TJA1042 High-speed CAN transceiver with Standby mode Rev. 02 — 8 July 2009 Product data sheet 1. General description The TJA1042 is a high-speed CAN transceiver that provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the automotive industry, providing the differential transmit and receive capability to (a microcontroller with) a CAN protocol controller. The TJA1042 is a step up from the TJA1040, PCA82C250 and PCA82C251 high-speed CAN transceivers. It offers improved ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD) performance, and also features: • Ideal passive behavior to the CAN bus when the supply voltage is off • A very low-current Standby mode with bus wake-up capability • Direct interfacing to microcontrollers with 3 V to 5 V supply voltages on TJA1042T/3 and TJA1042TK/3 These features make the TJA1042 an excellent choice for all types of HS-CAN networks, in nodes that require a low-power mode with wake-up capability via the CAN bus. 2. Features 2.1 General n n n n Fully ISO 11898-2 and ISO 11898-5 compliant Suitable for 12 V and 24 V systems Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI) VIO input on TJA1042T/3 and TJA1042TK/3 allows for direct interfacing with 3 V to 5 V microcontrollers (available in SO8 and very small HVSON8 packages respectively) n SPLIT voltage output on TJA1042T for stabilizing the recessive bus level (available in SO8 package only) 2.2 Low-power management n Very low-current Standby mode with host and bus wake-up capability n Functional behavior predictable under all supply conditions n Transceiver disengages from the bus when not powered up (zero load) 2.3 Protections n High ESD handling capability on the bus pins n Bus pins protected against transients in automotive environments TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode n n n n Transmit Data (TXD) dominant time-out function Bus-dominant time-out function in Standby mode Undervoltage detection on pins VCC and VIO Thermally protected 3. Ordering information Table 1. Ordering information Type number[1] Package Name Description Version TJA1042T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96 TJA1042T/3 SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96 TJA1042TK/3 HVSON8 plastic thermal enhanced very small outline package; 8 leads; body width 3 mm; lead pitch 0.65 mm; exposed die pad SOT782 [1] TJA1042T with SPLIT pin; TJA1042T/3 and TJA1042TK/3 with VIO pin. TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 2 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 4. Block diagram VIO VCC 5 3 VCC TJA1042 TEMPERATURE PROTECTION VIO(1) TXD 1 7 TIME-OUT SLOPE CONTROL AND DRIVER MODE CONTROL SPLIT 6 CANH CANL VIO(1) STB RXD 8 5 SPLIT(1) 4 MUX AND DRIVER WAKE-UP FILTER 2 GND 015aaa017 (1) In a transceiver with a SPLIT pin, the VIO input is internally connected to VCC. Fig 1. Block diagram TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 3 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 5. Pinning information 5.1 Pinning TJA1042T/3 TJA1042TK/3 TJA1042T TXD 1 8 STB TXD 1 8 STB GND 2 7 CANH GND 2 7 CANH VCC 3 6 CANL VCC 3 6 CANL RXD 4 5 SPLIT RXD 4 5 VIO 015aaa018 Fig 2. 015aaa019 Pin configuration diagrams 5.2 Pin description Table 2. Pin description Symbol Pin Description TXD 1 transmit data input GND 2 ground supply VCC 3 supply voltage RXD 4 receive data output; reads out data from the bus lines SPLIT 5 common-mode stabilization output; in TJA1042T version only VIO 5 supply voltage for I/O level adapter; in TJA1042T/3 and TJA1042TK/3 versions only CANL 6 LOW-level CAN bus line CANH 7 HIGH-level CAN bus line STB 8 Standby mode control input TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 4 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 6. Functional description The TJA1042 is a HS-CAN stand-alone transceiver with Standby mode. It combines the functionality of the PCA82C250, PCA82C251 and TJA1040 transceivers with improved EMC and ESD handling capability and quiescent current performance. Improved slope control and high DC handling capability on the bus pins provide additional application flexibility. The TJA1042 is available in two versions, distinguished only by the function of pin 5: • The TJA1042T is 100 % backwards compatible with the