MCP2561 DATA SHEET (07/14/2014) DOWNLOAD

MCP2561/2
High-Speed CAN Transceiver
Features:
Description:
• Supports 1 Mb/s Operation
• Implements ISO-11898-2 and ISO-11898-5 
Standard Physical Layer Requirements
• Very Low Standby Current (5 µA, typical)
• VIO Supply Pin to Interface Directly to 
CAN Controllers and Microcontrollers with 
1.8V to 5.5V I/O
• SPLIT Output Pin to Stabilize Common Mode in
Biased Split Termination Schemes
• CAN Bus Pins are Disconnected when Device is
Unpowered:
- An Unpowered Node or Brown-Out Event will
Not Load the CAN Bus
• Detection of Ground Fault:
- Permanent Dominant Detection on TXD
- Permanent Dominant Detection on Bus
• Power-on Reset and Voltage Brown-Out
Protection on VDD Pin
• Protection Against Damage Due to Short-Circuit
Conditions (Positive or Negative Battery Voltage)
• Protection Against High-Voltage Transients in
Automotive Environments
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or exceeds stringent automotive design
requirements including “Hardware Requirements
for LIN, CAN and FlexRay Interfaces in Automotive Applications”, Version 1.3, May 2012
• High-Noise Immunity Due to Differential Bus
Implementation
• High Electrostatic Discharge (ESD) Protection on
CANH and CANL, meeting the IEC61000-4-2 up
to ±14 kV
• Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L
• Temperature ranges:
- Extended (E): -40°C to +125°C
- High (H): -40°C to +150°C
The MCP2561/2 is a Microchip Technology Inc. second
generation high-speed CAN transceiver. It serves as an
interface between a CAN protocol controller and the
physical two-wire CAN bus.
The device meets the automotive requirements for
high-speed (up to 1 Mb/s), low quiescent current,
electromagnetic compatibility (EMC) and electrostatic
discharge (ESD).
Package Types
MCP2561
PDIP, SOIC
TXD 1
8 STBY
MCP2562
PDIP, SOIC
TXD 1
8 STBY
VSS 2
7 CANH
VSS 2
7 CANH
VDD 3
6 CANL
VDD 3
6 CANL
RXD 4
5 SPLIT
RXD 4
5 VIO
MCP2561
3x3 DFN*
TXD 1
VSS 2
VDD 3
8 STBY
EP
9
RXD 4
MCP2562
3x3 DFN*
TXD 1
7 CANH
VSS 2
6 CANL
VDD 3
5 SPLIT
RXD 4
8 STBY
EP
9
7 CANH
6 CANL
5 VIO
* Includes Exposed Thermal Pad (EP); see Table 1-2.
MCP2561/2 Family Members
Device
Feature
MCP2561
Split pin
Common mode stabilization
MCP2562
VIO pin
Internal level shifter on digital I/O pins
Note:
Description
For ordering information, see the “Product Identification System” section on page 27.
 2013-2014 Microchip Technology Inc.
DS20005167C-page 1
MCP2561/2
Block Diagram
SPLIT(2)
VDD/2
VIO(3)
VDD
Digital I/O
Supply
Thermal
Protection
POR
UVLO
VIO
Permanent
Dominant Detect
TXD
VIO
STBY
CANH
Driver
and
Slope Control
CANL
Mode
Control
Wake-Up
Filter
CANH
LP_RX(1)
CANL
Receiver
RXD
CANH
HS_RX
CANL
VSS
Note 1: There is only one receiver implemented. The receiver can operate in Low-Power or High-Speed mode.
2: Only MCP2561 has the SPLIT pin.
3: Only MCP2562 has the VIO pin. In MCP2561, the supply for the digital I/O is internally connected to VDD.
DS20005167C-page 2
 2013-2014 Microchip Technology Inc.
MCP2561/2
1.0
DEVICE OVERVIEW
1.1.1
NORMAL MODE
The MCP2561/2 is a high-speed CAN, fault-tolerant
device that serves as the interface between a CAN
protocol controller and the physical bus. The
MCP2561/2 device provides differential transmit and
receive capability for the CAN protocol controller, and
is fully compatible with the ISO-11898-2 and
ISO-11898-5 standards. It will operate at speeds of up
to 1 Mb/s.
Normal mode is selected by applying a low-level to the
STBY pin. The driver block is operational and can drive
the bus pins. The slopes of the output signals on CANH
and CANL are optimized to produce minimal
electromagnetic emissions (EME).
Typically, each node in a CAN system must have a
device to convert the digital signals generated by a
CAN controller to signals suitable for transmission over
the bus cabling (differential output). It also provides a
buffer between the CAN controller and the high-voltage
spikes that can be generated on the CAN bus by
outside sources.
