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AIC6176
0.5A Dual USB High-Side Power Switch
 FEATURES
 DESCRIPTION
 2.7V to 6.5V Input Voltage Range
The AIC6176 integrates dual 100m high-side
 0.5A Dual Continuous Load Current
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power
switches
for
self-powered
and
100mΩ High-Side P-MOSFET Switch
bus-powered
20Ω Open-Drain Over-Current Flag Output
applications. It operates with inputs ranging
80uA Quiescent Supply Current
from 2.7V to 6.5V, making it ideal for both 3 V
150°C Thermal Shutdown Protection
and 5V systems.
Short Circuit Current Fold-back Protection
The protection includes current limiting with
2.3V Under Voltage Lockout
fold-back, short circuit and thermal shutdown
Soft Start prevents large Inrush Current
under over-current occurs. Fault current is
Universal
Serial
Bus
(USB)
limited to typically 1A in accordance with the
9ms Error Flag Delay Time (AIC6176D)
USB power requirements.
Reverse Current Blocking
The AIC6176 is
ideal for any system where current limiting and
Enable Active-High or Active-Low Version
power control are desired.
Guaranteed minimum output rise time limits
 APPLICATIONS

USB Power Management.

Notebook PCs

Battery-Charger Circuit.
inrush current during hot plug-in as well as
minimizing EMI and prevents the voltage at
upstream port from dropping excessively.
 TYPICAL APPLICATION CIRCUIT
AIC6176
Analog Integrations Corporation
Si-Soft Research Center
DS-6176G-02
20120209
3A1, No.1, Li-Hsin Rd. I, Science Park, Hsinchu 300, Taiwan, R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
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AIC6176
 ORDERING INFORMATION
AIC6176X-XXXXXX
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
PIN CONFIGURATION
PACKAGING TYPE
S8: SOP-8
SOP-8
TOP VIEW
CTLA 1 O
FLGA 2
FLGB 3
G: GREEN PACKAGE
CTLB 4
CONTROL POLARITY
0: Active Low
1: Active High
8 OUTA
7 IN
6 GND
5 OUTB
Fault Flag Response Delay Time
D: Delay 9ms
N:No
Example: AIC6176N-0GS8TR
 No Delay, Active Low Version,
in SOP-8 Green Package
& Taping & Reel Packing Type

ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VIN)
7.0V
Fault Flag Voltage (VFLG)
7.0V
Control Input (VCTL)
-0.3V ~7V
Operating Temperature Range
-40C~85C
Junction Temperature
150C
Storage Temperature Range
-65C ~ 150C
Lead Temperature (Soldering, 10sec)
Thermal Resistance, θJA (Junction to Ambient)
260C
SOP-8
160C/W
(Assume no Ambient Airflow, no Heatsink)
Thermal Resistance, θJC (Junction to Case)
SOP-8…..……………..…………… 40C /W
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
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AIC6176
 ELECTRICAL CHARACTERISTICS
(VIN= 5V, CIN=1uF, COUT=1uF, TA=25C, unless otherwise specified.) (Note 1)
PARAMETERS
CONDITIONS
Supply Voltage
Supply Current
TYP.
2.7
MAX.
UNIT
6.5
V
Switch On, OUT=Open
80
160
Switch Off, OUT=Open
0.2
2
1.3
1.8
VCTL =Logic “0”
0.01
0.1
VCTL =Logic “1”
0.01
0.1
EN Input Threshold
Control Input Current
MIN.
0.8
Switch On Resistance
100
A
V
A
m
Output Turn-On Rise Time
RL = 10 each Output
1000
2500
S
Output Turn-Off Fall Time
RL = 10 each Output
0.7
20
S
Output Leakage Current
Switch Off, RL=0Ω
0.5
1
A
1.0
1.25
A
Current Limit Threshold
0.6
Short Circuit Current Fold-back
VOUT=0V
Over Current Flag Response
From fault condition to FLG
Delay
assertion
Over Temperature Shutdown
TJ Increasing
150
Threshold
TJ Decreasing
120
Error Flag Output Resistance
ISINK =1 mA
20
Error Flag Off Current
VFLG = 5V
0.01
1
UVLO Threshold
VIN Increasing
2.3
2.65
VIN Decreasing
4
1.8
0.38
A
9
ms
2.1
C