TJA1040, and also covers existing PCA82C250 and PCA82C251 applications • The TJA1042T/3 and TJA1042TK/3 allow for direct interfacing to microcontrollers with supply voltages down to 3 V 6.1 Operating modes The TJA1042 supports two operating modes, Normal and Standby, which are selectable via pin STB. See Table 3 for a description of the operating modes under normal supply conditions. Table 3. Operating modes Mode Pin STB Pin RXD LOW HIGH Normal LOW bus dominant bus recessive Standby HIGH wake-up request detected no wake-up request detected 6.1.1 Normal mode A LOW level on pin STB selects Normal mode. In this mode, the transceiver can transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block diagram). The differential receiver converts the analog data on the bus lines into digital data which is output to pin RXD. The slope of the output signals on the bus lines is controlled and optimized in a way that guarantees the lowest possible EME. 6.1.2 Standby mode A HIGH level on pin STB selects Standby mode. In Standby mode, the transceiver is not able to transmit or correctly receive data via the bus lines. The transmitter and Normal-mode receiver blocks are switched off to reduce supply current, and only a low-power differential receiver monitors the bus lines for activity. The wake-up filter on the output of the low-power receiver does not latch bus dominant states, but ensures that only bus dominant and bus recessive states that persist longer than tfltr(wake)bus are reflected on pin RXD. In Standby mode, the bus lines are biased to ground to minimize the system supply current. The low-power receiver is supplied by VIO, and is capable of detecting CAN bus activity even if VIO is the only supply voltage available. When pin RXD goes LOW to signal a wake-up request, a transition to Normal mode will not be triggered until STB is forced LOW. TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 5 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 6.2 Fail-safe features 6.2.1 TXD dominant time-out function A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus lines to recessive state. This function prevents a hardware and/or software application failure from driving the bus lines to a permanent dominant state (blocking all network communications). The TXD dominant time-out timer is reset when pin TXD is set to HIGH. The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s. 6.2.2 Bus dominant time-out function In Standby mode a 'bus dominant time-out' timer is started when the CAN bus changes from recessive to dominant state. If the dominant state on the bus persists for longer than tto(dom)bus, the RXD pin is reset to HIGH. This function prevents a clamped dominant bus (due to a bus short-circuit or a failure in one of the other nodes on the network) from generating a permanent wake-up request. The bus dominant time-out timer is reset when the CAN bus changes from dominant to recessive state. 6.2.3 Internal biasing of TXD and STB input pins Pins TXD and STB have internal pull-ups to VIO to ensure a safe, defined state in case one or both of these pins are left floating. 6.2.4 Undervoltage detection on pins VCC and VIO Should VCC drop below the VCC undervoltage detection level, Vuvd(VCC), the transceiver will switch to Standby mode. The logic state of pin STB will be ignored until VCC has recovered. Should VIO drop below the VIO undervoltage detection level, Vuvd(VIO), the transceiver will switch off and disengage from the bus (zero load) until VIO has recovered. 6.2.5 Over-temperature protection The output drivers are protected against overtemperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes recessive again. Including the TXD condition ensures that output driver oscillation due to temperature drift is avoided. 6.3 SPLIT output pin and VIO supply pin Two versions of the TJA1042 are available, only differing in the function of a single pin. Pin 5 is either a SPLIT output pin or a VIO supply pin. 6.3.1 SPLIT pin Using the SPLIT pin on the TJA1042T in conjunction with a split termination network (see Figure 3 and Figure 4) can help to stabilize the recessive voltage level on the bus. This will reduce EME in networks with DC leakage to ground (e.g. from deactivated nodes with poor bus leakage performance). In Normal mode, pin SPLIT delivers a DC output voltage of 0.5VCC. In Standby mode or when VCC is off, pin SPLIT is floating. TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 6 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode VCC TJA1042T CANH 60 Ω R VSPLIT = 0.5 VCC in normal mode; otherwise floating SPLIT 60 Ω R CANL GND Fig 3. 