Metal Film Thermosensitive Chip Resistors Metal Film Thermosensitive Chip Resistors 0402, 0603, 0805 Type: ERAW, V, S ■ Features ● Suitable for temperature correction circuits –6 ● Temperature coefficient value 1500 to 3900 10 /°C ● High performance Quick response to temperature change ● Linearity Excellent linear resistance value change in wide temperature range (–40 °C to +125 °C) ● High reliability, High density placing ● Small size and lightweight for PWB size reduction and lightweight products ● Suitable for both reflow and flow soldering ● Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2145 ● RoHS compliant ■ Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 E R A S 1 5 J 1 0 3 V Product Code Metal Film Chip Resistors Size, Power Rating Type: inches Power Rating W : 0402 0.031 W V : 0603 0.063 W S : 0805 0.1 W Temperature Coefficient of Resistance Code Type (10–6/°C) 15 ERAV, ERAS 1500 27 ERAW, ERAV, ERAS 2700 33 ERAW, ERAV, ERAS 3300 39 ERAV, ERAS 3900 ■ Construction Resistance Tolerance Code J Packaging Methods Packaging Type Punched Carrier Taping ERAW 2 mm pitch, 10,000 pcs. Code Tol. ±5% X Punched Carrier Taping ERAV 4 mm pitch, 5,000 pcs. ERAS V Resistance Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal point is expressed by “R ”. (ex.) 103 : 10 k 6R8 : 6.8 ■ Dimensions in mm (not to scale) L a Protective coating Alumina substrate Electrode (Inner) W (1) t b Electrode (Between) Thermosensitive element L ERAW (0402) 1.00 ERAV (0603) ERAS (0805) Electrode (Outer) Dimensions (mm) Type (inches) W ±0.07 0.50 1.60 ±0.20 2.00 ±0.20 a ±0.05 0.15 0.80 ±0.20 0.30 1.25 ±0.10 b ±0.10 0.25 ±0.20 0.30 ±0.25 0.40 Mass (Weight) [g/1000 pcs.] t ±0.07 0.35 ±0.20 0.45 ±0.25 0.40 ±0.05 0.6 ±0.10 2 ±0.10 4 0.50 1) Marking Temperture Coefficient value : –6 2 significant figure 100 10 /°C ERAW type is no marking. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Oct. 2010 Metal Film Thermosensitive Chip Resistors ■ Ratings Type (inched) Power Rating at 70 °C (W) ERAW (0402) 0.031 ERAV (0603) Standard Specification T.C.R. (2) (10 –6 /°C) Resistance Range () 2700 3300 43 to 1 k 22 to 390 1500 2700 3300 3900 1500 2700 3300 3900 10 to 10 k 43 to 3.3 k 22 to 1.2 k 7.5 to 390 10 to 10 k 43 to 5.1 k 22 to 1.8 k 6.2 to 470 0.063 ERAS (0805) (1) 0.1 T.C.R. Tolerance Resistance Tolerance (%) Standard Resistance Values ±10 % ±5 E12 ±5 E12 ±5 E12 ±200 10 -6 / °C ±10 % ±200 10 -6 / °C ±10 % (1) Please ask us when resistors other than standard specification shown in the above table are needed. (2) T.C.R.= { R R-R 75 25 25 6 –6 1 10 10 / ° C R25: Resistance value at reference temperature 25 °C 75–25 R75: Resistance value at temperature 75 °C } Power Derating Curve For resistors operated in ambient tem per a tures above 70 °C, power rating shall be derated in accordance with the figure on the right. Rated Load (%) 120 Category Temperature Range –40 °C to +125 °C 70 °C 100 80 60 40 125 °C 20 0 –40 –20 0 20 40 60 80 100 120 140 Ambient Temperature(°C) ■ Typical Linearity of Resistance Change Resistance Change (%) 60 50 40 390010–6/°C (ppm/°C) 30 270010–6/°C (ppm/°C) 20 150010–6/°C (ppm/°C) 10 0 –10 –20 –30 –40 –25 0 25 50 75 100 125 Ambient Temperature (°C) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Sep. 2010 Metal Film Thermosensitive Chip Resistors ■ Packaging Methods (Taping) ● Standard Quantity Type Kind of Taping Pitch (P1) Quantity 2 mm 10000 pcs./reel 4 mm 5000 pcs./reel ERAW Punched Carrier Taping ERAV ERAS ● Carrier Tape (Unit : mm) Punched Carrier P1 P2 P0 B W F E φD0 Type A B ERAW 0.67±0.05 1.17±0.05 ERAV 1.10 ±0.10 1.19 ±0.10 ERAS ±0.15 ±0.20 1.65 P1 (2 mm pitch) A T 2.50 W F E P1 P2 φD 0 P0 T 2.00 ±0.10 8.00 ±0.20 3.50 ±0.05 1.75 ±0.10 4.00 ±0.10 0.52±0.05 2.00 ±0.05 4.00 ±0.10 1.50 +0.10 –0 0.70 ±0.05 0.84±0.05 ● Taping Reel (Unit : mm) Type ERAW ERAV ERAS φN φC W1 W2 180.0 +0 –1.5 60 +1.0 –0 13.0 ±0.2 9.0 +1.0 –0 11.4±1.0 φN φC φA W1 φA W2 ■ Attention This product has high temperature coefficient. When measuring resistance, the resistance value can change due to Joule Heating. Therefore, the measuring current shall be very small in order to prevent the resistance value from changing. (For example, when the resistor is used at RCWV, temperature of the resistor rise about 15 °C and the resistance value rise a few percents.) Resistance value may also change due to the ambient temperature. Resistance value is measured at 25 °C. ■ Recommended Land Pattern Anexample of a land pattern to Metal Film Thermosensitive Chip Resistors is shown below. Example c Chip Resistor a Type (inch size) ERAW (0402) ERAV (0603) ERAS (0805) Dimensions (mm) a b c 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0 1.0 to 1.4 3.2 to 3.8 0.9 to 1.4 b Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Sep. 2010 Metal Film Thermosensitive Chip Resistors ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. Temperature Peak Preheating Heating For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 5 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating 150 °C to 180 °C 60 s to 120 s Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ● Recommended soldering conditions for flow Preheating Soldering For soldering Temperature Time 140 °C to 180 °C 60 s to 120 s 245 ± 5 °C 20 s to 30 s For lead-free soldering Temperature Time 150 °C to 180 °C 60 s to 120 s max. 260 °C max. 10 s Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER2 of this catalog. 1. Keep the rated power and ambient temperature within the specified derating curve. * When positioning and mounting Metal Film Thermosensitive Chip Resistors (hereafter called the resistors), make allowance for the effect of heat generated through close contact between the resistors and neighboring components and for the temperature rise of adjacent heat-generating components. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. When applying pulses to the resistors, keep the pulse peak within the rated voltage. 3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. 9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Sep. 2010