LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL COLOR LED LAMPS 明泰 Pb Lead-Free Parts LHYRDBK2093/R21 DATA SHEET DOC. NO : QW0905-LHYRDBK2093/R21 REV. : A DATE : 23-Sep.- 2014 Weight : 0.2135g/PCS MADE IN No.26, JinLing South Rd.Westem Part lndustry Division, ： Nan Sha ETDZ.Panyu.Guangzhou.China 發行 晶元材質 ： 四元晶片 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/10 PART NO. LHYRDBK2093/R21 Package Dimensions 3.0 4.2 4.0 5.2 6.7±0.5 HYR DBK 1.5 MAX □0.5 TYP 18.0MIN 1 2 1 2 3 3 1. CATHODE BLUE 2. COMMON ANODE 3. CATHODE YELLOW 2.0MIN 2.0MIN 2.54TYP 2.54TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHYRDBK2093/R21 Page 2/10 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HYR DBK Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 60 mA Power Dissipation PD 120 78 mW ESD 500 2000 V Reverse Current @5V Ir 50 10 Operating Temperature Topr -20 ~ +80 -40 ~ +85 ℃ Storage Temperature Tstg -30 ~ +100 -40 ~ +100 ℃ Electrostatic Discharge( * ) μA Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted AlGaInP Lens Yellow Dominant wave length λDnm Luminous Viewing Spectral Forward voltage intensity angle halfwidth @10mA(V) @10mA(mcd) 2 θ 1/2 △λ nm (deg) Min. Max. Min. Max. Min. Max. 585 595 20 1.7 2.6 900 2700 60 462 30 3.0 4.0 450 1500 60 Water clear LHYRDBK2093/R21 InGaN Blue 474 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/10 PART NO. LHYRDBK2093/R21 Brightness Code For Standard LED Lamps Bin Code HYR CHIP Group Luminous Intensity(mcd) at 10 mA Min. Max. A21 900 1100 A22 1100 1500 A23 1500 1800 A24 1800 2200 A25 2200 2700 Color Code HYR CHIP Group Dominant wave length λD (nm) at 10 mA Min. Max. 15 585 587 16 587 589 17 589 592 18 592 595 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/10 PART NO. LHYRDBK2093/R21 Brightness Code For Standard LED Lamps Bin Code DBK CHIP Group Luminous Intensity(mcd) at 10 mA Min. Max. A18 450 550 A19 550 700 A20 700 900 A21 900 1100 A22 1100 1500 Color Code DBK CHIP Group Dominant wave length λD (nm) at 10 mA Min. Max. 0C 468 471 0B 471 474 0A 474 477 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHYRDBK2093/R21 Page 5/10 LED LAMPS MODEL DESIGNATION SYSTEM L A HYR DBK 2 0 9 3 /R21 B B C A: Ligitek B: Dice Emitting Color C: Construction D: Modification E: Lead Frame Type F: Lens Color G: Polarity Reverse D E F G LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHYRDBK2093/R21 Page 3/5 Typical Electro-Optical Characteristics Curve HYR CHIP Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Voltage(V) Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1.0 0.5 0.0 500 550 600 Wavelength (nm) 650 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHYRDBK2093/R21 Page 7/10 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 400 450 500 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 550 Fig.6 Directivity Radiation 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHYRDBK2093/R21 Page 8/10 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 50 100 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHYRDBK2093/R21 Page 9/10 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/10 PACKING SPECIFICATION 1. 1000PCS / BAG 2. 8 BAG / INNER BOX SIZE : L X W X H 33.5cm X 19cm X 7.5cm L W H 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58.5cm X 34cm X 34cm L W C/NO: MADE IN CHINA . NO M IT E Y : Q'T ,: W : N, , W G, S PC s kg s kg H