015aaa020 Stabilization circuitry and application for version with SPLIT pin 6.3.2 VIO supply pin Pin VIO on the TTJA1042T/3 and TJA1042TK/3 should be connected to the microcontroller supply voltage (see Figure 5). This will adjust the signal levels of pins TXD, RXD and STB to the I/O levels of the microcontroller. Pin VIO also provides the internal supply voltage for the low-power differential receiver of the transceiver. For applications running in low-power mode, this allows the bus lines to be monitored for activity even if there is no supply voltage on pin VCC. For versions of the TJA1042 without a VIO pin, the VIO input is internally connected to VCC. This sets the signal levels of pins TXD, RXD and STB to levels compatible with 5 V microcontrollers. 7. Application design-in information BAT 5V VCC CANH CANH SPLIT CANL STB TJA1042T CANL Pyy TXD RXD VDD Pxx TX0 MICROCONTROLLER RX0 GND Fig 4. 015aaa022 Typical application with TJA1042T and a 5 V microcontroller. TJA1042_2 Product data sheet GND © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 7 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode BAT 3V INH 5V VCC VIO STB CANH CANH TJA1042T/3 TJA1042TK/3 CANL CANL TXD RXD VDD Pxx TX0 MICROCONTROLLER RX0 GND GND 015aaa021 Switching off the 5 V supply in Standby mode (dotted line) is optional. Fig 5. Typical application with TJA1042T/3 or TJA1042TK/3 and a 3 V microcontroller. 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter voltage on pin x Vx Conditions Min Max Unit −58 +58 V −0.3 +7 V −150 +100 V −9 +9 kV at pins CANH and CANL −8 +8 kV at any other pin −4 +4 kV −300 +300 V −750 +750 V −500 +500 V −40 +150 °C no time limit; DC value on pins CANH and CANL on any other pin Vtrt transient voltage on pins CANH and CANL [1] VESD electrostatic discharge voltage IEC 61000-4-2 [2] at pins CANH and CANL HBM [3] [4] [5] MM at any pin CDM [6] at corner pins at any pin [7] Tvj virtual junction temperature Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +125 °C [1] Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a, 3a and 3b. [2] IEC 61000-4-2 (150 pF, 330 Ω). TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 8 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode [3] ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 Ω) has been be verified by an external test house. The result is equal to or better than ±8 kV (unaided). [4] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ). [5] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 µH, 10 Ω). [6] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). The classification level is C5 (>1000 V). [7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P × Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). 9. Thermal characteristics Table 5. Thermal characteristics According to IEC 60747-1. Symbol Parameter Conditions Rth(vj-a) thermal resistance from virtual junction to ambient Value Unit SO8 package; in free air 145 K/W HVSON8 package; in free air 50 K/W 10. Static characteristics Table 6. Static characteristics Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC.[2] Symbol Parameter Conditions Min Typ Max Unit 4.5 - 5.5 V TJA1042T; includes IIO - 10 15 µA TJA1042T/3 or TJA1042TK/3 - - 5 µA recessive; VTXD = VIO 2.5 5 10 mA dominant; VTXD = 0 V 20 45 70 mA 3.5 - 4.5 V 2.8 - 5.5 V 5 - 14 µA recessive; VTXD = VIO 15 80 200 µA dominant; VTXD = 0 V 100 350 1000 µA 1.3 2.0 2.7 V Supply; pin VCC VCC supply voltage ICC supply current Standby mode Normal mode Vuvd(VCC) undervoltage detection voltage on pin VCC I/O level adapter supply; pin VIO[1] VIO supply voltage on pin VIO IIO supply current on pin VIO Standby mode Normal mode Vuvd(VIO) undervoltage detection voltage on pin VIO Standby mode control input; pin STB VIH HIGH-level input voltage 0.7VIO - VIO + 0.3 V VIL LOW-level input voltage −0.3 - 0.3VIO V IIH HIGH-level input current −1 - +1 µA VSTB = VIO TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 9 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode Table 6. Static characteristics …continued Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC.