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KSMU2N65
650V N-channel MOSFET
KERSMI ELECTRONIC CO.,LTD.
Description
This N-channel MOSFET s use advanced trench technology and design to provide
excellent RDS(on) with low gate charge. It can be used in a wide variety of applications.
Features
BVDSS
RDSON
ID
650V
1)
2)
3)
4)
2A
4.8Ω
Low gate charge.
Green device available.
Advanced high cell denity trench technology for ultra RDS(ON)
Excellent package for good heat dissipation.
TO-251
Absolute Maximum Ratings TC=25℃,unless otherwise noted
Symbol
Parameter
Ratings
Units
VDS
Drain-Source Voltage
650
VGS
Gate-Source Voltage
±20
V
V
Continuous Drain Current-1
2
Continuous Drain Current-T=100℃
1.14
Pulsed Drain Current2
7.6
EAS
Single Pulse Avalanche Energy3
120
PD
Power Dissipation4
44
TJ, TSTG
Operating and Storage Junction Temperature
Range
-55 to
+150
℃
Ratings
Units
ID
A
mJ
W
Thermal Characteristics
Symbol
Parameter
RƟJC
Thermal Resistance ,Junction to Case1
2.87
RƟJA
Thermal Resistance, Junction to Ambient1
110
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℃/W
1
KSMU2N65
KERSMI ELECTRONIC CO.,LTD.
Package Marking and Ordering Information
Part NO.
Marking
Package
KSMU2N65
KSMU2N65
TO-251
Electrical Characteristics TC=25℃
Symbol
Parameter
unless otherwise noted
Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain-Sourtce Breakdown Voltage
VDS=0V,ID=250μA
650
—
—
IDSS
Zero Gate Voltage Drain Current
VDS=0V, VDS=32V
—
—
1
IGSS
Gate-Source Leakage Current
VDS=±20V, VDS=0A
—
—
±100
v
μA
nA
VDS=VDS, ID=250μA
2.0
—
4.0
V
VDS=10V,ID=6A
—
3.6
4.8
VDS=2.5V,ID=5A
—
—
—
VDS=5V,ID=12A
—
5.0
—
—
180
235
—
20
25
—
4.3
5.6
—
9
28
—
25
60
—
24
58
On Characteristics
VGS(th)
GATE-Source Threshold Voltage
RDS(ON)
Drain-Source On Resistance²
GFS
Forward Transconductance
Ω
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS=15V,VGS=0V,
f=1MHz
pF
Switching Characteristics
td(off)
Turn-Off Delay Time
tf
Fall Time
—
28
66
Qg
Total Gate Charge
—
8.5
12
Qgs
Gate-SourceCharge
VGS=4.5V, VDS=20V,
—
1.3
—
Gate-Drain “Miller” Charge
ID=6A
—
4.1
—
ns
ns
ns
ns
nC
nC
nC
—
—
1.4
V
—
230
—
ns
—
1.0
—
nC
td(on)
Turn-On Delay Time
tr
Rise Time
Qgd
VDS=20V,
VGS=10V,RGEN=3.3Ω
Drain-Source Diode Characteristics
VSD
Source-Drain Diode ForwardVoltage²
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VGS=0V,IS =1A
IF=7A,di/dt=100A/μS
Notes:
1. The data tested by surface mounted on a 1 inch²FR-4 board 2OZ copper.
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KSMU2N65
KERSMI ELECTRONIC CO.,LTD.
2. The data tested by pulse width≤300us,duty cycle≤2%
3. The EAS data shows Max.rating.The test condition is VDD=25v,VGS=10V,L=0.1mH,iAS=17.8A
4. The power dissipation is limited by 150℃ junction temperature.
Typical Characteristics TJ=25℃
unless otherwise noted
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
Figure 3. Capacitance Characteristics
Figure 4. On-Resistance Variation vs.
Drain Current and Gate Voltage
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KSMU2N65
KERSMI ELECTRONIC CO.,LTD.
Figure 5. Gate Charge Characteristics
Figure 7.Breakdown Voltage Variation
vs. Temperature
Figure 6. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
Figure 8.Maximum Safe Operating Area
Figure 9. Transient Thermal Response Curve
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