ISL54409, ISL54410 Features The Intersil ISL54409 and ISL54410 are Dual SPST (Single Pole/Single Throw) switches that provides a very low distortion audio path for a stereo headphone and can be connected in a wired-OR configuration at the switch outputs with USB2.0 HS signals for Audio/USB signal multiplexing to a common connector. The audio switch path can be disabled to provide high signal isolation, preventing crosstalk between the audio codec and USB data signals. • Single Supply Operation (VDD) . . . +2.7V to +5.0V The ISL54409 and ISL54410 analog switches are negative swing capable with a single supply voltage and maintain excellent THD performance within a signal range of -1V to +1V. The switch terminals have low pin capacitance (4pF typical), minimizing impact to USB 2.0 High-Speed signals. The ISL54409 offers a Low Power Shutdown mode while the ISL54410 offers a High Off-Isolation mode. The ISL54410 contains active Audio Click and Pop Elimination circuitry for AC-coupled audio signals. • Low Power Shutdown Mode (ISL54409) The ISL54409 and ISL54410 are available in a 8 Ld TDFN (2mmx2mm) or a 10 Ld µTQFN (1.8mmx1.4mm) package. They operate over a temperature range of -40 to +85°C. Typical Application • Negative Signal Handling (See “Audio/USB wired-OR Application” on page 8 on protecting USB controller) • Low OFF Capacitance for HS USB . . . . . . . . . . 4pF • Power Off Protection • THD+N at 1mW into 32Ω Load . . . . . . . . <0.02% • Audio Muting . . . . . . . . . . . . . . . . . . . . .>110dB • Low Power Consumption. . . . 21µW with 3V supply • Active Click and Pop Elimination Circuitry (ISL54410) • USB VBUS Hot Plug Operation • Available in 8 Ld TDFN (2mmx2mm) or 10 Ld µTQFN (1.8mmx1.4mm) Package Applications*(see page 11) • Consumer Entertainment Systems • MP3 and other Personal Media Players • Cellular/Mobile Phones and PDAs Related Literature*(see page 11) • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” USB2.0 HS Eye Diagram USB CONTROLLER µCONTROLLER ISL54409 ISL54410 COMMON CONNECTOR LOGIC CONTROL CTRL IN COM+ RIN COM- LIN September 25, 2009 FN6983.0 AUDIO CODEC 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2009. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL54409, ISL54410 Audio/USB 2.0 Wired-OR Switch with Click and Pop Reduction ISL54409, ISL54410 Application Block Diagrams 0.1µF 3.3V USB CONTROLLER VDD CTRL LOGIC CONTROL D+ IN 4MΩ DCOM- LEFT SPEAKER 4MΩ LIN 50kΩ COM+ RIGHT SPEAKER USB CONTROLLER AUDIO CODEC 0.1µF VDD CTRL LOGIC CONTROL COM- 4MΩ LIN 200kΩ COM+ GND 220µF AUDIO CODEC CLICK AND POP SHUNT RIN 200kΩ LOGIC CONTROLLER IN 4MΩ D- RIGHT SPEAKER 220µF 50kΩ GND 3.3V LEFT SPEAKER 220µF RIN ISL54409 D+ LOGIC CONTROLLER 220µF ISL54410 TABLE 1. ISL54409, ISL54410 FEATURES ANALOG SIGNAL RANGE PART NUMBER PACKAGE LOW POWER MODE CLICK AND POP ELIMINATION VBUS HOT PLUG OPERATION ISL54409 -1 TO +1V 8 Ld TDFN, 10 Ld µTQFN Yes No Yes ISL54410 -1 TO +1V 8 Ld TDFN, 10 Ld µTQFN No Yes Yes 2 FN6983.0 September 25, 2009 ISL54409, ISL54410 Pin Configurations (Note 1) ISL54409, ISL54410 (8 Ld 2x2 TDFN) TOP VIEW ISL54409, ISL54410 (10 Ld 1.8x1.4 µTQFN) TOP VIEW VDD CTRL 10 9 NC 8 VDD LOGIC CONTROL IN 1 4MΩ NC 6 LIN LOGIC CONTROL 2 3 COM+ 4 5 GND RIN CTRL 4MΩ 7 LIN 