[2] Symbol Parameter Conditions Min Typ Max Unit IIL LOW-level input current VSTB = 0 V −15 - −1 µA CAN transmit data input; pin TXD VIH HIGH-level input voltage 0.7VIO - VIO + 0.3 V VIL LOW-level input voltage −0.3 - 0.3VIO V IIH HIGH-level input current VTXD = VIO −5 - +5 µA IIL LOW-level input current Normal mode; VTXD = 0 V −260 −150 −30 µA Ci input capacitance - 5 10 pF [3] CAN receive data output; pin RXD IOH HIGH-level output current VRXD = VIO − 0.4 V; VIO = VCC −8 −3 −1 mA IOL LOW-level output current VRXD = 0.4 V; bus dominant 2 5 12 mA Bus lines; pins CANH and CANL VO(dom) Vdom(TX)sy m VO(dif)bus VO(rec) dominant output voltage transmitter dominant voltage symmetry VTXD = 0 V; t < tto(dom)TXD pin CANH 2.75 3.5 4.5 V pin CANL 0.5 1.5 2.25 V −400 - +400 mV 1.5 - 3 V VTXD = VIO; VCC = 4.75 V to 5.25 V recessive; no load −50 - +50 mV Normal mode; VTXD = VIO; no load 2 0.5VCC 3 V −0.1 - V Vdom(TX)sym = VCC − VCANH − VCANL bus differential output voltage VTXD = 0 V; t < tto(dom)TXD VCC = 4.75 V to 5.25 V RL = 45 Ω to 65 Ω recessive output voltage Standby mode; no load Vth(RX)dif differential receiver threshold voltage Vcm(CAN) = −30 V to +30 V +0.1 [4] Normal mode 0.5 0.7 0.9 V 0.4 0.7 1.15 V 50 120 200 mV pin CANH; VCANH = 0 V −100 −70 −40 mA pin CANL; VCANL = 5 V / 40 V 40 70 100 mA Standby mode Vhys(RX)dif differential receiver hysteresis Vcm(CAN) = −30 V to +30 V voltage Normal mode IO(dom) dominant output current [5] VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V IO(rec) recessive output current Normal mode; VTXD = VIO VCANH = VCANL = −27 V to +32 V −5 - +5 mA IL leakage current VCC = VIO = 0 V; VCANH = VCANL = 5 V −5 - +5 µA Ri input resistance 9 15 28 kΩ ∆Ri input resistance deviation −1 - +1 % between VCANH and VCANL Ri(dif) differential input resistance 19 30 52 kΩ Ci(cm) common-mode input capacitance [3] - - 20 pF Ci(dif) differential input capacitance [3] - - 10 pF TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 10 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode Table 6. Static characteristics …continued Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are defined with respect to ground; Positive currents flow into the IC.[2] Symbol Parameter Conditions Min Typ Max Unit Normal mode ISPLIT = −500 µA to +500 µA 0.3VCC 0.5VCC 0.7VCC Normal mode; RL = 1 MΩ 0.45VCC 0.5VCC 0.55VCC V Standby mode VSPLIT = −58 V to +58 V −5 - +5 µA - 190 - °C Common mode stabilization output; pin SPLIT; only for TJA1042T output voltage VO leakage current IL V Temperature detection Tj(sd) [3] shutdown junction temperature [1] Only TJA1042T/3 and TJA1042TK/3 have a VIO pin. With TJA1042T, the VIO input is internally connected to VCC. [2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (final testing). Both pretesting and final testing use correlated test conditions to cover the specified temperature and power supply voltage range. [3] Not tested in production. [4] Vcm(CAN) is the common mode voltage of CANH and CANL. [5] For TJA1042T/3 and TJA1042TK/3: values valid when VIO = 4.5 V to 5.5 V; when VIO = 2.8 V to 4.5 V, values valid when Vcm(CAN) = −12 V to +12 V. TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 11 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 11. Dynamic characteristics Table 7. Dynamic characteristics Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise. All voltages are defined with respect to ground. Positive currents flow into the IC.