Medium-power general-purpose transistors

Medium-power general-purpose transistors
types in bold represent new products
SOT223 (SC-73)
SOT89 (SC-62)
DFN2020-3 (SOT1061)
DFN2020D-3 (SOT1061D)
Size (mm)
6.5 x 3.5 x 1.65
4.5 x 2.5 x 1.5
2.0 x 2.0 x 0.62
2.0 x 2.0 x 0.62
Ptot (mW)
1700
1300
1300
1300
Package
Polarity
VCEO (V)
IC (A)
hFE min
20
2
85 - 160
375
40
BCP68 / -25
BC868 / -25
BC68PA / BC68-25PA
BC68PAS / BC68-25PAS
45
1
63 - 100
160 - 250
100
BCP54 / -10 / -16
BCX54 / -10 / -16
BC54PA / BC54-10PA / BC54-16PA
BC54PAS / BC54-10PAS / BC54-16PAS
60
1
63 - 100
160 - 250
100
BCP55 / -10 / -16
BCX55 / -10 / -16
BC55PA / BC55-10PA / BC55-16PA
BC55PAS / BC55-10PAS / BC55-16PAS
100
300
100
BSP41
BSR41
80
1
63 - 100
160 - 250
100
BCP56 / -10 / -16
BCX56 / -10 / -16
BC56PA / BC56-10PA / BC56-16PA
BC56PAS / BC56-10PAS / BC56-16PAS
40 - 100
120 - 300
100
BSP43
BSR43
20
2
85 - 160
250 - 375
45
1
63 - 100
160 - 250
63 - 100
160 - 250
40 - 100
120 - 300
NPN
PNP
1)
60
1
80
1
hFE max
63 - 100
160 - 250
40 - 100
120 - 300
fT min (MHz)
BCP69 / -16 / -25
BC869 / -16 / -25
BC69PA / BC69-16PA / BC69-25PA
BC69PAS / BC569-16PAS / BC69-25PAS
BCP51 / -10 / -16
BCX51 / -10 / -16
BC51PA / BC51-10PA / BC51-16PA
BC51PAS / BC51-10PAS / BC51-16PAS
100
BCP52 / -10 / -16
BCX52 / -10 / -16
BC52PA / BC52-10PA / BC52-16PA
BC52PAS / BC52-10PAS / BC52-16PAS
100
BSP31
BSR30 / 31
BCP53 / -10 / -16
BCX53 / -10 / -16
BC53PA / BC53-10PA / BC53-16PA
BC53PAS / BC53-10PAS / BC53-16PAS
BSP32 / 33
BSR33
40
115
115
1)
1)
- 145
- 145
100
1)
1)
Typical value
Key features
}F
our different medium power SMD packages
}T
wo leadless very small SMD plastic package
with medium power capability (DFN2020)
}E
xposed heat sink for excellent thermal and electrical
performance in DFN2020-3, DFN2020D-3 and SOT89
}1
00% solderable sidepads, suitable for automatic
optical inspection (AOI) in DFN2020D-3
}V
CEO ranging from 20 V to 80 V
}H
igh collector current capability IC (up to 2 A) and
ICM (up to 3 A)
}A
EC-Q101 qualified
Same performance on a much smaller footprint
SOT89
DFN2020
Solderable
sidepads
Body dimensions: 4.5 x 2.5 mm
PCB area :
11.3 mm2
Package height: 1.5 mm
Body dimensions: 2.0 x 2.0 mm
PCB area: 4 mm2
Package height: 0.65 mm
} 80 % space reduction on PCB area
} 57 % height reduction
Key benefits
} Ideally suited for medium power applications
} High power dissipation capability
} High energy efficiency due to less heat generation
} Excellent electrical performance on a small footprint
2 x 2 mm (DFN2020 packages)
} 80% board space reduction (DFN2020 vs. SOT89)
} 90% board space reduction (DFN2020 vs. SOT223)
Minimized outline drawings and reflow soldering footprint
2.1
1.3
1.3
0.35
0.25
1
1.05
0.95
0.3
0.2
2
0.45
0.35
1.1
0.9
0.5 (2´)
0.65
max
0.4 (2´)
0.5 (2´)
2.1
1.9
solder paste = solder lands
0.6
2.3
solder resist
0.55
0.25
1.1
3
1.6
1.4
Dimensions in mm
0.6 (2´)
1.05
0.25
0.25
occupied area
1.2
Dimensions in mm
0.4
2.1
1.9
0.5
09-11-12
DFN2020-3 (SOT1061) / DFN2020D-3 (SOT1061D)
-
1.6
1.7
2.0 x 2.0 x 0.62 4.75
mm
2.25
2
1.9
4.75
1.2
2.25
2
1.9
0.2
0.85
1.2
0.2
0.85
1.2
4.6
1.2
solder lands
solder
resist
0.5
4.6
1
(3´)
1
(3´)
-
4.5 x 2.5 x 1.5 mm
solder resist
0.5
4.85
1.1
(2´)
solder paste
solder paste
occupied
area
occupied
area
Dimensions in mm
Dimensions in mm
1.5
0.6
(3´)
1.5
0.7
(3´)
0.6
(3´)
SOT89 (SC-62)
1.7
4.85
1.1
(2´)
1.5
1.5
solder lands
1.7
3.95
sot089_fr
0.7
(3´)
3.95
sot089_fr
7
3.85
3.6
3.5
0.3
1.3
(4´)
solder lands
1.2
(4´)
4
solder resist
3.9
1
2
3
6.1 7.65
solder paste
occupied area
Dimensions in mm
2.3
2.3
1.2
(3´)
1.3
(3´)
6.15
SOT223 (SC-73)
-
6.5 x 3.5 x 1.65 mm
www.nxp.com/microcontrollers
© 2015 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
Date of release: May 2015
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and
Document order number: 9397 750 17660
may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof
Printed in the Netherlands
does not convey nor imply any license under patent- or other industrial or intellectual property rights.