Reliability Report

AOS Semiconductor
Product Reliability Report
AON6512,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the reliability result for AON6512. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical
test at end point. Review of final electrical test result confirms that AON6512 passes AOS
quality and reliability requirements. The released product will be categorized by the process
family and be monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
General description:
• Latest Trench Power AlphaMOS (αMOS LV) technology 30V
• Very Low RDS(on) at 4.5VGS
• Low Gate Charge
• High Current Capability
• RoHS and Halogen-Free Compliant
Application:
• DC/DC Converters in Computing, Servers, and POL
• Isolated DC/DC Converters in Telecom and Industrial
Detailed information refers to datasheet.
II. Die / Package Information:
AON6512
Standard sub-micron
Low voltage N channel
Package Type
DFN 5x6
Lead Frame
Copper
Die Attach
Solder paste
Bonding Wire
N.A for Clip bond
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AON6512
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@260°c
HTGB
HTRB
HAST
Pressure Pot
Temperature
Cycle
Lot
Attribution
Total
Sample
size
Number
of
Failures
Standard
-
6 lots
770pcs
0
JESD22A113
Temp = 150 °c,
Vgs=100% of
Vgsmax
168hrs
500 hrs
1000 hrs
616pcs
0
2 lots
6 lots
JESD22A108
Temp = 150 °c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
77pcs / lot
616pcs
0
2 lots
6 lots
JESD22A108
130 +/- 2°°c,
85%RH, 33.3 psi,
Vgs = 100% of
Vgs max
121°°c, 29.7psi,
RH=100%
100 hrs
6 lots
77pcs / lot
330pcs
0
JESD22A110
96 hrs
4 lots
55pcs / lot
220pcs
0
JESD22A102
-65°°c to 150°°c,
air to air
250 / 500
cycles
4 lots
55pcs / lot
220pcs
0
JESD22A104
55pcs / lot
IV. Reliability Evaluation
FIT rate (per billion): 3
MTTF = 34699 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AON6512). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.83 x 10 / [2x (2x2x77x500+6x2x77 x1000) x (258)] = 3
9
8
MTTF = 10 / FIT = 3.04 x 10 hrs = 34699 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K