[2] Symbol Parameter Conditions Min Typ Max Unit Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 6 and Figure 7 td(TXD-busdom) delay time from TXD to bus dominant Normal mode - 65 - ns td(TXD-busrec) delay time from TXD to bus recessive Normal mode - 90 - ns td(busdom-RXD) delay time from bus dominant to RXD Normal mode - 60 - ns td(busrec-RXD) delay time from bus recessive to RXD Normal mode - 65 - ns tPD(TXD-RXD) propagation delay from TXD to RXD version with SPLIT pin Normal mode 60 - 220 ns versions with VIO pin Normal mode 60 - 250 ns tto(dom)TXD TXD dominant time-out time VTXD = 0 V; Normal mode 0.3 2 12 ms tto(dom)bus bus dominant time-out time Standby mode 0.3 2 12 ms tfltr(wake)bus bus wake-up filter time version with SPLIT pin Standby mode 0.5 1 3 µs versions with VIO pin Standby mode 0.5 1.5 5 µs 7 25 47 µs td(stb-norm) standby to normal mode delay time [1] Only TJA1042T/3 and TJA1042TK/3 have a VIO pin. With TJA1042T, the VIO input is internally connected to VCC. [2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (final testing). Both pretesting and final testing use correlated test conditions to cover the specified temperature and power supply voltage range. +5 V 47 µF 100 nF VIO(1) VCC CANH TXD TJA1042 SPLIT 100 pF CANL RXD GND RL STB 15 pF 015aaa024 (1) For versions with a VIO pin (TJA1042T/3 and TJA1042TK/3), the VIO pin is connected to pin VCC. Fig 6. Timing test circuit for CAN transceiver TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 12 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode HIGH TXD LOW CANH CANL dominant 0.9 V VO(dif)(bus) 0.5 V recessive HIGH 0.7VIO RXD 0.3VIO LOW td(TXD-busrec) td(TXD-busdom) td(busrec-RXD) td(busdom-RXD) tPD(TXD-RXD) Fig 7. tPD(TXD-RXD) 015aaa025 CAN transceiver timing diagram 12. Test information 12.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 13 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 13. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Fig 8. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Package outline SOT96-1 (SO8) TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 14 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT782-1 0 1 2 mm scale X A B D A A1 E terminal 1 index area c detail X C e1 terminal 1 index area v M C A B w M C b e 1 y1 C 4 y L Eh 8 5 Dh DIMENSIONS (mm are the original dimensions) UNIT A (1) max. A1 b c D (1) Dh E (1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.35 0.25 0.2 3.1 2.9 2.55 2.25 3.1 2.9 1.75 1.45 0.65 1.95 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Fig 9. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT782-1 --- MO-229 --- EUROPEAN PROJECTION ISSUE DATE 03-01-29 Package outline SOT782-1 (HVSON8) TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 15 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 16 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 10) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9 Table 8. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 9. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 10. TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 17 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 10. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 15. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes TJA1042_2 20090708 Product data sheet - TJA1042_1 - - Modifications • • Revised parameter values in Table 4 (VESD) Revised parameter values in Table 6 (VO for SPLIT pin) TJA1042_1 20090309 Product data sheet TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 18 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TJA1042_2 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 02 — 8 July 2009 19 of 20 TJA1042 NXP Semiconductors High-speed CAN transceiver with Standby mode 18. Contents 1 2 2.1 2.2 2.3 3 4 5 5.1 5.2 6 6.1 6.1.1 6.1.2 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.2.5 6.3 6.3.1 6.3.2 7 8 9 10 11 12 12.1 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Low-power management . . . . . . . . . . . . . . . . . 1 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6 TXD dominant time-out function . . . . . . . . . . . . 6 Bus dominant time-out function . . . . . . . . . . . . 6 Internal biasing of TXD and STB input pins . . . 6 Undervoltage detection on pins VCC and VIO . . 6 Over-temperature protection. . . . . . . . . . . . . . . 6 SPLIT output pin and VIO supply pin . . . . . . . . 6 SPLIT pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application design-in information . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . 13 Quality information . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Soldering of SMD packages . . . . . . . . . . . . . . 16 Introduction to soldering . . . . . . . . . . . . . . . . . 16 Wave and reflow soldering . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 July 2009 Document identifier: TJA1042_2