4MΩ 4MΩ 2 COM- IN 7 8 1 COM- 3 6 RIN COM+ 4 5 GND NOTE: 1. Switches shown with IN = 0 and CTRL = 1. Pin Descriptions ISL54409 and ISL54410 TDFN µTQFN NAME FUNCTION 1 10 VDD 2 1 IN 3 2 COM- Audio Left Output 4 3 COM+ Audio Right Output 5 4 GND IC Ground Connection 6 5 RIN Audio Right Input 7 6 LIN Audio Left Input - 7 NC Not Connected - 8 NC Not Connected 8 9 CTRL PD - Pad Power Supply Logic Control; Internal 4MΩ pull down Logic Control; Internal 4MΩ pull-down Thermal Pad; Connect to GND Plane Truth Tables ISL54409 IN CTRL COM-/ COM+ 0 0 OFF 0 1 ON 1 X OFF ISL54410 IN CTRL COM-/ COM+ 0 0 OFF Click and Pop Audio 0 1 ON Audio Mute 1 X OFF Mute MODE Low Power CTRL and IN: Logic “0” when ≤ 0.5V, Logic “1” when ≥ 1.4V 3 MODE CTRL and IN: Logic “0” when ≤ 0.5V, Logic “1” when ≥ 1.4V FN6983.0 September 25, 2009 ISL54409, ISL54410 Ordering Information PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE Tape & Reel (Pb-Free) PKG. DWG. # Coming Soon ISL54409IRTZ-T (Notes 2, 3) 409 -40 to +85 8 Ld 2x2 TDFN L8.2x2C ISL54409IRUZ-T (Notes 2, 4) U2 -40 to +85 10 Ld 1.8x1.4 µTQFN L10.1.8x1.4A Coming Soon ISL54410IRTZ-T (Notes 2, 3) 410 -40 to +85 8 Ld 2x2 TDFN L8.2x2C ISL54410IRUZ-T (Notes 2, 4) U3 -40 to +85 10 Ld 1.8x1.4 µTQFN L10.1.8x1.4A 2. Please refer to TB347 for details on reel specifications. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 5. For Moisture Sensitivity Level (MSL), please see device information page for ISL54409, ISL54410. For more information on MSL please see techbrief TB363. 4 FN6983.0 September 25, 2009 ISL54409, ISL54410 Absolute Maximum Ratings Thermal Information VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V Input Voltages LIN, RIN (Note 6) . . . . . . . . . . . . . -2V to ((VDD) + 0.3V) IN, CTRL (Note 6). . . . . . . . . . . . -0.3V to ((VDD) + 0.3V) Output Voltages COM-, COM+ (Note 5) . . . . . . . . . . . -2V to ((VDD) + 0.3V) Continuous Current (LIN, RIN) . . . . . . . . . . . . . . . . ±150mA Peak Current (LIN, RIN) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . ±300mA ESD Ratings: Human Body Model ISL54409. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5kV ISL54410. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6kV Machine Model ISL54409. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250V ISL54410. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300V Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . 2kV Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 1.8x1.4mm µTQFN (Notes 7, 8) . . . 160 61.9 2mmx2mm TDFN (Notes 7, 8) . . . . 84 10 Maximum Junction Temperature (Plastic Package). . . +150°C Storage Temperature Range . . . . . . . . . . . -65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Temperature. . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 6. Signals on LIN, RIN, COM-, COM+, IN and CTRL exceeding VDD or GND by specified amount are clamped. Limit current to maximum current ratings. 7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 8. