Reliability Data Report Product Family R504 LTM4600 / LTM4601 / LTM4602 / LTM4603 / LTM4604 / LTM4605 / LTM4606 / LTM4607 / LTM4608 / LTM4609 / LTM4611 / LTM4612 / LTM4613 / LTM4614 / LTM4615 / LTM4616 / LTM4617 / LTM4618 / LTM4619 / LTM4620 / LTM4622 / LTM4623 / LTM4624 / LTM4625 / LTM4627 / LTM4628 / LTM4630 / LTM4633 / LTM4634 / LTM4637 / LTM4639 / LTM4641 / LTM4642 / LTM4644 / LTM4648 / LTM4649 / LTM4650 / LTM4675 / LTM4676 / LTM4677 Reliability Data Report Report Number: R504 Report generated on: Wed May 18 10:08:33 PDT 2016 OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS CODE CODE (+125°C) 1 No. of FAILURES 2,3 BGA 06X06 BGA 15X09 BGA 15X15 271 306 911 1206 1228 1141 1338 1306 1428 271 306 834 0 0 0 BGA 16X16 LGA 06X06 306 154 1324 1430 1533 1449 306 154 0 0 LGA 15X09 LGA 15X15 LGA 16X16 788 2448 153 0634 0452 1233 0843 1223 1247 788 2297 115 0 0 0 Totals 5,337 - - 5,071 0 HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES 4 CODE CODE (+85°C) BGA 06X06 BGA 09X11 201 305 1337 1414 1527 1532 771 961 0 0 BGA 15X09 BGA 15X15 BGA 16X16 1149 958 1258 1306 1235 1334 1525 1530 1535 3998 2563 3102 0 0 0 LGA 06X06 LGA 15X09 689 77 1338 1502 1524 1502 2497 147 0 0 LGA 15X15 LGA 16X16 Totals 3591 434 8,662 0645 1248 - 1544 1447 - 10130 913 25,082 0 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE LGA 15X09 50 Totals 50 OLDEST DATE NEWEST DATE CODE CODE 1505 1505 1 0 - - 1 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES TEMP CYCLE FROM -40 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES LGA 15X09 LGA 15X15 76 230 0710 0632 0710 0642 76 230 0 0 Totals 306 - - 306 0 (1) Assumes Activation Energy = 1.0 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =0.36 FITS (3) Mean Time Between Failure in Years = 315776.72 (4) Assumes 20X Acceleration from 85 °C to +130 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning Reliability Data Report Report Number: R504 Report generated on: Wed May 18 10:08:33 PDT 2016 TEMP CYCLE FROM -55 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE BGA 06X06 BGA 09X11 BGA 15X09 883 307 2876 BGA 11X15 BGA 15X15 No. of FAILURES CODE CODE CYCLES 1245 1414 1150 1527 1532 1525 476 349 1809 0 0 0 77 3749 1304 1148 1304 1530 77 2883 0 0 BGA 16X16 LGA 06X06 LGA 15X09 1995 868 1350 1216 1338 0634 1535 1524 1527 2006 813 1441 0 0 0 LGA 11X15 LGA 15X15 153 13193 1304 0643 1304 1549 153 13717 0 0 LGA 16X16 Totals 1078 26,529 1147 - 1447 - 1074 24,798 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES BGA 15X09 BGA 15X15 620 3282 1213 1141 1517 1528 198 1659 0 0 BGA 16X16 LGA 15X09 675 7352 1412 0634 1511 1517 67 2917 0 0 LGA 15X15 LGA 16X16 Totals 53560 473 65,962 0513 1449 - 1544 1509 - 20158 47 25,046 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES THERMAL SHOCK FROM -55 TO 105 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES BGA 06X06 384 1245 1527 422 0 BGA 09X11 BGA 15X09 307 1416 1414 1150 1532 1525 307 1505 0 0 BGA 11X15 BGA 15X15 75 2203 1304 1049 1304 1530 77 1945 0 0 BGA 16X16 LGA 06X06 LGA 15X09 1966 765 1108 1242 1338 0634 1535 1524 1527 1625 765 1426 0 0 0 LGA 11X15 LGA 15X15 77 9794 1304 0708 1304 1533 77 12437 0 0 LGA 16X16 Totals 1033 19,128 1240 - 1447 - 917 21,503 