lrgb3392-s281-xh.pdf

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TRIPLE COLOR LED LAMPS
Pb
Lead-Free Parts
LRGB3392/S281-XH
DATA SHEET
DOC. NO :
QW0905- LRGB3392/S281-XH
REV.
:
A
DATE
:
22 - Apr.- 2016
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LRGB3392/S281-XH
Package Dimensions
5.0
5.8
7.6
8.6
1.5MAX
25.0MIN
□0.5
TYP
4 3 21
1.CATHODE RED
2.COMMON ANODE
3.CATHODE GREEN
4.CATHODE BLUE
1.0
4-1.27TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB3392/S281-XH
Page 2/8
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
R
G
B
Forward Current
IF
40
30
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
120
100
100
mA
Power Dissipation
PD
120
120
120
mW
Electrostatic Discharge
ESD
----
150
V
Reverse Current @5V
Ir
10
50
μA
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Red
Lens
Spectral
halfwidth
△λnm
Min. Typ. Max.
Forward
voltage
@20mA(V)
Luminous Viewing
intensity
angle
@20mA(mcd) 2θ 1/2
(deg)
Min. Typ. Max. Min. Max.
620
----
630
20
1.8 ---- 2.4 500 1200
60
InGaN/GaN Green White Diffused 515
----
525
36
2.8 ---
3.4 1000 2500
60
465
----
475
30
2.8 ---
3.4 250 650
60
GaAlAs
LRGB3392/S281-XH
Dominant
wave
length
λDnm
InGaN/GaN Blue
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LRGB3392/S281-XH
Typical Electro-Optical Characteristics Curve
R CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
2.5
2.0
1.5
1.0
0.5
01
0.0
2.0
1.0
3.0
4.0
5.0
1
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
3.0
2.5
2.0
1.5
1.0
0.5
0.0
100
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
Fig.6 Directive Radiation
1.0
0°
-30 °
30 °
0.5
-60 °
60 °
0.0
600
650
700
Wavelength (nm)
750
100% 75% 50%
25%
0
25%
50% 75% 100%
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB3392/S281-XH
Page 4/8
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
3.0
2.0
4.0
5.0
1.0
10
1000
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Temperature
Fig.3 Forward Voltage vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
100
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directive Radiation
Relative Intensity@20mA
1.0
0°
-30°
30 °
0.5
-60°
0.0
100% 75% 50%
450
500
550
Wavelength (nm)
600
60 °
25%
0
25%
50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB3392/S281-XH
Page 5/6
Typical Electro-Optical Characteristics Curve
B CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1
01
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.0
3.0
4.0
5.0
1
10
1.2
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
20
0
40
60
80
100
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.6 Directive Radiation
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
1.0
0°
-30 °
30 °
0.5
-60°
60 °
0.0
400
450
500
Wavelength (nm)
550
100% 75% 50%
25%
0
25%
50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LRGB3392/S281-XH
Page 6/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/8
PART NO. LRGB3392/S281-XH
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=245 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
Page 8/8
PACKING SPECIFICATION
1. 500PCS / BAG
2. 8 BAG / INNER BOX
SIZE : L X W X H 33.5cm X 19cm X 7.5cm
L
W
H
3. 12 INNER BOXES / CARTON
SIZE : L X W X H 58.5cm X 34cm X 34cm
L
W
C/NO:
MADE IN CHINA
.
NO
M
IT E Y :
Q'T ,:
W :
N,
,
W
G,
S
PC
s
kg
s
kg
H