 No anti-soldering and the coverage of dipping into solder must more than 75% was requested. DURABILITY DM(R)、NDI(R)、DL(R)、DJ SPECIFICATION Measurements shall be made following the test set forth below: Operation c25 mA, 24V DC resistive load 12 dRate of Operation: 15~20 cycles/ Life minute eCycle of Operation: 2000 cycles. Resistance Low 13 Temperature WEATHER-PROOF 文 件 編 號 : E-B-AD05 版 次 : F 頁 次 : 3 / 4 Resistance High 14 Temperatur e 15 Resistance Humidity Following the test set forth below the sample shall be left in normal temperature and humidity conditions for an hour before measurements are made : cTemperature : -40℃±3℃ dTime: 96 hours Following the test set forth below the sample shall be left in normal temperature and humidity conditions for an hour before measurements are made : cTemperature : 85℃±2℃ dTime: 96 hours Following the test set forth below the sample shall be left in normal temperature and humidity conditions for an hour before measurements are made : cTemperature : 85℃±2℃ dRelative Humidity :90~95% eTime: 96 hours cAs show in item 3,4 dContact Resistance: 100mΩ max. (final-after test) As shown in item 2~6 1.As shown in item 3~6 2.Contact Resistance: 100mΩ max. 1.As shown in item 4,6 2.Contact Resistance: 100mΩ max. 3.Insulation Resistance: 10MΩ min. 文 件 編 號 : E-B-AD05 版 次 : F 頁 次 : 4 / 4 DM(R)、NDI(R)、DL(R)、DJ SPECIFICATION 5. SOLDERING CONDITIONS: ■ Condition for Soldering –DM(R)、DL(R) Series ■ The condition mentioned above is the temperature on the Cu foil of the P.C.B surface. There are cases where board’s temperature greatly differs from switch’s surface temperature depending on board’s material, size, thickness, etc. Care, therefore, should be used not to allow switch’s surface temperature to exceed 240℃. ■ Manual Soldering Soldering Temperature Max.350℃ Continuous Soldering Time Max. 3 seconds ■ Precautions in Handling 1. Care should be exercised so that flux from the upper part of the printed circuit board does not adhere to the switch. 2. Don’t clean the switch body except with top tape sealed type, which can only spray of cleaning method from top of s/w. 3. Please make sure that there is no flux rose over the surface of the PCB