The device may be placed in Standby mode by
applying a high-level to the STBY pin. In Standby
mode, the transmitter and the high-speed part of the
receiver are switched off to minimize power
consumption. The low-power receiver and the wake-up
filter blocks are enabled in order to monitor the bus for
activity. The receive pin (RXD) will show a delayed
representation of the CAN bus, due to the wake-up
filter.
1.1
Mode Control Block
The high-speed differential receiver is active.
1.1.2
STANDBY MODE
The CAN controller gets interrupted by a negative edge
on the RXD pin (dominant state on the CAN bus). The
CAN controller must put the MCP2561/2 back into
Normal mode using the STBY pin, in order to enable
high-speed data communication.
The MCP2561/2 supports two modes of operation:
• Normal
• Standby
These modes are summarized in Table 1-1.
The CAN bus wake-up function requires both supply
voltages, VDD and VIO, to be in valid range.
TABLE 1-1:
MODES OF OPERATION
RXD Pin
Mode
STBY Pin
LOW
1.2
Normal
LOW
Bus is dominant
Bus is recessive
Standby
HIGH
Wake-up request is detected
No wake-up request detected
Transmitter Function
The CAN bus has two states: Dominant and
Recessive. A Dominant state occurs when the
differential voltage between CANH and CANL is
greater than VDIFF(D)(I). A Recessive state occurs
when the differential voltage is less than VDIFF(R)(I).
The Dominant and Recessive states correspond to the
Low and High state of the TXD input pin, respectively.
However, a Dominant state initiated by another CAN
node will override a Recessive state on the CAN bus.
1.3
HIGH
Receiver Function
In Normal mode, the RXD output pin reflects the differential bus voltage between CANH and CANL. The Low
and High states of the RXD output pin correspond to the
Dominant and Recessive states of the CAN bus,
respectively.
 2013-2014 Microchip Technology Inc.
1.4
Internal Protection
CANH and CANL are protected against battery shortcircuits and electrical transients that can occur on the
CAN bus. This feature prevents destruction of the
transmitter output stage during such a Fault condition.
The device is further protected from excessive current
loading by thermal shutdown circuitry that disables the
output drivers when the junction temperature exceeds
a nominal limit of +175°C. All other parts of the chip
remain operational, and the chip temperature is lowered due to the decreased power dissipation in the
transmitter outputs. This protection is essential to
protect against bus line short-circuit-induced damage.
DS20005167C-page 3
MCP2561/2
1.5
Permanent Dominant Detection
1.6
The MCP2561/2 device prevents two conditions:
Power-On Reset (POR) and 
Undervoltage Detection
The MCP2561/2 has undervoltage detection on both
supply pins: VDD and VIO. Typical undervoltage
thresholds are 1.2V for VIO and 4V for VDD.
• Permanent dominant condition on TXD
• Permanent dominant condition on the bus
In Normal mode, if the MCP2561/2 detects an
extended Low state on the TXD input, it will disable the
CANH and CANL output drivers in order to prevent the
corruption of data on the CAN bus. The drivers will
remain disabled until TXD goes High.
When the device is powered on, CANH and CANL
remain in a high-impedance state until both VDD and
VIO exceed their undervoltage levels. Once powered
on, CANH and CANL will enter a high-impedance state
if the voltage level at VDD drops below the undervoltage
level, providing voltage brown-out protection during
normal operation.
In Standby mode, if the MCP2561/2 detects an
extended dominant condition on the bus, it will set the
RXD pin to Recessive state. This allows the attached
controller to go to Low-Power mode until the dominant
issue is corrected. RXD is latched High until a
Recessive state is detected on the bus, and the
wake-up function is enabled again.
In Normal mode, the receiver output is forced to
Recessive state during an undervoltage condition on
VDD. In Standby mode, the low-power receiver is only
enabled when both VDD and VIO supply voltages rise
above their respective undervoltage thresholds. Once
these threshold voltages are reached, the low-power
receiver is no longer controlled by the POR comparator
and remains operational down to about 2.5V on the
VDD supply (MCP2561/2). The MCP2562 transfers
data to the RXD pin down to 1.8V on the VIO supply.
Both conditions have a time-out of 1.25 ms (typical).
This implies a maximum bit time of 69.44 µs
(14.4 kHz), allowing up to 18 consecutive dominant bits
on the bus.
1.7
Pin Descriptions
Table 1-2 describes the pinout.