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VCTRL = 1.4V, VIN = 0.5V, (Notes 9, 10), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. PARAMETER TEST CONDITIONS TEMP MIN MAX (°C) (Notes 10, 11) TYP (Notes 10, 11) UNITS ANALOG SWITCH CHARACTERISTICS Analog Input Signal Range, VDD = 3.3V VANALOG Full -1.5 - 1.5 V ON-Resistance, rON IXOUT = 40mA, VLIN or VRIN = -0.85V to 0.85V, (See Figure 2, Note 14) +25 - 2.5 2.8 Ω Full - - 3.8 Ω IXOUT = 40mA, VLIN or VRIN = -0.85V to 0.85V, (Notes 12, 14) +25 - 20 60 mΩ Full - - 70 mΩ IXOUT = 40mA, VLIN or VRIN = Voltage at max rON over signal range of -0.85V to 0.85V, (Notes 13, 14) +25 - 0.1 0.32 Ω Full - - 0.4 Ω Active Click and Pop Shunt VCTRL = 0V, VIN = 0V, VLIN or VRIN = -1.5V Resistance to 1.5V, ISL54410 only +25 - 40 - Ω Full - - - Ω rON Flatness, rFLAT(ON) rON Matching Between Channels, ΔrON DYNAMIC CHARACTERISTICS Turn-ON Time, tON VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1) 25 - 5 - µs Turn-OFF Time, tOFF VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1) 25 - 45 - ns OFF-Isolation VIN = 3V, VLIN or VRIN = 0.707VRMS, RL = 32Ω, f = 20Hz to 20kHz (see Figure 3) 25 - 110 - dB Crosstalk RIN to LOUT, LIN to ROUT VCTRL = 3.0V, VIN = 0V, RL = 32Ω, f = 20Hz to 20kHz, VLIN or VRIN = 0.707VRMS (2VP-P), (See Figure 4) +25 - -90 - dB 5 FN6983.0 September 25, 2009 ISL54409, ISL54410 Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VCTRL = 1.4V, VIN = 0.5V, (Notes 9, 10), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C. (Continued) PARAMETER Total Harmonic Distortion TEST CONDITIONS f = 20Hz to 20kHz, VCTRL = 3.0V, VIN = 0V, VLIN or VRIN = 0.36VRMS (1VP-P), RL = 32Ω TEMP MIN MAX (°C) (Notes 10, 11) TYP (Notes 10, 11) UNITS +25 - 0.03 - % +25 f = 20Hz to 20kHz, VCTRL= 3.0V, VIN = 0V, VLIN or VRIN = 0.707VRMS (2VP-P), RL = 32Ω - 0.06 - % f = 240MHz, VCTRL = 0V, VIN = 3V, VLIN or VRIN = 0V 25 - 5 - pF f = 240MHz, VCTRL = 0V, VIN = 0V, VLIN or VRIN = 0V 25 - 4 - pF Power Supply Range, VDD Full 2.7 3.6 V Audio Mode Supply Current, VDD = 3.6V IDD +25 - 7 13 µA Full - - 15 µA 25 - 1 10 nA Full - - 150 nA 25 - 2.4 4 µA Full - - 5 µA 25 - 7 - µA Logic Voltage Low, VLogic_L VDD = 2.7V to 3.6V Full - - 0.5 V Logic Voltage High, VLogic_H VDD = 2.7V to 3.6V Full 1.4 - - V Logic Input Low Current, ILogic_L VDD = 3.6V, VLogic = 0V Full -50 20 50 nA Logic Input High Current, ILogic_H VDD = 3.6V, VLogic = 3.6V Full -2 1 2 µA Logic Pull-Down Resistor, RLogic VDD = 3.6V, VLogic = 3.6V Full - 4 - MΩ COM-, COM+ OFF Capacitance, COFF POWER SUPPLY CHARACTERISTICS Shutdown Current, ISHDN VDD = 3.6V, VCTRL = 0.5V, VIN = 0.5V; ISL54409 VDD = 3.6V, VCTRL = 0.5V, VIN = 0.5V; ISL54410 Power OFF-Current, IRIN/LIN or ICOM-/COM+ VDD = 0V, VCTRL = VIN = Float, VLIN/RIN = VCOM-/COM+ = 5.25V, DIGITAL INPUT CHARACTERISTICS NOTES: 9. VLogic = Logic input voltage to perform proper function. 10. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 11. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 12. Flatness is defined as the difference between maximum and minimum value of ON-resistance over the specified analog signal range. 13. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON value. 14. Limits established by characterization and are not production tested. 