ITEM DESC. Q’TY MATERIALS TREATMENT REMARK 1. COVER 1 HIGH – TEMP. THERMOPLASTIC PA-9T UL 94V-0 MOLDED BLACK - 2. CONTACT * COPPER 3. ACTUATOR * THERRMOPLASTIC LCP UL 94V-0 MOLDED WHITE - 4. TERMINAL 1 BRASS GOLD PLATED - 5. BASE 1 HIGH – TEMP. THERMOPLASTIC PA9T UL 94V-0 MOLDED BLACK - 6. TAPE 1 KAPTON - - GOLD PLATED AT CONTACT AREA. - REMARK : E □ □- □ □ - □ - □ - □ PACKAGE STYLE □ =TUBE T/R=TAPE & REEL V = Lead Free SEAL: □=REGULAR T =TOP TAPE SEALED NUMBER OF POSITIONS: 01.02.03.04.05.06.07.08.09.10.12 POSITIONS (ONLY 2、 4 、 8 POLES ARE AVAILABLE) ACTUATOR TYPE: □=RAISED ACTUATOR R =RECESSED ACTUATOR TERMINAL TYPE M=S.M.T TYPE I =THUOUGH HOLE TYPE END-STACKABLE TYPE TITLE: END STACKABLE A DWG.REL REV ECO. NO APPD APPD. : TYPE DIP SWITCHES CHKD. : : 楊佩儒 PRROD. NO.:E□□-□□-□-V-□ PR. REV : A SHEET : 1 of 1 FILE NO.: E-V-CD15 P.3/3 EM(R)、EI(R)-□□-V SPECIFICATION 文 件 編 號 : E-V-AD13 版 次 : A4 頁 次 : 1 / 4 1.Style: This specification describes "DUAL IN-LINE PACKAGE SWITCHES" mainly used as signal switch of electric devices with the general requirements of mechanical and electrical characteristics. 1.1 Operating Temperature Range : -20℃ ~ +85℃ 1.2 Storage Temperature Range : -40℃ ~ +85℃ 2. Current Range : 2.1 Non-Switching : 100mA, 50V DC 2.2 Switching : 25mA , 24V DC 3. Type of Actuation: Actuated by sliding 4. Test Sequence : ELECTRIC PERFORMANCE ITEM DESCRIPTION 1 2 3 4 MECHANICAL PERFORMANCE 5 6 TEST CONDITIONS Visual By visual examination check without Examination any out pressure & testing. REQUIREMENTS There shall be no defects that affect the serviceability of the product. 1)To be measured between the two terminals associated with each Contact switch pole. 100mΩ max. (initial) Resistance 2)Measurements shall be made with a 1kHz shall current contact resistance meter. Insulation 500V DC, 1 minute ± 5 sec. 100MΩ min. Resistance 500V AC (50Hz or 60 Hz) shall be Dielectric There shall be no applied between all the adjacent withstandbreakdown or terminals and between the terminal ing Voltage flashover. and the frame for 1 minute. Capacitance 1 MHz ± 10 kHz 5 pF max. Applied in the direction of operation. ON→OFF 1000gf max Operation OFF→ON Force （9.8N max） EM(R)、EI(R)-□□-V SPECIFICATION 7 Stop Strength 文 件 編 號 : E-V-AD13 版 次 : A4 頁 次 : 2 / 4 A static load of 1 kgf is applied in the operating direction and pulling direction operated for a period of 15 seconds. There shall be no sign of damage mechanically. MECHANICAL PERFORMANCE 1)Soldering Temperature : Soldering Heat 8 Resistance PROD SERIES TEMP TIME THROUGH HOLE TYPE EI(R) 260℃±5℃ 5±1 sec. SMT TYPE SEE PAGE 4/4 EM(R) 2)Duration of Solder Immersion: 5±1 sec. 3)Frequency of Soldering Process: 2 times max. (PCB is 1.6mm in thickness.) Shall be vibrated in accordance with Method 201A of MIL-STD-202F 1)Frequency: 10-55-10 Hz 1 min/cycle. 9 Vibration 2)Direction: 3 vertical directions including the direction of operation. 3)Test Time: 2 hours each direction. Shall be shocked in accordance with Method 213B condition A of MIL-STD-202F 1)Acceleration: 50G. 10 Shock 2)Action Time : 11 ± 1 m sec. 3)Testing Direction: 6 sides. 4)Test cycle: 3 times in each direction 1EI(R) Soldering Temperature:245±3℃ Lead-Free solder：M705E JIS Z 3282 Class A (Tin 96.5%，Silver 3%，Copper 0.5%) 11 Solderability 2EM(R) SEE PAGE 4/4 3Flux: 5-10 seconds. fDuration of solder Immersion: 5±1 sec. 1)Contact Resistance : 200mΩMax 2)As shown in item 3~6 As shown in item 2~6 As shown in item 2~6 No anti-soldering and the coverage of dipping into solder must more than 75% was requested. DURABILITY EM(R)、EI(R)-□□-V SPECIFICATION Measurements shall be made following 1)As show in item 3,4 the test set forth below: Operation 1)25 mA, 24V DC resistive load 2)Contact Resistance: 12 )2)Rate of Operation: 15~20 cycles/ minute 500mΩ max. Life 3)Cycle of Operation: 2000 cycles. (final-after test) Resistance Low 13 Temperature WEATHER-PROOF 文 件 編 號 : E-V-AD13 版 次 : A4 頁 次 : 3 / 4 Resistance High 14 Temperatur e Following the test set forth below the sample shall be left in normal temperature and humidity conditions for an hour As shown in item 2~6 before measurements are made : 1)Temperature : -40℃±3℃ 2)Time: 96 hours Following the test set forth below the sample shall be left in normal temperature 1)As shown in item 3~6 and humidity conditions for an hour 2)Contact Resistance: before measurements are made : 100mΩ max. 1)Temperature : 85℃±2℃ 2)Time: 96 hours Following the test set forth below the sample 1)As shown in item 4,6 2)Contact Resistance: shall be left in normal temperature and 100mΩ max. humidity conditions for an hour before Resistance 3)Insulation Resistance: 15 Humidity measurements are made : 1)Temperature : 40℃±2℃ 10MΩ min. 2)Relative Humidity :90~95% 3)Time: 96 hours EM(R)、EI(R)-□□-V SPECIFICATION 文 件 編 號 : E-V-AD13 版 次 : A4 頁 次 : 4 / 4 5. SOLDERING CONDITIONS: ■ Condition for Soldering –EM(R) Series MAX 255° 250° 230° 150° Room Temperature 120~150sec 5~10sec 60sec TIME(sec) ■ The condition mentioned above is the temperature on the Cu foil of the P.C.B surface. There are cases where board’s temperature greatly differs from switch’s surface temperature depending on board’s material, size, thickness, etc. Care, therefore, should be used not to allow switch’s surface temperature to exceed 255℃. ■ Manual Soldering Soldering Temperature Max.350℃ Continuous Soldering Time Max. 5 seconds ■ Precautions in Handling 1. Care should be exercised so that flux from the upper part of the printed circuit board does not adhere to the switch. 2. Don’t clean the switch body except with top tape sealed type, which can only spray of cleaning method from top of s/w. 3. Please make sure that there is no flux rose over the surface of the PCB