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES BGA 15X09 BGA 15X15 151 1448 1213 1141 1306 1528 151 958 0 0 BGA 16X16 LGA 15X09 328 4797 1412 0634 1511 1505 32 2326 0 0 LGA 15X15 Totals 30716 37,440 0332 - 1544 - 12972 16,439 0 0 Reliability Data Report Report Number: R504 Report generated on: Wed May 18 10:08:33 PDT 2016 THERMAL SHOCK FROM -55 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE BGA 06X06 BGA 09X11 BGA 15X09 384 307 1416 BGA 11X15 BGA 15X15 No. of FAILURES CODE CODE CYCLES 1245 1414 1150 1527 1532 1525 422 307 1505 0 0 0 75 2203 1304 1049 1304 1530 77 1945 0 0 BGA 16X16 LGA 06X06 LGA 15X09 1966 765 1108 1242 1338 0634 1535 1524 1527 1625 765 1426 0 0 0 LGA 11X15 LGA 15X15 77 9794 1304 0708 1304 1533 77 12437 0 0 LGA 16X16 Totals 1033 19,128 1240 - 1447 - 917 21,503 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES POWER CYCLE FROM 50 TO 100 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES LGA 15X09 LGA 15X15 117 347 0712 0513 0730 1048 5850 16325 0 0 Totals 464 - - 22,175 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 0648 - 1434 - 353 353 0 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE LGA 15X15 Totals 578 578 HIGH TEMPERATURE BAKE AT 125 DEG C PACKAGE TYPE SAMPLE SIZE BGA 06X06 31 1412 1412 31 0 BGA 15X09 BGA 15X15 LGA 15X09 283 665 591 1447 1405 1229 1503 1503 1506 283 591 567 0 0 0 LGA 15X15 Totals 5198 6,768 1231 - 1514 - 4881 6,353 0 0 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES BGA 06X06 375 CODE CODE 1245 BGA 09X11 308 1414 1527 375 0 1532 269 BGA 15X09 BGA 11X15 891 77 0 1213 1324 1518 1324 852 77 0 0 BGA 15X15 BGA 16X16 LGA 06X06 LGA 15X09 1999 1141 1528 1953 0 786 693 4980 1334 1338 0634 1535 1524 1344 749 698 5262 0 0 0 LGA 11X15 LGA 15X15 50 30092 1304 0441 1304 1549 50 32561 0 0 LGA 16X16 Totals 763 41,014 1248 - 1447 - 759 43,605 0 0 (5) Board Mount Temp Cycle Meets IPC-9701 / JESD22-A104. (6) Board Mount Temp Cycle Includes Full Electrical Characterization, XRAY & Cross-sections. (7) Each Board Mounted Vehicle is Cycled up to 2000 Times or More. Reliability Data Report Report Number: R504 Report generated on: Wed May 18 10:08:33 PDT 2016 BOARD MOUNTED TEMP CYCLE FROM 0 TO 100 DEG C PACKAGE TYPE BGA 15X15 LGA 15X15 Totals SAMPLE SIZE 230 124 354 OLDEST DATE NEWEST DATE CODE CODE 1227 0632 - 1227 1040 - K DEVICE CYCLES No. of FAILURES 5,6,7 458 594 1,052 0 0 0 BOARD MOUNTED TEMP CYCLE FROM -40 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE CYCLES No. of FAILURES 5,6,7 CODE CODE BGA 15X15 77 1029 1029 154 0 LGA 15X09 LGA 15X15 783 634 0634 0513 0729 0941 950 1014 0 0 Totals 1,494 - - 2,118 0 BOARD MOUNTED TEMP CYCLE FROM -55 TO 125 DEG C PACKAGE TYPE LGA 15X15 Totals SAMPLE SIZE 185 185 OLDEST DATE NEWEST DATE CODE CODE 0624 - 1041 - K DEVICE CYCLES No. of FAILURES 5,6,7 256 256 0 0 MECHANICAL SHOCK (JESD22-B104 CONDITION B - PEAK = 1500G) PACKAGE TYPE SAMPLE SIZE LGA 15X09 LGA 15X15 25 140 Totals 165 OLDEST DATE NEWEST DATE No. of FAILURES CODE CODE 0634 0708 0634 1039 0 0 - - 0 VIBRATION VARIABLE FREQUENCY (JESD22-B103 CONDITION A - PEAK = 20G) PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE CODE CODE No. of FAILURES LGA 15X09 LGA 15X15 40 188 0634 0708 0713 1348 0 0 Totals 228 - - 0