6 FN6983.0 September 25, 2009 ISL54409, ISL54410 Test Circuits and Waveforms VCTRL LOGIC INPUT VCTRL tr < 20ns tf < 20ns 50% tOFF SWITCH INPUT VINPUT VDD IN VCOM-/COM+ VLIN/RIN VOUT 90% SWITCH OUTPUT 0.1µF VDD CTRL 90% VCTRL 0V CL 10pF RL 50Ω GND tON *CL includes board capacitance FIGURE 1B. TEST CIRCUIT FIGURE 1A. MEASUREMENT POINTS FIGURE 1. SWITCHING TIMES Repeat test for all switches. rON = V1/40mA VDD 0.1µF VDD IN VDD IN VDD LIN OR RIN VIN CTRL V1 40mA LIN OR RIN 0.1µF COM- OR COM+ RL CTRL COM- OR COM+ 0V OR FLOAT GND GND FIGURE 2. rON TEST CIRCUIT FIGURE 3. OFF ISOLATION CIRCUIT VDD CTRL COM- OR COM+ 0V or Float 0.1µF LIN OR RIN IN COM+ OR COM- RIN OR LIN RL GND FIGURE 4. CROSSTALK TEST CIRCUIT 7 FN6983.0 September 25, 2009 ISL54409, ISL54410 Detailed Description The ISL54409, ISL54410 are +2.7 to +5.0V, Single Pole Single Throw (SPST) audio switches that are negative swing capable. The switch outputs (COM-, COM+) have low OFF capacitance (4pF) that is capable of multiplexing USB2.0 HS data and audio signals in a wired-OR configuration for common connector applications (see “Application Block Diagrams” on page 2). The ISL54409 features a low power shutdown mode while the ISL54410 features audio Click and Pop Elimination circuitry. The ISL54409, ISL54410 are offered in a 8 Ld 2mmx2mm TDFN or 10 Ld 1.4x1.8mm µTQFN packages. Power Supply Considerations The ISL54409, ISL54410 operates on a +2.7V to +5.0V power supply. A 0.1µF local decoupling capacitor placed as closed as possible from the VDD pin to GND is highly recommended for stable operation. Audio Switches The ISL54409, ISL54410 switches are designed to have low THD+N from a signal range of -1V to +1V for audio applications (See Figures 8 through 11). The ON-resistance of the audio switches have a typical resistance of 2.6Ω. The analog signal range of the audio switches are capable beyond -1V to +1V however, the ON-resistance of the switches increases beyond it. The THD+N performance deteriorates beyond a signal range of -1V to +1V. Audio/USB wired-OR Application The ISL54409, ISL54410 allows the connection of an audio codec and USB Controller to a common connector. For audio mode of operation, the switch is closed to pass low distortion audio from the codec to a headphone. When the switch is open, USB2.0 HS data (480MBps) can be transmitted to a host controller with minimal signal degradation. Since the USB device is always connected to the COMand COM+ pins on the ISL54409, ISL54410, considerations must be taken to protect the USB Controller when passing audio signals through the switch. The USB2.0 specification requires the USB data line to sustain a signal of -1V without damage to the device. Audio signals from the codec may swing below 1V in some applications. Since the USB Controller is high impedance when not operating, exceeding -1V may cause high leakage currents or damage sensitive devices on the USB device. It is highly recommended to keep the audio signal range within -1V to +1V. USB VBUS Hot Plug Operation The ISL54409, ISL54410 allows the hot plug operation of the USB VBUS signal to operate the switch. This can be accomplished by connecting CTRL to VDD at all times. The VBUS signal from the USB Host is used to drive the IN logic pin. Note from the “Absolute Maximum Ratings” on page 5 that the IN pin must be kept below VDD. 8 Exceeding VDD by putting the 5V VBUS signal to the IN pin will forward bias the ESD diode on the IN pin, which will draw excessive diode current