A
V
Note 1: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
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AIC6176
 TYPICAL PERFORMANCE CHARACTERISTICS
Fig. 1 ON Resistance vs. Supply Voltage
Fig. 3 ON-State Supply Current vs. Supply Voltage
Fig. 5 Current Limit vs. Supply Voltage
Fig. 2 ON Resistance vs. Temperature
Fig. 4 ON-State Supply Current vs. Temperature
Fig. 6 Current Limit vs. Temperature
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AIC6176
 TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
Fig. 7 Flag Delay Time vs. Supply Voltage
Fig. 9 Control Input Voltage vs. Supply Voltage
Fig. 8 Flag Delay Time vs. Temperature
Fig. 10 UVLO Threshold Voltage vs. Temperature
Fig. 11 Rising Time vs. Temperature
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AIC6176
 BLOCK DIAGRAM
 PIN DESCRIPTIONS
PIN 1: CTLA - Controls the turn-on/turn-off of
channel A MOSFET with TTL as
a control input. Active high for
AIC6176-1 and active low for
AIC6176-0.
PIN 4: CTLB - Controls the turn-on/turn-off of
channel B MOSFET with TTL as
a control input. Active High for
AIC6176-1 and active low for
AIC6176-0.
PIN 2: FLGA - An active-low and open-drained
fault flag output for channel A.
FLGA is an indicator for current
limit or thermal shutdown when
CTLA is active.
PIN 5: OUTB - Channel B MOSFET switch
output.
PIN 3: FLGB - An active-low and open-drained
fault flag output for channel B.
FLGB is an indicator for current
limit or thermal shutdown when
CTLB is active.
PIN 8: OUTA - Channel A MOSFET switch
output.
PIN 6: GND
- Power ground.
PIN 7: IN
- Power supply input.
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AIC6176
 APPLICATION INFORMATION
 Flag Output
 Supply Filtering
An error Flag is an open-drained output of an
A 1F bypass capacitor from USB IN to GND,
N-channel MOSFET. Flag output is pulled low to
located near the device, is strongly recommended
signal
input
to control supply transients. Without a bypass
undervoltage, output current limit, and thermal
capacitor, an output short may cause sufficient
shutdown. The current limit flag response delay
ringing on the input (from supply lead inductance)
time is 9ms.
to damage internal control circuitry.
the
following
fault
conditions:
 Current Limit
 Transient Requirements
The current limit threshold is preset internally. It
USB supports dynamic attachment (hot plug-in) of
protects the output MOSFET switches from
peripherals. A current surge is caused by the input
damage resulting from undesirable short circuit
capacitance of downstream device. Ferrite beads
conditions or excess inrush current, which is often
are recommended in series with all power and
encountered during hot plug-in. The error flag
ground connector pins. Ferrite beads reduce EMI
signals when any current limit conditions occur.
and limit the inrush current during hot-attachment
 Thermal Shutdown
When temperature of AIC6176 exceeds 150C for
by filtering high-frequency signals.
 Short Circuit Transient
any reasons, the thermal shutdown function turns
Bulk capacitance provides the short-term transient
MOSFET switch off and signals the error flag. A
current needed during a hot-attachment event. A
hysteresis of 30C prevents the MOSFETs from
10F/10V ceramic capacitor mounted close to
turning back on until the chip temperature drops
downstream connector each port should provide
below 120C.
transient drop protection.
 Enable Control
Enable must be driven logic high or logic low for a
clearly defined input. Floating the input may cause
unpredictable operation.
 Printed Circuit Layout
The power circuitry of USB printed circuit boards
requires a customized layout to maximize thermal
dissipation and to minimize voltage drop and EMI.
 Under-voltage Lockout
UVLO (undervoltage lockout) prevents the output
MOSFET from turning on until input voltage
exceeds 2.3V typically. After the switch turns on, if
the input voltage drops below 2.1V typically,
UVLO shuts off the output MOSFET.
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AIC6176
 TYPICAL APPLICATION CIRCUIT
VCC
5.0V
4.50V to 5. 25V
Upst ream VBUS
100mA max
10K
10K
AIC1722
VBUS
IN
D+
+ 1F
CIN
DGND
USB
+
GND
ON/OFF
CTLA
OUTA
OVERCURRENT
FLGA
IN
OVERCURRENT
FLGB
GND
VIN
OUT
10F
COUT
Ferrite
Bead
AIC6176
ON/OFF
VBUS
1F
+
100F
*
D+
0. 01F
DGND
CTLB O UTB
GND
DATA
DATA
33F, 16V Tantalum, or
100F, 10V Electrolytic
Bold line indicate high- current traces
+
VBUS
100F
*
D+
0. 01F
DGND
DATA
Two-Port Self-Powered Hub
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AIC6176
 PHYSICAL DIMENSIONS (unit: mm)
 SOP-8 PACKAGE OUTLINE DRAWING
h X 45°
A
A
SEE VIEW B
A
e
H
E
D
WITH PLATING
0.25
C
A1
B
GAUGE PLANE
SEATING PLANE
θ
L
VIEW B
BASE METAL
SECTION A-A
Note: 1. Refer to JEDEC MS-012AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
SOP-8
MILLIMETERS
MIN.
MAX.
A
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
4.80
5.00
E
3.80
4.00
e
1.27 BSC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
θ
0°
8°
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than
circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We
reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are
devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when
properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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