AOS Semiconductor Product Reliability Report AOI7N60, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOI7N60. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOI7N60 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOI7N60 have been fabricated using an advanced high voltage MOSFET process that is designed to deliver high levels of performance and robustness in popular AC-DC applications. By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability these parts can be adopted quickly into new and existing offline power supply designs. Details refer to the datasheet. II. Die / Package Information: AOI7N60 Standard sub-micron 600V N-Channel MOSFET Package Type TO251A Lead Frame Bare Cu Die Attach Soft solder Bonding Al wire Mold Material Epoxy resin with silica filler Moisture Level Up to Level 1 * Note * based on info provided by assembler and mold compound supplier Process 2 III. Result of Reliability Stress for AOI7N60 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax Temp = 150°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs HAST 130 , 85%RH, 33.3 psi, Vgs = 100% of Vgs max 96 hrs Pressure Pot 121°c , 29.7psi, RH=100% 96 hrs HTGB Lot Attribution Total Sample size - 8 lots 1408pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 539pcs 0 3 lots 4 lots JESD22A108 77 pcs / lot 539pcs 0 JESD22A108 (Note A*) 6 lots 77 pcs / lot 330pcs 0 JESD22A110 (Note A*) 6 lots 55 pcs / lot 462pcs 0 JESD22A102 (Note A*) 77 pcs / lot 0 JESD22A104 (Note A*) HTRB Temperature Cycle -65°c to 150°c , air to air, 250 / 500 cycles Number of Failures 3 lots 4 lots 8 lots (Note A*) 616pcs Reference Standard 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 4 MTTF = 27263 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOI7N60). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (6x77x500+ 8x77x1000) x258] = 4 9 8 MTTF = 10 / FIT =2.39 x 10 hrs = 27263 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 258 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 130 deg C 150 deg C 2.59 1 3