and result in a damaged pin on the device. To prevent damage to the IN pin it is recommended to place a current limiting series resistor or use a voltage divider to bring the voltage at the IN pin below VDD. A 10kΩ series resistor will reduce current significantly to prevent possible damage to the IN pin. For further protection, a voltage divider with RT = 10kΩ will reduce the IN voltage below VDD with no impact on logic threshold voltages (see Figure 5). VDD 0.1µF VBUS = 5V *RIN IN *RT COM- CTRL ISL54409 ISL54410 COM+ *RIN = 10kΩ *RT = Optional LIN RIN GND FIGURE 5. USB VBUS HOT PLUG PROTECTION Low Power Shutdown/Click and Pop Mode When the CTRL and IN pins are at logic “0”, the ISL54409 and ISL54410 enter into a disabled mode of operation. In the disabled mode of operation, both switches are turned OFF. For the ISL54409, the disabled mode is Low Power Shutdown. The device is brought to a low powered state and the Icc current is significantly reduced. *Note: When placed in the Low Power Shutdown state, the internal charge pumps that generate the negative supply rails for negative signal swing capability are turned off to reduce power consumption. With the internal negative supply rail disabled the ISL54409 will have poor isolation and crosstalk performance for negative signal swings on the switch terminals. Negative voltages will have a low impedance path to the other switch terminals. It is not recommended to operate the switch in Low Power Shutdown if the audio codec will remain active when transmitting USB data on the COMand COM+ pins. For the ISL54410, the disabled mode is Audio Click and Pop Elimination. The switch input pins LIN and RIN have their active Click and Pop circuitry enabled, which turns on a typical 40Ω shunt resistance from the switch input pin to GND. Some audio application requires DC biasing the audio codec above ground for full output signal swing. The audio signal must have the DC component removed with a blocking capacitor at the headphone load. This blocking capacitor is typically the source of audible click and pop transients when the audio codec powers up or down with the DC bias. The negative signal swing capability of the audio switch allows the DC blocking capacitor to be placed on input side of the switch, which allows the Click and Pop Elimination circuitry to discharge the DC blocking capacitor of any transient currents, eliminating audio clicks and pops. FN6983.0 September 25, 2009 ISL54409, ISL54410 Typical Performance Curves TA = +25°C, Unless Otherwise Specified 2.61 4.0 IOUT = 40mA VDD = 2.7V 3.6 VDD = 3.0V 3.2 +85°C 3.4 2.59 rON (Ω) rON (Ω) 2.60 3.8 VDD = 3.3V 2.58 IOUT = 40mA VDD = 3.0V 3.0 2.8 2.6 +25°C 2.4 2.2 VDD = 3.6V 2.57 2.0 1.8 2.56 -1.0 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 VOUT (V) 0.6 0.8 1.0 VOUT (V) FIGURE 6. ON-RESISTANCE vs SWITCH VOLTAGE vs SUPPLY VOLTAGE 0.068 -40°C 1.6 -1.2 -1.0-0.8-0.6-0.4-0.2 0 0.2 0.4 0.6 0.8 1.0 1.2 FIGURE 7. ON-RESISTANCE vs SWITCH VOLTAGE vs TEMPERATURE 0.10 RLOAD = 32Ω VLOAD = 0.707VRMS 0.9VRMS 0.066 0.08 0.707VRMS VDD = 3.3V THD+N (%) THD+N (%) VDD = 3.0V 0.064 VDD = 3.6V 0.062 1.0VRMS 0.060 0.06 0.04 0.35VRMS 0.02 0.058 0.056 20 200 2k 0 20k RLOAD = 32Ω VDD = 3V RMS VOLTAGES AT LOAD 20 200 