TABLE 1-2:
MCP2561/2 PINOUT
MCP2561 MCP2561
3x3 DFN PDIP, SOIC
MCP2562
3x3 DFN
MCP2562
PDIP, SOIC
Symbol
Pin Function
1
1
1
1
TXD
Transmit Data Input
2
2
2
2
VSS
Ground
3
3
3
3
VDD
Supply Voltage
4
4
4
4
RXD
Receive Data Output
5
5
—
—
SPLIT
—
—
5
5
VIO
6
6
6
6
CANL
CAN Low-Level Voltage I/O
7
7
7
7
CANH
CAN High-Level Voltage I/O
8
8
8
8
STBY
Standby Mode Input
9
—
9
—
EP
DS20005167C-page 4
Common Mode Stabilization – MCP2561 only
Digital I/O Supply Pin – MCP2562 only
Exposed Thermal Pad
 2013-2014 Microchip Technology Inc.
MCP2561/2
1.7.1
TRANSMITTER DATA 
INPUT PIN (TXD)
The CAN transceiver drives the differential output pins
CANH and CANL according to TXD. It is usually
connected to the transmitter data output of the CAN
controller device. When TXD is Low, CANH and CANL
are in the Dominant state. When TXD is High, CANH
and CANL are in the Recessive state, provided that
another CAN node is not driving the CAN bus with a
Dominant state. TXD is connected to an internal pull-up
resistor (nominal 33 k) to VDD or VIO, in the MCP2561
or MCP2562, respectively.
1.7.2
GROUND SUPPLY PIN (VSS)
Ground supply pin.
1.7.3
1.7.9
STANDBY MODE INPUT PIN (STBY)
This pin selects between Normal or Standby mode. In
Standby mode, the transmitter, high speed receiver and
SPLIT are turned off, only the low power receiver and
wake-up filter are active. STBY is connected to an
internal MOS pull-up resistor to VDD or VIO, in the
MCP2561 or MCP2562, respectively. The value of the
MOS pull-up resistor depends on the supply voltage.
Typical values are 660 k for 5V, 1.1 M for 3.3V and
4.4 M for 1.8V
1.7.10
EXPOSED THERMAL PAD (EP)
It is recommended to connect this pad to VSS to
enhance electromagnetic immunity and thermal
resistance.
SUPPLY VOLTAGE PIN (VDD)
Positive supply voltage pin. Supplies transmitter and
receiver, including the wake-up receiver.
1.7.4
RECEIVER DATA 
OUTPUT PIN (RXD)
RXD is a CMOS-compatible output that drives High or
Low depending on the differential signals on the CANH
and CANL pins, and is usually connected to the
receiver data input of the CAN controller device. RXD is
High when the CAN bus is Recessive, and Low in the
Dominant state. RXD is supplied by VDD or VIO, in the
MCP2561 or MCP2562, respectively.
1.7.5
SPLIT PIN (MCP2561 ONLY)
Reference Voltage Output (defined as VDD/2). The pin
is only active in Normal mode. In Standby mode, or
when VDD is off, SPLIT floats.
1.7.6
VIO PIN (MCP2562 ONLY)
Supply for digital I/O pins. In the MCP2561, the supply
for the digital I/O (TXD, RXD and STBY) is internally
connected to VDD.
1.7.7
CAN LOW PIN (CANL)
The CANL output drives the Low side of the CAN
differential bus. This pin is also tied internally to the
receive input comparator. CANL disconnects from the
bus when MCP2561/2 is not powered.
1.7.8
CAN HIGH PIN (CANH)
The CANH output drives the high-side of the CAN
differential bus. This pin is also tied internally to the
receive input comparator. CANH disconnects from the
bus when MCP2561/2 is not powered.
 2013-2014 Microchip Technology Inc.
DS20005167C-page 5
MCP2561/2
1.8
Typical Applications
FIGURE 1-1:
MCP2561 WITH SPLIT PIN
VBAT
5V LDO
0.1 μF
PIC®
MCU
CANRX
RBX
RXD
STBY
CANH
CANH
SPLIT
300:
Optional(1)
VSS CANL
VSS
60:
4700 pF
60:
CANL
Optional resistor to allow communication during bus failure (CANL shorted to ground).
FIGURE 1-2:
VBAT
MCP2562 WITH VIO PIN
5V LDO
1.8V LDO
0.1 μF
VDD
PIC®
MCU
VIO
CANTX
TXD
CANRX
RXD
RBX
VSS
DS20005167C-page 6
0.1 μF
STBY
MCP2562
Note 1:
VDD
TXD
MCP2561
VDD
CANTX
CANH
VDD
CANH
Vss CANL
120:
CANL
 2013-2014 Microchip Technology Inc.
