') 1 ' BC68PAS series 20 V, 2 A NPN medium power transistors Rev. 1 — 19 June 2015 Product data sheet 1. Product profile 1.1 General description NPN medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads. PNP complement: BC69PAS series 1.2 Features and benefits High collector current capability Two current gain selections IC and ICM Reduced Printed-Circuit Board (PCB) Leadless very small SMD plastic area requirements package with medium power capability Exposed heat sink for excellent thermal Suitable for Automatic Optical and electrical conductivity Inspection (AOI) of solder joint AEC-Q101 qualified 1.3 Applications Linear voltage regulators Battery driven devices MOSFET drivers Low-side switches Power management Amplifiers 1.4 Quick reference data Table 1. Quick reference data Tamb = 25 C unless otherwise specified Symbol Parameter VCEO Min Typ Max Unit collector-emitter voltage open base - - 20 V IC collector current - - 2 A ICM peak collector current single pulse; tp 1 ms - - 3 A hFE DC current gain VCE = 1 V; IC = 500 mA [1] 85 - 375 VCE = 1 V; IC = 500 mA [1] 160 - 375 hFE selection -25 [1] Pulse test: tp 300 s; 0.02. Conditions BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors 2. Pinning information Table 2. Pinning Pin Description 1 base 2 emitter 3 collector Simplified outline Graphic symbol 3 1 2 sym021 7UDQVSDUHQWWRSYLHZ 3. Ordering information Table 3. Ordering information Type number Package Name BC68PAS BC68-25PAS Description Version DFN2020D-3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 2 0.65 mm. SOT1061D 4. Marking Table 4. Marking codes Type number Marking code BC68PAS BY BC68-25PAS BZ 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). BC68PAS_SER Product data sheet Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 32 V VCEO collector-emitter voltage open base - 20 V VEBO emitter-base voltage open collector - 5 V IC collector current - 2 A ICM peak collector current - 3 A IB base current - 0.4 A single pulse; tp 1 ms All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 2 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Ptot Parameter Conditions total power dissipation Tamb 25 C Min Max Unit [1] - 420 mW [2] - 830 mW [3] - 1.1 W [4] - 810 mW [5] - 1.65 W Tj junction temperature - 150 C Tamb ambient temperature 55 150 C Tstg storage temperature 65 150 C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2. DDF 3WRW : 7DPE& (1) FR4 PCB, 4-layer copper, 1 cm2 (2) FR4 PCB, single-sided copper, 6 cm2 (3) FR4 PCB, single-sided copper, 1 cm2 (4) FR4 PCB, 4-layer copper, standard footprint (5) FR4 PCB, single-sided copper, standard footprint Fig 1. BC68PAS_SER Product data sheet Power derating curves All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 3 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions thermal resistance from junction to ambient Rth(j-a) in free air thermal resistance from junction to solder point Rth(j-sp) Max Unit [1] 298 K/W [2] 151 K/W [3] 114 K/W [4] 154 K/W [5] 76 K/W 20 K/W in free air [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2 DDF =WKMD .: GXW\F\FOH WSV FR4 PCB, single-sided copper, tin-plated and standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values BC68PAS_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 4 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac684 103 Zth(j-a) (K/W) 102 10 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 1 0.01 0 10–1 10–5 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values DDF =WKMD .: GXW\F\FOH WSV FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2 Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values BC68PAS_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 5 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac686 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.25 0.33 0.2 0.1 10 0.05 0.02 1 0 10–1 10–5 0.01 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4 PCB, 4-layer copper, tin-plated and standard footprint Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values 006aac687 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.25 10 0.1 1 0 10–1 10–5 0.33 0.2 0.05 0.02 0.01 10–4 10–3 10–2 10–1 1 10 102 103 tp (s) FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2 Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for; typical values BC68PAS_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 6 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors 7. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = 25 V; IE = 0 A - - 100 nA VCB = 25 V; IE = 0 A; Tj = 150 C - - 10 A IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A - - 100 nA hFE DC current gain VCE = 10 V; IC = 5 mA hFE selection -25 collector-emitter saturation voltage VCEsat base-emitter voltage VBE 50 - - VCE = 1 V; IC = 500 mA [1] 85 - 375 VCE = 1 V; IC = 1 A [1] 60 - - VCE = 1 V; IC = 2 A [1] 40 - - VCE = 1 V; IC = 500 mA [1] 160 - 375 IC = 1 A; IB = 100 mA [1] - - 0.5 V IC = 2 A; IB = 200 mA [1] - - 0.6 V IC = 5 mA; VCE = 10 V [1] - - 0.7 V IC = 1 A; VCE = 1 V [1] - - 1 V fT transition frequency VCE = 5 V; IC = 50 mA; f = 100 MHz 40 170 - MHz Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - 22 - pF [1] Pulse test: tp 300 s; 0.02. 006aac694 400 006aac710 2.4 (1) hFE IB (mA) = 10 IC (A) 9 300 8 (2) 1.6 7 6 200 5 (3) 4 0.8 3 100 2 1 0 10–4 10–3 10–2 10–1 0.0 1 10 0 1 IC (A) 2 3 4 5 VCE (V) Tamb = 25 C VCE = 1 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 7. DC current gain as a function of collector current; typical values BC68PAS_SER Product data sheet Fig 8. Collector current as a function of collector-emitter voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 7 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors 006aac695 1.2 006aac696 1 VCEsat (V) VBE (V) (1) 0.8 10–1 (1) (2) (2) (3) 10–2 0.4 (3) 0 10–1 1 10 102 10–3 10–1 103 104 IC (mA) 1 10 VCE = 1 V IC/IB = 10 (1) Tamb = 55 C (1) Tamb = 100 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 100 C (3) Tamb = 55 C Fig 9. Base-emitter voltage as a function of collector current; typical values 102 103 104 IC (mA) Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline 1.3 1 0.04 max 2 1.1 0.9 0.3 0.2 0.65 max 0.45 0.35 0.35 0.25 2.1 1.9 3 1.6 1.4 2.1 1.9 Dimensions in mm 14-03-18 Fig 11. Package outline DFN2020D-3 (SOT1061D) BC68PAS_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 8 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors 10. Soldering )RRWSULQWLQIRUPDWLRQIRUUHIORZVROGHULQJRI')1'SDFNDJH 627' [ [ [ [ [ [ RFFXSLHGDUHD VROGHUUHVLVW VROGHUODQGV VROGHUSDVWH 'LPHQVLRQVLQPP ,VVXHGDWH VRWGBIU Fig 12. Reflow soldering footprint DFN2020D-3 (SOT1061D) BC68PAS_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 9 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors 11. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BC68PAS_SER v.1 20150619 Product data sheet - - BC68PAS_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 10 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BC68PAS_SER Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 11 of 13 BC68PAS series NXP Semiconductors 20 V, 2 A NPN medium power transistors No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 12.4 Trademarks Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BC68PAS_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 19 June 2015 © NXP Semiconductors N.V. 2015. All rights reserved. 12 of 13 NXP Semiconductors BC68PAS series 20 V, 2 A NPN medium power transistors 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 Quality information . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Contact information. . . . . . . . . . . . . . . . . . . . . 12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 19 June 2015 Document identifier: BC68PAS_SER