C:\Documents and Settings\IRENE\Local Settings\Temporary

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DAILYWELL
চЁκ
অ‫ࡕׯ‬Ёκ
ᡂ‫׳‬Вය
ቺճ࠶ႝηިҽԖज़Ϧљ
A
SIZE
ቹ౐ʳ A4
inch
mm
໢‫ۯ‬
UNIT
ʳ്ʳʳʳᑇ
SHEET
IRENE
।໢ᒳᇆ : QR-0507
ʳʳʳʳ፹ʳʳʳʳቹʳ
DRAWN BY
MAY - 16 - 2013
RICHARD
ֲʳʳཚ
DATE
DJR-08-T-V
J TYPE DIP SWITCH
DAILYWELL ELECTRONICS CO.,LTD.
TITLE
ቹʳʳʳ‫ټ‬
ቹʳʳʳʳᇆʳ
DWG NO.
ठʳ‫ء‬
REV.
ʳʳʳʳʳᐉʳʳʳʳʳʳʳு
CHECKED BY
ठ‫ ء‬: C
SCALE (ֺࠏ) : 5 : 1
FILE NAME : Y1307
ᐚ‫ܓ‬৖ሽ՗ैٝ‫ૻڶ‬ֆ‫׹‬
ITEM
DESC.
Q’TY
1.
COVER
1
2.
ACTUATOR
1
3.
CONTACT
1
4.
TERMINAL
1
5.
BASE
1
6.
TAPE
1
MATERIALS
HIGH – TEMP.
THERMOPLASTIC
PPS UL 94V–0
THERMOPLASTIC
NYLON UL 94V–0
TREATMENT
REMARK
MOLDED BLACK
-
MOLDED WHITE
-
GOLD PLATED AT
CONTACT AREA.
†= GOLD PLATED
P= GOLD PLATED AT
CONTACT
AREA,TIN/LEAD AT
TERMINATION AREA.
ALLOY-COPPER
BRASS
THERMOPLASTIC PPS UL
94V-0
KAPTON
-
MOLDED BLACK
-
-
-
!
!
!
!
!
!
!
!
!
Sfnbsl;!
c!!Prod. No/!!;!!!!!!!!D
!
Actuator Type;!
† = Raised Actuator.
R
= Recessed Actuator.
!
Number
Of
Position:
02 =
2
Position
03 =
3
Position
J
!
†!!.!!†!!†!!†!†!!†!
!!!!!!!!!!!!!!!!!!!!
!!!!!!!!!!!!!!!!!!!!!Package Style:
!!!!!!!!!!!!!!!!!!!!!ɍ = Tube
!!!!!!!!!!!!!!!!!!!!!T/R = Tape & Reel
!
!
!!!!!!!!!!!!!!!!!!!!!Seal:
!!!!!!!!!!!!!!!!!!!!!ɍ!= Regular!
!!!!!!!!!!!!!!!!!!!!!T = Top Tape Sealed
!
04 = 4 Position
!!!!!!!!!!!!!!!!ɍ =Gold Plated
05 = 5 Position
!!!!!!!!!!!!!!!! P =Tin/Lead Plated
06 = 6 Position
!
07 = 7 Position
!
08 = 8 Position
!
09 = 9 Position
10 = 10
Position
12 = 12
Position
dThe amounts of actuators, contacts, and terminals are based on position number.
!
!
!
!
!
!
!
!
!
!
!
!
!
!
!
!
!
π)πᡂ*1113:! ླྀᙦ൤!
C! !!EXH/SFM!
ླྀᙦ൤!
B! !!FDP/!OP!
!!BQQE!
!SFW! !
!
!
!
!
!
!
APPD. : ླྀᙦ൤
TITLE:
S.M.T TYPE DIP SWITCHES CHKD. : ֆਁύ
PRROD. NO. : DJ(R)-ɍɍ
PR.
: ླྀ‫ٵ‬Ꮒ
!
!!!!!!!!!!!!!!!!Q/404!
DM(R)ǵNDI(R)ǵDL(R)-V SPECIFICATION
FILE No.ʳ
REV.ʳ
Pageʳ
: E-V-AD05
:
B
: 1 / 4
1.Style:
This specification describes "DUAL IN-LINE PACKAGE SWITCHES" mainly used
as signal switch of electric devices with the general requirements of mechanical
and electrical characteristics.
1.1 Operating Temperature Range : -20к ~ +85к
1.2 Storage Temperature Range : -40к ~ +85к
2. Current Range :
2.1 Non-Switching : 100mA, 50V DC
2.2 Switching
: 25mA , 24V DC
3. Type of Actuation: Actuated by sliding
4. Test Sequence
:
ELECTRIC PERFORMANCE
ITEM DESCRIPTION
1
2
3
4
MECHANICAL
PERFORMANCE
5
6
TEST CONDITIONS
Visual
By visual examination check without
Examination any out pressure & testing.
REQUIREMENTS
There shall be no
defects that affect the
serviceability of the
product.
cTo be measured between the two
terminals associated with each
switch pole.