MCP2561/2
2.0
ELECTRICAL
CHARACTERISTICS
2.1
Terms and Definitions
A number of terms are defined in ISO-11898 that are
used to describe the electrical characteristics of a CAN
transceiver device. These terms and definitions are
summarized in this section.
2.1.1
BUS VOLTAGE
VCANL and VCANH denote the voltages of the bus line
wires CANL and CANH relative to ground of each
individual CAN node.
2.1.2
COMMON MODE BUS VOLTAGE
RANGE
Boundary voltage levels of VCANL and VCANH with
respect to ground, for which proper operation will occur,
if up to the maximum number of CAN nodes are
connected to the bus.
2.1.3
2.1.5
DIFFERENTIAL VOLTAGE, VDIFF 
(OF CAN BUS)
Differential voltage of the two-wire CAN bus, value
VDIFF = VCANH – VCANL.
2.1.6
INTERNAL CAPACITANCE, CIN 
(OF A CAN NODE)
Capacitance seen between CANL (or CANH) and
ground during the Recessive state, when the CAN
node is disconnected from the bus (see Figure 2-1).
2.1.7
INTERNAL RESISTANCE, RIN 
(OF A CAN NODE)
Resistance seen between CANL (or CANH) and
ground during the Recessive state, when the CAN
node is disconnected from the bus (see Figure 2-1).
FIGURE 2-1:
PHYSICAL LAYER
DEFINITIONS
ECU
DIFFERENTIAL INTERNAL
CAPACITANCE, CDIFF 
(OF A CAN NODE)
RIN
Capacitance seen between CANL and CANH during
the Recessive state, when the CAN node is
disconnected from the bus (see Figure 2-1).
RIN
CANL
CANH
CIN
2.1.4
DIFFERENTIAL INTERNAL
RESISTANCE, RDIFF 
(OF A CAN NODE)
CDIFF
RDIFF
CIN
GROUND
Resistance seen between CANL and CANH during the
Recessive state when the CAN node is disconnected
from the bus (see Figure 2-1).
 2013-2014 Microchip Technology Inc.
DS20005167C-page 7
MCP2561/2
Absolute Maximum Ratings†
VDD .............................................................................................................................................................................7.0V
VIO ..............................................................................................................................................................................7.0V
DC Voltage at TXD, RXD, STBY and VSS .............................................................................................-0.3V to VIO + 0.3V
DC Voltage at CANH, CANL and SPLIT ...................................................................................................... -58V to +58V
Transient Voltage on CANH, CANL (ISO-7637) (Figure 2-5) ................................................................... -150V to +100V
Storage temperature ...............................................................................................................................-55°C to +150°C
Operating ambient temperature ..............................................................................................................-40°C to +150°C
Virtual Junction Temperature, TVJ (IEC60747-1) ....................................................................................-40°C to +190°C
Soldering temperature of leads (10 seconds) .......................................................................................................+300°C
ESD protection on CANH and CANL pins for MCP2561 (IEC 61000-4-2).............................................................±14 kV
ESD protection on CANH and CANL pins for MCP2562 (IEC 61000-4-2)...............................................................±8 kV
ESD protection on CANH and CANL pins (IEC 801; Human Body Model)..............................................................±8 kV
ESD protection on all other pins (IEC 801; Human Body Model).............................................................................±4 kV
ESD protection on all pins (IEC 801; Machine Model) ............................................................................................±300V
ESD protection on all pins (IEC 801; Charge Device Model) ..................................................................................±750V
† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
DS20005167C-page 8
 2013-2014 Microchip Technology Inc.
MCP2561/2
2.2
DC Characteristics
Electrical Characteristics: Extended (E): TAMB = -40°C to +125°C and High (H): TAMB = -40°C to +150°C; 
VDD = 4.5V to 5.5V, VIO = 1.8V to 5.5V (Note 2), RL = 60; unless otherwise specified.
Characteristic
Sym.
Min.
Typ.
Max.