2k FREQUENCY (Hz) FREQUENCY (Hz) FIGURE 8. THD+N vs SUPPLY VOLTAGE vs FREQUENCY 0.20 FIGURE 9. THD+N vs SIGNAL LEVELS vs FREQUENCY RLOAD = 32Ω RLOAD = 32Ω FREQ = 1kHz VDD = 3V FREQ = 1kHz VDD = 3V 0.10 0.08 0.06 THD+N (%) THD+N (%) 0.10 0.08 20k 0.04 0.02 0.06 0.04 0.03 0.02 0.01 0.01 0.003 0.12 0.23 0.35 0.47 0.58 0.70 0.82 0.93 1.05 1.16 OUTPUT VOLTAGE (VRMS) FIGURE 10. THD+N vs OUTPUT VOLTAGE 9 0.008 1 2 3 4 5 6 7 8 910 20 30 OUTPUT POWER (mW) FIGURE 11. THD+N vs OUTPUT POWER FN6983.0 September 25, 2009 ISL54409, ISL54410 Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued) 0 NORMALIZED GAIN (dB) -40 -1.0 -1.5 -2.0 20 VDD = 3V RL = 32Ω VIN = 0.707 VRMS 100 200 500 1k 2k FREQUENCY (Hz) -60 -80 -100 -120 -140 -160 10k 20k RL = 32Ω VIN = 0.2VP-P TO 2VP-P 20 100 200 500 1k 2k FREQUENCY (Hz) 5k 10k 20k FIGURE 13. OFF-ISOLATION FIGURE 12. INSERTION LOSS -40 NORMALIZED GAIN (dB) GAIN (dB) -0.5 -60 -80 -100 -120 -140 -160 20 RL = 32Ω VIN = 0.2VP-P TO 2VP-P 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) FIGURE 14. CROSSTALK 10 FN6983.0 September 25, 2009 ISL54409, ISL54410 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION 9/25/09 FN6983.0 CHANGE Initial Release. Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL54409, ISL54410 To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff FITs are available from our website at http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 FN6983.0 September 25, 2009 ISL54409, ISL54410 Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) D L10.1.8x1.4A B 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS 6 INDEX AREA 2X A N E SYMBOL 0.10C 1 2X A 2 0.10C A1 TOP VIEW C A 0.05C SIDE VIEW (DATUM A) PIN #1 ID 1 2 NX L NX b 5 10X 0.10 MC A B 0.05 MC L1 5 (DATUM B) 7 MAX NOTES 0.50 0.55 - - - 0.05 - 0.127 REF - b 0.15 0.20 0.25 5 D 1.75 1.80 1.85 - E 1.35 1.40 1.45 - e A1 NOMINAL 0.45 A3 0.10C SEATING PLANE MIN 0.40 BSC - L 0.35 0.40 0.45 L1 0.45 0.50 0.55 - N 10 2 Nd 2 3 Ne 3 3 θ 0 - 4 12 Rev. 3 6/06 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.51994. 2. N is the number of terminals. e 3. Nd and Ne refer to the number of terminals on D and E side, respectively. BOTTOM VIEW 4. All dimensions are in millimeters. Angles are in degrees. NX (b) 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. CL (A1) 5 L SECTION "C-C" e C C TERMINAL TIP 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. 8. Maximum allowable burrs is 0.076mm in all directions. 9. JEDEC Reference MO-255. 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. 2.20 1.00 0.60 1.00 0.50 1.80 0.40 0.20 0.20 0.40 10 LAND PATTERN 12 FN6983.0 September 25, 2009 ISL54409, ISL54410 Package Outline Drawing L8.2x2C 8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN) WITH E-PAD Rev 0, 07/08 2.00 6 PIN #1 INDEX AREA A B 6 PIN 1 INDEX AREA 8 1 0.50 2.00 1.45±0.050 Exp.DAP (4X) 0.15 0.10 M C A B 0.25 ( 8x0.30 ) TOP VIEW 0.80±0.050 Exp.DAP BOTTOM VIEW ( 8x0.20 ) Package Outline ( 8x0.30 ) SEE DETAIL "X" ( 6x0.50 ) 1.45 2.00 0.10 C 0 . 75 ( 0 . 80 max) C BASE PLANE SEATING PLANE 0.08 C SIDE VIEW ( 8x0.25 ) 0.80 2.00 TYPICAL RECOMMENDED LAND PATTERN C 0 . 2 REF 0 . 00 MIN. 0 . 05 MAX. DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 13 FN6983.0 September 25, 2009