SSF6N40D Main Product Characteristics: VDSS 400V RDS(on) 0.85Ω (typ.) ID 5.5A TO-252 Schematic diagram Assignment Features and Benefits: Marking and pin Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery 150℃ operating temperature Description: It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications. Absolute max Rating: Symbol Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V① 5.5 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V① 3.5 IDM Pulsed Drain Current② 22 Power Dissipation③ 50 W Linear Derating Factor 0.4 W/°C VDS Drain-Source Voltage 400 V VGS Gate-to-Source Voltage ± 30 V EAS Single Pulse Avalanche Energy @ L=22mH 345 mJ IAS Avalanche Current @ L=22mH 5.6 A -55 to +150 °C PD @TC = 25°C TJ TSTG Operating Junction and Storage Temperature Range ©Silikron Semiconductor CO.,LTD. 2012.07.12 www.silikron.com Version : 1.0 A page 1 of 8 SSF6N40D Thermal Resistance Symbol Characterizes Typ. Max. Units RθJC Junction-to-case③ — 2.5 ℃/W RθJA Junction-to-ambient (t ≤ 10s) ④ — 110 ℃/W Electrical Characterizes @TA=25℃ unless otherwise specified Symbol Parameter Min. V(BR)DSS Drain-to-Source breakdown voltage RDS(on) Static Drain-to-Source on-resistance VGS(th) Gate threshold voltage IDSS Drain-to-Source leakage current IGSS Gate-to-Source forward leakage Qg Typ. Max. Units V 400 — — — 0.85 1.0 — 1.75 — 2 — 4 — 2.25 — — — 1 — — 50 — — 100 — — -100 Total gate charge — 16.1 — Qgs Gate-to-Source charge — 3.9 — Qgd Gate-to-Drain("Miller") charge — 6.0 — td(on) Turn-on delay time — 11.3 — tr Rise time — 18.0 — td(off) Turn-Off delay time — 37.9 — tf Fall time — 18.9 — Ciss Input capacitance — 643 — Coss Output capacitance — 79.0 — Crss Reverse transfer capacitance — 5.14 — Ω V μA nA Conditions VGS = 0V, ID = 250μA VGS=10V,ID = 2.75A TJ = 125℃ VDS = VGS, ID = 250μA TJ = 125℃ VDS = 400V,VGS = 0V TJ = 125℃ VGS =30V VGS = -30V ID = 5.5A, nC VDS=320V, VGS = 10V ns VGS=10V, VDS=200V, RGEN=25Ω,ID=5.5A VGS = 0V pF VDS = 25V ƒ = 1MHz Source-Drain Ratings and Characteristics Symbol IS ISM Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Min. Typ. Max. Units — — 5.5 A — — 22 A Conditions MOSFET symbol showing the integral reverse p-n junction diode. VSD Diode Forward Voltage — 0.89 1.4 V IS=5.5A, VGS=0V trr Reverse Recovery Time — 267 — ns TJ = 25°C, IF =5.5A, Qrr Reverse Recovery Charge — 1644 — nC di/dt = 100A/μs ©Silikron Semiconductor CO.,LTD. 2012.07.12 www.silikron.com Version : 1.0 page 2 of 8 SSF6N40D Test circuits and Waveforms Switch Waveforms: Notes: ①The maximum current rating is limited by bond-wires. ②Repetitive rating; pulse width limited by max. junction temperature. ③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal resistance. ④The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C ©Silikron Semiconductor CO.,LTD. 2012.07.12 www.silikron.com Version : 1.0 page 3 of 8 SSF6N40D Typical electrical and thermal characteristics Figure 2. Gate to source cut-off voltage Figure 1. Typical Output Characteristics Figure 3. Drain-to-Source Breakdown Voltage vs. Case Temperature ©Silikron Semiconductor CO.,LTD. Figure 4.Normalized On-Resistance Vs. Case Temperature 2012.07.12 www.silikron.com Version : 1.0 page 4 of 8 SSF6N40D Typical electrical and thermal characteristics Figure 5. Maximum Drain Current Vs. Case Figure 6.Typical Capacitance Vs. Drain-to-Source Temperature Voltage Case Temperature Figure7. Maximum Effective Transient Thermal Impedance, Junction-to-Case ©Silikron Semiconductor CO.,LTD. 2012.07.12 www.silikron.com Version : 1.0 page 5 of 8 SSF6N40D Mechanical Data: TO-252 PACKAGE OUTLINE DIMENSION Symbol A A1 B B1 C D D1 D2 E E1 e H F K V2 Dimension In Millimeters Min Nom Max 2.200 2.300 2.380 0.910 1.010 1.110 0.710 0.760 0.810 5.130 5.330 5.460 0.460 0.510 0.560 6.000 6.100 6.200 5.350 (REF) 2.900 (REF) 6.500 6.600 6.700 4.83 (REF) 2.186 2.286 2.386 9.800 10.100 10.400 1.400 1.500 1.700 1.600 (REF) ©Silikron Semiconductor CO.,LTD. Min 0.087 0.036 0.028 0.202 0.018 0.236 0.256 0.086 0.386 0.055 80 (REF) Dimension In Inches Nom 0.091 0.040 0.030 0.210 0.020 0.240 0.211 (REF) 0.114 (REF) 0.260 0.190 (REF) 0.090 0.398 0.059 0.063 (REF) Max 0.094 0.044 0.032 0.215 0.022 0.244 0.264 0.094 0.409 0.067 80 (REF) 2012.07.12 www.silikron.com Version : 1.0 page 6 of 8 SSF6N40D Ordering and Marking Information Device Marking: SSF6N40D Package (Available) TO-252(DPAK) Operating Temperature Range C : -55 to 150 ºC Devices per Unit Option1: Package Type TO-252 Option2: Package Type TO-252 Units/Tape Tapes/Inner Box 2500 2 Units/Tape Tapes/Inner Box 2500 1 Units/Inner Box 5000 Units/Inner Box 2500 Inner Boxes/Carton Box 7 Units/Carton Box Inner Boxes/Carton Box 10 Units/Carton Box 35000 25000 Reliability Test Program Test Item Conditions Duration Sample Size High Temperature Reverse Bias(HTRB) High Temperature Gate Bias(HTGB) Tj=125℃ to 150℃ @ 80% of Max VDSS/VCES/VR 168 hours 500 hours 1000 hours 3 lots x 77 devices Tj=150℃ @ 100% of Max VGSS 168 hours 500 hours 1000 hours 3 lots x 77 devices ©Silikron Semiconductor CO.,LTD. 2012.07.12 www.silikron.com Version : 1.0 page 7 of 8 SSF6N40D ATTENTION: ■ ■ ■ ■ ■ ■ ■ ■ ■ Any and all Silikron products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your Silikron representative nearest you before using any Silikron products described or contained herein in such applications. Silikron assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all Silikron products described or contained herein. Specifications of any and all Silikron products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment. Silikron Semiconductor CO.,LTD. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all Silikron products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. 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Specifications and information herein are subject to change without notice. Customer Service Worldwide Sales and Service: [email protected] Technical Support: [email protected] Suzhou Silikron Semiconductor Corp. 11A, 428 Xinglong Street, Suzhou Industrial Park, P.R.China TEL: (86-512) 62560688 FAX: (86-512) 65160705 E-mail: [email protected] ©Silikron Semiconductor CO.,LTD. 2012.07.12 www.silikron.com Version : 1.0 page 8 of 8