Voltage Range
VDD
4.5
—
5.5
Supply Current
IDD
—
5
10
—
45
70
—
5
15
—
5
15
Units
Conditions
SUPPLY
VDD Pin
Standby Current
IDDS
mA
Recessive; VTXD = VDD
Dominant; VTXD = 0V
µA
MCP2561
MCP2562; Includes IIO
High Level of the POR 
Comparator
VPORH
3.8
—
4.3
V
Low Level of the POR 
Comparator
VPORL
3.4
—
4.0
V
Hysteresis of POR 
Comparator
VPORD
0.3
—
0.8
V
VIO
1.8
—
5.5
V
IIO
—
4
30
µA
VIO Pin
Digital Supply Voltage Range
Supply Current on VIO
—
85
500
IDDS
—
0.3
1
µA
(Note 1)
VUVD(IO)
—
1.2
—
V
(Note 1)
Standby Current
Undervoltage detection on VIO
Recessive; VTXD = VIO
Dominant; VTXD = 0V
BUS LINE (CANH; CANL) TRANSMITTER
CANH; CANL: 
Recessive Bus Output Voltage
VO(R)
2.0
0.5VDD
3.0
V
VTXD = VDD; No load
CANH; CANL: 
Bus Output Voltage in Standby
VO(S)
-0.1
0.0
+0.1
V
STBY = VTXD = VDD; No load
Recessive Output Current
IO(R)
-5
—
+5
mA
VO(D)
2.75
3.50
4.50
V
0.50
1.50
2.25
VO(D)(M)
-400
0
+400
mV
VO(DIFF)
1.5
2.0
3.0
V
-120
0
12
mV
VTXD = VDD
Figure 2-2, Figure 2-4
-500
0
50
mV
VTXD = VDD,no load.
Figure 2-2, Figure 2-4
CANH: Dominant 
Output Voltage
CANL: Dominant 
Output Voltage
Symmetry of Dominant 
Output Voltage
(VDD – VCANH – VCANL)
Dominant: Differential 
Output Voltage
Recessive: 
Differential Output Voltage
Note 1:
2:
3:
-24V < VCAN < +24V
TXD = 0; RL = 50 to 65
RL = 50 to 65
VTXD = VSS (Note 1)
VTXD = VSS; RL = 50 to 65
Figure 2-2, Figure 2-4
Characterized; not 100% tested.
Only MCP2562 has VIO pin. For the MCP2561, VIO is internally connected to VDD.
-12V to 12V is ensured by characterization, tested from -2V to 7V.
 2013-2014 Microchip Technology Inc.
DS20005167C-page 9
MCP2561/2
2.2
DC Characteristics (Continued)
Electrical Characteristics: Extended (E): TAMB = -40°C to +125°C and High (H): TAMB = -40°C to +150°C; 
VDD = 4.5V to 5.5V, VIO = 1.8V to 5.5V (Note 2), RL = 60; unless otherwise specified.
Characteristic
CANH: Short Circuit 
Output Current
Sym.
Min.
Typ.
Max.
Units
IO(SC)
-120
-85
—
mA
VTXD = VSS; VCANH = 0V;
CANL: floating
-100
—
—
mA
same as above, but
VDD=5V, TAMB = +25°C (Note 1)
—
75
+120
mA
VTXD = VSS; VCANL = 18V;
CANH: floating
—
—
+100
mA
same as above, but
VDD=5V, TAMB = +25°C (Note 1)
-1.0
—
+0.5
V
-1.0
—
+0.4
0.9
—
VDD
1.0
—
VDD
0.5
0.7
0.9
0.4
—
1.15
CANL: Short Circuit 
Output Current
Conditions
BUS LINE (CANH; CANL) RECEIVER
Recessive Differential 
Input Voltage
Dominant Differential 
Input Voltage
Differential 
Receiver Threshold
VDIFF(R)(I)
VDIFF(D)(I)
VTH(DIFF)
Normal Mode;
-12V < V(CANH, CANL) < +12V;
See Figure 2-6 (Note 3)
Standby Mode;
-12V < V(CANH, CANL) < +12V;
See Figure 2-6 (Note 3)
V
Normal Mode;
-12V < V(CANH, CANL) < +12V;
See Figure 2-6 (Note 3)
Standby Mode;
-12V < V(CANH, CANL) < +12V;
See Figure 2-6 (Note 3)
V
Normal Mode;
-12V < V(CANH, CANL) < +12V;
See Figure 2-6 (Note 3)
Standby Mode;
-12V < V(CANH, CANL) < +12V;
See Figure 2-6 (Note 3)
Differential 
Input Hysteresis
VHYS(DIFF)
50
—
200
mV
Normal mode, see Figure 2-6,
(Note 1)
Common Mode 
Input Resistance
RIN
10
—
30
k
(Note 1)
RIN(M)
-1
0
+1
%
VCANH = VCANL, (Note 1)
Differential Input 
Resistance
RIN(DIFF)
10
—
100
k
(Note 1)
Common Mode 
Input Capacitance
CIN(CM)
—
—
20
pF
VTXD = VDD; (Note 1)
Differential 
Input Capacitance
CIN(DIFF)
—
—
10
ILI
-5
—
+5
Common Mode 
Resistance Matching
CANH, CANL: 
Input Leakage
Note 1:
2:
3:
VTXD = VDD; (Note 1)
µA
VDD = VTXD = VSTBY = 0V.