Contact
50m max. (initial)
Resistance dMeasurements shall be made with a
1kHz shall current contact resistance
meter.
Insulation
500V DC, 1 minute ± 5 sec.
100M min.
Resistance
500V AC (50Hz or 60 Hz) shall be
There shall be no
Dielectric
applied between all the adjacent
breakdown or
withstandterminals and between the terminal
flashover.
ing Voltage
and the frame for 1 minute.
Capacitance 1 MHz ± 10 kHz
5 pF max.
Applied in the direction of operation.
ONOFF
1000gf max
Operation OFFON
Force
Ȑ9.8N maxȑ
FILE No.ʳ
REV.ʳ
Pageʳ
DM(R)ǵNDI(R)ǵDL(R)-V SPECIFICATION
7
Stop
Strength
A static load of 1 kgf is applied in the
operating direction and pulling direction
operated for a period of 15 seconds.
: E-V-AD05
:
B
: 2 / 4
There shall be no sign of
damage mechanically.
MECHANICAL PERFORMANCE
1.Soldering Temperature :
PROD SERIES
TEMP
TIME
THROUGH HOLE
TYPE
NDI(R)-V
260к±5к
5±1 sec.
Soldering
SMT TYPE
Heat
As shown in item 2~6
8
SEE PAGE 4/4
DM(R)ǵDL(R)-V
Resistance
2.Duration of Solder Immersion:
5±1 sec.
3.Frequency of Soldering Process:
2 times max.
(PCB is 1.6mm in thickness.)
Shall be vibrated in accordance with
Method 201A of MIL-STD-202F
cFrequency: 10-55-10 Hz 1 min/cycle.
As shown in item 2~6
9 Vibration
dDirection: 3 vertical directions including
the direction of operation.
eTest Time: 2 hours each direction.
Shall be shocked in accordance with
Method 213B condition A of
MIL-STD-202F
Shock
cAcceleration: 50G.
As shown in item 2~6
10
dAction Time : 11 ± 1 m sec.
eTesting Direction: 6 sides.
fTest cycle : 3 times in each direction
cTHROUGH HOLE TYPE Soldering
Temperature:245±3к
Lead-Free solderΚM705E JIS Z 3282 Class
No anti-soldering and the
A
coverage of dipping into
(Tin 96.5%ΔSilver 3%ΔCopper 0.5%)
11 Solderability
solder must more than
dFlux: 5-10 seconds.
75% was requested.
eDuration of solder Immersion:
3±0.5 sec.
f SMT TYPE SEE PAGE 4/4
DURABILITY
DM(R)ǵNDI(R)ǵDL(R)-V SPECIFICATION
Measurements shall be made following
the test set forth below:
Operation c25 mA, 24V DC resistive load
12
dRate of Operation: 15~20 cycles/
Life
minute
eCycle of Operation: 2000 cycles.
Resistance
13
Low
Temperature
WEATHER-PROOF
FILE No.ʳ
REV.ʳ
Pageʳ
Resistance
14
High
Temperature
: E-V-AD05
:
B
: 3 / 4
1.As show in item 3,4
2.Contact Resistance:
100m max.
(final-after test)
Following the test set forth below the sample
shall be left in normal temperature and
humidity conditions for an hour before
As shown in item 2~6
measurements are made :
1.Temperature : -40к±3к
2.Time: 96 hours
Following the test set forth below the sample
shall be left in normal temperature and
1.As shown in item 3~6
humidity conditions for an hour before
2.Contact Resistance:
measurements are made :
100m max.
1.Temperature : 85к±2к
2.Time: 96 hours
1.As shown in item 4,6
Following the test set forth below the
sample shall be left in normal temperature 2.Contact Resistance:
100m max.
and humidity conditions for an hour
Resistance
3.Insulation Resistance:
before measurements are made :
15
Humidity
10M min.
cTemperature : 40к±2к
dRelative Humidity :90~95%
eTime: 96 hours
DM(R)ǵNDI(R)ǵDL(R)-V SPECIFICATION
FILE No.ʳ
REV.ʳ
Pageʳ
: E-V-AD05
:
B
: 4 / 4
5. SOLDERING CONDITIONS:
Ϯʳ Condition for Soldering –DM(R)ΕDL(R) –V Series
MAX 260°
255°
230°
150°
Room
Temperature
120~150sec
5~10sec
60sec
TIME(sec)
The condition mentioned above is the temperature on the Cu foil of the P.C.B
surface.
There are cases where board’s temperature greatly differs from switch’s
surface temperature depending on board’s material, size, thickness, etc.
Care, therefore, should be used not to allow switch’s surface temperature to
exceed 260к.
Manual Soldering
Soldering Temperature
Max.350к
Continuous Soldering Time
Max. 5 seconds
Precautions in Handling
1. Care should be exercised so that flux from the upper part of the printed
circuit board does not adhere to the switch.
2. Don’t clean the switch body except with top tape sealed type, which can
only spray of cleaning method from top of s/w.
3. Please make sure that there is no flux rose over the surface of the PCB