Medium-power general-purpose transistors types in bold represent new products SOT223 (SC-73) SOT89 (SC-62) DFN2020-3 (SOT1061) DFN2020D-3 (SOT1061D) Size (mm) 6.5 x 3.5 x 1.65 4.5 x 2.5 x 1.5 2.0 x 2.0 x 0.62 2.0 x 2.0 x 0.62 Ptot (mW) 1700 1300 1300 1300 Package Polarity VCEO (V) IC (A) hFE min 20 2 85 - 160 375 40 BCP68 / -25 BC868 / -25 BC68PA / BC68-25PA BC68PAS / BC68-25PAS 45 1 63 - 100 160 - 250 100 BCP54 / -10 / -16 BCX54 / -10 / -16 BC54PA / BC54-10PA / BC54-16PA BC54PAS / BC54-10PAS / BC54-16PAS 60 1 63 - 100 160 - 250 100 BCP55 / -10 / -16 BCX55 / -10 / -16 BC55PA / BC55-10PA / BC55-16PA BC55PAS / BC55-10PAS / BC55-16PAS 100 300 100 BSP41 BSR41 80 1 63 - 100 160 - 250 100 BCP56 / -10 / -16 BCX56 / -10 / -16 BC56PA / BC56-10PA / BC56-16PA BC56PAS / BC56-10PAS / BC56-16PAS 40 - 100 120 - 300 100 BSP43 BSR43 20 2 85 - 160 250 - 375 45 1 63 - 100 160 - 250 63 - 100 160 - 250 40 - 100 120 - 300 NPN PNP 1) 60 1 80 1 hFE max 63 - 100 160 - 250 40 - 100 120 - 300 fT min (MHz) BCP69 / -16 / -25 BC869 / -16 / -25 BC69PA / BC69-16PA / BC69-25PA BC69PAS / BC569-16PAS / BC69-25PAS BCP51 / -10 / -16 BCX51 / -10 / -16 BC51PA / BC51-10PA / BC51-16PA BC51PAS / BC51-10PAS / BC51-16PAS 100 BCP52 / -10 / -16 BCX52 / -10 / -16 BC52PA / BC52-10PA / BC52-16PA BC52PAS / BC52-10PAS / BC52-16PAS 100 BSP31 BSR30 / 31 BCP53 / -10 / -16 BCX53 / -10 / -16 BC53PA / BC53-10PA / BC53-16PA BC53PAS / BC53-10PAS / BC53-16PAS BSP32 / 33 BSR33 40 115 115 1) 1) - 145 - 145 100 1) 1) Typical value Key features }F our different medium power SMD packages }T wo leadless very small SMD plastic package with medium power capability (DFN2020) }E xposed heat sink for excellent thermal and electrical performance in DFN2020-3, DFN2020D-3 and SOT89 }1 00% solderable sidepads, suitable for automatic optical inspection (AOI) in DFN2020D-3 }V CEO ranging from 20 V to 80 V }H igh collector current capability IC (up to 2 A) and ICM (up to 3 A) }A EC-Q101 qualified Same performance on a much smaller footprint SOT89 DFN2020 Solderable sidepads Body dimensions: 4.5 x 2.5 mm PCB area : 11.3 mm2 Package height: 1.5 mm Body dimensions: 2.0 x 2.0 mm PCB area: 4 mm2 Package height: 0.65 mm } 80 % space reduction on PCB area } 57 % height reduction Key benefits } Ideally suited for medium power applications } High power dissipation capability } High energy efficiency due to less heat generation } Excellent electrical performance on a small footprint 2 x 2 mm (DFN2020 packages) } 80% board space reduction (DFN2020 vs. SOT89) } 90% board space reduction (DFN2020 vs. SOT223) Minimized outline drawings and reflow soldering footprint 2.1 1.3 1.3 0.35 0.25 1 1.05 0.95 0.3 0.2 2 0.45 0.35 1.1 0.9 0.5 (2´) 0.65 max 0.4 (2´) 0.5 (2´) 2.1 1.9 solder paste = solder lands 0.6 2.3 solder resist 0.55 0.25 1.1 3 1.6 1.4 Dimensions in mm 0.6 (2´) 1.05 0.25 0.25 occupied area 1.2 Dimensions in mm 0.4 2.1 1.9 0.5 09-11-12 DFN2020-3 (SOT1061) / DFN2020D-3 (SOT1061D) - 1.6 1.7 2.0 x 2.0 x 0.62 4.75 mm 2.25 2 1.9 4.75 1.2 2.25 2 1.9 0.2 0.85 1.2 0.2 0.85 1.2 4.6 1.2 solder lands solder resist 0.5 4.6 1 (3´) 1 (3´) - 4.5 x 2.5 x 1.5 mm solder resist 0.5 4.85 1.1 (2´) solder paste solder paste occupied area occupied area Dimensions in mm Dimensions in mm 1.5 0.6 (3´) 1.5 0.7 (3´) 0.6 (3´) SOT89 (SC-62) 1.7 4.85 1.1 (2´) 1.5 1.5 solder lands 1.7 3.95 sot089_fr 0.7 (3´) 3.95 sot089_fr 7 3.85 3.6 3.5 0.3 1.3 (4´) solder lands 1.2 (4´) 4 solder resist 3.9 1 2 3 6.1 7.65 solder paste occupied area Dimensions in mm 2.3 2.3 1.2 (3´) 1.3 (3´) 6.15 SOT223 (SC-73) - 6.5 x 3.5 x 1.65 mm www.nxp.com/microcontrollers © 2015 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The Date of release: May 2015 information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and Document order number: 9397 750 17660 may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof Printed in the Netherlands does not convey nor imply any license under patent- or other industrial or intellectual property rights.