For MCP2562, VIO = 0V.
VCANH = VCANL = 5 V.
Characterized; not 100% tested.
Only MCP2562 has VIO pin. For the MCP2561, VIO is internally connected to VDD.
-12V to 12V is ensured by characterization, tested from -2V to 7V.
DS20005167C-page 10
 2013-2014 Microchip Technology Inc.
MCP2561/2
2.2
DC Characteristics (Continued)
Electrical Characteristics: Extended (E): TAMB = -40°C to +125°C and High (H): TAMB = -40°C to +150°C; 
VDD = 4.5V to 5.5V, VIO = 1.8V to 5.5V (Note 2), RL = 60; unless otherwise specified.
Characteristic
Sym.
Min.
Typ.
Max.
Units
Conditions
0.5VDD
0.7VDD
V
Normal mode; 
ISPLIT = -500 µA to +500 µA
0.45VDD 0.5VDD
COMMON MODE STABILIZATION OUTPUT (SPLIT)
Output Voltage
Vo
0.3VDD
0.55VDD
V
Normal mode; RL  1 M
Leakage Current
IL
-5
—
+5
µA
Standby mode; 
VSPLIT = -24V to + 24V 
(ISO 11898: -12V ~ +12V)
High-Level Input Voltage
VIH
0.7VIO
—
VIO + 0.3
V
Low-Level Input Voltage
VIL
-0.3
—
0.3VIO
V
High-Level Input Current
IIH
-1
—
+1
µA
TXD: Low-Level Input Current
IIL(TXD)
-270
-150
-30
µA
STBY: Low-Level Input Current
IIL(STBY)
-30
—
-1
µA
VOH
VDD - 0.4
—
—
V
VIO - 0.4
—
—
VOL
—
—
0.4
V
IOL = 4 mA; typical 8 mA
TJ(SD)
165
175
185
°C
-12V < V(CANH, CANL) < +12V,
(Note 1)
TJ(HYST)
20
—
30
°C
-12V < V(CANH, CANL) < +12V,
(Note 1)
DIGITAL INPUT PINS (TXD, STBY)
RECEIVE DATA (RXD) OUTPUT
High-Level Output Voltage
Low-Level Output Voltage
IOH = -2 mA (MCP2561); typical
-4 mA
IOH = -1 mA (MCP2562); typical
-2 mA
THERMAL SHUTDOWN
Shutdown 
Junction Temperature
Shutdown 
Temperature Hysteresis
Note 1:
2:
3:
Characterized; not 100% tested.
Only MCP2562 has VIO pin. For the MCP2561, VIO is internally connected to VDD.
-12V to 12V is ensured by characterization, tested from -2V to 7V.
 2013-2014 Microchip Technology Inc.
DS20005167C-page 11
MCP2561/2
FIGURE 2-2:
PHYSICAL BIT REPRESENTATION AND SIMPLIFIED BIAS IMPLEMENTATION
CANH, CANL, SPLIT
Normal Mode
Standby Mode
CANH
SPLIT
SPLIT
floating
CANL
Recessive
Dominant
Recessive
Time
VDD
CANH
VDD/2
Normal
RXD
Standby
Mode
CANL
DS20005167C-page 12
 2013-2014 Microchip Technology Inc.
MCP2561/2
2.3
AC Characteristics
Electrical Characteristics: Extended (E): TAMB = -40°C to +125°C and High (H): TAMB = -40°C to +150°C; 
VDD = 4.5V to 5.5V, VIO = 1.8V to 5.5V (Note 2), RL = 60; unless otherwise specified.
Param.
No.
Sym.
1
tBIT
Bit Time
2
fBIT
Bit Frequency
Characteristic
Min.
Typ.
Max.
Units
1
—
69.44
µs
14.4
—
1000
kHz
3
tTXD-BUSON
—
—
70
ns
4
tTXD-BUSOFF Delay TXD High to Bus Recessive
—
—
125
ns
5
tBUSON-RXD
—
—
70
ns
6
tBUSOFF-RXD Delay Bus Recessive to RXD
—
—
110
ns
—
—
125
ns
—
—
235
tFLTR(WAKE) Delay Bus Dominant to RXD 
(Standby mode)
0.5
1
4
µs
Standby mode
Delay Standby 
to Normal Mode
5
25
40
µs
Negative edge on STBY
7
Delay TXD Low to Bus Dominant
Conditions
tTXD - RXD
Delay Bus Dominant to RXD
Propagation Delay TXD to RXD
8
9
10
tWAKE
Negative edge on TXD
Positive edge on TXD
11
tPDT
Permanent Dominant Detect Time
—
1.25
—
ms
TXD = 0V
12
tPDTR
Permanent Dominant Timer Reset
—
100
—
ns
The shortest recessive
pulse on TXD or CAN bus
to reset Permanent
Dominant Timer
FIGURE 2-3:
TEST LOAD CONDITIONS
Load Condition 1
Load Condition 2
VDD/2
RL
CL
Pin
CL
Pin
RL = 464 
CL = 50 pF
FIGURE 2-4:
VSS
for all digital pins
VSS
TEST CIRCUIT FOR ELECTRICAL CHARACTERISTICS
0.1 µF
VDD
CANH
TXD
SPLIT
CAN
Transceiver
RL
100 pF
RXD
30 pF
CANL
GND
STBY
Note: On MCP2562, VIO is connected to VDD.
 2013-2014 Microchip Technology Inc.
DS20005167C-page 13
MCP2561/2
FIGURE 2-5:
TEST CIRCUIT FOR AUTOMOTIVE TRANSIENTS
CANH
TXD
SPLIT
CAN
Transceiver
1000 pF
Transient
Generator
RL
RXD
CANL
GND
STBY
1000 pF
Note: On MCP2562, VIO is connected to VDD.
The wave forms of the applied transients shall be in accordance
with ISO-7637, Part 1, test pulses 1, 2, 3a and 3b.
FIGURE 2-6:
HYSTERESIS OF THE RECEIVER
RXD (receive data
output voltage)
VOH
VDIFF (r)(i)
VDIFF (d)(i)
VOL
VDIFF (h)(i)
0.5
DS20005167C-page 14
VDIFF (V)
0.9
 2013-2014 Microchip Technology Inc.
MCP2561/2
2.4
Timing Diagrams and
Specifications
FIGURE 2-7:
TIMING DIAGRAM FOR AC CHARACTERISTICS
VDD
TXD (transmit data
input voltage)
0V
VDIFF (CANH,
CANL differential
voltage)
RXD (receive data
output voltage)
3
5
6
4
7
8
FIGURE 2-8:
TIMING DIAGRAM FOR WAKE-UP FROM STANDBY
VSTBY
Input Voltage
VDD
0V
VDD/2
VCANH/VCANL
0
VTXD = VDD
FIGURE 2-9:
10
PERMANENT DOMINANT TIMER RESET DETECT
Minimum pulse width until CAN bus goes to dominant after the falling edge
TXD
VDIFF (VCANH-VCANL)
Driver is off
11
 2013-2014 Microchip Technology Inc.
12
DS20005167C-page 15
MCP2561/2
2.5
Thermal Specifications
Parameter
Symbol
Min.
Typ.
Max.
Units
Specified Temperature Range
TA
-40
—
+125
C
-40
—
+150
Operating Temperature Range
TA
-40
—
+150
C
Storage Temperature Range
TA
-65
—
+155
C
Thermal Resistance, 8L-DFN 3x3
JA
—
56.7
—
C/W
Thermal Resistance, 8L-PDIP
JA
—
89.3
—
C/W
Thermal Resistance, 8L-SOIC
JA
—
149.5
—
C/W
Test Conditions
Temperature Ranges
Thermal Package Resistances
DS20005167C-page 16
 2013-2014 Microchip Technology Inc.
MCP2561/2
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
8-Lead DFN (3x3 mm)
Example:
Part Number
Code
MCP2561-E/MF
DADR
MCP2561T-E/MF
DADR
MCP2561-H/MF
DADS
MCP2561T-H/MF
DADS
MCP2562-E/MF
DADU
MCP2562T-E/MF
DADU
MCP2562-H/MF
DADT
MCP2562T-H/MF
DADT
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
MCP2561
3
E/P e^^256
1307
Example:
YYWW
8-Lead PDIP
(300 mil)
8-Lead SOIC (150 mil)
OR
MCP2561
3
H/P e^^256
1307
Example:
MCP2561E
3
SN e^^1246
256
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DADR
1326
256
OR
MCP2561H
3
SN e^^1246
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2013-2014 Microchip Technology Inc.
DS20005167C-page 17
MCP2561/2
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005167C-page 18
 2013-2014 Microchip Technology Inc.
MCP2561/2
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2013-2014 Microchip Technology Inc.
DS20005167C-page 19
MCP2561/2
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005167C-page 20
 2013-2014 Microchip Technology Inc.
MCP2561/2
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
'54
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
6&!
'!
9'&!
7"')
%!
7,8.
7
7
7:
;
<
&
&
&
=
=
##44!!
-
1!&
&
=
=
"#&
"#>#&
.
-
-
##4>#&
.
<
: 9&
-<
-?
&
&
9
-
9#4!!
<
)
?
)
<
1
=
=
69#>#&
9
*9#>#&
: *+
1,
-
!"#$%&"' ()"&'"!&)
&#*&&&#
+%&,&!&
- '!
!#.#
&"#'
#%!
&"!
!
#%!
&"!
!!
&$#/!#
'!
#&
.0
1,21!'!
&$& "!
**&
"&&
!
* ,<1
 2013-2014 Microchip Technology Inc.
DS20005167C-page 21
MCP2561/2
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005167C-page 22
 2013-2014 Microchip Technology Inc.
MCP2561/2
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2013-2014 Microchip Technology Inc.
DS20005167C-page 23
MCP2561/2
!
""#$%& !'
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
'54
DS20005167C-page 24
 2013-2014 Microchip Technology Inc.
MCP2561/2
APPENDIX A:
REVISION HISTORY
Revision C (July 2014)
The following is the list of modifications:
1.
2.
3.
4.
5.
Added references to ISO-11898-2 throughout
the document.
Updated Section 1.1.2 “Standby Mode”.
Described transition from Standby to Normal
mode. Emphasized that wake-up on CAN bus
requires both VDD and VIO.
Explained that POR and Brown-out are limited
to VDD pin in Section 1.6 “Power-On Reset
(POR) and Undervoltage Detection”.
Updated Section 2.2 “DC Characteristics”.
Clarified RL, added CANH/CANL Short Circuit
specification for 5V and room temperature.
Minor typographical corrections.
Revision B (March 2013)
• Updated the MCP2561/2 Family Members table
on page 1.
Revision A (March 2013)
• Original Release of this Document.
 2013-2014 Microchip Technology Inc.
DS20005167C-page 25
MCP2561/2
NOTES:
DS20005167C-page 26
 2013-2014 Microchip Technology Inc.
MCP2561/2
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-X
/XX
Device
Temperature
Range
Package
Examples:
a)
b)
Device:
MCP2561: High-Speed CAN Transceiver with SPLIT
MCP2561T: High-Speed CAN Transceiver with SPLIT
(Tape and Reel) (DFN and SOIC only)
MCP2562: High-Speed CAN Transceiver with VIO
MCP2562T: High-Speed CAN Transceiver with VIO
(Tape and Reel) (DFN and SOIC only)
c)
d)
e)
Temperature
Range:
E
H
=
=
-40°C to +125°C (Extended)
-40°C to +150°C (High)
Package:
MF = Plastic Dual Flat, No Lead Package - 3x3x0.9 mm
Body, 8-lead
P
= Plastic Dual In-Line - 300 mil Body, 8-lead
SN = Plastic Small Outline - Narrow, 3.90 mm Body, 
8-lead
a)
b)
c)
d)
e)
 2013-2014 Microchip Technology Inc.
MCP2561-E/MF: Extended Temperature,
8LD 3x3 DFN package
MCP2561T-E/MF: Tape and Reel,
Extended Temperature,
8LD 3x3 DFN package
MCP2561-E/P:
Extended Temperature,
8LD PDIP package
MCP2561-E/SN: Extended Temperature,
8LD SOIC package
MCP2561T-E/SN: Tape and Reel,
Extended Temperature,
8LD SOIC package
MCP2561-H/MF: High Temperature,
8LD 3x3 DFN package
MCP2561T-H/MF: Tape and Reel,
High Temperature,
8LD 3x3 DFN package
MCP2561-H/P: High Temperature,
8LD PDIP package
MCP2561-H/SN: High Temperature,
8LD SOIC package
MCP2561T-H/SN:Tape and Reel,
High Temperature,
8LD SOIC package
DS20005167C-page 27
MCP2561/2
NOTES:
DS20005167C-page 28
 2013-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2013-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-378-5
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2013-2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005167C-page 29
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
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Fax: 43-7242-2244-393
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Tel: 45-4450-2828
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Tel: 61-2-9868-6733
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DS20005167C-page 30
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Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
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Tel: 86-25-8473-2460
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China - Qingdao
Tel: 86-532-8502-7355
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Tel: 49-2129-3766400
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Tel: 81-3-6880- 3770
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Tel: 49-89-627-144-0
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Tel: 82-53-744-4301
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Tel: 49-7231-424750
Italy - Milan
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03/25/14
 2013-2014 Microchip Technology Inc.